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Pocket Program Kilowatt Exhibitors Megawatt Exhibitors 2016 IEEE International Power Modulator and High Voltage Conference San Francisco, CA – July 5–9, 2016 http://www.ipmhvc.org/2016 Pocket Program Kilowatt Exhibitors Sponsored By: Technically Co-Sponsored By: Watt Exhibitors Palace Hotel Conference Layout to second floor No access Registration Exhibits, Oral Breaks, Sessions Receptions Oral Sessions First Floor 1: Stangenes Industries, Inc. 18: Dean Technology, Inc. 1: Stangenes Industries, Inc. 18: Dean Technology, Inc. 2: 5S Components Inc. 19: Pearson Electronics 2: 5S Components Inc. 19: Pear son Electronics 3: JEMA Energy 20: Advanced Energy Inc 4: Pulse Power Solutions LLC 3: JEMA Energy 21: General Atomics 20: Advanced Energy Inc. 5: open 4: Pulse Power Solutions LLC 22: ITHPP21: General Atomics to first floor 6: Silicon Power Corporation 5: IEEE NPSS 23: GMW Associates22: ITHPP-Alcen 7: Pulse Power & Measurement Ltd. 6: Silicon Power Corporation 24: R&K Company Limited23: GMW Associates 8: CalRamic 7: Pulse Technologies LLC Power & Measurement 25: Barth Electronics, Inc.24: R&K Company Limited 9: Voltage Multipliers Inc. Ltd. 26: Diversified Technologies Inc.25: Barth Electronics, Inc. Poster Session C Short Courses, 10: open 8: CalRamic Technologies LLC 27: Behlke26: Diver sified Power Electronics LLC Technologies Inc. Satellite Meetings 11: Spellman High Voltage 9: Voltage Multipliers Inc. 28: Eagle Harbor Technologies, Inc. 27: Behlke Power Electronics LLC 12: L‐3 Applied Technologies, Inc. 10: open 29: TDK‐Lambda Americas28: Eagle Harbor Technologies, 13: Scandinova11: Spellman Systems AB High Voltage 30: HVR Advanced Power Components, Inc. Poster Session B 14: open12: L-3 Applied Technologies, Inc. Inc.29: TDK-Lambda Americas 15: Lockheed Martin13: Scandino va Systems AB T1:30: HVR Open Advanced Power Poster Session A 16: Kanthal‐Globar, Sandvik T2: TREK, INC. 14: open Components, Inc. Heating Technology USA T3: Tera Analysis Ltd 15: Lockheed Martin T1: Teledyne Reynolds, Inc. 17: NWL Inc. T4: R.E. Beverly III and Associates 16: Kan thal-Globar, Sandvik T2: TREK, Inc. Second Floor Heating Technology USA T3: Tera Analysis Ltd. 17: NWL Inc. T4: R.E. Beverly III and Associates 2016 International Power Modulator 2016and International High Voltage Power Conference Modulator 2016and International High Voltage Power Conference Modulator 2016 International Power Modulator and HighJuly Voltage 5 - 9, 2016 Conference and HighJuly Voltage 5 - 9, 2016 Conference SanJuly Francisco, 5 - 9, 2016 CA SanJuly Francisco, 5 - 9, 2016 CA San Francisco, CA San Francisco, CA Sponsored by: Sponsored by: Sponsored by: Sponsored by: Technical Co-Sponsored by: WELCOME! On behalf of the International Power Modulator and High Voltage Conference (IPMHVC) Executive Committee and the Conference and Technical Program Committees, we welcome you to the 2016 IEEE IPMHVC. San Francisco is known for its scenic beauty, cultural attractions, diverse communities, and world-class cuisine. Measuring 49 square miles, this walkable city includes landmarks like the Golden Gate Bridge, cable cars, Alcatraz and the largest Chinatown in the United States. The city has a colorful past, growing from a small village to a major city nearly overnight as a result of the 1849 Gold Rush. The city is home to world-class theatre, opera, symphony and ballet companies and often boasts premieres of Broadway-bound plays and culture-changing performing arts. San Francisco is one of America’s greatest dining cities. The diverse cultural influences, proximity of the freshest ingredients and competitive creativity of the chefs result in unforgettable dining experiences throughout the city. Originally established in 1875, the Palace was San Francisco’s first premier luxury hotel and the largest in the world. The four-diamond Palace Hotel is a member of The Luxury Collection, a glittering ensemble of more than 100 of the world’s finest hotels and resorts in more than 30 countries in bustling cities and spectacular destinations around the world. In 1909 the breathtaking Garden Court was unveiled. Crowned by a 7 million dollar stained-glass dome and flanked by a double row of massive Italian marble Ionic columns, The Garden Court is legendary. This year, a record number of abstracts was received. Over 320 abstracts were submitted to the technical topics of New and Novel Applications of Power Modulators; Repetitive Pulsed Power Systems, Repetitive Pulsed Magnetics, Accelerators, Beams, High Power Microwaves, and High Power Pulse Antennas; Power Modulator Configurations, Systems, Diagnostics, and Applications in Vacuum and Low Pressure; Solid State Power Modulators, Components, Switches, and Systems; Opening, Closing, and Solid State Switches; Lasers, X-Rays, EUV, Partial Discharge Testing, and Other Emitters; Biological, Medical, and Environmental Applications of Power Modulators; Electromagnetic Launchers, High Current Systems, High Rep-Rate Systems, Thermal Management, and Applications; Analytical Methods, Modeling, and Simulation; Dielectrics, Insulation, and Breakdown; High Voltage Design, Devices, Testing, and Diagnostics; Power Electronics, Power Supplies, Prime Power, Rotating Machines, and Energy Converters. 