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Numerical and Experimental Investigations of Self-Heating Phenomena in 3D Hybrid Bonding Imaging Technologies Axel Pic

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Numerical and Experimental Investigations of Self-Heating Phenomena in 3D Hybrid Bonding Imaging Technologies Axel Pic Numerical and experimental investigations of self-heating phenomena in 3D Hybrid Bonding imaging technologies Axel Pic To cite this version: Axel Pic. Numerical and experimental investigations of self-heating phenomena in 3D Hybrid Bond- ing imaging technologies. Thermics [physics.class-ph]. Université de Lyon, 2019. English. NNT : 2019LYSEI054. tel-02956242 HAL Id: tel-02956242 https://tel.archives-ouvertes.fr/tel-02956242 Submitted on 2 Oct 2020 HAL is a multi-disciplinary open access L’archive ouverte pluridisciplinaire HAL, est archive for the deposit and dissemination of sci- destinée au dépôt et à la diffusion de documents entific research documents, whether they are pub- scientifiques de niveau recherche, publiés ou non, lished or not. The documents may come from émanant des établissements d’enseignement et de teaching and research institutions in France or recherche français ou étrangers, des laboratoires abroad, or from public or private research centers. publics ou privés. N° d’ordre NNT : 2019LYSEI054 THESE de DOCTORAT DE L’UNIVERSITE DE LYON Opérée au sein de L’INSA de Lyon En cotutelle internationale avec STMicroelectronics Ecole Doctorale N° ED 162 MEGA de Lyon Energétique/Thermique Soutenue publiquement le 04/09/2019, par : Axel PIC Numerical and experimental investigations of self-heating phenomena in 3D Hybrid Bonding imaging technologies Devant le jury composé de : VAILLON Rodolphe Directeur de recherche (IES) Directeur de thèse CHAPUIS Pierre-Olivier Chargé de recherche (CETHIL) Co-directeur de thèse GALLOIS-GARREIGNOT Sébastien Ingénieur-docteur (STMicroelectronics) Examinateur (Co-encadrant) DILHAIRE Stefan Professeur (Université de Bordeaux) Rapporteur WEAVER Jonathan Professeur (University of Glasgow) Rapporteur GOMES Séverine Directrice de recherche (CETHIL) Examinatrice THOMPSON Sarah Professeure (University of York) Examinatrice COLONNA Jean-Philippe Ingénieur-docteur (CEA LETI) Examinateur BECKRICH-ROS Hélène Ingénieur-docteur (STMicroelectronics) Membre invitée 1 Cette thèse est accessible à l'adresse : http://theses.insa-lyon.fr/publication/2019LYSEI054/these.pdf © [A. Pic], [2019], INSA Lyon, tous droits réservés Cette thèse est accessible à l'adresse : http://theses.insa-lyon.fr/publication/2019LYSEI054/these.pdf © [A. Pic], [2019], INSA Lyon, tous droits réservés 3 Cette thèse est accessible à l'adresse : http://theses.insa-lyon.fr/publication/2019LYSEI054/these.pdf © [A. Pic], [2019], INSA Lyon, tous droits réservés Cette thèse est accessible à l'adresse : http://theses.insa-lyon.fr/publication/2019LYSEI054/these.pdf © [A. Pic], [2019], INSA Lyon, tous droits réservés Acknowledgments Acknowledgments A ma famille et amis, Tout d’abord, je voudrais remercier mes encadrants de thèse Sébastien et Pierre-Olivier. C’est grâce à vous que j’ai énormément appris sur le plan scientifique, en thermique et en modélisation mais plus important encore, c’est vous deux qui m’avez enseigné les rouages du milieu industriel et académique. Durant ces trois années de thèse, vous avez su me motiver au quotidien pour tirer le meilleur de moi- même. C’est en grande partie grâce à votre incroyable management et soutient que j’ai pu finalement arriver au bout de ce marathon qu’est la thèse de doctorat. Egalement, je voudrais remercier les doctorants de STMicroelectronics et du CETHIL. Merci à Clément et Idir. C’était un véritable plaisir de travailler avec vous au quotidien. Merci à toi Eloïse pour ton aide précieuse sur le microscope thermique à sonde locale. Sans toi, je n’aurais pas pu aussi bien dompter la bête. Dans un autre registre, un grand merci pour m’avoir aidé à finir les bouteilles de vin en conférence. Christophe, ton aide sur l’instrumentation du circuit électronique des mesures 3ω a été indispensable. J’ai beaucoup apprécié t’emprunter ton alimentation en courant pour de « courtes » durées. Enfin, je remercie chaleureusement le personnel technique du CETHIL, Anthony et David, pour leur grande réactivité à résoudre mes problèmes divers et variés lors de cette thèse. Chloé, merci de m’avoir soutenu tout au long de ces trois dernières années. Tu as su non seulement me supporter, quand le stress se faisait sentir, mais aussi m’encourager et m’aider à m’améliorer. Tu as été un cobaye de choix pour mes entraînements et répétitions de présentations de conférences. Je n’oublie pas que sans toi, je serais peut-être encore perdu au fin fond de l’état de Californie entre Los Angeles et San Francisco sans savoir où dormir. Je t’aime mon amour. Enfin et surtout, je veux remercier toute ma famille avec mon frère Pierre-Louis, ce grand déconneur sans qui je n’aurais