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ARPA/NBS Workshop V Moisture Measurement Technology for Hermetic Semiconductor Devices

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ARPA/NBS Workshop V Moisture Measurement Technology for Hermetic Semiconductor Devices NAT'L INST. OF STAND " & TECH " ' NBS Ill PUBLICATIONS NBS SPECIAL PUBLICATION 400-69 U.S. DEPARTMENT OF COMMERCE / National Bureau of Standards iconductor Measurement Technology: ARPA/NBS Workshop V Moisture Measurement Technology for Hermetic Semiconductor Devices QC 100 U57 No.TO-691 1981 c. 3L . NATIONAL BUREAU OF STANDARDS The National Bureau of Standards' was established by an act ot Congress on March 3, 1901. The Bureau's overall goal is to strengthen and advance the Nation's science and technology and facilitate their effective application for public benefit. To this end, the Bureau conducts research and provides: (1) a basis for the Nation's physical measurement system, (2) scientific and technological services for industry and government, (3) a technical basis for equity in trade, and (4) technical services to promote public safety. The Bureau's technical work is per- formed by the National Measurement Laboratory, the National Engineering Laboratory, and the Institute for Computer Sciences and Technology. THE NATIONAL MEASUREMENT LABORATORY provides the national system of physical and chemical and materials measurement; coordinates the system with measurement systems of other nations and furnishes essential services leading to accurate and uniform physical and chemical measurement throughout the Nation's scientific community, industry, and commerce; conducts materials research leading to improved methods of measurement, standards, and data on the properties of materials needed by industry, commerce, educational institutions, and Government; provides advisory and research services to other Government agencies; develops, produces, and distributes Standard Reference Materials; and provides calibration services. The Laboratory consists of the following centers: Absolute Physical Quantities^ — Radiation Research — Thermodynamics and Molecular Science — Analytical Chemistry — Materials Science. THE NATIONAL ENGINEERING LABORATORY provides technology and technical ser- vices to the public and private sectors to address national needs and to solve national problems; conducts research in engineering and applied science in support of these efforts; builds and maintains competence in the necessary disciplines required to carry out this research and technical service; develops engineering data and measurement capabilities; provides engineering measurement traceability services; develops test methods and proposes engineering standards and code changes; develops and proposes new engineering practices; and develops and improves mechanisms to transfer results of its research to the ultimate user. The Laboratory consists of the following centers: Applied Mathematics — Electronics and Electrical Engineering^ — Mechanical Engineering and Process Technology^ — Building Technology — Fire Research — Consumer Product Technology — Field Methods. THE INSTITUTE FOR COMPUTER SCIENCES AND TECHNOLOGY conducts research and provides scientific and technical services to aid Federal agencies in the selection, acquisition, application, and use of computer technology to improve effectiveness and economy in Government operations in accordance with Public Law 89-306 (40 U.S.C. 759), relevant Executive Orders, and other directives; carries out this mission by managing the Federal Information Processing Standards Program, developing Federal ADP standards guidelines, and managing Federal participation in ADP voluntary standardization activities; provides scientific and technological advisory services and assistance to Federal agencies; and provides the technical foundation for computer-related policies of the Federal Government. The Institute consists of the following centers: Programming Science and Technology — Computer Systems Engineering. 'Headquarters and Laboratories at Gaithersburg, MD, unless otherwise noted; mailing address Washington, DC 20234. -Some divisions within the center are located at Boulder, CO 80303. NfiTIONfiL BURERXJ- OF STftND.''j;D3 LiERASY Semiconductor Measurement Technology: at ARPA/NBS Workshop V Moisture Measurement Technology for Hermetic Semiconductor Devices Proceedings of the ARPA/NBS Workshop V held at the National Bureau of Standards, Gaithersburg, MD March 22-23, 1978 Edited by Harry A. Schafft, Stanley Ruthberg, and Elaine C. Cohen Electron Devices Division Center for Electronics and Electrical Engineering National Engineering Laboratory National Bureau of Standards Washington, DC 20234 This activity was supported by Defense Advanced Research Projects Agency 1400 Wilson Blvd. Arlington, VA 22209 and National Bureau of Standards U.S. DEPARTMENT OF COMMERCE, Malcolm Baldrige, Secretary NATIONAL BUREAU OF STANDARDS, Ernest Ambler, Director Issued May 1981 Library of Congress Catalog Card Number: 81-600034 National Bureau of Standards Special Publication 400-69 Nat. Bur. Stand. (U.S.), Spec. Publ. 400-69, 202 pages(May 1981) CODEN: XNBSAV U.S. GOVERNMENT PRINTING OFFICE WASHINGTON: 1981 For sale by the Superintendent of Documents, U.S. Government Printing Office, Wasliington, D.C. 20402 Price $6.00 (Add 25 percent for other than U.S. mailing) Table of Contents Page Preface v Abstract 1 1 . Introduction 1 2. Session I Mass Spectrometer Measurements 3 2.1 Mass Spectrometer Measurements at RADC Benjamin A* Moove (Rome Aiv Development Center) ... 