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How Auto IC Requirements, Adaptive Testing and Multichip Products Are Changing the Industry" Phil Nigh | Test Strategy & Methodology Phil.Nigh@Globalfoundries.Com

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How Auto IC Requirements, Adaptive Testing and Multichip Products Are Changing the Industry "Emerging Test Methods -- How Auto IC Requirements, Adaptive Testing and Multichip Products are Changing the Industry" Phil Nigh | Test Strategy & Methodology phil.nigh@globalfoundries.com SWTW June 2017 Thanks SWTW June 2017 2 Disclaimer / Abstract • Some of the material in this presentation are my thoughts on these topics. • That is, some comments are NOT the official GLOBALFOUNDRIES position related to future offerings. Abstract Key Industry trends are changing how we Test ICs -- and how we guarantee Quality, Reliability and Yield during the production process. The number of ICs in Automobiles is dramatically increasing -- and these ICs have very unique requirements. Leading-edge companies are using more & more "Adaptive Test" methods -- that are challenging given our dis-aggregated production test processes. Also, multichip products (including ICs from multiple suppliers) are finally emerging; but the challenge is that adequate industry support practices are not yet in place. This talk will both describe these challenges and recommended practices to move the industry ahead. SWTW June 2017 3 Outline • Foundry support for IC Testing • Multichip Packages – Test Challenges • Heterogeneous Integration – where are we headed ? • What are industry gaps in supporting advanced packages ? • Wafer-level (probe) testing – need to drive improvements • How should industry evolve to overcome these challenges ? • Drive to true KGD • Cross company collaboration, standards enabling test collaboration, more test transparency, … • Automotive – Auto ICs vs. consumer ICs – what’s different ? • Adaptive Testing & Advanced Statistical Test Analysis • End-to-End Data Integration and WW / Cross Company Collaboration SWTW June 2017 4 GLOBALFOUNDRIES Fabs Burlington VT New fab East Fishkill, NY Dresden, Germany in China Malta, NY Singapore SWTW June 2017 GLOBALFOUNDRIES (GF) Test Engineering for a • GF’s primary business is wafer foundry variety of Technologies 1. Dresden • FinFet: 14nm, 7nm 2. Singapore • ASICs: Cu32, FX14 3. Fishkill, NY • 22FDX ® , 12FDXTM 4. Burlington, VT • 8XP SiGe RF (mmWave) 5. Malta, NY • 22FDX-MRAM, eNVM 6. China (future) • Most of these ICs are designed by other companies. • e.g., IBM, AMD, … and quite a few other companies. • Over time, GF will be more than “just a wafer fab”. • ASICs, Design methodologies, IP (building blocks), advanced packages (Post Fab services) • In some cases, GF will offer “products”. (e.g., sub-assemblies) SWTW June 2017 6 GLOBALFOUNDRIES Test Facilities Plus Inline / eTest at each fab Burlington Production Wafer OSAT – IBM, Probe Test Center Bromont, Dresden Canada Production Wafer Burlington VT Probe Test Center East Fishkill, NY Dresden, Germany New fab OSAT in China Partners Singapore Malta, NY Malta, NY Technology Development 14nm – 7nm Test & New Product Singapore Introduction Test Development, OSAT support SWTW June 2017 Consolidation of Semiconductor Fabs SMICPost-consolidation phase – Foundries will offer a broader UMC TSMCset of Services Chartered SMIC Dongbu HiTek UMC Grace Semi TSMC • Advanced packaging SMIC/ heterogeneous integration Altis Semi Chartered UMC Seiko Epson Dongbu HiTek • Including integrationTSMC of silicon from multiple companies Freescale Grace Semi Chartered Infineon Seiko Epson Seiko Epson Sony • Test developmentFreescale Freescale TI Infineon Infineon ST Micro • includingSony full test program development/debug, DFT implementation, Sony SMIC AMD TI equipment/fixtures/probesTI , OSAT/supplyUMC chain management IBM ST Micro ST Micro TSMC Intel AMD • Full test support for foundryAMD suppliedGLOBALFOUNDRIES IP UMC Samsung IBM IBM ST Micro TSMC Intel Intel IBM GLOBALFOUNDRIES • RecommendedSamsung test & data collection methods Samsung Intel ST Micro TSMC • Yield learning / diagnostic / characterizationSamsung best methodsIBM GF Intel Intel • DFT recommendations Samsung Others… Others… Others… Others… Samsung • Fab-specific targeted tests < 130nm • Data Analytics90nm – broader65nm than just45/ fab40nm data 32/28nm 20/14nm & beyond <2000 • Data 2002feedforward & Adaptive2006 Test enablement2008 2010 2012 SWTW June 2017 Test Support Future?? by IC Foundry • Product Test is an integral part of the foundry offering • Foundry provides wide range of Historical View Test & DFT services. • Foundry builds wafers – • Test Development including etest/Inline Test • Test for foundry IP • Production Testing • Test for technology • Test for Yield learning development (testsites, etc.) • Test recommendations (e.g., based on fab learning) • Foundry supports product • Outlier screens wafer probe test for select • Foundry