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Munich June 21-24, 2003 4 International Symposium on Laser Precision Microfabrication Munich June 21-24, 2003 Conference Chair Isamu Miyamoto, Osaka University, Japan Co-Chairs Andreas Ostendorf,Laser Zentrum Hannover, Germany Koji Sugioka, RIKEN, Japan Henry Helvajian; The Aerospace Corporation, USA Table of Contents Welcome........................................................................................................................................................1 List of Cooperating Organisations .................................................................................................................1 Invitation to Conference Opening (16th International Conference on Lasers and Electrooptics in Europe) 2 Committees....................................................................................................................................................3 Programme Overview....................................................................................................................................4 Dinner Invitations...........................................................................................................................................6 Oral Presentations: Session Overviews and Abstracts.................................................................................9 Opening Session: Overview on Laser Precision Microfabrication..................................................10 Session 1: Thin-film Processing .....................................................................................................13 Session 2: Fundamentals of fs-laser Processing ...........................................................................17 Session 3: Machining of Silica and Glass.......................................................................................21 Session 4: Manufacturing of Microsystems....................................................................................27 Session 5: Precise Structuring .......................................................................................................32 Session 6: Special Session on EUV Technology ...........................................................................38 Session 7, Part I: Micro-Welding and Melting.................................................................................43 Session 7, Part II: Micro-Welding and Melting ...............................................................................45 Session 8: Applications of fs-laser machining ................................................................................50 Session 9: Precision Marking .........................................................................................................53 Session 10: Drilling and Microcutting .............................................................................................56 Session 11: Laser nano-machining ................................................................................................62 Session 12: Manufacturing of Waveguides ....................................................................................66 Session 13: Dicing Processes ........................................................................................................69 Session 14: Post-Deadline Papers.................................................................................................72 Poster Session: Overview and Abstracts ....................................................................................................77 Index of Authors ..........................................................................................................................................93 Appendix......................................................................................................................................................95 LPM Proceedings Order Form........................................................................................................95 SPIE Copyright Form......................................................................................................................97 List of Sponsors...........................................................................................................................................99 Advertisements..........................................................................................................................................101 LPM 2003 – 4th International Symposium on Laser Microfabrication Munich June 21-24, 2003 Welcome to LPM 2003 The International Symposium on Laser Precision Microfabrication (LPM) focuses on science and technology of advanced laser processing for precision microfabrication. Considering the requests from all over the world, the fourth LPM (LPM 2003) is