3 2.2 A Method for Measuring the PPM Moisture-Sensing Limitations of Mass Spectrometers in Testing Small Packages Johnny L. Hartley (Sandia Laboratories) 24 2.3 A Dynamic Method of Calibrating a Mass Spectrometer Used for Measuring the Water Content of Semiconductor Encapsulations Robert P. Merrett (British Post Office Research Centre) 33 2.4 Moisture Measurement by Mass Spectrometer John C. Pemiaka (Pemiaka Corporation) 42 2.5 Microcircuit Package Gas Analysis Ray F. Haack and Alex Shurrka (Jet Propulsion Laboratory) 43 2.6 Comparison of Mass Spectrometric Moisture Measurements by Different Laboratories Kenneth L. Perkins (Rockwell International) 58 3. Session II Moisture Sensors 69 3.1 The Effects of Assembly Techniques Upon the Performance Characteristics of AI2O3 In-Situ Moisture Sensors Victor Fang (Panametrics, Inc.) 69 3.2 Application Considerations of Solid State Moisture Chips for Hybrids and Associated Calibration Measurement Techniques Paul F. Bennewitz (Thunder Scientific Corporation) . 75 3.3 Hysteresis and Long-Term Repeatability of Aluminum Oxide Humidity Sensors Herbert L, Webster (Sandia Laboratories) 80 3.4 Moisture Standards and Sensors Charles G. Messenger (Rome Air Development Center), . 82 3.5 Assessment of the Use of Measurement of Surface Conductivity as a Means of Determining Moisture Content of Hermetic Semiconductor Encapsulations Robert P. Merrett and Steven P. Sim (British Post Office Research Centre) 94 3.6 Moisture Sensing With the Charge-Flow Transistor Stephen D. Senturia, Michel G, Huberman, Robert Van der Klott (Massachusetts Institute of Technology) 108 iii 3.7 A Surface Conductance Technique for the Evaluation of Internal Package Environments Colin W, T. Knight, Abe Korgav, and Emit Pievvon (Advanced Micro Devices) •%••%%•••*•%•••• 115 4. Panel Meetings 122 4.1 Discussion Group Summary of Mass Spectrometer Measurements Robert W, Thomas, Chairman (Rome Air Development Center) 122 4.2 Comments on Round-Robin Results Robert W, Thomas, Chairman (Rome Air Development Center) 124 4.3 Moisture Sensors Saburo Hasegawa, Chairrmn (National Bureau of Standards)* 126 5. Session III Package Analysis and Quality Assurance 128 5.1 Parts-Per-Million Water-Vapor Generating System Used to Simulate Moisture in Small Integrated Circuit Packages Johnny L, Hartley (Sandia Laboratories) 128 5.2 A Total Moisture Analyzer for Hermetic Devices Steven R» Louaks and Arthur Bumham (Medtronic Inc*) ••••••«. 133 5.3 Analysis of Water Vapor in Purified Gas Systems Haiping Dun, Brenton L, Mattes, and David A. Stevenson (Stanford University )• 143 5.4 Mass Spectrometric Moisture Analysis of Hermetic Semiconductor Devices by Acetylene Conversion William M» Hickam and William R» Morgan (Westinghouse Research and Development Center) 153 5.5 Moisture in Packages - A User's Viewpoint Aaron Der Marderosian (Raytheon Company) 159 5.6 Problems in Specifying and Measuring Moisture Content Within Electronic Devices Robert W, Thomas (Rome Air Development Center) • • • • • 179 6. Group Encounters 185 6. 1 List of Attendees 187 iv PREFACE The Workshop on Moisture Measurement Technology for Hermetic Semiconductor Devices was conducted as part of the Semiconductor Technology Program in the Electron Devices Division of the National Bureau of Standards (NBS). This Workshop is the fifth in a series dedicated to the furtherance of the mea- surement technology needed by the semiconductor device industry in its at- tempt to provide to its customers products that are based on the most ad- vanced technology, yet have high reliability and the affordable costs which result from high yields. It was held at the Gaithersburg, Maryland^ facility of the National Bureau of Standards on March 22-23, 1978^ under the cosponsor- ship of the National Bureau of Standards and the Defense Advanced Research Projects Agency^ with the concurrence of the Rome Air Development Center. Representatives from industrial, governmental, and academic organizations concerned with device manufacture, analysis, and instrument design participa- ted in this workshop. Speakers were selected from among the finest and most active researchers in the field. The outcome was a large and enthusiastic workshop attendance. The workshop was
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