Comparison of Analytical and Numerical Solutions of the Heat
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Interconnect Thermal Management of High Power Packaged Electronic Architectures A Thesis Presented to The Academic Faculty By Jason Todd Cook In Partial Fulfillment of the Requirements for the Degree Master’s of Science in Mechanical Engineering Georgia Institute of Technology June 2004 Interconnect Thermal Management of High Power Packaged Electronic Architectures Approved: Yogendra Joshi, Ph.D., Chair Ravi Doraiswami, Ph.D. S. Mostafa Ghiaasiaan, Ph.D. Date Approved: June 29, 2004 ii DEDICATION To my wife Megan M. Cook & To my parents Roy and Mary Ann Cook iii ACKNOWLEDGEMENTS The author would like to thank Jesus Christ the Lord and Savior, without whom none of this would have been possible. Next, the author would like to thank Roy and Mary Ann Cook for their encouragement and support over the years. The author would like to thank Dr. Yogendra Joshi and Dr. Ravi Doraiswami for their advice, direction, and serving on the thesis committee for this project. The author would also like to thank Dr. Mostafa Ghiaasiaan for participating in the thesis reading committee. The author also acknowledges financial support for this study from the National Science Foundation and Packaging Research Center at Georgia Institute of Technology. Finally, the author would like to thank the Woodruff School of Mechanical Engineering at Georgia Institute of Technology. iv TABLE OF CONTENTS DEDICATION.................................................................................................................III ACKNOWLEDGEMENTS ...........................................................................................IV TABLE OF CONTENTS ................................................................................................ V LIST OF TABLES .......................................................................................................VIII LIST OF FIGURES ........................................................................................................IX NOMENCLATURE...................................................................................................... XII Symbols…….. ............................................................................................................ xii Abbreviations ............................................................................................................ xii Greek Characters..................................................................................................... xiii SUMMARY… ................................................................................................................XV CHAPTER I.. .................................................................................................................... 1 INTRODUCTION AND LITERATURE REVIEW...................................................... 1 COOLING FUTURE ELECTRONIC ARCHITECTURES........................................ 1 REVIEW OF ELECTRONIC PACKAGE THERMAL MANAGEMENT..................... 3 OFF-CHIP METAL INTERCONNECTS ............................................................. 6 COEFFIECIENT OF THERMAL MISMATCH, ELECTROMIGRATION, AND THERMOMIGRATION................................................................................ 10 SIGNAL QUALITY DEGRADATION............................................................... 13 THERMAL MANAGEMENT OF PACKAGED INTEGRATED CIRCUITS .............. 15 JET IMPINGEMENT COOLING ...................................................................... 17 THREE-DIMENSIONAL ELECTRONIC ARCHITECTURES ................................ 21 CHAPTER II................................................................................................................... 22 INITIAL NUMERICAL MODELING OF DIRECT INTERCONNECT COOLING ON A PLASTIC BALL GRID ARRAY PACKAGE................................................... 22 INITIAL MODELING OF A PLASTIC BALL GRID ARRAY DIE ........................ 22 BASELINE PLASTIC BALL GRID ARRAY MODEL......................................... 26 PLASTIC BALL GRID ARRAY MODEL WITH JET IPINGMENT ....................... 28 CHAPTER III ................................................................................................................. 33 v INSTRUMENTATION AND EXPERIMENTAL PROCEDURES .......................... 33 PLASTIC BALL GRID ARRAY PACKAGE CHIP ............................................. 35 PRINTED CIRCUIT BOARD .......................................................................... 36 AIR SUPPLY EQUIPMENT............................................................................ 37 MEASUREMENT AND DATA ACQUISITION EQUIPMENT .............................. 39 EXPERIMENTAL PARAMETERS.................................................................... 43 EXPERIMENTAL PROCEDURE...................................................................... 46 CHAPTER IV.................................................................................................................. 52 EXPERIMENTAL RESULTS AND DISCUSSION ................................................... 52 0.250 MM CENTERED JET HOLE PATTERN EXPERIMENTS .......................... 52 COMPARISONS BETWEEN THE FOUR JET HOLE DESIGNS ............................ 65 CHAPTER V. .................................................................................................................. 75 NUMERICAL MODELING BASED ON EXPERIMENTAL RESULTS ............... 75 MODEL DESCRIPTION................................................................................. 75 MODEL VALIDATION ................................................................................. 78 COMPARISONS BETWEEN THE FOUR JET HOLE DESIGN MODELS ............... 82 PBGA HEAT PATH ANALYSIS ................................................................... 86 CHAPTER VI.................................................................................................................. 89 CONCLUSION AND RECOMMENDATIONS.......................................................... 89 APPENDIX A.................................................................................................................. 93 PRESSURE DROP AND FLOW RATE CALCULATIONS ..................................... 93 HARGRAVES BTC DIAPHRAGM COMPRESSOR ........................................... 93 THOMAS RIETSCHLE ROTARY COMPRESSOR.............................................. 94 APPENDIX B .................................................................................................................. 95 EXPERIMENTAL DESIGNS ....................................................................................... 95 PCB DESIGN LAYOUT ............................................................................... 95 INDIVIDUAL PCB DESIGNS ........................................................................ 96 JET HOLE DIAMETERS................................................................................ 97 APPENDIX C.................................................................................................................. 98 EQUIPMENT SPECIFICATIONS............................................................................... 98 SPECIAL LIMITS K-TYPE THERMOCOUPLES ............................................... 98 FATHOM FLOW METER .............................................................................. 99 WIKA PRESSURE TRANSDUCER................................................................ 100 AGILENT E3620A POWER SUPPLY .......................................................... 101 INSTEK GPR-H D.C. POWER SUPPLY ...................................................... 102 PRESSURE CHAMBER ............................................................................... 103 vi MINCO RESISTIVE HEATERS .................................................................... 104 AGILENT DATA ACQUISITION SWITCH UNIT............................................ 105 APPENDIX D................................................................................................................ 106 THERMOCOUPLE CALIBRATION CURVES....................................................... 106 0.250 MM X PATTERN JET HOLES............................................................ 106 0.368 MM CENTERED PATTERN JET HOLES.............................................. 106 0.368 MM X PATTERN JET HOLES............................................................ 107 APPENDIX E ................................................................................................................ 108 UNCERTAINTY ANALYSIS...................................................................................... 108 DESCRIPTION AND POWER SETTINGS FOR THE EXPERIMENTS .................. 114 REFERENCES.............................................................................................................. 115 vii LIST OF TABLES Table II.1: A list of the material properties used in the PBGA model.............................. 24 Table III.1: The complete list of voltage, current, and power settings for each experiment. ................................................................................................................................... 51 Table IV.1: Pressure measurements for the four experimental designs............................ 68 Table IV.2: Flow rate measurements for the four experimental designs.......................... 69 Table IV.3: Temperature repeatability among the experiments for each of the four jet hole designs at various chip level heat loads. ................................................................... 70 Table V.1: Mesh size