DOCSLIB.ORG

BU97530KVT MAX 445 Segment(89Segx5com)

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
BU97530KVT MAX 445 Segment(89Segx5com) Datasheet LCD Segment Drivers Multi-function LCD Segment Drivers BU97530KVT MAX 445 Segment(89SEGx5COM) General Description Key Specifications The BU97530KVT is 1/5, 1/4, 1/3 duty or Static ■ Supply Voltage Range: +2.7V to +6.0V General-purpose LCD driver. The BU97530KVT can ■ Operating Temperature Range: -40°C to +85°C drive up to 445 LCD Segments directly. The ■ Max Segments: 445 Segments BU97530KVT can also control up to 9 General-purpose ■ Display Duty Static, 1/3, 1/4, 1/5 Selectable output pins / 9 PWM output pins. ■ Bias: 1/2, 1/3 Selectable These products also incorporate a key scan circuit that ■ Interface: 3wire Serial Interface accepts input from up to 30 keys to reduce printed circuit board wring. Features Package W (Typ) x D (Typ) x H (Max) Key Input Function for up to 30 Keys (A key scan is performed only when a key is pressed.) Either 1/5, 1/4, 1/3 Duty or Static Can be Selected with the Serial Control Data. 1/5 Duty Drive: Up to 445 Segments can be Driven 1/4 Duty Drive: Up to 360 Segments can be Driven 1/3 Duty Drive: Up to 270 Segments can be Driven Static Drive: Up to 90 Segments can be Driven Selectable Display Frame Frequency for Common and Segment Output Waveforms. Configurable Output Pin to Segment Output / PWM Output / General-purpose Output.(Max 9 Pins) Built-in OSC Circuit TQFP100V Integrated Voltage Detection Type Reset Circuit 16.00mm x 16.00mm x 1.20mm (VDET) No External Component Low Power Consumption Design Supports Line and Frame Inversion Applications Car Audio, Home Electrical Appliance, Meter Equipment etc. Typical Application Circuit Key Matrix (P1/G1) (General purpose/PWM ports) (P9/G9) (For use control of backlight) KS1/S79 KI1/S85 | | COM1 KS6/S84 KI5/S89 COM2 COM3 COM4 COM5/S78 LCD Panel S1/P1/G1 +5V VDD (Up to 445 (Note) Segments) S9/P9/G9 S10 From SCE SCL Control SDI S77 OSC/S90 To Control SDO (Note) Insert capacitors between VDD and VSS C≥0.1µF Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays. www.rohm.com TSZ02201-0P4P0D300570-1-2 © 2014 ROHM Co., Ltd. All rights reserved. 1/56 TSZ22111 • 14 • 001 11.Jan.2019 Rev.005 BU97530KVT Block Diagram ・・・ ・・・ S9/P9/G9 S76 S75 S77 S10 S1/P1/G1 COM1 COM4 COM2 COM3 COM5/S78 COMMON Driver SEGMENT Driver/Latch Clock /Timing OSC / S90 Control Register Generator PWM Register SCE Shift Register SCL Serial Interface SDI LCD voltage Generator SDO KEY BUFFER VLCD VDD VLCD1 VDET KEY SCAN VLCD2 VSS VSS KS4/ S82 KS4/ KI4 /KI4 S88 KI2 / S86 KI2 KI1 /KI1 S85 KI3 / S87 KS6/ S84 KS6/ KS3/ S81 KS3/ KS5/ S83 KS5/ KS1/ S79 KS1/ KI5 /KI5 S89 KS2/ S80 KS2/ Figure 2. Block Diagram Pin Arrangement S63 S61 S60 S59 S57 S56 S55 S54 S53 S52 S51 S73 S72 S71 S69 S68 S67 S66 S65 S64 S62 S58 S75 S74 S70 51 75 76 50 S76 S50 S77 S49 COM5/S78 S48 COM4 S47 COM3 S46 COM2 S45 COM1 S44 KS1/S79 S43 KS2/S80 S42 KS3/S81 S41 KS4/S82KS4/S8 S40 2 KS5/S83KS5/S8 S39 3 KS6/S84KS6/S8 S38 4 KI1/S85 S37 KI2/S86 S36 KI3/S87 S35 S34 KI4/S88 KI5/S89 S33 VDD S32 SDODO S31 VSS S30 OSC/S90 S29 SCECE S28 SCLCL S27 SDIDI S26 100 26 1 25 S10 S11 S12 S13 S14 S15 S16 S17 S18 S19 S20 S21 S22 S23 S24 S25 S9/P9/G9 S7/P7/G7 S8/P8/G8 S1/P1/G1 S5/P5/G5 S6/P6/G6 S2/P2/G2 S3/P3/G3 S4/P4/G4 Figure 3. Pin Configuration(TOP VIEW) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ02201-0P4P0D300570-1-2 