The ESD Association newsletter, published for everyone with an interest in the understanding and control of electrostatic discharge. Volume 25, No. 5 September/October 2009
In this issue The 31st EOS/ESD Symposium is a
From the President Success in Anaheim! David E. Swenson, page 4 Dr. Steven H. Voldman Symposium Awards, pages 2-3 ESD Symposium General Chairman IEW Call for Presentations, page 6
Symposium Call for Papers, page 7-8 It was a great pleasure to be the Gen-
Standards Activity Update, pages 9-10 eral Chairman of the 2009 EOS/ESD Symposium in Anaheim, California Q & A, page 11 held from August 30th - September 4th, 2009. a tradition and have the opportunity to ESD on Campus, page 12 This year, the EOS/ESD Symposium invite more faculty allowing our ESD Local Sparks, pages 13-14 attendance exceeded 300 people. The society to grow. ESDA Spotlight, page 15 conference this year was a lot of fun, During the Assocation Luncheon a with great events, good food, excellent special talk was given by Dr. Jeremy Online Training, page 16 California vintages of wine, and excel- Smallwood, Chairman of IEC TC101 – Electrostatics. the talk was titled “The Calendar, page 17 lent assistance from the Disneyland staff. The weather was beautiful, and Strange World of Static Electricity and there were fantastic fireworks every International Standards” covering some www.esda.org evening after dusk. of the strange and humerous affects Some of the highlights of the Sym- that ESD has had on industries. In the next issue of posium this year included a Keynote This year at the EOS/ESD Symposium, talk in the biomedical field, The there was significant growth in publica- Threshold... Keynote talk given by Dr. Shekar tions in the area of micro electrome- 2009 EOS/ESD Symposium featured Rao, of Texas Instruments was titled chanical (MEMs), advanced CMOS ten interactive workshops. The topics “Emerging Trends of Medical Devices devices, and ESD device level testing. of the workshops included ESD de- and Opportunities for Semiconductor In the Exhibit Hall, the latest advance- sign, simulation, test, control methods Chip Technology.” The talk discussed ment in vendor materials and equip- and many others. Symposium partici- biomedical directions for chip devel- ment was shown. The exhibit hall was pants enjoyed great opportunity for opment. Faculty were invited from filled with exhibitors from corporations lively discussions and learning from four different universities that provide to universities in the ionization, materi- ESD industry experts as well as shar- research and development in the field als, conductive polymers, consulting to ing their own experiences. Detailed of ESD. Vice President Ker Ming-Dou device-level test equipment. report on 2009 EOS/ESD Sympo- of I-Shou University (Kaohsiang, sium workshops will be published in Taiwan), Professor J.J. Liou of To liven up the event, Disney characters November/December issue. University of Central Florida (UCF), even entered the technical sessions Professor Albert Wang of University of and the exhibit hall, shaking hands, California Riverside (UCR), and Pro- and greeting the attendees. fessor Kaustav Banerjee of University Was this event a good time? Yes! Be- of California Santa Barbara (UCSB) tween the food, the weather, the venue, provided lectures on ESD research in the staff and a good program to keep their respective research groups. This us busy, it was a good EOS/ESD event was a great success, with many stu- ...a great EOS/ESD event! dents from these universities attending. See you in Sparks (Reno), NV in 2010, In future years, we hope to make this at the 32nd EOS/ESD Symposium. September/October 2009
Symposium Award Recognition! Numerous individuals contribute to the success of the industry, organization or events. For those who go above and beyond, the ESD Association annually recognizes individuals who have made a last- ing impact on the Association or on the ESD industry. These awards are presented at the annual EOS/ESD Symposium. Outstanding Contribution Award ESD Symposium General Chairman Reinhold Gaertner Dr. Steven H. Voldman The Outstanding Contributions Award is The Symposium General Chairman is rec- awarded to an individual who has made a ognized for the time and contributions put major contribution to either the develop- forth in the organization and planning of ment or the operation of the ESD Associa- another successful EOS/ESD Symposium tion or has had a significant impact in the event. field of EOS/ESD.
Symposium Award Arnold Steinman
Industry Pioneer Recognition President Award Award Evan Grund Steve Fowler The President’s award is presented in The ESD Association Industry Pioneer recognition of significant contributions, lead- Award is presented to an individual whose ership and management that has enhanced contributions, vision and service helped to ESDA operations and effectiveness in serv- Volunteer Award form, or significantly change, the industry. ing industry and the organization. Tim Prass
TPC Award David F. Barber Sr. Memorial Award Joel P. Weidendorf Memorial Award David Tremouilles Carl Newberg Fred Tenzer (Horst Geiser received the award for David) The David Barber Sr. Memorial Award is The Joel Weidendorf Memorial Award is The ESD Association Technical Program presented to an individual who has made a presented to an individual who has made a Committee award honors an individual for significant contribution to the development, significant contribution to the development outstanding contribution to the Symposium organization, management and growth of of ESD Association Standards. Technical Program Committee. the EOS/ESD Symposium.
