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CPMT Newsletter Fall 2011 Components, Packaging, and Manufacturing Technology Society Newsletter THE GLOBAL SOCIETY FOR MICROELECTRONICS SYSTEMS PACKAGING VOL. 34 NO. 2, FALL 2011, ISSN 1077-2999 www.cpmt.org www.ewh.ieee.org/soc/cpmt/newsletter President’s Column.... Fan from Lamar University, USA, winner of the Exceptional Technical Achievement Award; Mark Brillhart from Cisco, who received the Electronics Manufacturing Technology Award; Rolf Aschenbrenner Muhannad Bakir from Georgia Institute of Technology¸ USA, President, IEEE CPMT Society who received the Outstanding Young Engineer Award and Paul Fraunhofer-Institut, Berlin, Germany Wesling, Santa Clara, CA, USA, who was recognized for his [email protected] contribution to the Santa Clara CPMT chapter. Please see the full profile of the 2011 winners further on in the newsletter for more information about their individual contributions. We also cannot forget our former CPMT president Rao R. Tummala, e are currently heading into another round of elections who received the “2011 IEEE Components, Packaging and for CPMT’s Board of Governors. This year, voters in Manufacturing Technology Award” (also profiled in the news- WRegions 1–7 and 9 (US, Canada and Central and South letter) – I’d like to extend my congratulations on behalf of all of America) will elect four members-at-large, while Regions 8 CPMT to you, Rao. (Europe, Middle East, Africa) and 10 (Asia, Pacific) will each From bodies of work that grow slowly but steadily over time, to elect one member-at-large. The elected representatives will join potentially game-changing flashes of inspiration, right through to continuing members-at-large: eight in Regions 1–7 and 9 and two dedicated efforts towards developing our society’s programs and each in Regions 8 and 10. CPMT’s Board of Governors serves as activities, the CPMT awards are an excellent means of acknowl- a vital part of our organizational structure by directly feeding your edging outstanding contributions to our profession. Nominations concerns and interests into CPMT policy and budgeting. Although for CPMT’s 2012 awards have already opened. Please visit our the final slate of candidates is not quite finalized, I urge everyone website at http://www.cpmt.org/awards/index.html to suggest to check the website for more information and, of course, to vote. members deserving of special recognition. We need as many members as possible participating to ensure that the allotted number of representatives for each region are elected and, thus, that our organizational structure reflects the geographic distribution of our membership. Another major event in coming months will be the relaunch of NEWSLETTER SUBMISSION CPMT website. As in our profession, Internet technologies and DEADLINES: design conventions evolve rapidly, the time has come to update our online presence. The overhaul has been a large-scale project 1 November 2011 within the society for some time and is shaping up nicely. Our new site will make better use of recent web technologies, provide 1 February 2012 a comprehensive platform for our members and present the CPMT 1 May 2012 society to industry and the public-at-large in the best light pos- 1 August 2012 sible. Stay tuned for more information… Last but not least, I’d like to extend my congratulations to this year’s five CPMT award winners: John Lau from the Industrial Submit all material to [email protected] Technology Research Institute, Singapore, who received the Outstanding Sustained Technical Contribution Award; Xuejun Fall 2011 IEEE CPMT Society Newsletter 1 CPMT Officers TC-Therm - Thermal Management & Thermomech. Design: Tony Mak President: Rolf Aschenbrenner Rolf.Aschenbrenner@izm. TC-WLP - Wafer Level Packaging: fraunhofer.de Michael Toepper VP (Technical): Ricky Lee [email protected] VP (Conferences): Jie Xue [email protected] VP (Publications): R. Wayne Johnson [email protected] Strategic Program Directors VP (Education): Kitty Pearsall [email protected] Awards and Recognition: Patrick Thompson, [email protected] VP (Finance): Thomas G. Reynolds III [email protected] Conferences: Jie Xue, [email protected] Sr. Past Pres.: Phil Garrou pgarrou/[email protected] Educational Programs: Kitty Pearsall, [email protected] Jr. Past Pres.: William T. Chen [email protected] Global Chapters and Membership: Eric Perfecto, [email protected] Executive Director: Marsha Tickman [email protected] Publications: R. Wayne Johnson, [email protected] Student Programs: Chris Bailey, Chris Bailey, [email protected] Elected Board Members Technical Programs: Ricky Lee, [email protected] Region 8 Programs: Eric Beyne [email protected] 2011: Vasudeva Atluri, Koneru Ramakrishna, Patrick Thompson, Paul Region 10 Programs: Charles Lee, [email