2/56 TSZ22111 • 15 • 001 11.Jan.2019 Rev.005 BU97530KVT Absolute Maximum Ratings(VSS = 0.0V) Parameter Symbol Pin / Conditions Ratings Unit Maximum Supply Voltage VDD VDD -0.3 to +7.0 V VIN1 SCE, SCL, SDI, OSC -0.3 to +7.0 V Input Voltage VIN2 KI1 to KI5 -0.3 to +7.0 V Allowable Loss Pd - 1.49(Note) W Operating Temperature Topr - -40 to +85 °C Storage Temperature Tstg - -55 to +125 °C (Note) Derate by 1.49mW/°C when operating above Ta=25°C (when mounted in ROHM’s standard board). (Board size: 70mm×70mm×1.6mm material: FR4 board copper foil: land pattern only) Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2:Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Recommended Operating Conditions (Ta = -40°C to +85°C, VSS = 0.0V) Ratings Parameter Symbol Conditions Unit Min Typ Max Supply Voltage VDD - 2.7 5.0 6.0 V Electrical Characteristics (Ta = -40°C to +85°C, VDD = 2.7V to 6.0V, VSS = 0.0V) Limit Parameter Symbol Pin Conditions Unit Min Typ Max VH1 SCE, SCL, SDI, OSC - - 0.03VDD - Hysteresis V VH2 KI1 to KI5 - - 0.1VDD - Power-on Detection V VDD - 1.4 1.8 2.2 V Voltage DET VIH1 SCE, SCL, SDI, OSC 4.0V ≤ VDD ≤ 6.0V 0.4VDD - VDD “H” Level Input Voltage VIH2 SCE, SCL, SDI, OSC 2.7V ≤ VDD < 4.0V 0.8VDD - VDD V VIH3 KI1 to KI5 - 0.7VDD - VDD SCE, SCL, SDI, OSC “L” Level Input Voltage V - 0 - 0.2VDD V IL1 KI1 to KI5 Input Floating Voltage VIF KI1 to KI5 - - - 0.05VDD V Pull-down Resistance RPD KI1 to KI5 VDD=5.0V 50 100 250 kΩ Output Off Leakage I SDO V =6.0V - - 6.0 µA Current OFFH O “H” Level Input Current IIH1 SCE, SCL, SDI, OSC VI = 5.5V - - 5.0 µA “L” Level Input Current IIL1 SCE, SCL, SDI, OSC VI = 0V -5.0 - - µA I = -20µA, V S1 to S90 O VDD-0.9 - - OH1 VLCD=1.00*VDD I = -100µA, V COM1 to COM5 O VDD-0.9 - - “H” Level OH2 VLCD=1.00*VDD V Output Voltage VOH3 P1/G1 to P9/G9 IO = -1mA VDD-0.9 - - VOH4 KS1 to KS6 IO = -500µA VDD-1.0 VDD-0.5 VDD-0.2 VOL1 S1 to S90 IO = 20µA - - 0.9 VOL2 COM1 to COM5 IO = 100µA - - 0.9 “L” Level V P1/G1 to P9/G9 I = 1mA - - 0.9 V Output Voltage OL3 O VOL4 KS1 to KS6 IO = 25µA 0.2 0.5 1.5 VOL5 SDO IO = 1mA - 0.1 0.5 1/2 Bias I = ±20µA 1/2VDD 1/2VDD V S1 to S90 O - MID1 VLCD=1.00*VDD -0.9 +0.9 1/2 Bias I = ±100µA 1/2VDD 1/2VDD V COM1 to COM5 O - MID2 VLCD=1.00*VDD -0.9 +0.9 1/3 Bias I = ±20µA 2/3VDD 2/3VDD V S1 to S90 O - Middle Level MID3 VLCD=1.00*VDD -0.9 +0.9 V Output Voltage 1/3 Bias I = ±20µA 1/3VDD 1/3VDD V S1 to S90 O - MID4 VLCD=1.00*VDD -0.9 +0.9 1/3 Bias I = ±100µA 2/3VDD 2/3VDD V COM1 to COM5 O - MID5 VLCD=1.00*VDD -0.9 +0.9 1/3 Bias I = ±100µA 1/3VDD 1/3VDD V COM1 to COM5 O - MID6 VLCD=1.00*VDD -0.9 +0.9 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ02201-0P4P0D300570-1-2 3/56 TSZ22111 • 15 • 001 11.Jan.2019 Rev.005 BU97530KVT Electrical Characteristics– continued Limit Parameter Symbol Pin Conditions Unit Min Typ Max IDD1 VDD Power-saving mode - - 15 VDD = 5.0V Output open IDD2 VDD 1/2 Bias - 100 200 Frame frequency=80Hz Current Consumption VLCD=1.00*VDD µA VDD = 5.0V Output open IDD3 VDD 1/3 Bias - 130 250 Frame frequency=80Hz VLCD=1.00*VDD Oscillation Characteristics (Ta = -40°C to +85°C, VDD = 2.7V to 6.0V, VSS = 0.0V) Limit Parameter Symbol Pin Conditions Unit Min Typ Max Oscillator Frequency 1 fOSC1 - VDD = 2.7V to 6.0V 300 - 720 kHz Oscillator Frequency 2 fOSC2 - VDD = 5V 510 600 690 kHz External Clock f 30 - 1000 kHz Frequency(Note) OSC3 