September/October 2009
Symposium
Symposium Paper Awards
The Symposium Outstanding Paper Award A special recognition cites the best paper went to HBM ESD Failures Caused by a from the 2008 RCJ ESD Symposium- Parasitic Pre-Discharge Current Spike Japan. This year’s Friendship Award was
presented to Melanie Etherton, Victor Axelrod, James ESD Parameter Extraction W. Miller, Haim Marom, Freescale Semi- by TLP Measurement Orangewood conductor; Tom Meuse, Thermo Fisher Yasuhiro Fukuda, Tomomi Yamada, Oki Scientific Engineering, Co., Ltd.; Masanori Sawada, Children’s Hanwa Electronic Industry Co., Ltd. Foundation Contribution
At this year’s EOS/ESD Symposium, the ESD Association was pleased to ESD ASSOCIATION sponsor one of Anaheim’s local char- The Best Paper Award awarded to ELECTS BOARD MEMBERS ity organizations. The Orangewood A Study of Cable Discharge Events and Children’s Foundation is a shelter for Other Short Time Pulses of Cabled MR AND OFFICERS FOR 2010 children who were the victims of abuse, Sensors Election results were reported during neglect and abandonment. The Or- Icko Eric Timothy Iben, IBM the annual ESD Association business angewood Children’s Foundation con- meeting luncheon at the 2009 EOS/ tinues its efforts by meeting the needs ESD Symposium, in Anaheim, CA. of children in the foster care system, developing a wide range of activities, Elected to the Board of Directors, by scholarships, support and programs to the members of the ESD Association, give every child every chance to suc- for a three-year term from January 1, ceed. 2010, to December 31, 2012, were Nate Peachey, RFMD; Tim Prass, Raytheon; With the support of members and Kathy Muhonen, Penn State Erie, The attendees at the 2009 EOS /ESD Behrend College; Terry Welsher, Dan- Symposium we were able to help this The Best Student Paper was awarded to gelmayer & Associates. important organization with a donation Design Methodology of FinFET Devices of . that Meet IC-Level HBM ESD Targets $2,776 The Board of Directors also elected its S. Thijs, G. Groeseneken, IMEC vzw and officers for a one-year term of January Our sincerest thank you to all who Katholieke Universiteit Leuven; C. Russ, 1, 2010, to December 31, 2010. The contributed. H. Gossner, Infineon Technologies AG; D. following officers were elected: Donn Trémouilles, LAAS/CNRS; A. Griffoni, Uni- versity of Padova; D. Linten, M. Scholz, N. G. Bellmore, Advanced ESD Services Collaert, R. Rooyackers, M. Jurczak, IMEC +, President; Leo G. Henry, ESD/TLP vzw; M. Sawada, T. Nakaei, T. Hasebe, Consultants, LLC, Senior Vice Presi- Hanwa Electronics Ind. Co. Ltd.; C. Duv- dent; and Terry Welsher, Dangelmayer vury, Texas Instruments and Associates, Vice President.
September/October 2009
From the President
ESDA activities.... One of the things we try to do most items produced by the Association. years is find a way to support the The vast majority of these items can host city or a charity in the local now be done in the office, giving us community where we hold our the ability to print on demand and Symposium. This year we chose reduce printed copy inventory. This Orangewood Children’s Foundation. helps reduce a tremendous amount Orangewood deals with child abuse of waste since print runs can be cases and offers some unique much smaller. In the Standards area services to assist young people that alone, we do not have to have a suddenly become “emancipated” stack of published documents on the from the foster care system when shelf as they can be printed to order. they turn 18 years old. Many of Since Standards documents change these young folks have a great deal every so often (5- year reviews), of difficulty getting started in life having an inventory almost always after foster care and Orangewood has led to a large amount of waste in provides much needed assistance the past. The office can now manage and guidance. Symposium attend- printing deadlines better which also Our 2009 EOS/ESD Symposium ees had the opportunity to contrib- assists the volunteers responsible will be history by the time you are ute to the Foundation while at the for content and editorial review. reading this issue of Threshold. Symposium and received a special This has been a pretty trying year button to wear with their Name Electronic delivery of Standards and the Board of Directors and Badge. Special thanks to all who related documents is also a big plus Executive Committee have had to participated in this program; I am to reducing printing inventory. We make some difficult choices regard- sure our modest contribution was are migrating consistently but care- ing the various events and activities well received by the Orangewood fully towards electronic processing that take place at the Symposium. Children’s Foundation. of orders. Due to the unique consid- Hopefully, none of the choices had erations that not-for-profit organiza- a significant impact on the quality On the administrative side of the tions have to deal with, electronic of the Symposium or affected the ESD Association operations, our orders are not so simple. Every experience of any of our attendees. office in Rome, NY has now taken transaction has to be coded properly If you are among those who were on much more of our routine printing and that is a challenge with paper- able to attend, please let us know and publishing responsibility. Just less systems. Software systems are your opinion about this year’s event. about all of the printed matter is now getting better though, and we should Hopefully, you will have filled out a produced in-house. In the past we be able to offer electronic order Symposium Questionnaire since we have used printing houses for printing processing for just about everything, really do review every single one our Standards related documents, including Symposium registration, of the comments and take them to tutorial notes, flyers, brochures, and within a few years. heart. the myriad of other paper based
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September/October 2009
From the President
ESDA activities....continued
On the Technical side of operations, regarding sensitivity levels and will oppressing heat this summer has a Task Team made up of people from be developing a recommendation brought. As of today (end of July) a cross-section of our membership is on how to classify processes and we have had 41 days of 100° F or working on definitions of terminology parts sensitive to very low levels of higher this summer and July will go related to items or processes that are electrostatic charge or discharge. down on record as the hottest month very sensitive to electrostatic phe- in recorded history. The average for nomena. As mentioned in previous Reports from around the industry are this area is 12 days of 100+ for the columns this year, the term “Class beginning to show signs of recovery entire summer. If any one would like 0” is not being used properly since from the latest recession (almost to contribute to my electricity bill, there is no current definition of what depression). As the housing industry please feel free. that means other than its use with and stock market recover from their Human Body Model (HBM) sensitiv- very depressed state of just months ity levels for components. This Task ago, I hope you are seeing an im- Team, led by Steve Heymann, is provement in your business. Here currently gathering information from in central Texas we are looking around the industry and the military forward to the fall and relief of the
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September/October 2009 IEW IEW Call For Presentations 2010 International Electrostatic Discharge Workshop May 10-13, 2010 in Tutzing, Germany http://www.esda.org/iew.htm
Tutzing Castle estate is located on the shores of Lake Starnberg, 30 kilometers Southwest of Munich. With its modern conference rooms and facilities, it has been chosen as the venue of our workshop. The spirit of this place encourages thoughtful discussions and intensive interaction.
