Fingerprint Cards AB – FPC1268 1 Table of Contents

Fingerprints Cards AB – FPC1268 Capacitive Fingerprint Under Glass from Huawei Mate 9 pro MEMS report by Stéphane ELISABETH March 2016

Overview / Introduction 3 Comparison Analysis 72 o Executive Summary o Comparison with FPC1025 o Reverse Costing Methodology o Comparison With Qualcomm Ultrasonic Sensor Company Profile 7 Manufacturing Process Flow 77 o FingerPrint Cards o Global Overview o Huawei Mate 9 pro Teardown o Sensor & ASIC Front-End Process Physical Analysis 15 o Sensor & ASIC Wafer Fabrication Unit o Synthesis of the Physical Analysis o Sensor Back-End Process Flow o Sensor Back-End Fabrication Unit o Physical Analysis Methodology o ASIC Back-End & LGA Package Assembly unit o Package 18 o Assembly Process Flow  Package Views & Dimensions o Glass & Final Assembly Unit  Package Opening Cost Analysis 91  Fingerprint Package Views & Dimensions o Synthesis of the cost analysis  Fingerprint Package opening o Yields Explanation & Hypotheses  Package Cross-Section : Metal Parts, Glass Cover o Sensor & ASIC Die 96  Fingerprint Package Cross-Section :  Sensor & ASIC Front-End Cost ASIC, ASIC Copper Pillar, Sensor Bumps, Sensor TSV  Sensor Back-End Cost  Sensor Back-End Cost per process steps o Sensor Die 38  Sensor & ASIC Back-End 0 : Probe Test & Dicing  View, Dimensions & Marking  Sensor & ASIC Wafer & Die Cost  Active area, Density, Pixels & Pads  Delayering & Main Blocks Identification o Component 104  Cross-Section  Back-End : LGA Packaging Cost  Process Characteristics  Back-End : LGA Final Test Cost  Final Assembly Cost o ASIC Die 60  Final Assembly Cost per Process Steps  View, Dimensions & Marking  Component Cost  Delayering & Main Blocks Identification  Cross-Section  Process Characteristics Estimated Price Analysis 111 Company services 115 ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 2 Executive Summary

Overview / Introduction o Executive Summary • The Huawei Mate 9 Pro is the first to feature the capacitive fingerprint completely hidden behind the cover o Reverse Costing Methodology glass. The sensor is located under the home button in the front of the device under specific glass cover o Glossary developed by TPK allowing new highly attractive designs like the ultrasonic fingerprint. Company Profile & Supply Chain • Physical Analysis The sensor has the same process as the previous FPC flagship, the 1025, but its integration doesn’t wire bonding any more but a specific TSV designed by an identify OSAT based on Tessera’s WLCSP solution. Comparison Analysis Previously used for CIS integration, it’s the first time the fingerprint. Along with the ASIC, the fingerprint is integrated in a LGA package who’s soldered on a flex PCB and covered by a glass specially designed by TPK. Manufacturing Process Flow

Cost Analysis

Selling Price Analysis • The solution developed by TPK allows the precise detection and identification of the fingerprint under the glass thanks to conductive layers. Everything is packaged in a metal ring giving the form of the home About System Plus button.

• Complete chip fabrication and package processes are presented in the report along with the cost estimation. It also includes comparison with the previous generation of capacitive fingerprint from FPC, the FPC1025 and the new ultrasonic fingerprint from Qualcomm, the Sense ID.

Overview / Introduction

Company Profile & Supply Chain o FingerPrint Cards AB o Huawei Mate 9 Pro Teardown

Physical Analysis

Comparison Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die

Comparison Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die

Comparison Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die

Comparison Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die

Comparison Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die

Comparison Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die

Comparison Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Comparison Analysis o FPC1025 o Qualcomm Fingerprint

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Comparison Analysis

Manufacturing Process Flow o Global Overview o Sensor & ASIC Front-End Process o Sensor Back-End Process o LGA Packaging Process o Assembly Process

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Comparison Analysis

Manufacturing Process Flow o Global Overview o Sensor & ASIC Front-End Process o Sensor Back-End Process o LGA Packaging Process o Assembly Process

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Comparison Analysis

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o Sensor/ASIC Wafer Cost o Sensor Back-End Cost o Sensor/ASIC Die Cost o Back-End Cost o Component Cost

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Comparison Analysis

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o Sensor/ASIC Wafer Cost o Sensor Back-End Cost o Sensor/ASIC Die Cost o Back-End Cost o Component Cost

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Comparison Analysis

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o Sensor/ASIC Wafer Cost o Sensor Back-End Cost o Sensor/ASIC Die Cost o Back-End Cost o Component Cost

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT Physical Analysis MEMS & SENSORS MEMS & SENSORS Comparison Analysis • Qualcomm® Snapdragon Sense™ ID 3D Fingerprint • Sensors for Biometry and Recognition • Finger Print Sensors Applications and Technologies Manufacturing Process Flow • NEXT Biometrics NB-1010-U/NB-2020-U • Samsung Galaxy S6 Fingerprint Sensor • Status of the MEMS Industry 2016 Cost Analysis • NEEgisTec ET300 Fingerprint Sensor • Nexus 6P Fingerprint Sensor ADVANCED PACKAGING Selling Price Analysis • iPhone 6s Plus Fingerprint Sensor • 3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 • Huawei Ascend Mate 7 Fingerprint Sensor Business Update About System Plus • Samsung Galaxy S5 – Home Button Synaptics Fingerprint o Company services Sensor o Feedbacks • iPhone 5S Fingerprint Sensor – Apple/AuthenTec TMDR92 & o Contact Sapphire o Legal PATENT ANALYSIS - KNOWMADE

MEMS • Capacitive Fingerprint Sensors Technology and Patent Infringement Risk Analysis 2015

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Comparison Analysis Custom Analyses (>130 analyses per year) Manufacturing Process Flow

Cost Analysis

Selling Price Analysis Reports (>40 reports per year) About System Plus o Company services o Feedbacks o Contact o Legal Costing Tools

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Overview / Introduction

Company Profile & Supply Dear Customer, Chain

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Selling Price Analysis Sincerely, About System Plus Wilfried THERON o Company services Quality Manager o Feedbacks o Contact o Legal Click below to access to our online Customer Satisfaction Survey.

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis FRANKFURT/MAIN Europa Sales Office Comparison Analysis NANTES LYON Headquarter YOLE HQ Manufacturing Process Flow TOKYO PHOENIX YOLE KK Cost Analysis YOLE Inc. GREATER CHINA Selling Price Analysis YOLE

About System Plus o Company services o Feedbacks o Contact o Legal Headquarters Europe Sales Office America Sales Office Asia Sales Office 21 rue La Noue Bras de Fer Lizzie LEVENEZ Steve LAFERRIERE Takashi ONOZAWA 44200 Nantes Frankfurt am Main Phoenix Tokyo FRANCE GERMANY USA JAPAN +33 2 40 18 09 16 +49 151 23 54 41 82 [email protected] [email protected] [email protected] [email protected] Mavis WANG GREATER CHINA [email protected] www.systemplus.fr

Overview / Introduction

Company Profile & Supply Chain DISCLAIMER Physical Analysis System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the Comparison Analysis report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this Manufacturing Process Flow report. The quoted trademarks are property of their owners. Reverse Costing® is a deposed brand, by System Plus Consulting. Cost Analysis

Selling Price Analysis SERVICES About System Plus o Company services Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by o Feedbacks industry experts. o Contact o Legal These results are open for discussion. We can reevaluate this circuit with your information.