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RADC/NBS Workshop Moisture Measurement and Control for Semiconductor Devices, III A11107 aiQSWS NBSIR 84-2852 RADC/NBS Workshop Moisture Measurement and Control for Semiconductor Devices, III U S. DEPARTMENT OF COMMERCE National Bureau of Standards National Engineering Laboratory Center for Electronics and Electrical Engineering Semiconductor Materials and Processes Division Washington, DC 20234 May 1984 * 0,>eau o* U S. DEPARTMENT OF COMMERCE U ' VTION AL BUREAU OF STANDARDS RATIONAL BUREA OF STANDARDS . LIBRARY / ( l F Oc NBSIR 84-2852 RADC/NBS WORKSHOP MOISTURE MEASUREMENT AND CONTROL FOR SEMICONDUCTOR DEVICES, III Proceedings of the RADC/NBS Workshop held at the National Bureau of Standards Gaithersburg, MD November 2-4, 1 983 Benjamin A. Moore and Stanley Ruthberg, Editors U.S. DEPARTMENT OF COMMERCE National Bureau of Standards National Engineering Laboratory Center for Electronics and Electrical Engineering Semiconductor Materials and Processes Division Washington, DC 20234 This activity was sponsored by: Rome Air Development Center RBRE Griffiss AFB, NY 1 3441 and National Bureau of Standards May 1984 U.S. DEPARTMENT OF COMMERCE, Malcolm Baldrige, Secretary NATIONAL BUREAU OF STANDARDS, Emwt Ambler. Director ) Table of Contents Page Preface vi Abstract 1 1. Introduction 1 2. Session I Moisture Analysis ......... 3 Chairman, Robert W. Thomas, RADC 2.1 What's Happening at RADC B. A . Moore (Rome Air Development Center) 3 2.2 Moisture Analysis at Oneida Research Services, Inc. T. J. Rossiter and D. Feliciano-Welpe s Oneida Research Services , Inc,) 8 2.3 Gas Analysis at Gollob Analytical Service F. Gollob (Gollob Analytical Service) 19 2.4 Control Chart Analysis of Moisture in CERDIPs R. B . Elo and A . M, Massoletti (American Microsystems . 24 2.5 A Moisture Standard for IC Package Gas Analysis R . F, Haack (Jet Propulsion Laboratory) 39 2.6 The Evolution of Method 1018 R. W. Thomas (Rome Air Development Center) 51 3. Session II Moisture Measurement Methods 59 Chairman, Robert K. Lowry, Harris Semiconductor 3.1 Selecting Moisture Measurement Methods for Semiconductor Devices R, K . Lowry (Harris Semiconductor) 59 3.2 The Influence of Filling Gas of Hermetically Sealed Packages on Device Reliability: A Demand for a Complete Residual Gas Analysis L. J , Van Beek and H. A . Loos (Bell Telephone Mfg . Co,) . 62 3.3 Extended Computer Control and Data Processing for the Mass Spectrometr ic Analysis of Package Atmospheres L, J, Rigby (Standard Telecommunication Laboratories) , , 69 3.4 Gaseous Compositions of Hermetic Package Cavity Ambients II R, K, Lowry (Harris Semiconductor) 86 3.5 Improvements in the Capacitance-Ratio Method of Using an IC Die as a Moisture Sensor R, P, Merrett (British Telecom Research Laboratories) . 94 3.6 Comparison of Various Moisture Measurement Methods: Test Procedures at RADC N. K, Annamalai (Rome Air Development Center) 106 3.7 Laser Spectrometr ic Determination of Moisture J, ‘A, Mucha (AT&T Bell Laboratories) 119 3.8 Total Water Measurement Equipment and Process Using Method 1018, Procedure 2 C, Sloneker and B, Church (Medtronic > Inc.) 128 iii 4. Page Session III Moisture Sensors 129 Chairman, Victor Fong, Panametrics 4.1 Fundamental Studies of the Aging Mechanism in Aluminum Oxide Thin Films C.-H. Lin and S. D. Senturia (Massachusetts Institute of Technology ) 129 4.2 Recent Evaluations of AI2O3 In Situ Moisture Sensors for Industrial Electronic Hermetic Components Application M. Brizoux and J. Perdrigeat (Thomson-CSF) and D. Kane, and R. Gauthier (I.N.S.A. Lyon) 140 5. 4.3 Moisture Sources and Measurement in CERDIP Packages with Alumina Sensors H. Joss (Coors Porcelain Company) 153 4.4 Moisture Content Control Using Alumina Sensor C. M . Roberts, Jr. (Analog Devices) 162 4.5 Monitoring of Moisture in CERDIP Devices Using a Moisture Sensor Chip J. Hunter (Advanced Micro Devices, Inc.) 171 Session IV Hermeticity and Moisture 180 6. Chairman, Stanley Ruthberg, NBS 5.1 How to Raise the Permissible Leak Rate by Four Orders of Magnitude J. G. Davy (Westinghouse Manufacturing Systems and Technology Center) 180 5.2 Hermeticity and Moisture Ingress A. DerMarderosian (Raytheon Company) 196 5.3 Leak Detection, Gross and Fine, Using Helium as a Trace Gas P. R. Forant (Varian/Lexington Vacuum Division) 217 5.4 Using Optical Correlation to Measure Leak Rates in Sealed Packages J. W. Wagner, L. C. Phillips, E. P. Mueller, and R. E. Green, Jr. (Johns Hopkins University) 222 Session V Moisture Physics 226 Chairman, Aaron DerMarderosian, Raytheon Company 6.1 The Physisorption of Water Onto Integrated Circuit Package Components J . M. Ammons , G. R. Hoff, M. Kovac, J. H. Linn, and W. E. Swartz, Jr. (University of South Florida) 226 6.2 Simulating the Corrosion Threshold of LSI/VLSI Devices Using Moisture Sensitive Test Patterns J. B. Kiely (Intel Corporation) 236 6.3 The Effect of Humidity on Cermet Resistors T. R. Homa and P. P. Vadala (IBM Corporation) 251 6.4 Moisture Effects on Passive Hybrid Components - 4 Year Exposure Test J. A. Ronning, Jr. and A. H. Jevne (Medtronic, Inc.) . 