External clock mode External Clock Rise Time tr OSC/S90 - 160 - ns (OC=1) External Clock Fall Time tf - 160 - ns External Clock Duty tDTY 30 50 70 % (Note) Frame frequency is decided external clock and dividing ratio of FC0,FC1,FC2,FC3 setting. [Reference Data] 700 650 VDD = 6.0V 600 VDD = 5.0V 550 VDD = 3.3V 500 fosc[kHz] 450 VDD = 2.7V 400 350 300 -40 -20 0 20 40 60 80 Temperature[°C] Figure 4. Oscillator Frequency Typical Temperature Characteristics www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ02201-0P4P0D300570-1-2 4/56 TSZ22111 • 15 • 001 11.Jan.2019 Rev.005 BU97530KVT MPU Interface Characteristics (Ta = -40°C to +85°C, VDD = 2.7V to 6.0V, VSS = 0.0V) Limit Parameter Symbol Pin Conditions Unit Min Typ Max Data Setup Time tDS SCL, SDI - 120 - - ns Data Hold Time tDH SCL, SDI - 120 - - ns SCE Wait Time tCP SCE, SCL - 120 - - ns SCE Setup Time tCS SCE, SCL - 120 - - ns SCE Hold Time tCH SCE, SCL - 120 - - ns Clock Cycle Time tCCYC SCL - 320 - - ns High-level Clock Pulse t SCL - 120 - - ns Width CHW Low-level Clock Pulse t SCL - 120 - - ns Width (Write) CLWW Low-Level Clock Pulse RPU=4.7kΩ tCLWR SCL (Note) 1.6 - - µs Width (Read) CL=10pF Rise Time tr SCE, SCL, SDI - - 160 - ns Fall Time tf SCE, SCL, SDI - - 160 - ns RPU=4.7kΩ SDO Output Delay Time tDC SDO (Note) - - 1.5 µs CL=10pF RPU=4.7kΩ SDO Rise Time tDR SDO (Note) - - 1.5 µs CL=10pF (Note) Since SDO is an open-drain output, “tDC” and “tDR” depend on the resistance of the pull-up resistor RPU and the load capacitance CL.
Load more

Recommended publications
  • Thierry Moreau
    Compilation and Hardware Support for Approximate Acceleration Thierry Moreau, Adrian Sampson, Andre Baixo, Mark Wyse, Ben Ransford, Jacob Nelson, Hadi Esmaeilzadeh (Georgia Tech), Luis Ceze and Mark Oskin University of Washington [email protected] Theme: 2384.004 1 Thierry Moreau Approximate Computing Aims to exploit application resilience to trade-off quality for efficiency 2 Thierry Moreau Approximate Computing 3 Thierry Moreau Approximate Computing ✅ Accurate ✅ Approximate ❌ Expensive ✅ Cheap 4 Thierry Moreau 5 Thierry Moreau 6 Thierry Moreau 7 Thierry Moreau Neural Networks as Approximate Accelerators CPU Esmaeilzadeh et al. [MICRO 2012] 8 Thierry Moreau Neural Acceleration float foo (float a, float b) { AR F … NPUM P G return val; approximation acceleration } 9 Thierry Moreau Neural Acceleration compiler-support float foo (float a, float b) { AR F … NPUM P G return val; approximation acceleration } ACCEPT* *Sampson et. al [UW-TR] 10 Thierry Moreau Neural Acceleration compiler-support HW-support float foo (float a, float b) { AR F … NPUM P G return val; approximation acceleration } ACCEPT SNNAP* *Moreau et. al [HPCA2015] 11 Thierry Moreau Neural Acceleration compiler-support HW-support float foo (float a, float b) { AR F … NPUM P G return val; approximation acceleration } ACCEPT SNNAP 3.8x speedup and 2.8x efficiency - 10% error 12 Thierry Moreau Talk Outline Introduction Compiler Support with ACCEPT SNNAP Accelerator design Evaluation & Comparison with HLS 13 Thierry Moreau Compilation Overview code 1. Region detection annotation 14 Thierry Moreau Compilation Overview ACCEPT code region detection 1. Region detection & program annotation instrumentation 15 Thierry Moreau Compilation Overview ACCEPT code region detection 1. Region detection & program annotation instrumentation back prop.