Abstract Submission Deadline Friday, Nov. 20, 2009 Submission Instructions We invite you to submit a presentation proposal addressing any of the following topics: Your abstract (two pages including figures) must clearly present the data and the Novel Design Concepts significance of the results. Submitted New protection device and circuit Simulation Tools abstracts will be considered for both concepts, high sensitivity & high speed TCAD interpretation examples, device podium and poster presentation. Please circuit challenges, off-the-wall ideas behavior under ESD like conditions, standard SPICE simulation techniques to email your presentation abstract including Special Custom Design Approaches verify ESD designs, ESD checking tool title, author affiliation, and email address High voltage application designs, development to [email protected] by the November 20, protection design for analog circuits, 2009 deadline. The required format is Bi-CMOS and Bipolar protection, GaAs ESD Testing Characterization and pdf® (Adobe Acrobat®). Notification of protection Tester Issues acceptance will occur by December 11, Failure debug procedures, correlation of 2009. Final presentations for the workshop Technology Integration Issues TLP and HBM and correlation of VFTLP in PowerPoint® format must be received ESD sensitivity with technology transfers, and CDM. Tester to tester correlation, by April 9, 2010. These PowerPoint® qualification challenges for different fabs, ESD tester artifacts, and test standards slides will be included in the Presentation unusual problems of process interaction issues Handout along with a CD-ROM that will be with ESD, process monitor methods distributed during the Workshop. Refereed System Level ESD Issues poster presentations will be included in the Failure Analysis On-chip and on-board IEC protection CD-ROM. There will be no formal report New techniques to detect ESD failures, device techniques, cable discharge, published. Due to an agreed alignment correlation between HBM/CDM/TLP with transient latch-up effects, system failure through the ESD Association, presentation physical FA, unusual failure modes cases of your work at the IEW will not preclude a subsequent, but more detailed, submission Test Structures Unresolved ESD Issues to the EOS/ESD Symposium. For any Design of standard structures for It2, gate Random and unrepeatable ESD failures, questions please contact the Technical oxide and metal current density monitor; issues with ESD standards, ESD data Program Chair, Gaudenzio Meneghesso special VFTLP test structure design and statistics ([email protected] ) analysis
Wolfgang Warmbier Monroe Electronics Untere Giesswiesen 21, D-78247 Hilzingen, Germany 100 Housel Avenue, Lyndonville, NY 14098 Tel: 49-7731-86880 Fax: 49-7731-868846 Tel: 585-765-2254 Fax: 585-765-9330 www.warmbier.com • E-mail: [email protected] E-mail: [email protected] ISO 9001:2000 certified for consulting, manufacturing and supply of static www.monroe-electronics.com control materials and systems, ESD test Instrument calibration Full line manufacturer of static measurement equipment
September/October 2009
Symposium
32nd Annual ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM 2010 SYMPOSIUM CALL FOR Papers
OCT 3 - 8, 2010 John Ascuaga’s Nugget Resort Sparks (Reno), Nevada, USA Accepted papers published in any form prior to presentation at the Symposium may result in the paper being withdrawn from the Symposium Proceedings. Au- thors must obtain appropriate company and government clearances prior to submitting their abstracts. Paper Awards and Recognition Awards are presented annually for the Symposium Outstanding Paper (selected by Symposium attendees), the Best Paper (selected by the Tech- Technical Papers nical Program Committee), and the mission toolkit available on the ESD Best Student Paper. The Best Paper The Technical Program Committee so- Association’s website www.esda.org. is considered for presentation at the licits paper contributions, including data Presentation of work at the International RCJ EOS/ESD Symposium in Japan. and analysis that advance the state-of- ESD Workshop (IEW) will not preclude Eligible student contributions for the the-art knowledge, enhance or review an abstract submission, as long as Best Paper Award should be marked the general knowledge, or discuss new the submission follows the EOS/ESD as such by the authors at the time of topics related to EOS/ESD. Paper Pre- Symposium guidelines. If the IEW work abstract submission. sentations at the Symposium will be in is submitted to the EOS/ESD Sympo- electronic Power Point® format. sium, it is required that the IEW work is Deadlines expanded upon in the abstract submis- Abstracts The submission deadline is Friday, sion for the EOS/ESD Symposium in January 29, 2010. Late submissions will Authors must submit a 50-word abstract order to be considered for acceptance. not be accepted. Abstracts not meeting and 4-page (maximum) summary of guidelines may not be accepted. The fi- their work. The summary must clearly Electronic Submissions nal submission deadline for the finished state the purpose, results (e.g., data, Abstract submissions shall be made papers will be Friday, July 2, 2010. diagrams, photographs, etc.), and con- electronically via an emailed PDF file ESDA reserves the right to withdraw clusions of the work. Summaries must to [email protected]. One file for each any paper not meeting the guidelines, also include references to prior publica- submission is required. including deadlines. Your paper MUST tions and state how the work enhances be submitted by the deadline. Final existing knowledge. Authors must des- Paper Acceptance papers will be limited to a maximum of ignate the appropriate technical area The Technical Program Committee will 10 pages - guidelines will be provided related to their work and submission. accept unpublished papers for peer re- after acceptance of the paper. See reverse for suggested, but not view with the understanding that the au- restricted, topic listings. Authors are thor will not publish the work elsewhere encouraged to use the abstract sub- prior to presentation at the Symposium. Continued on page 8
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September/October 2009
Symposium
Papers are solicited in the following areas: I. Component Level eos/esD x On-Chip Protection Devices & Techniques x EOS/ESD Failure Analysis x ESD Device and Circuit Simulation x IC Design and Layout Issues x Transmission Line Pulse and x Modeling and Physics of EOS/ESD Other Testing Methods x ESD & Latchup, or other Reliability Aspects x Processing Issues and Effects x RF Devices and Circuits x ESD in Advanced Technologies (Multi-gate, x New ESD Phenomena in MEMS x High Voltage, High Power SOI, SiGe, Compound Semiconductors, (Microelectromechanical Systems) Technologies (BiCMOS, HV CMOS) Carbon Nano-tubes, etc.) II. system Level eos/esD x Simulators, Calibration and Correlation x Case Studies, Reviews and Analysis x Optical Networks ESD x Test Methods and Procedures x ESD Detection and Measurement Techniques x Modeling and Simulation x ESD Electronic Design Automation (EDA) Ill. eos/esD Factory Level and Materials Technology x Packaging and Handling x Case Studies, Reviews and Analysis x Test Methods and Procedures x Transient ESD/EMI Induced Upset x Air Ionization and Uses x Troubleshooting Techniques x Facility Design x Management Issues (cost/benefit analyses, etc.) x ESD Control Materials x ESD Shunting Packaging Technology x Use of Antistatic Materials x Chemistry IV. electrostatic Considerations x Biomedical & Chemical Industry Electrostatic Control x Graphic Arts Electrostatic Control x ESD Control in Explosives and Pyrotechnics x Oil/Petroleum Industry Electrostatic Control x Aircraft, Spacecraft and Avionics ESD x Other ESD Topics V. Magnetic Recording Heads and Ultra sensitive Devices x Testing and Analysis x Protection Techniques x Special Considerations for Extremely Sensitive Devices x Failure Analysis Techniques and Interpretations VI. esD standards – Components, system, Factory & Materials x Test Methods and Procedures x Round-Robin Testing, Results and Analysis x Standards - Comparisons and Analysis x Case Studies
Accepted papers covering selected topics may be considered for review for possible publication in a special issue of either the iEEE transactions on Components, Packaging and Manufacturing technology, the Journal of Electrostatics, the Micro- Electronics Reliability Journal, or other appropriate publications.