2 In addition to the main technical program, we will be offering two short courses, two technical tours to SLAC National Accelerator Laboratory, and will be holding a workshop: “Optimizing RF Accelerator Klystron Modulator Design at the (RF Power) System-Level.” In addition, a special invited talk only session will be held to highlight topics of special interest to the broad community. A Transactions on Dielectrics and Electrical Insulation special issue will be published which will contain significantly expanded and enhansed material from the conference. We are also excited to announce that we will be having a record size industrial exhibition at the conference. We encourage you to visit the booths and talk to the exhibitors. In addition, we will be having a night out at the baseball game featuring the San Francisco Giants versus the Colorado Rockies. The conference is fully sponsored by the IEEE Dielectrics and Electrical Insulation Society and technically co-sponsored by the IEEE Nuclear and Plasma Sciences Society. We gratefully acknowledge the sponsorship from government, university, and industry, and the outstanding support we have received from our exhibitors. We would also like to express our sincere gratitude to the entire Conference Organizing Committee for all of their efforts and we extend our sincere thanks to all the members of the Technical Program Committee for their hard work in reviewing the abstract submissions and defining an outstanding technical program. Finally, we thank all of the presenters and attendees for contributing to the ongoing success of this conference and we look forward to seeing you in 2018. Dr Mark Kemp SLAC National Accelerator Laboratory 2016 IEEE IPMHVC General Chair Dr Allen Garner Purdue University 2016 IEEE IPMHVC Technical Chair 3 2016 IPMHVC COMMITTEE CHAIRS AND STAFF General Conference Chair Mark Kemp SLAC National Accelerator Laboratory Technical Program Chair Allen Garner Purdue University Conference Treasurer Andrew Benwell SLAC National Accelerator Laboratory Publications Chair Peter Norgard University of Missouri, Columbia Publicity Chair George Laity Sandia National Laboratories Exhibits Chair Richard Ness Ness Engineering Professional Awards Chair James Dickens Texas Tech University Student Awards Chair Rob Saethre Oak Ridge National Laboratory Student Travel Grant Chair Rob Saethre Oak Ridge National Laboratory Visa Assistance Chair Tao Shao Institute of Electrical Engineering, CAS Short Course Chair James Dickens Texas Tech University IEEE DEIS Meetings Chair Resi Zarb Qualtrol-Iris Power Executive Committee Chair Richard Ness Ness Engineering Mailing List Management Matthew Aubuchon General Atomics 4 Technical Tours Tony Beukers SLAC National Accelerator Laboratory TECHNICAL PROGRAM COMMITTEE MEMBERS Hidenori Akiyama Kumamoto University Ray Allen Naval Research Laboratory Plato Apergis EMS Development Corporation Matthew Aubuchon General Atomics Michael Baginski General Atomics Stephen Bayne University of Buffalo Kevin Burke University at Buffalo Craig Burkhart SLAC National Accelerator Laboratory Steve Calico Lockheed Martin Yang Cao University of Connecticut George Chen University of Southampton Isaac Cohen University of Texas - Arlington Randy Cooper Cooper Consulting Services, Inc. Randy Curry University of Missouri Dong Dai South China University of Tech. James Dickens Texas Tech University Matt Domonkos Air Force Research Laboratory Laurent Ducimetiere CERN Andrew Dunlop Dynex Semiconductor Douglas Eaton ScandiNova Systems Inc. Juan Elizondo Sandia National Laboratories Masoud Farzaneh Université du Québec à Chicoutimi Klaus Frank University of Erlangen - Nuremberg Nancy Frost Krempel Allen Garner Purdue University Michael Giesselmann Texas Tech University Steve Glover Sandia National Laboratories Stanislaw Gubanski Chalmers University Martin Gundersen University of Southern California John Harris Air Force Research Laboratory Werner Hartmann Siemens Frank Hegeler Naval Research Laboratory David Hemmert HEM Technologies 5 Cameron Hettler SARA Shad Holt Texas Tech University Brett Huhman Naval Research Laboratory Marcus Iberler Frankfurt University Chunqi Jiang Old Dominion University Richard F. Johnson JPA, Inc. Nick Jordan University of Michigan Ravi Joshi Texas Tech University Mark Kemp SLAC National Accelerator Laboratory Juergen
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