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3.3 Volt Electronic Fuse NIS5431 Series +3.3 Volt Electronic Fuse The NIS5431 series is a cost effective, resettable fuse which can greatly enhance the reliability of a hard drive or other circuit from both catastrophic and shutdown failures. It is designed to buffer the load device from excessive input voltage which can damage sensitive circuits. It also includes an overvoltage www.onsemi.com clamp circuit that limits the output voltage during transients but does not shut the unit down, thereby allowing the load circuit to continue operation. 4.5 AMP, 3.3 VOLT ELECTRONIC FUSE Features • Integrated Power Device • Power Device Thermally Protected • No External Current Shunt Required • 40 mW Typical WDFN10 CASE 522AA • Internal Charge Pump • Internal Undervoltage Lockout Circuit • Internal Overvoltage Clamp MARKING DIAGRAM • ESD Ratings: Human Body Model (HBM); 2000 V 1 Pin Function Machine Model (MM); 200 V 31 1−5 SOURCE AYWG 6I • These are Pb−Free Devices and are RoHS Compliant G LIMIT+ 7ILIMIT− Typical Applications 8 Enable/Fault • 9 dv/dt Mother Board 10 GND • Hard Drives 11 (flag) VCC • Fan Drives 31 = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Features Package Shipping† NIS5431MT1TXG Thermal Latching WDFN10 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: November, 2015 − Rev. 1 NIS5431/D NIS5431 Series VCC Charge Enable Pump ENABLE/ FAULT SOURCE Thermal Current Shutdown Limit ILIMIT UVLO dv/dt Voltage dv/dt Clamp Control Figure 1. Block Diagram GND Table 1. FUNCTIONAL PIN DESCRIPTION Pin Function Description 1−5 Source This pin is the source of the internal power FET and the output terminal of the fuse. 7 ILimit A resistor between this pin and the source pin sets the overload and short circuit current limit levels. 8 Enable/Fault The enable/fault pin is a tri−state, bidirectional interface. It can be used to enable or disable the output of the device by pulling it to ground using an open drain or open collector device. If a ther- mal fault occurs, the voltage on this pin will go to an intermediate state to signal a monitoring cir- cuit that the device is in thermal shutdown. It can also be connected to another device in this fami- ly to cause a simultaneous shutdown during thermal events. 9 dv/dt The internal dv/dt circuit controls the slew rate of the output voltage at turn on. It has an internal capacitor that allows it to ramp up over a period of 1.4 ms. An external capacitor can be added to this pin to increase the ramp time. If an additional time delay is not required, this pin should be left open. 10 Ground Negative input voltage to the device. This is used as the internal reference for the IC. 11 (belly pad) VCC Positive input voltage to the device. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage, operating, steady−state (VCC to GND, Note 1) VIN −0.6 to 14 V Thermal Resistance, Junction−to−Air qJA °C/W 0.1 in2 copper (Note 2) 227 0.5 in2 copper (Note 2) 95 Thermal Resistance, Junction−to−Lead (Pin 1) qJL 27 °C/W Thermal Resistance, Junction−to−Case qJC 20 °C/W Total Power Dissipation @ TA = 25°C Pmax 1.3 W Derate above 25°C 10.4 mW/°C Operating Temperature Range (Note 3) TJ −40 to 150 °C Nonoperating Temperature Range TJ −55 to 155 °C Lead Temperature, Soldering (10 Sec) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Negative voltage will not damage device provided that the power dissipation is limited to the rated allowable power for the device. 2. 1 oz copper, double−sided FR4. 3. Thermal limit is set above the maximum thermal rating. It is not recommended to operate this device at temperatures greater than the maximum ratings for extended periods of time. www.onsemi.com 2 NIS5431 Series ELECTRICAL CHARACTERISTICS (Unless otherwise noted: VCC = 3.3 V, CIN = 2.2 mF, C L = 70 mF, dv/dt pin open, TA = 25°C unless otherwise noted.) Characteristics Symbol Min Typ Max Unit POWER FET Delay Time (enabling of chip to ID = 100 mA with 1 A resistive load) Tdly 10 200 475 ms ON Resistance (Note 4) RDS(on) 35 45 55 mW TJ = 140°C (Note 5) 65 Off State Output Voltage Voff 50 200 mV (VCC = 10 Vdc, VGS = 0 Vdc, RL = 100 kW) Output Capacitance Cout 230 pF (VDS = 3.3 VDC, VGS = 0 VDC, RL = R) 2 Continuous Current (TA = 25°C, 0.5 in pad) (Note 5) ID 4.5 A (T = 80°C, minimum copper) 1.7 A ID THERMAL LATCH Shutdown Temperature (Note 5) TSD 150 175 200 °C Thermal Hysteresis (Decrease in die temperature for turn on, does not THyst 45 °C apply to latching parts) UNDER/OVERVOLTAGE PROTECTION VOUT Maximum (VCC = 10 V) Vout−clamp 3.6 3.85 4.10 V Undervoltage Lockout (Turn on, Voltage Going High) VUVLO 1.91 2.35 2.5 V UVLO Hysteresis VHyst 0.055 0.10 0.25 V CURRENT LIMIT Hold Current Limit (Note 6) (RLIMIT = 10 W) IHOLD 2.2 A Trip Current Limit (Note 6) (RLIMIT = 10 W) ITRIP 3.1 A dv/dt CIRCUIT Output Voltage Ramp Time (Enable to VOUT = 3.0 V) tslew 0.30 0.60 1.2 ms Maximum Capacitor Voltage Vmax VCC V ENABLE/FAULT Logic Level Low (Output Disabled) Vin−low 0.35 0.81 V Logic Level Mid (Thermal Fault, Output Disabled) Vin−mid 0.82 1.4 1.95 V Logic Level High (Output Enabled) Vin−high 1.96 2.2 3.5 V High State Maximum Voltage Vin−max 2.51 3.3 5.2 V Logic Low Sink Current (Venable = 0 V) Iin−low −12 −20 mA Logic High Leakage Current for External Switch (Venable = 3.3 V) Iin−leak 1.0 mA Maximum Fanout for Fault Signal (Total number of chips that can be Fan 3.0 Units connected to this pin for simultaneous shutdown) TOTAL DEVICE Bias Current (Operational) IBias 400 750 mA Bias Current (Shutdown) IBias 80 mA Minimum Operating Voltage (Notes 5 and 7) Vmin 2.5 V 4. Pulse test: Pulse width 300 ms, duty cycle 2%. 5. Verified by design. 6. Refer to explanation of short circuit and overload conditions in application note AND8140/D. 7. Device will shut down prior to reaching this level based on actual UVLO trip point. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NIS5431 Series 11 1 3.3 V VCC 2 3 SOURCE 4 5 NIS5431 RS 7 ILIMIT 8 6 ENABLE ILIMIT GND dv/dt LOAD ENABLE 10 9 GND Figure 2. Typical Application Circuit 3.3 V 5 V or 12 V VCC VCC SOURCE SOURCE ILIMIT+ RS NIS5431 NISxxxx I ILIMIT− LIMIT ENABLE ENABLE dv/dt GND GND dv/dt LOAD LOAD ENABLE Figure 3. Common Thermal Shutdown APPLICATION INFORMATION Basic Operation The device will remain on as long as the temperature does This device is a self−protected, resettable, electronic fuse. not exceed the 175°C limit that is programmed into the chip. It contains circuits to monitor the input voltage, output The current limit circuit does not shut down the part but will voltage, output current and die temperature. reduce the conductivity of the FET to maintain a constant On application of the input voltage, the device will apply current at the internally set current limit level. The input the input voltage to the load based on the restrictions of the overvoltage clamp also does not shutdown the part, but will controlling circuits. The dv/dt of the output voltage will be limit the output voltage to the Vout−clamp value in the event controlled by the internal dv/dt circuit. The output voltage that the input exceeds that level. will slew from 0 V to the rated output voltage in 0.6 ms, An internal charge pump provides bias for the gate voltage unless additional capacitance is added to the dv/dt pin. of the internal n−channel power FET and also for the current limit circuit. The remainder of the control circuitry operates between the input voltage (VCC) and ground. www.onsemi.com 4 NIS5431 Series Current Limit The ramp time from 0 to the nominal output voltage can The current limit circuit uses a SENSEFET along with a be determined by the following equation, where t is in reference and amplifier to control the peak current in the seconds: device. The SENSEFET allows for a small fraction of the t + 8.25 E5 @ C load current to be measured, which has the advantage of 0−3 ext reducing the losses in the sense resistor as well as increasing Where: the value and decreasing the power rating of the sense C is in Farads resistor. Sense resistors are typically in the tens of ohms t is in Seconds range with power ratings of several milliwatts making them Any time that the unit shuts down due to a fault, enable very inexpensive chip resistors.
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