263 IV ) Page 7. Session VI Moisture and Organics 271 Chairman, Thomas J. Rossiter, Oneida Research Services 7.1 Mass Spectrometr ic Evaluation of Epoxy Adhesive Systems W. Bardens (Beckman Instruments , Inc,) 271 7.2 Moisture Transport in Polyimide Films: Implications for Moisture Measurement in IC Packages D, D, Denton , D, R. Day, and S. D. Senturia (Massachu- setts Institute of Technology 279 7.3 Moisture Content Variation in a High Polymer Content Package B, Church (Medtronic, Inc,) 288 7.4 Volatility Behavior of Organic Die Adhesive Materials R, K. Lowry and K. L, Hanley (Harris Semiconductor) , . , 289 8. Session VII Moisture Control 296 Chairman, John Kiely, Intel Corporation 8.1 Moisture in Electronic Packaging: Measurement and the Control of It G, B. Cvijanovich (AMP Incorporated Research) 296 8.2 Evaluation of Moisture Sources in Hybrid Microcircuits G, H, Ebel, H. Hammer , and S , Herman (Singer Company) . , 302 8.3 Implantable Pacemaker Moisture Control J, A, Ronning, Jr, (Medtronic, Inc.) 307 8.4 Determination of Reliable Moisture Levels B. Church (Medtronic, Inc.) 313 9. Workshop Participants 314 9.1 List of Speakers 314 9.2 List of Attendees 317 v Preface A third workshop on Moisture Measurement Technology for Semiconductor Devices was held at the Gaithersburg, Maryland, facility of the National Bureau of Standards on November 2 to 4, 1983, under the co-sponsorship of the Rome Air Development Center (RADC) and the National Bureau of Standards (NBS) . It was another in a series of workshops that have been conducted as part of the Semiconductor Technology Program of the NBS. These workshops have been dedi- cated to the furtherance of the measurement technology needed by the semicon- ductor device industry in its attempt to provide to its customers products that are based on the most advanced technology, yet have high reliability and the affordable costs which result from high yields. Representatives from industrial, governmental, and academic organizations concerned with device manufacture, analysis, and instrument design participated. These workshops have provided a forum for reporting the continuous progress that has been made in the measurement of moisture in hermetic semiconductor devices, in the correlation between measurements by different procedures, in determining the sources of moisture, in test environments, and in process control. Thirty-four formal presentations were given. The workshop was co-chaired by Benjamin A. Moore of RADC and Stanley Ruthberg of NBS; Sara R. Torrence and Kathleen D. Kilmer of NBS coordinated workshop arrangements; Pamela M. Baker of NBS was responsible for fiscal matters and registration; E. Jane Walters of NBS provided editorial assistance and super- vised processing of these Proceedings; and Brenda L* Kefauver, Marilyn L. Stream, Jennifer L. Allen, and Josephine S. Halapatz assisted in operational details. Disclaimers The views and conclusions expressed are those of the authors and do not necessarily represent the official policies of the Department of Defense, Department of Commerce, or the United States Government. Certain commercial equipment, instruments, or materials are identified in papers published in this report in order to adequately specify the experimental procedure. In no case does such identification imply recommendation or endorsement by the National Bureau of Standards, nor does it imply that the material or equipment identified is necessarily the best available for the purpose. Papers in this volume have not been edited by the National Bureau of Standards. Non-NBS authors are solely responsible for the content and quality of their submissions. vi ) * , RADC/NBS Workshop Moisture Measurement and Control for Semiconductor Devices, III - A Workshop Report - Benjamin A. Moore (RADC) and Stanley Ruthberg (NBS The workshop, one of a series concerned with measurement problems in integrated circuit processing and assembly, served as a forum to examine the continuing progress that has been made in the measure- ment and control of moisture in hermetically packaged semiconductor devices. Thirty-four presentations are included which contain detailed information for securing hermetic packages with low mois- ture content. Agreement in measurement has been obtained with the mass spectrometer for cerdip and metal packages at the 5000 ppmv level of moisture through the use of suitable moisture generators, a 3-volume calibrator, calibrated dewpoint hygrometers, and appro- priate operational procedures. An approach is given for a repro- ducible and reliable
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