Contact addresses for ESD Association Technical Program Chair questions2010 or EOS/ESDfurther Symposium 7900 Turin Road, Building 3 Michael KhazhinskyNon-Profit Org. information:c/o ESD Association Rome, NY 13440 Freescale SemiconductorU.S. POSTAGE PAID PERMIT No. 189 7900 Turin Road, Bldg. 3 Phone: (+1)315-339-6937 3501 Ed Bluestein Blvd, MD K10 Rome, NY 13440 Rome, New York Fax: (+1)315-339-6793 Austin, TX, 78721 e-mail: [email protected] Phone: (+1)512-933-3318 e-mail: [email protected] Molded Fiber Glass Tray Co. TOPLINE-ELME 6175 US Highway 6, Linesville, PA 16424 7331A Garden Grove Blvd., Garden Grove, CA 92841 Tel: 800-458-6050 Fax: 814-683-4504 E-mail: [email protected] Tel: 800-776-9888 E-mail: [email protected] www.ESD.TV Manufacturer of static dissipative and conductive trays and containers for Full line ESD products including shoes, garments, chairs, brushes, mats, static protection of sensitive parts. gloves. Maximum comfort.
September/October 2009
Standards Standards Activity Update August 2009 Meeting Series Disneyland Hotel, ments on the HBM standard and mant in February 2009. Attendees Anaheim, CA made editorial and technical showed interest at the 2009 IEW changes. The document has been about different methodologies that submitted to HQ for STDCOM are currently being used in indus- WG2.0 – Garments Vote-By-Mail and will also be sent try that are not the same as SP5.4. •WIP2.1 was approved during to the JEDEC 14.1 Committee for Further discussions will take place STDCOM Vote-by-Mail vote. to decide if SP5.4 could be redes- •The WG addressed all approval ignated or revised. and disapproval comments. The WG5.2 – (MM) Device Testing disapproval vote will be changed WG5.5 – (TLP) Device Testing to an approval with comments. •The WG responded to industry Formal responses will be sent to review comments from seven re- •Two presentations were given. commenters. viewers. No technical changes Mirko Scholz had completed some have been made. Formal respons- VF-TLP modeling using needle •The document has been submit- es will be sent to the commenters probe instead of calibration of VF- ted to HQ for Industry Review be- and the document will be going to TLP transient measurements. tween the August and February publication. The MM WG will be meetings. •Alan Righter gave a presentation going dormant. using VF-TLP to determine tran- sient safe operating areas for de- WG3.0 – Ionization WG5.3.1 – (CDM) Device Testing vices. •The WG discussed TAS input •The WG began the comment •The round robin is complete and and recommended changes for resolution for the industry review data is being prepared for review WIP3.4. Additional changes were comments. by the standards statistician. made and have been sent to HQ for another TAS review. WG5.6 – (HMM) Device Testing •The document will go to STDCOM JWG (WG5.3.1) - (CDM) Device Vote-By-Mail between the August Testing •The WG adjudicated industry and February meeting series. •Four presentations were given. review comments. No technical changes were made. The docu- •Donn Pritchard also presented Tim Maloney gave an update on the 10 ohm resistor model for ment will be submitted for TAS re- data from testing on numerous view and publication. “standard 6” CPMs having differ- CDM. This is to prepare for a joint ent size ground planes. Testing CDM document with JEDEC. •A discussion was held regarding confirmed that measurements/re- •Reinhold Gaertner and Marti Far- the round robin testing that is be- sults are very different and it ap- ris gave separate presentations on ing arranged for the potential el- pears that the size of the ground three pulse vs. one pulse. evation of SP5.6 to STM5.6. Sem- plane and many other factors af- tech brought 50 devices that were •Marcos Hernandez gave a pre- distributed to 10 participating labs. fect the results. sentation on a new CDM test methodology. JWG (WG5.1) – (HBM) Device Testing WG5.4 – (TLU) Device Testing
•The JWG reviewed TAS com- •The WG had decided to go dor- Continued on page 10
September/October 2009
Standards Standards Activity Update Continued
WG7.0 – Flooring •The WG reviewed S7.1 for five- year review. They discussed whether to add a section for raised access floors in this document or to add it to the current TR being developed.