    [Show full text]
  • Heater Element Specifications Bulletin Number 592
    Technical Data Heater Element Specifications Bulletin Number 592 Topic Page Description 2 Heater Element Selection Procedure 2 Index to Heater Element Selection Tables 5 Heater Element Selection Tables 6 Additional Resources These documents contain additional information concerning related products from Rockwell Automation. Resource Description Industrial Automation Wiring and Grounding Guidelines, publication 1770-4.1 Provides general guidelines for installing a Rockwell Automation industrial system. Product Certifications website, http://www.ab.com Provides declarations of conformity, certificates, and other certification details. You can view or download publications at http://www.rockwellautomation.com/literature/. To order paper copies of technical documentation, contact your local Allen-Bradley distributor or Rockwell Automation sales representative. For Application on Bulletin 100/500/609/1200 Line Starters Heater Element Specifications Eutectic Alloy Overload Relay Heater Elements Type J — CLASS 10 Type P — CLASS 20 (Bul. 600 ONLY) Type W — CLASS 20 Type WL — CLASS 30 Note: Heater Element Type W/WL does not currently meet the material Type W Heater Elements restrictions related to EU ROHS Description The following is for motors rated for Continuous Duty: For motors with marked service factor of not less than 1.15, or Overload Relay Class Designation motors with a marked temperature rise not over +40 °C United States Industry Standards (NEMA ICS 2 Part 4) designate an (+104 °F), apply application rules 1 through 3. Apply application overload relay by a class number indicating the maximum time in rules 2 and 3 when the temperature difference does not exceed seconds at which it will trip when carrying a current equal to 600 +10 °C (+18 °F).
    [Show full text]
  • K-12 Individual No. Name Team Gr Rate Pts Tbrk1 Tbrk2 Tbrk3 Tbrk4
    K-12 Individual No. Name Team Gr Rate Pts TBrk1 TBrk2 TBrk3 TBrk4 Rnd1 Rnd2 Rnd3 Rnd4 Rnd5 Rnd6 1 Chakraborty, Dipro 11 2299 5.5 21 24 43 20.5 W27 W12 W5 W32 W8 D3 State Champion, AZ Denker Representative 2 Yim, Tony Sung BASISS 8 2135 5 20.5 23.5 38.5 17.5 W24 W10 D3 D16 W11 W9 3 Aletheia-Zomlefer, Soren CHANPR 11 1961 5 20 23 35.5 18.5 W25 W26 D2 W40 W15 D1 4 Desmarais, Nicholas Eduard NOTRED 10 1917 5 18 20 33 18 W39 W23 W18 L15 W10 W8 5 Wong, Kinsleigh Phillip CFHS 10 1992 4.5 20 20 24.5 15 -X- W17 L1 W26 D7 W15 6 Todd, Bryce BASISC 10 1923 4.5 17 19 26.5 14.5 W38 D18 L9 W23 W21 W16 7 Chaliki, Kalyan DSMTHS 9 1726 4.5 17 18.5 26 15 W46 L16 W28 W22 D5 W17 8 Li, Bohan UHS 9 2048 4 22 25 29 18 W30 W11 W45 W9 L1 L4 9 Mittal, Rohan CFHS 9 1916 4 19.5 20.5 23 17 W47 W22 W6 L8 W20 L2 10 Pennock, Joshua CFHS 10 1682 4 19 22 24 14 W31 L2 W25 W21 L4 W29 11 Aradhyula, Sumhith CFHS 9 1631 4 18 20 22 14 W41 L8 W38 W13 L2 W19 12 Johnston, Nicolas Godfrey CFHS 9 1803 4 18 19.5 21 13 W43 L1 W29 L17 W24 W20 13 Martis, Tyler BRHS 12 1787 4 17 18 21 13 W42 L15 W24 L11 W18 W22 14 Plumb, Justin Rodney GCLACA 10 1700 4 16 17 20 13 W51 L32 W19 L20 W28 W27 15 Martinez, Isaac GLPREP 10 2159 3.5 21.5 24.5 27.5 16 W28 W13 D16 W4 L3 L5 16 Chen, Derek H CFHS 10 1965 3.5 21 23.5 26 15.5 W35 W7 D15 D2 D17 L6 17 Woodson, Tyler GILBHS 1640 3.5 19 19 17.5 14 W50 L5 W30 W12 D16 L7 18 Cancio, Aiya CFHS 9 1469 3.5 18.5 20 17.5 12.5 W36 D6 L4 W46 L13 W25 AZ Girls' Invitational Representative 19 Folden, Kurt CHANPR 10 1207 3 14 18 12 10 L32 W50 L14 W31 W23 L11 20 Thornton,
