Fingerprints Cards AB – FPC1268 Capacitive Fingerprint Under Glass from Huawei Mate 9 pro MEMS report by Stéphane ELISABETH March 2016 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 1 Table of Contents Overview / Introduction 3 Comparison Analysis 72 o Executive Summary o Comparison with FPC1025 o Reverse Costing Methodology o Comparison With Qualcomm Ultrasonic Sensor Company Profile 7 Manufacturing Process Flow 77 o FingerPrint Cards o Global Overview o Huawei Mate 9 pro Teardown o Sensor & ASIC Front-End Process Physical Analysis 15 o Sensor & ASIC Wafer Fabrication Unit o Synthesis of the Physical Analysis o Sensor Back-End Process Flow o Sensor Back-End Fabrication Unit o Physical Analysis Methodology o ASIC Back-End & LGA Package Assembly unit o Package 18 o Assembly Process Flow Package Views & Dimensions o Glass & Final Assembly Unit Package Opening Cost Analysis 91 Fingerprint Package Views & Dimensions o Synthesis of the cost analysis Fingerprint Package opening o Yields Explanation & Hypotheses Package Cross-Section : Metal Parts, Glass Cover o Sensor & ASIC Die 96 Fingerprint Package Cross-Section : Sensor & ASIC Front-End Cost ASIC, ASIC Copper Pillar, Sensor Bumps, Sensor TSV Sensor Back-End Cost Sensor Back-End Cost per process steps o Sensor Die 38 Sensor & ASIC Back-End 0 : Probe Test & Dicing View, Dimensions & Marking Sensor & ASIC Wafer & Die Cost Active area, Density, Pixels & Pads Delayering & Main Blocks Identification o Component 104 Cross-Section Back-End : LGA Packaging Cost Process Characteristics Back-End : LGA Final Test Cost Final Assembly Cost o ASIC Die 60 Final Assembly Cost per Process Steps View, Dimensions & Marking Component Cost Delayering & Main Blocks Identification Cross-Section Process Characteristics Estimated Price Analysis 111 Company services 115 ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 2 Executive Summary Overview / Introduction o Executive Summary • The Huawei Mate 9 Pro is the first to feature the capacitive fingerprint completely hidden behind the cover o Reverse Costing Methodology glass. The sensor is located under the home button in the front of the device under specific glass cover o Glossary developed by TPK allowing new highly attractive designs like the ultrasonic fingerprint. Company Profile & Supply Chain • Physical Analysis The sensor has the same process as the previous FPC flagship, the 1025, but its integration doesn’t wire bonding any more but a specific TSV designed by an identify OSAT based on Tessera’s WLCSP solution. Comparison Analysis Previously used for CIS integration, it’s the first time the fingerprint. Along with the ASIC, the fingerprint is integrated in a LGA package who’s soldered on a flex PCB and covered by a glass specially designed by TPK. Manufacturing Process Flow Cost Analysis Selling Price Analysis • The solution developed by TPK allows the precise detection and identification of the fingerprint under the glass thanks to conductive layers. Everything is packaged in a metal ring giving the form of the home About System Plus button. • Complete chip fabrication and package processes are presented in the report along with the cost estimation. It also includes comparison with the previous generation of capacitive fingerprint from FPC, the FPC1025 and the new ultrasonic fingerprint from Qualcomm, the Sense ID. ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 3 Huawei Mate 9 Pro Teardown Overview / Introduction Company Profile & Supply Chain o FingerPrint Cards AB o Huawei Mate 9 Pro Teardown Physical Analysis Comparison Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 4 PHYSICAL ANALYSIS ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 5 Synthesis of the Physical Analysis Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die Comparison Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 6 Package View & Dimensions Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die Comparison Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 7 Package Cross-Section Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die Comparison Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 8 Fingerprint Package Cross-Section – Die TSV Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die Comparison Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 9 Sensor Die View & Dimensions Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die Comparison Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 10 Sensor Die – Die Cross-Section Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Fingerprint Package o Sensor Die o ASIC Die Comparison Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 11 Comparison with Qualcomm Fingerprint Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison Analysis o FPC1025 o Qualcomm Fingerprint Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 12 Global Overview Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison Analysis Manufacturing Process Flow o Global Overview o Sensor & ASIC Front-End Process o Sensor Back-End Process o LGA Packaging Process o Assembly Process Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 13 Sensor – Back-End Process Flow 1/3 Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison Analysis Manufacturing Process Flow o Global Overview o Sensor & ASIC Front-End Process o Sensor Back-End Process o LGA Packaging Process o Assembly Process Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 14 Sensor Front-End Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Supply Chain o Yields o Sensor/ASIC Wafer Cost o Sensor Back-End Cost o Sensor/ASIC Die Cost o Back-End Cost o Component Cost Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 15 Sensor Back-End Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Supply Chain o Yields o Sensor/ASIC Wafer Cost o Sensor Back-End Cost o Sensor/ASIC Die Cost o Back-End Cost o Component Cost Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 16 Component Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Supply Chain o Yields o Sensor/ASIC Wafer Cost o Sensor Back-End Cost o Sensor/ASIC Die Cost o Back-End Cost o Component Cost Selling Price Analysis About System Plus ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 17 Related Reports Overview / Introduction Company Profile & Supply Chain REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT Physical Analysis MEMS & SENSORS MEMS & SENSORS Comparison Analysis • Qualcomm® Snapdragon Sense™ ID 3D Fingerprint • Sensors for Biometry and Recognition • Finger Print Sensors Applications and Technologies Manufacturing Process Flow • NEXT Biometrics NB-1010-U/NB-2020-U • Samsung Galaxy S6 Fingerprint Sensor • Status of the MEMS Industry 2016 Cost Analysis • NEEgisTec ET300 Fingerprint Sensor • Nexus 6P Fingerprint Sensor ADVANCED PACKAGING Selling Price Analysis • iPhone 6s Plus Fingerprint Sensor • 3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 • Huawei Ascend Mate 7 Fingerprint Sensor Business Update About System Plus • Samsung Galaxy S5 – Home Button Synaptics Fingerprint o Company services Sensor o Feedbacks • iPhone 5S Fingerprint Sensor – Apple/AuthenTec TMDR92 & o Contact Sapphire o Legal PATENT ANALYSIS - KNOWMADE MEMS • Capacitive Fingerprint Sensors Technology and Patent Infringement Risk Analysis 2015 ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 18 COMPANY SERVICES ©2016 System Plus Consulting | Fingerprint Cards AB – FPC1268 19 Business Models a Fields of Expertise Overview /