pas eu tant de fous rires durant toute notre enfance. Merci à mes parents, ma mère et mon père, qui ont tous les deux fourni des efforts incommensurables pour me permettre de m’épanouir au mieux. D’aussi loin que je m’en souvienne, vous avez toujours été là que ce soit pour l’école, le sport, la musique ou tout autre activité enrichissante. Je me souviens de ma mère qui n’aura jamais hésité une seconde à prendre sur son temps de loisir pour m’aider sur mes devoirs à l’école. Et de mon père qui m’a amené, de jour comme de nuit, partout où j’en avais besoin un nombre de fois incalculable. Si un jour, j’arrive à n’avoir ne serait-ce que la moitié de votre énergie à consacrer à l’éducation de mes enfants, je saurai être déjà un père hors du commun. Je sais ne pas vous le dire assez souvent mais je le pense toujours ; Je vous aime. 5 Cette thèse est accessible à l'adresse : http://theses.insa-lyon.fr/publication/2019LYSEI054/these.pdf © [A. Pic], [2019], INSA Lyon, tous droits réservés Cette thèse est accessible à l'adresse : http://theses.insa-lyon.fr/publication/2019LYSEI054/these.pdf © [A. Pic], [2019], INSA Lyon, tous droits réservés Abstract Abstract English In this PhD thesis, self-heating phenomena are studied for guiding the design of next-generation 3D Integrated Circuits (ICs). By means of experimental and numerical investigations, associated heat dissipation in 3D Hybrid Bonding imagers is analyzed and the impact of the resulting temperature rise is evaluated. First, in order to develop accurate models, the thermal properties of materials used in ICs are to be determined. Different dielectric thin films involving oxides, nitrides, and low-k compounds are investigated. To do so, Scanning Thermal Microscopy (SThM) and the 3ω electrothermal method, sensitive to low and large effective thermal conductivity, are implemented. In a second step, finite- element models of 3D ICs are developed. A numerical method involving homogenization and a multiscale approach is proposed to overcome the large aspect ratios inherent in microelectronics. The numerical procedure is validated by comparing calculations and experimental measurements performed with SThM, resistive thermometry and infrared microscopy on a simplified Hybrid Bonding test chip. It is shown that heat dissipation is mainly limited by the heat sink conductance and the losses through air. Finally, numerical and experimental studies are performed on fully-functional 3D Hybrid Bonding imagers. The temperature field is measured with SThM and compared with finite-element computations at the die surface. The numerical results show that the temperature of the pixel surface is equal to that of the imager Front-End-Of-Line. The influence of the temperature rise on the optical performance of the imager is deduced from the analysis. The study also allows assessing the various numerical and experimental methods for characterizing heat dissipation in microelectronics. French Dans cette thèse, les phénomènes d’auto-échauffement ont été étudié pour guider la conception de circuits intégrés 3D de nouvelle génération. Grâce à des études expérimentales et numériques, la dissipation thermique dans des imageurs 3D par collage hybride a été analysée et l’impact de l’augmentation de température résultante a été évalué. Premièrement, afin de développer des modèles précis, les propriétés thermiques des matériaux utilisés dans les circuits intégrés ont dû être déterminées. Différents films minces diélectriques impliquant des oxydes, des nitrures et des composés low-k ont été étudiés. Pour ce faire, la microscopie thermique à sonde locale (SThM) et la méthode électrothermique 3ω, sensibles à la conductivité thermique effective faible et élevée, ont été mises en œuvre. Dans un deuxième temps, des modèles éléments finis de circuits intégrés 3D ont été développés. Une méthode numérique nécessitant homogénéisations et approches multi-échelles a été proposée pour surmonter des grands rapports de forme inhérents à la microélectronique. La procédure numérique a été validée en comparant les calculs et les mesures expérimentales effectuées par SThM, la thermométrie résistive et la microscopie infrarouge sur une puce de test par collage hybride simplifiée. Il a été montré que la dissipation de chaleur est principalement limitée par la conductance du puit thermique ainsi que les pertes par l'air. Enfin, des études numériques et expérimentales ont été réalisées sur des imageurs 3D par collage hybride fonctionnels. Le champ de température a été mesuré par SThM et comparé aux calculs par éléments finis à la surface de la matrice. Les résultats numériques ont montré que la température de la surface des pixels est égale à celle du Front-End-Of-Line de l’imageur. L'influence de l'échauffement sur les performances optiques de l'imageur a été déduite de cette analyse. Cette étude a permis également d'évaluer les différentes méthodes numériques
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