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Datasheet Specifications Product Order Technical Tools & Support & Folder Now Documents Software Community SN74HCS7266 SCLS788A –JANUARY 2020–REVISED MAY 2020 SN74HCS7266 Quadruple 2-Input XNOR Gates with Schmitt-Trigger Inputs 1 Features 2 Applications 1• Wide operating voltage range: 2 V to 6 V • Detect phase differences in input signals • Schmitt-trigger inputs allow for slow or noisy input • Create a selectable inverter / buffer signals • Low power consumption 3 Description – Typical I of 100 nA This device contains four independent 2-input XNOR CC Gates with Schmitt-trigger inputs. Each gate performs – Typical input leakage current of ±100 nA the Boolean function Y = A ⊕ B in positive logic. • ±7.8-mA output drive at 5 V (1) • Extended ambient temperature range: –40°C to Device Information +125°C, TA PART NUMBER PACKAGE BODY SIZE (NOM) SN74HCS7266DR SOIC (14) 8.70 mm × 3.90 mm SN74HCS7266PWR TSSOP (14) 5.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Benefits of Schmitt-trigger Inputs Low Power Noise Rejection Supports Slow Inputs Input Voltage Input Input Input Voltage Waveforms Voltage Voltage Input Voltage Time Time Standard Voltage CMOS Input Voltage Output Response Output Current Current Waveforms SupplyCurrent Input Voltage Time Time Schmitt-trigger CMOS Input Voltage Voltage Response Output Output Current Current Waveforms SupplyCurrent Input Voltage Time Time 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74HCS7266 SCLS788A –JANUARY 2020–REVISED MAY 2020 www.ti.com Table of Contents 1 Features .................................................................. 1 8.3 Feature Description................................................... 7 2 Applications ........................................................... 1 8.4 Device Functional Modes.......................................... 8 3 Description ............................................................. 1 9 Application and Implementation .......................... 9 4 Revision History..................................................... 2 9.1 Application Information.............................................. 9 5 Pin Configuration and Functions ......................... 3 9.2 Typical Application .................................................... 9 6 Specifications......................................................... 3 10 Power Supply Recommendations ..................... 12 6.1 Absolute Maximum Ratings ...................................... 3 11 Layout................................................................... 12 6.2 ESD Ratings.............................................................. 4 11.1 Layout Guidelines ................................................. 12 6.3 Recommended Operating Conditions....................... 4 11.2 Layout Example .................................................... 12 6.4 Thermal Information.................................................. 4 12 Device and Documentation Support ................. 13 6.5 Electrical Characteristics........................................... 4 12.1 Documentation Support ........................................ 13 6.6 Switching Characteristics.......................................... 5 12.2 Related Links ........................................................ 13 6.7 Typical Characteristics.............................................. 5 12.3 Community Resources.......................................... 13 7 Parameter Measurement Information .................. 6 12.4 Trademarks ........................................................... 13 8 Detailed Description .............................................. 7 12.5 Electrostatic Discharge Caution............................ 13 8.1 Overview ................................................................... 7 12.6 Glossary ................................................................ 13 8.2 Functional Block Diagram ......................................... 7 13 Mechanical, Packaging, and Orderable Information ........................................................... 13 4 Revision History Changes from Original (January 2020) to Revision A Page • Added D package to Device Information table....................................................................................................................... 1 • Added D package information to Pin Configuration and Functions........................................................................................ 3 • Added D package column to Thermal Information table ........................................................................................................ 4 2 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated Product Folder Links: SN74HCS7266 SN74HCS7266 www.ti.com SCLS788A –JANUARY 2020–REVISED MAY 2020 5 Pin Configuration and Functions D or PW Package 14-Pin SOIC or TSSOP Top View 1A 1 14 VCC 1B 2 13 4B 1Y 3 12 4A 2Y 4 11 4Y 2A 5 10 3Y 2B 6 9 3B GND 7 8 3A Pin Functions PIN I/O DESCRIPTION NAME NO. 1A 1 Input Channel 1, Input A 1B 2 Input Channel 1, Input B 1Y 3 Output Channel 1, Output Y 2Y 4 Output Channel 2, Output Y 2A 5 Input Channel 2, Input A 2B 6 Input Channel 2, Input B GND 7 — Ground 3A 8 Input Channel 3, Input A 3B 9 Input Channel 3, Input B 3Y 10 Output Channel 3, Output Y 4Y 11 Output Channel 4, Output Y 4A 12 Input Channel 4, Input A 4B 13 Input Channel 4, Input B VCC 14 — Positive Supply 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage –0.5 7 V V < –0.5 V or V > V + I Input clamp current(2) I I CC ±20 mA IK 0.5 V V < –0.5 V or V > V + I Output clamp current(2) I I CC ±20 mA OK 0.5 V IO Continuous output current VO = 0 to VCC ±35 mA Continuous current through VCC or GND ±70 mA (3) TJ Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed. (3) Guaranteed by design. Copyright © 2020, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: SN74HCS7266 SN74HCS7266 SCLS788A –JANUARY 2020–REVISED MAY 2020 www.ti.com 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ±4000 ANSI/ESDA/JEDEC JS-001(1) V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC ±1500 specification JESD22-C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Supply voltage 2 5 6 V VI Input voltage 0 VCC V VO Output voltage 0 VCC V TA Ambient temperature –40 125 °C 6.4 Thermal Information SN74HCS7266 THERMAL METRIC(1) PW (TSSOP) D (SOIC) UNIT 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 151.7 133.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 79.4 89.0 °C/W RθJB Junction-to-board thermal resistance 94.7 89.5 °C/W ΨJT Junction-to-top characterization parameter 25.2 45.5 °C/W ΨJB Junction-to-board characterization parameter 94.1 89.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics over operating free-air temperature range; typical values measured at TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT 2 V 0.7 1.5 VT+ Positive switching threshold 4.5 V 1.7 3.15 V 6 V 2.1 4.2 2 V 0.3 1.0 VT- Negative switching threshold 4.5 V 0.9 2.2 V 6 V 1.2 3.0 2 V 0.2 1.0 ΔVT Hysteresis (VT+ - VT-) 4.5 V 0.4 1.4 V 6 V 0.6 1.6 IOH = -20 µA 2 V to 6 V VCC – 0.1 VCC – 0.002 VOH High-level output voltage VI = VIH or VIL IOH = -6 mA 4.5 V 4.0 4.3 V IOH = -7.8 mA 6 V 5.4 5.75 IOL = 20 µA 2 V to 6 V 0.002 0.1 VOL Low-level output voltage VI = VIH or VIL IOL = 6 mA 4.5 V 0.18 0.30 V IOL = 7.8 mA 6 V 0.22 0.33 II Input leakage current VI = VCC or 0 6 V ±100 ±1000 nA ICC Supply current VI = VCC or 0, IO = 0 6 V 0.1 2 µA 4 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated Product Folder Links: SN74HCS7266 SN74HCS7266 www.ti.com SCLS788A –JANUARY 2020–REVISED MAY 2020 Electrical Characteristics (continued) over operating free-air temperature range; typical values measured at TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT Ci Input capacitance 2 V to 6 V 5 pF Power dissipation capacitance C No load 2 V to 6 V 10 pF pd per gate 6.6 Switching Characteristics CL = 50 pF; over operating free-air temperature range; typical values measured at TA = 25°C (unless otherwise noted). See Parameter Measurement Information. PARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN TYP MAX UNIT 2 V 14 40 tpd Propagation delay A or B Y 4.5 V 6 17 ns 6 V 5 16 2 V 9 16 tt
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