International Technical Program Committee
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INTERNATIONAL TECHNICAL PROGRAM COMMITTEE PROGRAM CHAIR: Hideto Hidaka, Renesas Electronics, Itami, Japan PROGRAM VICE CHAIR: Bram Nauta, University of Twente, Enschede, The Netherlands ANALOG SUBCOMMITTEE IMAGERS, MEMS, MEDICAL AND TECHNICAL DIRECTIONS SUBCOMMITTEE Chair: Bill Redman-White, NXP Semiconductors, DISPLAYS SUBCOMMITTEE Chair: Siva Narendra, Tyfone, Portland, OR Southampton, United Kingdom Pascal Ancey, STMicroelectronics, Crolles, France Chair: Roland Thewes, TU Berlin, Berlin, Germany Ivan Bietti, ST Microelectronics, Grenoble, France Ahmad Bahai, National Semiconductor, Santa Clara, CA JungChak Ahn, Samsung Electronics, Yongin, Korea Tony Chan Carusone, University of Toronto, Toronto, Canada *Azeez Bhavnagarwala, GLOBALFOUNDRIES, Jan Bosiers, Teledyne DALSA Professional Imaging, Gyu-Hyeong Cho, KAIST, Daejon, Korea Hopewell Junction, NY Eindhoven, The Netherlands Baher Haroun, Texas Instruments, Dallas, TX Shekhar Borkar, Intel, Hillsboro, OR Timothy Denison, Medtronic, Minneapolis, MN Jed Hurwitz, Broadcom, Edinburgh, United Kingdom Alison Burdett, Toumaz Technology, Maysam Ghovanloo, Georgia Institure of Technology, Minkyu Je, Institute of Microelectronics, A*STAR, Singapore Abingdon, United Kingdom Atlanta, GA Wing Hung Ki, HKUST, Clear Water Bay, Hong Kong, Eugenio Cantatore, Eindhoven University of Technology, *Christoph Hagleitner, IBM Research, Peter Kinget, Columbia University, New York, NY Eindhoven, The Netherlands Ruschlikon, Switzerland *Kimmo Koli, ST-Ericsson Oy, Turku, Finland Eric Colinet, CEA-LETI, Grenoble, France Makoto Ikeda, University of Tokyo, Tokyo, Japan Jae-Youl Lee, Samsung Electronics, Yongin, Korea Fu-Lung Hsueh, TSMC, Hsinchu, Taiwan Robert Johansson, Aptina Imaging, Oslo, Norway Tsung-Hsien Lin, National Taiwan University, Taipei, Taiwan Uming Ko, Texas Instruments, Houston, TX Sam Kavusi, Bosch Research and Technology Center, Chris Mangelsdorf, Analog Devices, Tokyo, Japan Tadahiro Kuroda, Keio University, Yokohama, Palo Alto, CA Jafar Savoj, Xilinx, San Jose, CA Kanagawa, Japan Shoji Kawahito, Shizuoka University, Hamamatsu, Japan Michiel Steyaert, KULeuven, Hevrelee, Belgium Masaitsu Nakajima, Panasonic, Moriguchi, Japan Wentai Liu, UC Santa Cruz, Santa Cruz, CA Axel Thomsen, Silicon Laboratories, Austin, TX David Ruffieux, CSEM, Neuchatel, Switzerland Kofi Makinwa, Technical University of Delft, Satoshi Shigematsu, NTT Electronics, Yokohama, Japan Ed van Tuijl, University of Twente, Enschede, The Netherlands Delft, The Netherlands Chris Van Hoof, IMEC, Leuven, Belgium Young-Sun Na, LG Electronics, Seoul, Korea Hoi-Jun Yoo, KAIST, Daejeon, Korea DATA CONVERTERS SUBCOMMITTEE Jun Ohta, Nara Institute of Science & Technology, Chair: Venu Gopinathan, Texas Instruments, Bangalore, India Nara, Japan Brian Brandt, Maxim Integrated Products, Yusuke Oike, Sony, Kanagawa, Japan North Chelmsford, MA Maurits Ortmanns, University of Ulm, Ulm, Germany WIRELESS SUBCOMMITTEE *Lucien Breems, NXP Semiconductors, Aaron Partridge, SiTime, Sunnyvale, CA Chair: David Su, Atheros Communications, San Jose, CA Eindhoven, The Netherlands David Stoppa, Fondazione