Bluetooth Low Energy Generalities
February 2016 - Page 1 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com Contents
Company Profile
Bluetooth Smart Basics
Bluetooth Smart Modules
February 2016 - Page 2 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com Company Profile
Established in 2005 Founded by actual CEO and CTO Core team of PhD and MSc from National Semiconductor Electromagnetic simulation, antenna design and µW & RF circuit theory skills
Locations Europe – HQ & Technical team in Sophia-Antipolis North America – Subsidiary in Denver Asia – Sales office in Tokyo Global network of distributors
Experts in RF System-in-Package (SiP) and Antenna-in-Package (AiP) In response to the fast growing demand for ultra-miniature wireless systems Capability to deliver new innovative solutions to the market in record time Unique set of design techniques & industrialization expertise Fab-less company
February 2016 - Page 3 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com SiP Expertise
SiP approach consists of integrating several different components into a single miniaturized module From different semiconductor and passive technologies Unique ability to embed functions within the package RF know-how Irrespective of the technology . Organic substrates (BT, FR4...) . Multi-layer ceramic substrates (LTCC, HTCC, Thick film…) . Thin film Integrated Passive Devices (IPD) on silicon or glass Extremely rapid and low cost development cycles
Addition of ultra-miniature antennas to the RF SiP create a so called “Antenna in Package” product (AiP) Fundamental part of long term Insight SiP’s research program Combining electromagnetic simulations and circuit level optimization Based on a user extendable library of physical objects R&D work has already been implemented in products for Bluetooth Low Energy and Wireless High Definition Interface products
February 2016 - Page 4 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com SiP Product Lines
Design Service Business Unit Turnkey solutions for creative packaging solutions Any Wireless connectivity to fit any device space Multiple Technologies : BT, FR4, LTCC, HTCC, Thick Film, PCB, IPD,… Multiple Assembly Methods: SMT, Wirebond, Flipchip, Embedded Dies… Optimization Size / Cost / Time to Market Technical Successes in 3G, ANT, BLE, Bluetooth®, GSM/W-CDMA, GPS, ISM, LTE, NFC, RFID, UMTS, UWB, WHDI™, WiFi, WLan, Zigbee ® … Benefits to our customers: Smaller, Faster, Lower Cost
Standard Modules Business Unit Dedicated to wireless electronic industry Bluetooth Low Energy – BLE Modules ANT Modules Low Energy Sensors Beacons Secured Connectivity Modules Benefits to our customers: Ready to use modules
February 2016 - Page 5 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com SiP Production
Break by Application Volumes 2016 Manufacturing with multiple 2014 2015 established partners Amkor ASE 2017 AT&S Low Energy Connectivity Barry Ind Connectivity Kyocera 4G/5G Front End & Radio Tong Hsing Secure Connectivity (Internal and licensed production)
Modules BU Shipment Quality standards in production ISO9000 standards and several other equivalent certifications OHSAS18001 – Health and Safety management ISO13485 – Medical requirements AS9100 – Aerospace requirements QS9000 – Automotive requirements
February 2016 - Page 6 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com Contents
Company Profile
Bluetooth Smart Basics
Bluetooth Smart Modules
February 2016 - Page 7 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com BLE Generalities
Bluetooth Smart is the commercial banner used for Bluetooth Low Energy
Designed for Low Power Applications where aim is ultra long battery lifetime Bluetooth Low Energy is designed to enable connectivity of power-sensitive devices operating on primary cells for long periods of time ranging from months to years
Aimed for applications where data volume is low Bluetooth Low Energy concentrates on lowest possible power consumption and therefore can only support occasional data exchange
BLE evolution toward improved connectivity V4.0 = slave connectivity only V4.1 = master & slave on the same chip V4.2 = IPv6 connectivity
February 2016 - Page 8 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com BT / BLE Interconnection
Single mode Bluetooth Smart Bluetooth low energy protocol stack is implemented solely Low Energy hardware
Dual-mode Bluetooth Smart Ready Bluetooth low energy functionality is integrated into an existing Classic Bluetooth controller Traditional technology, no Low Energy hardware embedded
BLE only
BLE + BT classic
BT classic only
February 2016 - Page 9 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com BLE Specifications
Frequency range In the globally unlicensed ISM 2.4 GHz band : 2400–2483.5 MHz Using frequency-hopping radio technology with 1600 hops per second for robust transmission in parallel of Wi-Fi and other technology in the same frequency band Data are divided into packets which are transmitted on one of the 40 channels Range – Data rate Operates in the 100 meters range Maximum data rate 260 kbps Profiles There are a wide range of Bluetooth profiles that describe many different types of applications or use cases for devices All communication in low energy takes place over the Generic Attribute Profile (GATT) GATT architecture makes it easy to both create and implement application profiles such as Health Thermometer, Glucose, Current Time, Location and Navigation, … Central role (Master) & Peripheral role (Slave ) Bluetooth is a packet-based protocol with a master-slave structure. One master may communicate with several slaves, all devices share the master's clock.