•The WG discussed new ideas: ESD events at the board and IC WG9.0 – Footwear ♦Voltage retention on packaging level. •Comparison tests were completed – using a contact volt meter to •Robert Ashton presented CDE using different industry standards scan packages waveforms/methods of capturing with three pairs of shoes from five ♦A TR for using resistance test events over long time periods on manufacturers. methods. multiple wires. ♦A comparison test was done be- ♦Voltage decay on packaging. •All STDCOM Vote-by-Mail com- tween STM9.1 and the Canadian ments were adjudicated for CSA Z195 test methods. There is ♦Use EMI detector inside packag- WIP14.3 (measurment of CDE a large difference. ing. Current.) ♦A comparison test was done be- •WIP14.4 (CDE Test Procedures) tween STM97.1 and the ASTM WG13.0 – Handtools is due to HQ for TAS review in test method. There wasn’t a large •The WG visited the OKI facility Oct. difference. and went through round robin data •WIP14.5 (EMC ESD Scanning) from the second round robin. The was discussed. WG10.0 – Handlers second round robin didn’t give de- sired results. There was too much •The WG reviewed WIP10.2 and variation to meet the standard defi- WG15.0 – Gloves made required edits. nition of accepted variability due to •The WG reviewed TAS comments •A technical discussion was held the inherent operating frequency on WIP15.2. The document will be regarding the “target” design and ranges of the equipment and varia- submitted to TAS after a few more repeatability of waveforms. tion in bandwidth of measurement changes. equipment on the market.
WG11.0 – Packaging •The document will be sent to TAS WG53.0 – Compliance Verifica- for review. •The WG reviewed comments tion from STDCOM Vote-By-Mail. All •The WG incorporated and re- changes were editorial. The docu- WG14.0 – System Level ESD viewed the last set of TAS com- ment has been submitted to HQ •There were two presentations. ments. After two more figures are for Industry Review. Fabrice Caignet gave a presenta- added to the document, will be tion on modeling and simulating sent back to TAS.
10 September/October 2009
Q&A
ANSI/ESD S20.20 2007, limit of 2000 volts/in
Q. In ANSI/ESD S20.20 2007 there not a threat if e-filed is <2000V or insulator does is induce a voltage is a limit of 2000 volts/in. What this <1000V even for contact? Is there on an ungrounded device and if the is stating is that if insulators mea- any test or experiment that can device is grounded within the field, sure less than 2000 v/in then they show it is not a risk for 100V HBM a discharge could occur. However are NOT considered a threat and or higher device? Is there any arti- a field of 100 volts/in cannot in- no action needs to be taken. 2000 cle that can be shared? Is there any duce a potential on a device that is volts/in is the limit even for contact. further study conducted by ESDA damaging. The field must be much The problem is most of our custom- that <2000V is not a risk even for higher to be able to set up a damag- ers are using 100V as the control contact? ing event. In fact, the studies show limit to audit our workstation. If the that insulators need to have a large e-field from the package material, As most of our customers have a uniform charge across the surface the machine cover or even an ESD misunderstanding for 100V HBM, (very unlikely) and must be very smock is higher than 100V, they I’d like to get your comments so that close (less than 1/8 of an inch) to say it is not ESD S20.20 compli- I can persuade them. become problems. Fields of 2000 ant and we are required to take ac- v/in did not cause problems unless tion to bring it down. But honestly A. You are correct in your inter- the insulator was a large uniform speaking, it is hard to control all to pretation of the insulator threat material almost in contact with the <100V. level in ANSI/ESD S20.20 - 2007. device. For a typical insulator, the The threat level is defined as 2000 field generated had to be in excess My belief is that what most people volts/in for insulators. The number of 10,000 v/in before problems oc- do not understand is that 100 volts was generated by studies done by curred. on a person is not the same as 100 North America (Celestica and the volts on an insulator. While a person US Air force) and by studies done can discharge their voltage to the in Europe. The important point to part, an insulator can only induce a note is that 100 volts on a person voltage on a part. I noticed that the is different from 100 volts on an in- E-field control limit in IEC61340-5-1 sulator. A person with 100 volts can is also 2000V. In JEDEC625-A the discharge the entire energy into the control limit is changed to 1000V. device. An insulator does not have My question is that for ESD sensi- a potential but can only generate tive devices which are sensitive to a field. So the proper term that an 100 volts or higher HBM, why the e- insulator can have is 100 volts/in. field control limit is 2000V or 1000V This level is a field and cannot be but not 100V. How can I say it is discharged into a device. What an
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11 September/October 2009 ESDAssociation on Campus
Silicon Shuttles to Space Shuttles, ESD at the University of Central Florida
Wen Liu is doing experimental work on nanowire FETs and Carbon nanowires. When I was visiting, the first ESD TLP measurements of Carbon Nanowires were being tested by student Wen Liu, and the first publication was being pre- pared for release. UCF collaborates with Singapore and Taiwan in ESD re- search efforts. Dr. Steven H. Voldman provided an ESD talk, co-sponsored by the ESD Association and the IEEE Electron De- vice Society on “Nano-Defects-ESD in Nano-technology” highlighting the new fields of ESD in nano-technology. In Central Florida, silicon technology is there are silicon “shuttles” – multi-pur- Central Florida is exploring devices as abundant – from the sandy beaches at pose wafers from TSMC, and other small as Carbon Nanowires, as large Satellite Beach to the ESD laboratory of corporations on the tables being tested as the Space Shuttle and Internation- University of Central Florida. on the Barth TLP test system for ESD al Space Station; from both electron From Satellite Beach, you can see the development in the lab of Professor to planetary orbitals…and of course, launch of the Space Shuttles and Delta J.J. Liou. The walls of the lab are sur- some sunshine on the beach and the rockets from Launch Pad 39A at the rounded with ESD charged students good surf. Hang ten! Kennedy Space Center. On a typical working on applications from RF ESD, day, surfers and pelicans hang on the analog, smart power devices, to carbon Dr. Steven H. Voldman coastline riding the waves. On a night nano-wires. Graduate students include ESD on Campus launch of the Space Shuttle, the beach- Slavica Malabobic, David Ellis, Blerina ESD Association Board of Directors es are filled with spectators awaiting the Aliaj, Wen Liu, Qiang Cui, You Li, and countdown’s final minutes. In this re- Zhiwei Liu; Slavica gion, there is NASA’s Kennedy Space Malobabic works on Center, Harris Corporation, Intersil, GE, an ESD Transient DRS Technology, and thousands of Safe Operating vendors supporting the NASA needs - Area (SOA); David all concerned with ESD. At NASA, even Ellis is working on the bed of stone under the transporter, gate oxide and soft- delivering the Shuttle to the launch- ware development; pad, is special stone from Tennessee You Li’s research is with low tribo-electric charging to avoid on RF ESD; Zhiwei charging as it travels from the Verticle Liu works on high Assembly Building to the launch pad voltage ESD; Xiang 39A. Liu focuses on III- V ESD work; and Only one hour drive away, at UCF,
Tech Wear, Inc. Dur-A-Flex Inc. 2205 Faraday Ave., Suite B, Carlsbad, CA 92008 95 Goodwin St., East Hartford, CT 06108 Tel: 760-438-7788 Fax: 760-438-6868 Tel: 800-253-3539 www.dur-a-flex.com Email: [email protected] www.techwear.com With over 40 years of experience and innovation. Dur-A-Flex manufactures epoxy, urethane and acrylic seamless flooring and wall systems for commercial, Industry leader in static control garments, including groundable industrial and institutional applications. cleanroom garment systems.