now Isamu Miyamoto held at Munich, Germany, in cooperation with WLT-Wissenschaftliche Gesellschaft Lasertechnik e.V. The last three LPM conferences have won reputation and popularity as Professor, Dr. one of the most important international meetings in the field of LPM in the world. Eng. LPM 2003 is planned as a four day event, and during the conference, you can also Osaka University enjoy “Laser 2003: World of Photonics” which is one of the largest international trade shows in laser and optics. The aim of LPM 2003 is to provide a forum for discussion of fundamental aspects of laser- material interaction, the state of the art of laser materials processing, and topics for the next generation by the collaboration among fundamental scientists, end users and laser manufactures. I do hope one can find out what technologies are limiting their real applications and future laser technologies to be developed through the papers presented by many world authorities invited to LPM 2003. Conference Chair Professor Dr. Eng. Isamu Miyamoto Osaka University, Japan Special Thanks to the LPM 2003 Cooperating Organizations JSPE - The Japan Society for Precision Engineering JSAP - The Japan Society of Applied Physics Mate 2003 JWS - The Japan Welding Society Mate 2003 - Committee of Micro Joining, The Japan Welding Society LSJ - The Laser Society of Japan JIEP - Japan Institute of Electronics Packaging - 1 - LPM 2003 – 4th International Symposium on Laser Microfabrication Munich June 21-24, 2003 Committees General Chair: Isamu Miyamoto (Osaka University, Japan) Co-Chairs: Andreas Ostendorf (Laser Zentrum Hannover, Germany) Koji Sugioka (RIKEN, Japan) Henry Helvajian (The Aerospace Corp., USA) __________________________________________________________________________________ Program Committee: Organizing Committee: David Ashkenasi (LMTB Berlin, Germany) Zhao-Gu Cheng (SIOFM, China) Dieter Bäuerle (Johannes Kepler University Linz, Friedrich Dausinger (University of Stuttgart, Germany) Austria) Gerd Eßer (Bavarian Laser Zentrum, Germany) Boris Chichkov (Laser Zentrum Hannover, Germany) Burkhard Fechner (Lambda Physik, Japan) Jan Dubowski (NRC, Canada) Jim Fieret (Exitech Ltd., UK) Friedrich Dausinger (University of Stuttgart, Germany) Kenshi Fukumitsu (Hamamatsu Photonics, Japan) Corey Dunsky (Electro Scientific Industries, USA) Arnold Gillner (Fraunhofer ILT, Germany) Gerd Eßer (Bavarian Laser Zentrum, Germany) M. H. Hong (DSI, Singapore) Arnold Gillner (Fraunhofer ILT, Germany) Tony Hoult (Coherent Inc, USA) Malcolm Gower (Exitech Ltd., UK) Juergen Ihlemann (Laser Laboratory Goettingen, Peter Herman (University of Toronto, Canada) Germany) Ingolf Hertel (Max-Born Institut Berlin, Germany) Narumi Inoue (National Defence Academy, Japan) James Horwitz (Naval Research Laboratories, USA) Takashi Ishide (Matsushita Heavy Industry, Japan) Hideo Hosono (Tokyo Institute of Technology, Japan) Shinichi Ishizaka (Japan Steel Works, Japan) Willem Hoving (Philips CFT, Netherlands) Yoshiro Ito (Nagaoka University of Technology, Yoshiro Ito (Nagaoka University of Technology, Japan) Japan) Takahisa Jitsuno (Osaka University, Japan) Kazuyoshi Itoh (Osaka University, Japan) Teruyoshi Kadoya (Trumph, Japan) Takahisa Jitsuno (Osaka University, Japan) Kazuo Kamada (Matsushita Electric Works, Japan) Klaus Koerber (Laser Zentrum Hannover, Germany) Hidehiko Karasaki (Matsushita Industrial Equipment, Vitali Konov (GPI, Russia) Japan) C. Lee (In-Ha University, Korea) Kojiro Kobayashi (Osaka University, Japan) Y. F. Lu (University of Nebraska, USA) Klaus Koerber (Laser Zentrum Hannover, Germany) Hiroshi Masuhara (Osaka University, Japan) Christian Kulik (Laser Zentrum Hannover, Germany) Johan Meijer (University of Twente, Netherlands) William P. Latham (Air Force Research Laboratories, Simon Metev (University of Bremen-BIAS, Germany) USA) Michel Meunier (Ecole Polytechnique Montreal, J. M. Lee (Samsung Electronics, Korea) Canada) Simon Metev (University of Bremen-BIAS, Germany) Hiroaki Misawa (Tokushima University, Japan) Hiroshi Miura (Shizuoka University, Japan) Hiroyuki Niino (AIST, Japan) Takashi Miyoshi (Osaka University, Japan) Jyunji Nishii (AIST-Kansai, Japan) Sumio Nakahara (Kansai University, Japan) Etsuji Ohmura (Osaka University, Japan) Hirokuni Namba (Sumitomo Electric Industry, Japan) Tatsuo Okada (Kyushu University, Japan) Hiroyuki Niino (AIST, Japan) Toshihiko Ooie (AIST-Shikoku, Japan) Satoru Nishio (Tohoku University, Japan) Raj Patel (IMRA America, USA) Klaus Nowitzki (OptecNet Deutschland, Germany) Alan Petersen (Spectra Physics, USA) Etsuji Ohmura (Osaka University, Japan) Juergen Reif (University of Cottbus, Germany) Toshihiko Ooie (AIST-Shikoku, Japan) Uwe Stamm (XTREME Technologies GmbH, Alberto Piqué (Naval Research Laboratories, USA) Germany)
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