February 2016 - Page 10 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com BLE Consumption
BLE chip saves power by being in “sleep mode” most of the time
Power consumption is strongly related to data rate
One cannot look at peak RX or TX current to assess overall power consumption since the time in low power “sleep” mode dominates overall power consumption
In average, current consumption is . # 10 mA during Rx/Tx . < 1 mA during Processing . < 1 µA during Sleep mode
February 2016 - Page 11 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com BLE Versions
Version evolution of Bluetooth Smart since 2010
V4.0 First Bluetooth Low Energy Concept Enables Slave connectivity
V4.1 Multirole capabilities Master & Slave on the same chip
V4.2 Enables IPv6 for Bluetooth Increases speed with bigger packets Includes new security fixtures Improves privacy
February 2016 - Page 12 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com BLE Main Applications
BLE typically used for
Connected sensors for medical devices, healthcare, sport, fitness, industrial devices … IoT applications: connected objects like bracelet, watches … Wearable technology Phone/laptop accessories Home automation Beacons Localize indoors to medium accuracy Wireless charging Led lighting Toys
February 2016 - Page 13 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com BLE Pros & Cons
Major advantages of BLE Presence of BLE connectivity in nearly every phone and laptop released today Only need new hardware at one end Software for phone/laptop easily distributable via app stores Bluetooth protocol widely understood and used, mature
Various alternative technologies on the market Zigbee, ANT, Various proprietary sub-giga protocols BLE is “adapted” for low energy use-case Other protocols are technically better designed for certain use cases Other protocols may have lower power consumption for certain use cass Some are established in certain market sectors
For the vast majority of applications where connectivity to a phone or laptop is involved, the “built in” advantage of BLE is overwhelming
February 2016 - Page 14 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com BLE Pros & Cons
Consumption Comparison Consumption analysis between several technologies demonstrated BLE as the more efficient
Test was based on a standard sensor application
Whatever connection interval, BLE remains leader
Consumption of ZigBee and ANT are generally twice of BLE
February 2016 - Page 15 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com Contents
Company Profile
Bluetooth Smart Basics
Bluetooth Smart Modules
February 2016 - Page 16 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com Module Disadvantages
Bill of Material cost is inevitably higher for a Module than for a Discrete design
And that is pretty much it !