Bruno Kessler, Trento, Italy Didier Belot, ST Microelectronics, Crolles, France Klaas Bult, Broadcom, Bunnik, The Netherlands Gangadhar Burra, Texas Instruments, Dallas, TX Marco Corsi, Texas Instruments, Dallas, TX MEMORY SUBCOMMITTEE George Chien, MediaTek, San Jose, CA Dieter Draxelmayr, Infineon Techologies, Villach, Austria Jan Crols, AnSem, Heverlee, Belgium Chair: Kevin Zhang, Intel, Hillsboro, OR Michael Flynn, University of Michigan, Ann Arbor, MI Ranjit Gharpurey, University of Texas at Austin, Austin, TX Colin Bill, Global Foundries, Sunnyvale, CA Gabriele Manganaro, Analog Devices, Wilmington, MA Hossein Hashemi, University of Southern California, Leland Chang, IBM T. J. Watson Research Center, Yiannos Manoli, University of Freiburg, IMTEK, Los Angeles, CA Yorktown Heights, NY Freiburg, Germany Myung-Woon Hwang, FCI, Sungnam, Korea Joo Sun Choi, Samsung, Hwasung, Korea Takahiro Miki, Renesas Electronics, Itami, Japan Albert Jerng, Ralink, Jhubei, Taiwan Sungdae Choi, Hynix Semiconductor, Icheon, Korea Gerhard Mitterregger, Intel Mobile Communications Austria, Eric Klumperink, University of Twente, Michael Clinton, Texas Instruments, Dallas, TX St. Magdalen, Austria Enschede, The Netherlands Jin-Man Han , Samsung Electronics, Hwasung, Korea Un-Ku Moon, Oregon State University, Corvallis, OR Shouhei Kousai, Toshiba, Kawasaki, Japan *Satoru Hanzawa, Hitachi Central Research Laboratory, Boris Murmann, Stanford University, Stanford, CA Domine Leenaerts, NXP Semiconductors, Tokyo, Japan Katsu Nakamura, Analog Devices, Wilmington, MA Eindhoven, The Netherlands Heinz Hoenigschmid, Elpida Memory, Munich, Germany Shanthi Pavan, Indian Institute Of Technology, Chennai, India Sven Mattisson, Ericsson AB, Lund, Sweden Nicky C.C. Lu, Etron Technology, Hsinchu, Taiwan Michael Perrott, Masdar Institute of Science and Technology, *Kenichi Okada, Tokyo Institute of Technology, Tokyo, Japan Cormac O’Connell, TSMC, Ottawa, Canada Abu Dhabi, United Arab Emirates Yorgos Palaskas , Intel, Hillsboro, OR Yasuhiro Takai, Elpida Memory, Sagamihara, Japan Aarno Parssinen, Renaesas Mobile, Helsinki, Finland Daisaburo Takashima, Toshiba, Yokohama, Japan Woogeun Rhee, Tsinghua University, Beijing, China ENERGY-EFFICIENT DIGITAL Ken Takeuchi, University of Tokyo, Tokyo, Japan Iason Vassiliou, Broadcom, Alimos, Greece SUBCOMMITTEE Daniele Vimercati, Micron Technology, Agrate, Italy Tadaaki Yamauchi, Renesas Electronics, Itami, Japan Chair: Tzi-Dar Chiueh, National Chip Implementation Center, Hsinchu, Taiwan WIRELINE SUBCOMMITTEE Kazutami Arimoto, Renesas Electronics, Hyogo, Japan RF SUBCOMMITTEE Chair: Daniel Friedman, IBM Thomas J. Watson Research *Ming-Yang Chao, Mediatek, Hsinchu, Taiwan Chair: Andreia Cathelin, STMicroelectronics, Crolles Cedex, Center, Yorktown Heights, NY Wim Dehaene, KU Leuven, Leuven, Belgium France Ajith Amerasekera, Texas Instruments, Dallas, TX Vasantha Erraguntla, Intel Technology India, Bangalore, India Ehsan Afshari, Cornell University, Ithaca, NY Ken Chang, Xilinx, San Jose, CA Stephen Kosonocky, Advanced Micro Devices, Pietro Andreani, Lund University, Lund, Sweden SeongHwan Cho, KAIST, Daejon, Korea Fort Collins, CO Hooman Darabi, Broadcom, Irvine, CA Nicola