12 September/October 2009 Association Local Chapters Quick Links to ESD Local Chapters and affiliated organizations AEC (ASEMEP ESD CounASEMEPcil) ESD Council • aec.asemep.com.ph Asociación ESD de Mexico • www.esdmexico.com Philippines Update Indian Chapter no website available North Central Chapter • www.esdnorthcentral.org July , 2009 “Local Sparks” Northeast Chapter • www.nechapter-esda.org The Local Chapter Connection th Silicon Valley EOS/ESD Society • www.esdiscovery.org SouthwestASEMEP ChapterESD COU N•C www.southwestesd.comIL ASEMEP Philippines 5 ESD Forum (AEC) OFFICERS 2009 - 2010 Texas Chapte Cr h•a iwww.Centxesdassoc.homestead.comrman : Michael Josue J. Pacis Jr. ASEMEP(AMKOR ESD Phil sCOUNCIL) (AEC) OFFICERS 2009 - 2010 Chairman:Vice Chai r man: J e d Michael Romal eJosues J. Pacis Jr. (AMKOR Phils) Vice(3M Chairman:Philippine s ) S e c Jedreta Romalesry : (3M Philippines) Secretary:Vivian V a l l e za ( P R VivianICON Valleza) (PRICON) AsstAsst Secretary: Secretary : R o yRoy Ma Martinezrtinez (PROPACK) Treasurer:(PROPAC K ) T r eJerryasur eRiverar : (DOUYEE) MembershipJerry River aChairman: (DOUYEE) M e Marcelonmbership Cada Chai r(ON-SEMIman : Calamba) Technical & Education: Marcelon Cada Ray Tag-at (HGST) (ON-SEMI Calamba) Events Chairman: T e cKerwinhnical Picazo& Edu c a(NXP)tion : The recognition of newly elected AEC Officers last June 5, 2009 during the Ray Tag-at (HGST) 5thThe Philippine recognition ESD of newly Forum elected at SMX AEC Mall Officers of Asia. last June 5, 2009 Events Chairman : during the 5th Philippine ESD Forum at SMX Mall of Asia. Kerwin Picazo (NXP)
TheThe ASEMEPASEMEP ESD Council ESD CouncilThe theme Industries for 2009 5th in the Philippines Inc The AEC 5th PESDF is an every (AEC)(AEC) isis the the first Asian first local Asian localPhilippine (SEIPI).ESD Forum (PESDF) The AEC 5th PESDF is another every year event and was held chapterchapter of ofESD Association ESD Association is “Innovative Thinking other year event and was heldat SMXat Mall of Asia on June 5, (ESDA) a world-wide organization Towards Robust and Cost SMX Mall of Asia last June 5, (ESDA)which has a the world-wide responsibility of organizaEffective- ESDThe Control theme for the 20092009, attended 5th byPhil more- than2009. The event was attended by tionrepresenting which has the interest the ofresponsibility Program”. ippineThe event ESD focus is Forum to hundred (PESDF) delegates was from more than a hundred delegates International Electrotechnical interact, converse and share Semiconductor and Electronic of representingCommission (IEC) in thethe area interest of topi cs of about “Innovative ESD Control best ThinkingIndustries Towards ESD Control Supplyfrom Semiconductor and Elec- Internationalelectrostatics. Electrotechnicalknown practicesRobust and advance and Cost Chain, Effective Academes ESD and other tronic Industries, ESD Control The AEC was formed in technologies which will ASEMEP members. The technical CommissionJanuary 2002 as (IEC) technical in working the area facilitate of learningControl and Programs”.speakers The were eventfrom Academe, Supply Chain, Academes, and electrostatics.group of the Association of applicationfocus of practical was ways to on interact,International converse Guest Speakers other and ASEMEP members. The Semiconductor and Electronics how to simplifyand theshare existing topics aboutExperts, ESD ESD GuruCon and- technical speakers were from Manufacturing Engineers of the ESD Control to reduce cost and International NARTE Certified ThePhilippines AEC was(ASEMEP) formed and the in Januat the -sametrol, time make best it robust. known ESD practices Engineers of and the Philippines. Academe, International Guest ary Semiconductor 2002 as and technical Electronics working advance technologies, which Speakers and Experts, and Inter- Industries in the Philippines Inc group(SEIPI). of the Association of could facilitate learning and ap- national iNARTE Certified ESD Semiconductor and Electronics plication of practical ways on how Engineers of the Philippines. Manufacturing Engineers of the to simplify existing ESD Controls. Philippines (ASEMEP) and the Several ideas on how to reduce Semiconductor and Electronics cost, while maintaining a robust control system were presented. California Micro Devices Corp. Winifred Int’l Technology Ltd. 490 N. McCarthy Blvd. #100 • Milpitas, CA 95035 399 Cailun Road, Pudong New Area, Shanghai, China Tel: 800-325-4966 Fax: 408-263-7846 www. winifred-hk.com • e-mail: [email protected] www.cmd.com Leading supplier for ESD and contamination control products, wrist straps, Leading supplier of application specific analog and mixed rubber mats, test equipment, packaging products, clean gloves, garments, signal semiconductor products, protection devices chairs, and ionizers.