supports Advanced products Multichip Packages • Fabless customer supplies test • Including integration of silicon from solution multiple companies SWTW June 2017 9 Test Support Models ASICs “Hybrid” Foundry Product Delivery Fully tested modules Tested modules Tested wafers or tested dies GF’s Role in GF owns all components GF does Testing – Wafer probe test as a service – Testing testing. customer provides input enabling yield learning Test Program GF develops a custom Customer delivers wafer test GF Development test program program to GF Supplier Collaboration Yield/Quality/ Customer owns Quality / Reliability ProvidesGF betweenGF ReliabilityCustomer and Test - driven& Circuit Ownership portion of yield Solution GF ownsFull all Test embedded Customer and IP / DFT Definition / DFT “collaboration” Customer owns DFT & IP IP – including DFT / Test Ownership model. GF IP supported testability. SolutionMethods GF Yield Learning / GF provides a level of yield GF GF Diagnostics analysis / diagnostics GF applies advanced Test Data Analytics GF offers state-of-art Test data analytical methods are data methods as / Stat Methods capabilities defined by customer required SWTW June 2017 Design Enabled Manufacturing (Y2011) From Bob Madge, GLOBALFOUNDRIES Major Foundry Challenges: How can Test help?: 1. Technology Bring-up – need early • Volume test data and Diagnostics on design/process correlation data. DFM early product-like vehicles. Need much simulation/testchips losing faster, much more adaptive and easier to effectiveness (complexity) use and correlate to design. 2. Volume Product Ramp – need • System Test correlation to Fab. Outlier yield/quality/rel feedback. Need to screens have reached their limit. Need “teach” in-line metrology/tools so system correlation back to fab. tool (e.g., issues can be identified in-fab. Variability, defect) 3. Cost/Capacity – need more flexibility • Test program/pattern conversion and in test capacity. Foundries currently Adaptive test – enable flexible control of too dependent on customer tester, the “virtual test floor”. Resolve data DFT, S/W security through standards. SWTW June 2017 Madge, ITC 2011 Test Panel Design Enabled Manufacturing (Y2011) Foundry / Design / Test Co-optimization Data Data Process Statistics Design-based Yield and capability Diagnostics Nitride Shallow Furnace Metrology STI Masking Metrology Metrology Trench Etch Deposition Dep Time and Etch Time Endpoint Exposure Temperatures (By Chamber) Times Trench Nit Nit Nit CD Depth Dep Thk Ref CD Thk Depth Controller Controller Controller Trench Trench TEOS Furnace Metrology Planarization Metrology Planarization Metrology Deposition Masking Etch Dep Time and Overlay Etch Temperatures Settings Time Overlay Oxide Measurements Oxide Dep Controller Thk Overlay Etch Loss Thk (Development) Controller Controller Knowledge-Aware STI PolishProcessMetrology Nitride Control Strip Metrology and Polish Bath Flow of Data Time Times Oxide Oxide Oxide Flow of WIP Design Thk Thk Nit Thk Adaptive Test Thickness MetrologyThk Oxide Loss Controller Controller Trench Depth Oxide Thk Design statistics & Process/Design care-abouts Sensitivities Data Data Madge, ITC 2011 Test Panel SWTW June 2017 What Will Drive Growth… 2016 “Things” $16B IoT Computing & Storage $32B Automotive $0B 5G Comms & Networking $4B AR/VR $5B AI Sources: (a) IoT; GLOBALFOUNDRIES estimates on Gartner data; (b) Automotive: GLOBALFOUNDRIES projections on Gartner and IHS actuals and forecasts; (c) 5G: Mobile Experts; (d) AR/VR: GLOBALFOUNDRIESSWTW projectionsJune on Goldman2017 Sachs and Bank of America and Gartner data Crazy Growth of Data -- How much will we store ? Estimates for number of “things” by 2020 range from 25B to 14T Brontobyte Hard drive would cover 27 the earth 23,000 times Digital 10 Sensors Drones Yottabyte 24 21 Zettabyte Autonomous = 250 trillion DVDs 10 1.3 ZB of traffic 10 annually by 2016 Cars 1018 1015 Exabyte Petabyte 12 Robotics 10 Terabyte 109 6 Gigabyte Megabyte 10 Wearables Source: HP Information Optimization Press Conference 2012 SWTW June 2017 Multichip Packaging Trends SWTW June 2017 15 Industry Trends driving Multichip Packaging • Moore’s Law is slowing down. Semiconductor scaling is not achieving historic levels of higher densities, lower cost and higher performance. • Move to newer technologies provide less performance gains and the improvement in cost / transistor has slowed. • Another approach to higher density is to integrate multiple bare dies onto the same package .. or to “stack dies”. (“heterogeneous integration") • 2.5D, 3D, MCMs (multichip modules), Wirebond Chip stack, WLFO, … SWTW June 2017 16 Silicon Scaling Alternatives – Packaging Services ASIC/Server Mobile IoT/RF 2.5D 3D Photonics Cost & Power Wafer Level Packaging Substrates + Integrated Passives Bandwidth and Interconnect Density Requirements IoT/RF Mobile AP ASIC Server Interconnect Low cost multi-chip Wafer level packaging High
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