    [Show full text]
  • BU91530KVT-M : Display Drivers
    Datasheet LCD Segment Drivers Multi-function LCD Segment Drivers BU91530KVT-M MAX 445 Segment(89SEGx5COM) General Description Key Specifications The BU91530KVT-M is 1/5, 1/4, 1/3 or 1/1 duty ■ Supply Voltage Range: +2.7V to +6.0V general-purpose LCD driver that can be used for ■ Operating Temperature Range: -40°C to +85°C frequency display in electronic tuners under the control of ■ Max Segments: 445 Segments a microcontroller. The BU91530KVT-M can drive up to ■ Display Duty 1/1, 1/3, 1/4, 1/5 Selectable 445 LCD Segments directly. The BU91530KVT-M can ■ Bias: 1/2, 1/3 Selectable also control up to 9 general-purpose output ports. ■ Interface: 3wire Serial Interface These products also incorporate a key scan circuit that accepts input from up to 30 keys to reduce printed circuit board wring. Package W (Typ.) x D (Typ.) x H (Max.) Features AEC-Q100 Qualified (Note1) Key input function for up to 30 keys (A key scan is performed only when a key is pressed.) Either 1/5, 1/4, 1/3 or 1/1 duty (static) can be selected with the serial control data. 1/5 duty drive: Up to 445 segments can be driven 1/4 duty drive: Up to 360 segments can be driven 1/3 duty drive: Up to 270 segments can be driven 1/1 duty drive: Up to 90 segments can be driven Serial Data Control of frame frequency for common and segment output waveforms. Serial data control of switching between the segment TQFP100V output port , PWM output port and general-purpose 16.00mm x 16.00mm x 1.20mm output port functions.(Max 9 ports) Built-in OSC circuit Integrated Power-on Reset Circuit No external component Low power consumption design Supports Line and Frame Inversion (Note1) Grade 3 Applications Car Audio, Home Electrical Appliance, Meter Equipment etc.
    [Show full text]
  • NEMA Motor Control
    Bulletin Eutectic Alloy Overload Relays Heater Elements Selection For Application on Bulletin 100/500/609/1200 Line Starters Eutectic Alloy Overload Relay Heater Elements Heater Element Selection Type J — CLASS 10 Table of Contents 0 Type P — CLASS 20 (Bul. 600 ONLY) Type W — CLASS 20 Overload Relay Type WL — CLASS 30 Class Designation...... this page Heater Element Selection ....................... this page 1 Type W Heater Elements Ambient Temperature Correction..................... this page Time — Current Characteristics............ 1-169 2 Index to Heater Element Selection Tables ............................. 1-170 3 Description The following is for motors rated for Continuous Duty: For motors with marked service factor of not less than 1.15, or Overload Relay Class Designation motors with a marked temperature rise not over +40 °C United States Industry Standards (NEMA ICS 2 Part 4) designate an (+104 °F), apply application rules 1 through 3. Apply application 4 overload relay by a class number indicating the maximum time in rules 2 and 3 when the temperature difference does not exceed seconds at which it will trip when carrying a current equal to 600 +10 °C (+18 °F). When the temperature difference is greater, see percent of its current rating. below. A Class 10 overload relay will trip in 10 seconds or less at a current 1. The Same Temperature at the Controller and the Motor — equal to 600 percent of its rating. Select the “Heater Type Number” with the listed “Full Load 5 Amperes” nearest the full load value shown on the motor A Class 20 overload relay will trip in 20 seconds or less at a current nameplate.