13 September/October 2009 Association Local Chapters Quick Links to ESD Local Chapters and affiliated organizations ASEMEP ESD Council • aec.asemep.com.ph Asociación ESD de Mexico • www.esdmexico.com Indian Chapter no website available North Central Chapter • www.esdnorthcentral.org “Local Sparks” Northeast Chapter • www.nechapter-esda.org The Local Chapter Connection Silicon Valley EOS/ESD Society • www.esdiscovery.org Southwest Chapter • www.southwestesd.com Texas Chapter • www.Centxesdassoc.homestead.com
An ESD Awareness course was conducted by the India Chapter, (IESDA) in Bangalore, India, on July 22nd, 2009. The workshop was well received by the partici- pants and was a very encourag- ing course. The India Chapter hopes to hold more ESD events in the coming days.
Thank you to A.Vijayendra, Founder, Member, and Presi- dent of the Indian Chapter of the ESD Association for sharing these photos with us.
CONTROLLED ENVIRONMENTS MAGAZINE 4 Limbo Lane, Amherst, NH 03033 Statico 541 Taylor Way, #1, San Carlos, CA 94070 USA Tel:603-672-9997 Fax:603-672-3028 Tel: 650-592-4733 Toll Free: 1-800-261-4149 www.cemag.us [email protected] Leading source of information on contamination prevention, Fax: 650-508-0761 • [email protected] • www.statico.com detection, and control for cleanrooms and critical environments. Global supplier of static control & cleanroom products
14 September/October 2009 LocalESDA Chapters Spotlight Elaine Olson an “ESD Guru” ESD knowledge. guidance”, says Elaine about her Having attended the Garments, membership experience. Gloves and Packaging standards Elaine is married with 3 children committees for about 5 years as and 3 grandchildren. Her young- a guest Elaine is now a member est child is still at home, he will be of two years running. Elaine a sophomore in high school this says “The ESDA tutorials and coming August. The family spends standards meetings have been as much time as possible travel- my education and support in the ing in their RV. The longest and ESD world.” She went on to say furthest trip to date was 6 weeks “The resources and the generous in Canada and Alaska. Elaine support of the people in the orga- enjoys scrapbooking, reading and nization have greatly contributed spending time with her son on the to my success.” golf course (she is his caddy). “This has been a great opportunity Watching the Food Network chan- to broaden my ESD knowledge nel gives Elaine an opportunity to and insight into the various indus- find new recipes to try out on her tries that depend on the ESDA for unsuspecting family.
Elaine Olson an ESD/Micro En- gineer from Intel Corp. is in the ESDA spotlight! Elaine has worked at Intel for 28 years in both Fab and Assembly Test in manufacturing and process engineering. She has spent the last 11 of those years developing and sustaining an ESD - Micro con- tamination program in Assembly Test. With Julian Montoya as her mentor, Elaine has benefited im- mensely from the ESDA and loves to share what she has learned with anyone who will listen. Elaine says she is known at work as the “ESD Guru” because of all of her
Achilles USA, Inc. 1407 80th Street S.W., Everett, WA 98203 Your Listing Can Appear Here Tel: 425-438-4549 Fax: 425-347-5785 Contact ESD Association for details [email protected] • www.achillesusa.com 7900 Turin Road, Building 3, Rome, NY 13440-2069 Achilles is the leading global manufacturer of static controlled materials. ST-Polymer, a unique conductive polymer Tel: 315-339-6937 Fax: 315-339-6793 developed by Achilles’ advanced technology, has been gaining attention around the world for its quality. Achilles also manufactures a variety of electronics-related items including EMI shields, heat conductive sheets, and more. [email protected]
15 Air Ionization: Theory and Practice October 8, 2009 • 2:00 p.m. Eastern Time September/October 2009 Offered by the ESD Association AssociationEducation
Air Ionization:Air AirTheory Ionization: Ionization: and Practice Theory Theory and and Practice Practice October 8,October 2009Air • 2:00 Ionization: p.m.8, 2009 Eastern • Theory2:00Time •p.m. Course and Eastern length Practice - one Time hour. OctoberAir Ionization: 8, 2009 • 2:00 Theory p.m. Easternand Practice Time Online Training Instructor:October Arnold Steinman, 8, 2009 Electronics • 2:00 Workshop p.m. Eastern Time OfferedOfferedOctober 8,by by 2009 the the • ESD2:00 ESD p.m.Association Association Eastern Time Solve ProblemsOffered Caused by Bythe Static ESD Charge Association With Air Ionization AirAir Ionization: Ionization:Offered Theory Theory and andby Practice Practice the ESD Association October 8, 2009 • 2:00 p.m. Eastern Time • Course length - one hour. OctoberAir Ionization: 8, 2009 Theory • 2:00 andp.m. Practice Eastern Time • Course length - one hour. Online Training Instructor: Arnold Steinman, Electronics Workshop
Online Training The primary method of static charge control is direct connection to ground for conductors, AirInstructor:October Ionization: 8, 2009Arnold Theory • 2:00 Steinman, and p.m. Practice Eastern Electronics Time Workshop • Course length - one hour.