protected] Wesling, Klaus-Jurgen Wolter, and Kishio Yokkouchi 2012: Chris Bailey, Daniel Donahoe, Paul D. Franzon, S-W (Ricky) Lee, Kwang-Lung Lin, and Leonard W. Schaper Standing Committee Chairs 2013: Debendra Mallik, Toni Mattila, James E. Morris, Eric Perfecto, Dongkai Awards: Patrick Thompson, [email protected] Shangguan, Jean Trewhella Chapter Development: Eric Perfecto, [email protected] Constitution and Bylaws: Tony Mak, [email protected] Distinguished Lecturers: Kitty Pearsall, [email protected] CPMT Society Newsletter Educational Activities: Vacant Editor-in-Chief: Kitty Pearsall [email protected] Fellows Evaluation: CP Wong, [email protected] Fellows Search: Rao Tummala, [email protected] Finance: William Chen, [email protected] CPMT Archival Publications Long Range / Strategic Planning: Philip E. Garrou, pgarrou/[email protected] Transactions on Components, Packaging and Manufacturing Technology Membership: Eric Perfecto, [email protected] Nominations: William Chen, [email protected] Managing Editor: R. Wayne Johnson Co-Editor, Advanced Packaging: Distinguished Lecturers Ravi Mahajan Co-Editor, Electrical Performance: Program Director: Kitty Pearsall, [email protected] José E. Schutt-Ainé Lecturers: Albert F. Puttlitz, Ph.D., Avram Bar-Cohen, Ph.D., H. Anthony Chan, Co-Editor, Components: Characterization and Modeling: Ph.D., Rajen Chanchani, Ph.D., William T. Chen, Ph.D., Badih El-Kareh, Ph.D., Koneru Ramakrishna Xuejun Fan, Ph.D., Paul D. Franzon, Ph.D., Philip Garrou, Ph.D., George G. Co-Editor, Packaging Technologies: Harman, Ph.D., R. Wayne Johnson, Ph.D., George A. Katopis, Ph.D., Jorma Kal- Kuo-Ning Chiang evi Kivilahti, D.Sc., John H. Lau, Ph.D., Michael Lebby, Ph.D, Ning-Cheng Lee, Co-Editor, Electronics Manufacturing: Ph.D., S. W. Ricky Lee, Ph.D., Johan Liu, Ph.D., James E. Morris, Ph.D., Kyung R. Wayne Johnson W. Paik, Ph.D., T. Paul Parker, Michael Pecht, Ph.D., Karl J. Puttlitz, Ph.D., Bahgat Sammakia, Ph.D., Dongkai Shangguan, Ph.D., Nihal Sinnadurai, Ph.D., Ephraim Suhir, Ph.D., Yong-Khim Swee, Yutaka Tsukada, Ph.D., Rao Tummala, Ph.D., Technical Committee Chairs Walter Trybula, Ph.D., E. Jan Vardaman, Paul Wesling, CP Wong, Ph.D., Ralph W. Wyndrum Jr., Ph.D., Kishio Yokouchi, Ph.D. TC-Assy - IC and Package Assembly: Martin Goetz TC-ASTR - Environmental Stress & Reliability Test: Chapters and Student Branches John E. Proulx Refer to www.cpmt.org for CPMT Society Chapters and Student Branches list TC-ECCC - Electrical Contacts, Connectors and Cables: Jerry Witter IEEE Components, Packaging, and Manufacturing Technology Society Newsletter TC-Ed - Education: is published quarterly by the Components, Packaging, and Manufacturing Technol- Rao R. Tummala ogy Society of the Institute of Electrical and Electronics Engineers, Inc. Headquar- TC-EDMS - Electrical Design, Modeling and Simulation: ters: 3 Park Avenue, 17th Floor, New York, NY 10016-5997. US$1.00 per member Madhavan Swaminathan per year is included in Society fee for each member of the Components, Packaging, TC-EM - Manufacturing - Design & Process: and Manufacturing Technology Society. Printed in U.S.A. Periodicals postage paid Vacant at New York, NY, and at additional mailing offices. Postmaster: Send address TC-GEMP - Green Electronics Manufacturing and Packaging: changes to IEEE CPMT Newsletter, IEEE 445 Hoes Lane, Piscataway, NJ 08854. Nils F. Nissen All rights reserved, copyright (c) 2005 by the CPMT Society of IEEE. Authors and TC-HDSB - High Density PWB Packaging: Artists given full permission for further use of their contributions. For circulation Yoshitaka Fukuoka information call IEEE Customer Service 800-701-4333, or FAX 908-981-9667. TC-M - Materials: Rajen Chanchani TC-MEMS - MEMS and Sensor Packaging: Circulate your printed or PDF copy of this Eric Jung TC-NANO - Nano Packaging: NEWSLETTER to co-workers. Rao Tummala TC-OPTO - Fiber Optics & Photonics: IEEE prohibits discrimination, harassment, and bullying. For more information, Vacant visit http://www.ieee.org/web/aboutus/whatis/policies/p9-26.html. TC-PEP - Power Electronics Packaging: Douglas Hopkins TC-RF+W - RF and Wireless: Craig A. Gaw CPMT Members-Only Web TC-SP - Systems Packaging: (www.cpmt.org/mem/) Cian O Mathuna TC-Test - Electrical Test: Username: nano Bruce Kim Password: packaging 2 IEEE CPMT Society Newsletter Fall 2011 CPMT Society News.... Rao R. Tummala Receives 2011 IEEE An IEEE Fellow, Dr. Tummala is an endowed chair professor Components, Packaging & Manufacturing and director of the 3D Systems Packaging Research Center at the Technology Award Georgia Institute of Technology in Atlanta. Dr. Tummala joins the following past recipients of this Award. he IEEE Components, Packaging and Manufacturing Technology Award, sponsored by the
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