    [Show full text]
  • Nuclear Weapons Databook, Volume I 3 Stockpile
    3 Stockpile Chapter Three USNuclear Stockpile This section describes the 24 types of warheads cur- enriched uranium (oralloy) as its nuclear fissile material rently in the U.S. nuclear stockpile. As of 1983, the total and is considered volatile and unsafe. As a result, its number of warheads was an estimated 26,000. They are nuclear materials and fuzes are kept separately from the made in a wide variety of configurations with over 50 artillery projectile. The W33 can be used in two differ- different modifications and yields. The smallest war- ent yield configurations and requires the assembly and head is the man-portable nuclear land mine, known as insertion of distinct "pits" (nuclear materials cores) with the "Special Atomic Demolition Munition" (SADM). the amount of materials determining a "low" or '4high'' The SADM weighs only 58.5 pounds and has an explo- yield. sive yield (W54) equivalent to as little as 10 tons of TNT, In contrast, the newest of the nuclear warheads is the The largest yield is found in the 165 ton TITAN I1 mis- W80,5 a thermonuclear warhead built for the long-range sile, which carries a four ton nuclear warhead (W53) Air-Launched Cruise Missile (ALCM) and first deployed equal in explosive capability to 9 million tons of TNT, in late 1981. The W80 warhead has a yield equivalent to The nuclear weapons stockpile officially includes 200 kilotons of TNT (more than 20 times greater than the only those nuclear missile reentry vehicles, bombs, artil- W33), weighs about the same as the W33, utilizes the lery projectiles, and atomic demolition munitions that same material (oralloy), and, through improvements in are in "active service."l Active service means those electronics such as fuzing and miniaturization, repre- which are in the custody of the Department of Defense sents close to the limits of technology in building a high and considered "war reserve weapons." Excluded are yield, safe, small warhead.
    [Show full text]
  • Waukesha W68 & W88 Series
    INSTRUCTION MANUAL W68 and W88 Series THROTTLING/PRESSURE CONTROL VALVES FORM NO.: 95-03043 REVISION: 02/2013 READ AND UNDERSTAND THIS MANUAL PRIOR TO OPERATING OR SERVICING THIS PRODUCT. SPX Flow Technology 611 Sugar Creek Road Delavan, WI 53115 USA Tel: (800) 252-5200 or (262) 728-1900 Fax: (800) 252-5012 or (262) 728-4904 E-mail: [email protected] Web site: www.spxft.com Information contained in this manual is subject to change Copyright © 2013 SPX Corporation. without notice and does not represent a commitment on the All Rights Reserved. part of SPX Corporation. No part of this manual may be reproduced or transmitted in any form or by any means, Never-Seez is a registered trademark of Bostik Findley. electronic or mechanical, including photocopying and Dow Corning is a registered trademark of Dow Corning Corporation. recording, for any purpose, without the express written per- Loctite is a registered trademark of Henkel Loctite Corporation, U.S.A. mission of SPX Corporation. Revision Date: 02/2013 Publication: 95-03043 Table of Contents Waukesha Cherry-Burrell Warranty ................................................................................................................... 6 Shipping Damage or Loss ........................................................................................................6 Warranty Claim ........................................................................................................................6 Safety .......................................................................................................................
    [Show full text]
  • High School Championship -- Standings
    2017 TCA South Texas State Scholastic Championships: High School Championship -- Standings # Place Name ID Rtng Post Team Rd 1 Rd 2 Rd 3 Rd 4 Rd 5 Rd 6 Rd 7 Tot TBrk[M] TBrk[M] TBrk[S] TBrk[R] TBrk[C] 1 1 Priya Niki Trakru 13806686 2013 2033 STSTMAW63 W53 W18 W25 W12 W2 W6 7.0 30.5 24.5 34.5 34 28 2 2-5 Camille Y Kao 14297024 1969 1968 W85 W82 W32 W20 W11 L1 W15 6.0 29 22 32 25.5 26 3 Polo Stein 14275794 1709 1726 SBSBHSW69 W58 D10 W14 W27 D6 W16 6.0 28 22.5 31.5 27.25 24.5 4 Genta Kaieda 14354622 1888 1877 SHSHS W52 W41 L39 W43 W25 W22 W17 6.0 26.5 21.5 30.5 26.5 23 5 Fabian Olivares 13958918 1614 1656 SBSBHSW78 W16 W54 L39 W41 W11 W13 6.0 26.5 21.5 30 26.5 24 6 6-9 Jonathan Huerta 14086076 1748 1757 BRHHECHSW87 W111 W49 W26 W39 D3 L1 5.5 28.5 21.5 30.5 21 26 7 Satya G Holla 14354691 1698 1704 STSATSW72 W91 W33 L11 W26 W20 D8 5.5 27.5 22 30.5 23.25 23.5 8 Ritik Verma 13745958 1927 1903 CCVETERAW126 L44 W73 W30 W10 W36 D7 5.5 27 21.5 28.5 22.25 21.5 9 Jesus Guillen Jr 13762512 1791 1766 BRHHECHSW73 W108 L26 W111 D31 W40 W29 5.5 23.5 19 25.5 19.25 21.5 10 10-24 Nicholas Galindo 14494914 1390 1530 BRPORTERW99 W67 D3 W29 L8 W31 D12 5.0 29 23 32 21 22 11 Glen Ernest Rocha 16122046 1459 1543 HREARLYW65 W56 W84 W7 L2 L5 W44 5.0 29 23 32 20 23 12 Jorge Hernandez 14281624 1611 1617 SHSHS W51 W68 W44 W40 L1 D19 D10 5.0 29 22 32.5 20.5 23.5 13 Michael D Thomas 14793323 1783 1750 SBVMA W75 L43 W87 W42 W32 W28 L5 5.0 26.5 20.5 29.5 19.5 21 14 Jose Castillo Jr 14085711 1493 1504 BRHHECHSD103 W64 W35 L3 D30 W43 W40 5.0 26.5 20.5 29 19.5 19 15 Luis Ferna