Online Training staticOctoberInstructor: dissipative 8, 2009 Arnold materials, • 2:00 Steinman, p.m. Eastern and Electronics personnel. Time •Workshop Course But lengtha complete - one hour. static control program must also
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This seminar ▲ Ionizer will cover Selection the following Criteria topics: and Examples October ▲ ▲ Ionizer IonizationImportance Selection 27, Fundamentals of CriteriaIonization2009 and • in and Examples2:00 a Static Methods p.m. Control EasternProgram Time ▲ ▲ANSI/ESD Importance S20.20 of Ionization Static in Controla Static Control Program Program Requirements for Ionization ▲ ▲ ANSI/ESD IonizerIonization Selection S20.20 Fundamentals Static Criteria Control and Program ExamplesMethods Requirements for Ionization ▲ Ionization Fundamentals and Methods About Offered the ▲ Instructor ANSI/ESDIonizer Selection S20.20by Criteria Staticthe andControl ESD Examples Program Association Requirements for Ionization About the ▲Instructor Ionizer Selection Criteria and Examples ▲ ANSI/ESD S20.20 Static Control Program Requirements for Ionization ArnoldAbout Steinmanthe Instructor is currently an independent Electrostatics Consultant. For over 25 years ArnoldGrounding he guidedSteinman ▲ theANSI/ESD in technologyan is Electrostatic currently S20.20 of Ion StaticanSystemsProtected independent Control Inc. Area Starting Program Electrostatics in 1983, Requirements he was responsibleConsultant. for Ionization for the For over 25 years he guidedOctoberdesignArnoldAbout concepts theSteinmanthe 27, Instructor 2009technology of • theis2:00 currently company’s p.m. of Eastern Ion an ionization independentSystems Time static • CourseInc. Electrostatics control Starting length products, - in oneConsultant. 1983,including hour. he four For was patents over responsible 25 years for the Instructor:Aboutcovering the air Instructor Davidionizer E. technology. Swenson, Steinman Affinity Static graduated Control from Consulting, the Polytechnic L.L.C Institute of heArnold guided Steinman the technology is currently of Ionan independentSystems Inc. ElectrostaticsStarting in 1983, Consultant. he was responsible For over 25 for years the Online Training designBrooklyn, concepts receiving of boththe BSEEcompany’s and MSEE ionization degrees. Steinmanstatic control is a member products, of the Boardincluding four patents LearnArnolddesign theSteinman concepts basics isof of currentlythe grounding—without company’s an independent ionization leaving Electrostaticsstatic control your desk! products,Consultant. including For over four 25 patents years coveringofhe Directors guided air ionizer theof the technology ESD technology. 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ESD Association 7900 Turin Rd. ESDEquipment Association Requirements315-339-6937 ph [email protected] Building 3 This course uses a multi-way315-339-6793 audio broadcastfax over the Internet.www.esda.org You will need a soundcard andRome, speakers NY 13440 (a headsetEquipment is recommended) Requirements installed to hear the presenter during the course. AttendeesThis cancourse send uses questions a multi-way to the audio presenter broadcast via text over chat, the otherInternet. interaction You will is need not available.a soundcard and speakers (a headset is recommended) installed to hear the presenter during the course. Attendees can send questions to the presenter via text chat, other interaction is not available.
ESD Association 7900 Turin Rd. ESD Association 315-339-6937 ph [email protected] BuildingESD 3 Association 315-339-6793 fax www.esda.org Rome,7900 NY 13440Turin Rd. ESD Association 315-339-6937 ph [email protected] Building 3 315-339-6793 fax www.esda.org Rome, NY 13440 September/October 2009 T Calendar
October 8, 2009 November 10, 2009 June 10-15, 2010 Air Ionization: Theory and Practice Charged Board Events: A Growing June Meeting Series Online Course Industry Concern Doubletree, Chicago (North Shore), IL http://www.esda.org/documents/ Online Course AirIonizationTheoryandPractice.pdf http://www.esda.org/documents/ September 30 – October 8, 2010 ChargeBoardEventsAGrowingIndustryConcern.pdf EOS/ESD Symposium October 13 - 14, 2009 JA Nugget, Sparks (Reno), NV S20.20 Seminar February 25-March 2, 2010 ESDA Headquarters, Rome, NY February Meeting Series http://www.esda.org/documents/ JA Nugget, Reno, NV RomePMSeminar10-09.pdf May 10 - 13, 2010 October 27, 2009 IEW International Electrostatic Grounding in an Electrostatic Workshop Protected Area Tutzing, Germany Online Course http://www.esda.org/documents/ GroundingOnline10-27-09.pdf
Threshold
ThresholdTM is published six times a year by the Newsletter Staff Editorial Advisory Board ESD Association, a not-for-profit corporation. It strives for the advancement of theory and Editor President practice of electrical overstress avoidance and Terry Finn David E. Swenson, of allied arts and sciences and the maintenance ESD Association Affinity Static Control Consulting, LLC of a high professional standing among its 7900 Turin Road, Bldg. 3, Rome, NY 13440 members and others. Tel: 315-339-6937 Fax: 315-339-6793 Sr. Vice President ©Copyright 2008, ESD Association, Rome, NY E-mail: [email protected] Donn Bellmore, Advanced ESD Services +
ThresholdTM Publication Schedule Associate Editors Vice President Issue Deadlines Development Leo G. Henry, ESD/TLP Consultants, LLC. January/February...... Nov. 19 David E. Swenson, President March/April...... Feb. 1 Affinity Static Control Consulting, LLC Human Resources May/June...... April 1 Arnie Steinman, Electronics Workshop July/August...... June 1 Production Design and Test September/October...... Aug. 1 Steve Voldman, Dr. Steven H. Voldman LLC Additional Editorial Assistance November/December...... Oct. 1 Leo G. Henry, ESD/TLP Consultants Marti Farris, Intel Corporation
Threshold Institutional Listings Technology ESD Association Headquarters Staff Space in the Threshold Institutional Listings, Charvaka Duvvury, Texas Instruments Lisa Pimpinella, Director of Operations which appear at the bottom of newsletter Christina Earl, Standards Administrator pages, can be purchased for $600.00 for six Terry Finn, Marketing Administrator consecutive issues. Listings will also appear Karen Macri, Administrator in the online calendar. Larger contributions are welcome. No agency fee is granted for soliciting such contributions. Inquiries, or contributions made payable to the ESD Association, should be sent to: ESD Association, 7900 Turin Rd., Bldg. 3, Rome, NY 13440-2069 Tel: (315) 339-6937, Fax: (315) 339-6793, e-mail: [email protected]. 7900 Turin Road, Bldg. 3, Rome, NY 13440-2069 Tel: (315) 339-6937 • Fax: (315) 339-6793 E-mail: [email protected] • Web: www.esda.org
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