Da Dalt, Infineon, Austria Shannon Morton, Nvidia, Bristol, United Kingdom Brian Floyd, North Carolina State University, Raleigh, NC Ichiro Fujimori, Broadcom, Irvine, CA Byeong-Gyu Nam, Chungnam National University, *Joseph Golat, Motorola, Algonquin, IL Chewnpu Jou, TSMC, Hsinchu, Taiwan Daejeon, Korea Songcheol Hong, KAIST, Daejeon, Korea Jack Kenney, Analog Devices, Somerset, NJ Michael Phan, Qualcomm, Raleigh, NC Mike Keaveney, Analog Devices, Limerick, Ireland Miki Moyal, Intel Israel, Haifa, Israel Michael Polley, Texas Instruments, Dallas, TX Harald Pretl, Intel Mobile Communications, Linz, Austria Masafumi Nogawa, NTT Microsystem Integration Masaya Sumita, Panasonic, Moriguchi, Japan Gabriel Rebeiz, University of California, San Diego, Laboratories, Atsugi, Japan Kees van Berkel, ST-Ericsson, Eindhoven, The Netherlands La Jolla, CA Bob Payne, Texas Instruments, Dallas, TX Carlo Samori, Politecnico di Milano, Milano, Italy Tatsuya Saito, Hitachi, Kokubunji, Tokyo, Japan Bogdan Staszewski, TU Delft, Delft, The Netherlands HIGH-PERFORMANCE DIGITAL Ali Sheikholeslami, University of Toronto, Toronto, Canada Piet Wambacq, imec, Leuven, Belgium Jae-Yoon Sim, POSTECH, Pohang, Korea SUBCOMMITTEE Taizo Yamawaki, Renesas Mobile, Takasaki, Japan John T. Stonick, Synopsys, Hillsboro, OR Chair: Stefan Rusu, Intel, Santa Clara, CA Masoud Zargari, Qualcomm-Atheros, Irvine, CA *Koichi Yamaguchi, Renesas Electronics, Kawasaki, Japan *Lew Chua-Eoan, Qualcomm, San Diego, CA Jing-Hong Conan Zhan, MediaTek, HsinChu, Taiwan Hisakatsu Yamaguchi, Fujitsu Laboratories, Kawasaki, Japan Tim Fischer, AMD, Fort Collins, CO Michael Zybura, RF Micro Devices, Scotts Valley, CA Joshua Friedrich, IBM, Austin, TX Hiroo Hayashi, Toshiba, Kawasaki, Japan Anthony Hill, Texas Instruments, Dallas, TX Atsuki Inoue, Fujitsu, Kawasaki, Japan Tanay Karnik, Intel, Hillsboro, OR Tobias Noll, RWTH Aachen University, Aachen, Germany Luke Shin, Oracle, San Jose, CA Vladimir Stojanovic, MIT, Cambridge, MA Se-Hyun Yang, Samsung, Yongin, Korea *ADS/IDS Committee DIGEST OF TECHNICAL PAPERS • 525 PROGRAM COMMITTEE EUROPEAN REGIONAL COMMITTEE FAR EAST REGIONAL COMMITTEE ITPC EUROPEAN REGIONAL CHAIR ITPC FAR EAST REGIONAL CHAIR Aarno Pärssinen, Renaesas Mobile, Helsinki, Finland Hoi-Jun Yoo, KAIST, Daejeon, Korea ITPC EUROPEAN REGIONAL VICE CHAIR ITPC FAR EAST REGIONAL VICE CHAIR AND STUDENT FORUM VICE-CHAIR Eugenio Cantatore, Eindhoven University of Technology, Makoto Ikeda, University of Tokyo, Tokyo, Japan Eindhoven, The Netherlands ITPC FAR EAST REGIONAL SECRETARY ITPC EUROPEAN REGIONAL SECRETARY Kazutami Arimoto, Renesas Electronics, Itami, Japan Alison Burdett, Toumaz Technology, Abingdon, United Kingdom Members: JungChak Ahn, Samsung Electronics, Yongin, Korea Members: Pascal Ancey, STMicroelectronics, Crolles, France Ming-Yang Chao, MediaTek, Hsinchu, Taiwan Pietro Andreani, Lund University, Lund, Sweden Tzi-Dar Chiueh, National Chip Implementation Center, Hsinchu, Taiwan Didier Belot, STMicroelectronics, Crolles, France Gyu-Hyoeong Cho, KAIST, Daejeon, Korea Ivan Bietti, STMicroelectronics, Grenoble, France SeongHwan Cho, KAIST, Daejon, Korea Jan Bosiers, Teledyne DALSA Professional Imaging, Joo Sun Choi, Samsung,