    [Show full text]
  • DNA1.94Og27.Ool G
    DNA1.94Og27.Ool g No. Pub. Year Citations File Name File Size (bytes) 5 1967-1968 857 RADBIB05.TXT 791,604 The search criteria was for radiation or radiological for publication year greater than 1966 and less than 1969. The document database four character field names and a descriptor for each. field are as follows: ABS Abstract ACCD Accession Date ADNO DTIC Number ---*->*h I AUTH Author (s) CCDE Computer Code ( s ) CLSS Classification CONN Contract Number CORP Corporation DATE Report Date DESC Descriptor (s) EFFT Damage Mechanism EMPF Electro Magnetic Pulse File number(s) HESO High Explosive Shot(s) INUM Item Number LA Country or Language PROJ Project Number REPN Report Number SHOT Nuclear Test (s) SUCE Device Designation SUJO DASIAC Subject number(s) SYMJ Published in SYST System Affected TEMP Document Control number(s) TITL Report Title TNFF Tactical Nuclear Warfare TREE Transient Radiation Effects on Electronics number(s) TSHO Shot. Type Statement A Approved for public release;* Distribution unlirnited.ZMi-d=- .folddata Report Log for Bibliography Report 'bibliography' scheduled as 'radbib' Bibliography using full text searching with selection qualification. STILAS text selection v6.2 started on Monday, June 13, 1994, 10:45 AM Search will use the KUNI database Search strings will be read from standard input The catalog key will be written to standard output 19940613104505 BRS/Search-Engine v.5 started for seltextl 11379 records found for #1: RADIATION OR RADIOLOGICAL 1 searches considered 1 searches selected. STILAS text selection finished on Monday, June 13, 1994, 10:49 AM STILAS catalog selection v6.2 started on Monday, June 13, 1994, 10:45 Ah4 Catalog key will be read from standard input The catalog key will be written to standard output The author key will be written to standard output The title key will be written to standard output Catalog will be selected if year-ofjub is more than 1968 and less than 1971 11379 catalog record(s) considered 893 catalog record(s) selected.
    [Show full text]
  • How Much Warhead Reliability Is Enough for a Comprehensive Nuclear Test Ban Treaty?
    How Much Warhead Reliability Is Enough for a Comprehensive Nuclear Test Ban Treaty? David Hafemeister I. Introduction The National Nuclear Security Administration (NNSA) selected the winning design from the two nuclear weapons laboratories for the reliable replacement warhead (RRW) on March 2, 2007. The winning design by the Lawrence–Livermore National Laboratory was the more cautious design, and had been tested previously. The Los Alamos design was more creative, but had not been nuclear tested. With the Cold War over, NNSA is planning to make warheads that are less constrained in weight and, in principle, more reliable. The Congress and the Executive Branch have agreed that RRW will not be tested before it enters the stockpile. Of course, this does not guarantee that the decision not to test could not be reversed in the future. The JASON group will comment on the RRW designs during the next year and the American Association for the Advancement of Science will release its report on the RRW in March 2007. Our discussion is intended as background material to help understand the RRW decisions and reports. On March 6, a session at the Denver APS meeting considered the RRW and nuclear missions. Talks were given by John Harvey (Director of NNSA Policy and Planning), Lt. General C. Robert Kehler (Deputy Commander of STRATCOM), Bruce Tarter (Chair of the AAAS–RRW Study), Sidney Drell (Stanford), Ivan Oelrich (Federation of American Scientists). The need for the RRW has been called into doubt by the 2006 JASON report that concluded the following: [1] “Most primary types have credible minimum lifetimes in excess of 100 years as regards aging of plutonium; those with assessed minimum lifetime of 100 years or less have clear mitigation paths that are proposed and/or being implemented...There is no evidence for void swelling in naturally –Pu samples over the actual and acceleratedδaged or artificially aged times scales examined to date, and good reason to believe it will not occur on times scales of interest, if at all.