February 2016 - Page 17 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com Module Advantages
Ready to Go No need for RF knowledge Design effort for RF design is very often underestimated Minimum electronic skills for digital connection Module is pre-certified, avoiding lengthy and expensive certification process
Fast Time to Market Time to market reduced by 3 to 6 months
Smaller Small and integrated solution Single component replaces many, supply chain simpler
Improved performance Optimized antenna performance BLE function concentrated in one single component
Application development is focused on its added value
February 2016 - Page 18 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com Module / Discrete Trade Off
Need to check overall project cost and duration between both solution
Module Chip + Discrete
RF design Core competency of module vendor Expertise required for layout, signal routing, Heavy 1-time investment layer stack-up, interference, shielding Non module will require larger area on Size Optimized size target PCB Procurement 1 component Multiple components
Complexity Like any component to place RF design and RF yield
Assembly 1 component ready to mount Complex Bill Of Material (BOM) Module fully tested (behaviour, Need full test on end-product Test Electromagnetic, placement,…) Yield losses in production Yield 100% yield ready modules Failure analysis & rework costs Quality Modules are fully tested and provided as RF expertise and test flows to cover known good connectivity systems Certification Pre-certified / already certified Certification from scratch
February 2016 - Page 19 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com Module / Discrete Trade Off
Volume Module Suitability Project Points
Up to 50 K . At this level, BOM savings will simply not cover Module is ideal pcs / year development costs
. Looking only at BOM costs, discrete looks good 50 – 150 K Module is a good . However, it is important to double check real pcs / year solution development cost that might be under-estimated
. Here, discrete solution starts to look attractive . Even so, when real dev. costs, certification etc is 150 – 500 K Module could be accounted for, it isn’t clear pcs / year good solution . Need to look at other factors – time to market, risk etc . Can suggest customer starts with module, and can switch later if product proven
500 K + Module is an option . Still may be attractive for customer who wants to keep pcs / year for specific app things simple and get to market fast
February 2016 - Page 20 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com ISP Solution Advantages
Insight SiP intends to propose a complete BLE solution offer to our customers
Integration
Module solution Sensor solution Custom SiP Ready to Use BLE Ready to Use Radio Radio and Hardware Module to be integrated and Hardware circuit included in a Custom in application circuit with integrated sensor Design SiP Off shelf Custom or Off shelf Specific form factor
February 2016 - Page 21 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com ISP Solution Advantages
Offers 3 BLE platforms BLE Connectivity – Module without MCU for creating BLE node on existing designs BLE Intelligent Node – Module including latest BLE generation with MCU and antenna BLE Combo Node – Module including latest BLE generation with MCU and antenna and another low energy wireless node (Coming Q2-Q3 2016)
Offers complete development kit
Working demos including hardware, and software for iOS Sensor demo Beacon demo Easy starting point for customers
Very high quality hardware support from true RF experts Possible RF and range simulation of customer design
Capacity to offer custom design if required later
February 2016 - Page 22 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com ISP Module Advantages
Tiny module size SIP package = smallest solution on the market for complete module with antenna
Proven high performance Verified by major companies Outstanding antenna performance Various other modules have been “announced”, but are not actually available Hardware support for standard application : BLE node, sensor board
Based on Nordic Semiconductor chipset Established player in BLE for many years Proven and well supported protocol stack, with huge firmware library
Fully certified BT SIG, CE, FCC, IC, TELEC Many of “cheapest” modules are NOT certified
Insight modules in production since 2009 Track record
February 2016 - Page 23 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com ISP Module Advantages
Maximum concentrated performance designed by RF specialist and leading chipset manufacturer Nordic Inside WLCSP wireless SoC with 31 GPIOs and multiple analog and digital functions Both crystals included MCU & Radio 16 MHz and 32 kHz Synchronization Reduced power consumption Power supply decoupling For both DC-DC enable or disable operating mode Antenna matching circuit Integrated Antenna Proprietary integrated antenna Offering best reproducibility and best in class performance Relatively insensitive to environment Integrated shielding avoiding external metallic covers Reduces height and size
February 2016 - Page 24 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com ISP Module Advantages
Modules pre-certified for easy final application certification
Insight SiP Module End user Application Realized Additional certification Certification process
BT SIG Qualified List End Product Listing
EMC test Module Certified Marking Product FCC & IC ID with antenna Notice on Product manual EMC and Safety test Certification based on Marking on Product CE test report with antenna CE declaration
Module Certified No additional task with antenna
February 2016 - Page 25 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com Company Profile
Bluetooth Smart Basics
Bluetooth Smart Modules
THANK YOU !
February 2016 - Page 26 Mailto: [email protected] Distributed by Texim Europe Web: www.insightsip.com Contact details
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