    [Show full text]
  • Us - USSR Strategic Offensive Nuclear Forces 1946 - 1989
    us - USSR Strategic Offensive Nuclear Forces 1946 - 1989 Robert Standish Norris and Thomas B. Cochran Natural Resources Defense Council 1350 New York Avenue, NW Washington, DC 2000S 202-783-7800 Introduction Sources of Information Definitions Sources Table. 1: U.S. Strategic Offensive Forces, 1946-1989 Table 2: USSR Strategic Offensive Forces, 1956-1989 Table 3: U.S. ICBM Forces, 1959-1989 Table 4: USSR ICBM Forces, 1960-1989 Table 5: U.S. Ballistic Missile Submarine Forces, 1960-1989 Table 6: USSR Ballistic Missile Submarine Forces, 1958-1989 Table 7: U.S. Strategic Bomber Forces, 1946-1989 Table 8: USSR Strategic Bomber Forces, 1956-1989 Figure 1: U.S.- USSR Strategic Offensive Warheads, 1946-1989 Figure 2: U.S.- USSR ICBM Launchers, 1959-1989 Figure 3: U.S.- USSR ICBM WarheadsIRVs, 1959-1989 Figure 4: U.S.- USSR SLBM Launchers, 1958-1989 Figure 5: U.S.- USSR SLBM WarheadsIRVs, 1958-1989 Figure 6: U.S.- USSR Strategic Bombers, 1946-1989 Figure 7: U.S.- USSR Str~tegic Bomber Weapons, 1946-1989 About the Authors The NRDC Nuclear Weapons Data Center Recent Publications . Introduction A regular element of the debate about nuclear weapons and arms control is the presentation of data on the relative levels of US and USSR strategic forces, often in the form of tables or charts. Frequently, the data presented is unclear in terms of where it came from or what assumptions were used to construct it. Some tables present current "total" forces, others "on-line" forces, "alert" forces, "generated alert" forces, or "SALT accountable" forces. Each is important and more usable if detail about the sources and assumptions is provided.
    [Show full text]
  • Transparency and Verification Options: an Initial Analysis of Approaches for Monitoring Warhead Dismantlement
    Transparency and Verification Options: An Initial Analysis of Approaches for Monitoring Warhead Dismantlement Prepared by: The Department of Energy Office of Arms Control and Nonproliferation May 19, 1997 Supported by the Dismantlement Study Group Contributors: Office of Defense Programs Office of Security Affairs Pantex Oak Ridge Y-12 Lawrence Livermore National Laboratory Los Alamos National Laboratory Pacific Northwest National Laboratory Sandia National Laboratories DynMeridian Contains infonnation which may be exempt from public release under the Freedom of Infonnation Act (5 D.S.C. 552), exemption numbers 2,7. Approval by the Department of Energy prior to public release is required. III. DESCRIPTION OF THE U.s. DISMANTLEMENT PROCESS 29 A. FACILITIES 29 B. DISMANTLEMENT PROCESS 36 C. U.S. DISMANTLEMENT SCHEDULE 40 IV. V. VI. EVALUATION OF OPTIONS 65 A. DESCRIPTION OF EVALUATION CRITERIA 65 B. ANALYSIS OF OPTIONS 67 II VII. APPENDIX E: INTERIM TECHNICAL REPORT ON RADIATION SIGNATURES FOR MONITORING NUCLEAR WARHEAD DISMANTLEMENT 133 OFFICIAL USE ONLY At the March 21, 1997,Helsinki Summit, Presidents Clinton and Yeltsin underscored their interest in further nuclear warhead reductions beyond STARTI and STARTII, as well as the need to monitor nuclear warhead inventories, nuclear warhead dismantlement, and fissile materials resulting from warhead reductions. Progress in these areas would further U.S. efforts to reduce the nuclear danger and strengthen strategic stability and nuclear security. In anticipation of an agreement requiring further warhead reductions and the monitoring of warhead dismantlement, the Department of Energy (DOE) Office of Arms Control and Nonproliferation commissioned a technical study in the Fall of 1996 to identify transparency and verification options that could be implemented at OOE facilities to monitor warhead dismantlement.
    [Show full text]