ADVANCED MICRO DEVICES, INC. (Exact Name of Registrant As Specified in Its Charter)
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Cadence SPB / Orcad 17.4 System Requirements
A Parallel Systems Technical Note Cadence SPB / OrCAD 17.4 System Requirements Supported Operating Systems Windows 10 (64-bit) Professional, including Dark Theme mode Windows Server 2012 (All Service Packs) Windows Server 2012 R2 Windows Server 2016 Note: Cadence Allegro and OrCAD products do not support Windows 10 Starter and Home Basic. In addition, Windows Server support does not include support for Windows Remote Desktop. Windows RT and Tablets/Phones, including Windows 10 Phone, are not supported. Note: 64-bit Windows require 64-bit Flex software dongle drivers if using dongle-based licensing. Recommended Hardware Intel® Core™ i7 4.30 GHz or AMD Ryzen™ 7 4.30 GHz with at least 4 cores Note: Faster processors are preferred. 16 GB RAM 50 GB free disk space (SSD drive is recommended) 1920 x 1200 display resolution with true color (at least 32bit colour) A dedicated graphics card supporting OpenGL, minimum 2GB (with additional support for DX11 for 3D Canvas) Dual monitors (For physical design) Broadband Internet connection for some service Ethernet port/card (for network communications and security hostID) Three-button Microsoft-compatible mouse Supported MATLAB Version R2019A-64Bit (For the PSpice-MATLAB interface) Microsoft SharePoint for Allegro Pulse Cadence® Allegro® Pulse supports an interface to Microsoft SharePoint. Following are the requirements for SharePoint: • Windows Server 2012 (64-bit) • SharePoint Foundation 2013 • Microsoft SQL Server 2012 (64-bit) • Following 64-bit browsers: • Microsoft® Internet Explorer® 11.0 on windows • Mozilla Firefox 52.0 ESR on Windows • Mozilla Firefox 52.0 on Linux • Google Chrome 58.0 on Windows Using Spaces in File and Directory Names Support for spaces in file and directory names applies only to Windows. -
GS40 0.11-Μm CMOS Standard Cell/Gate Array
GS40 0.11-µm CMOS Standard Cell/Gate Array Version 1.0 January 29, 2001 Copyright Texas Instruments Incorporated, 2001 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the materials, methods, techniques, or apparatus described herein are the exclusive property of Texas Instruments. No disclosure of information or drawings shall be made to any other person or organization without the prior consent of Texas Instruments. IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this war- ranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WAR- RANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. -
Exploring Weak Scalability for FEM Calculations on a GPU-Enhanced Cluster
Exploring weak scalability for FEM calculations on a GPU-enhanced cluster Dominik G¨oddeke a,∗,1, Robert Strzodka b,2, Jamaludin Mohd-Yusof c, Patrick McCormick c,3, Sven H.M. Buijssen a, Matthias Grajewski a and Stefan Turek a aInstitute of Applied Mathematics, University of Dortmund bStanford University, Max Planck Center cComputer, Computational and Statistical Sciences Division, Los Alamos National Laboratory Abstract The first part of this paper surveys co-processor approaches for commodity based clusters in general, not only with respect to raw performance, but also in view of their system integration and power consumption. We then extend previous work on a small GPU cluster by exploring the heterogeneous hardware approach for a large-scale system with up to 160 nodes. Starting with a conventional commodity based cluster we leverage the high bandwidth of graphics processing units (GPUs) to increase the overall system bandwidth that is the decisive performance factor in this scenario. Thus, even the addition of low-end, out of date GPUs leads to improvements in both performance- and power-related metrics. Key words: graphics processors, heterogeneous computing, parallel multigrid solvers, commodity based clusters, Finite Elements PACS: 02.70.-c (Computational Techniques (Mathematics)), 02.70.Dc (Finite Element Analysis), 07.05.Bx (Computer Hardware and Languages), 89.20.Ff (Computer Science and Technology) ∗ Corresponding author. Address: Vogelpothsweg 87, 44227 Dortmund, Germany. Email: [email protected], phone: (+49) 231 755-7218, fax: -5933 1 Supported by the German Science Foundation (DFG), project TU102/22-1 2 Supported by a Max Planck Center for Visual Computing and Communication fellowship 3 Partially supported by the U.S. -
View Annual Report
2013 ANNUAL REPORT ON FORM 10-K Dear Stockholders: In 2013, we made significant progress in bringing AMD closer to our mission of becoming the world’s leading designer and integrator of innovative, tailored technology solutions that empower people to push the boundaries of what is possible. Throughout the year, we achieved many goals the Company set going into 2013 despite broader PC industry challenges. Transformation and Progress: Profitability and Acceleration of Our Business Our strategic three-phase plan to transform AMD began with resetting and restructuring our business to lay the foundation for the acceleration of our growth. By the end of 2013, we successfully implemented phase one and phase two of our turnaround plan to create a more efficient and sustainable business model in the following ways: • Reducing our operating expenses more than 30 percent from the first quarter of 2012 to the fourth quarter of 2013. • Generating more than 30 percent of our net revenues in the second half of 2013 from our semi-custom and embedded businesses, both high-growth focus areas for AMD. • Exiting the year with cash balances, including marketable securities, of $1.2 billion, above our optimal cash balance target of $1.1 billion, and establishing an incremental secured revolving line of credit up to $500 million. • Returning to profitability and free cash flow in the second half of the year. I’m very pleased to report that AMD has also made steady progress on phase three of our plan: to transform our business into a high-growth market competitor. Our business transformation is being propelled by an increasingly diversified product portfolio and a focus on driving to 50 percent of AMD revenue from five high-growth markets by the end of 2015: semi-custom solutions, ultra-low power client PC, embedded, dense server, and professional graphics. -
Designcon 2016 Needs and Capabilities for Modeling Of
DesignCon 2016 Needs and Capabilities for Modeling of Capacitor Derating Panel discussion Brad Brim, Cadence Design Systems Istvan Novak, Oracle Tim Michalka, Qualcomm Technologies Wilmer Companioni, KEMET Electronics Shoji Tsubota, Murata Manufacturing Sam Chitwood, Cadence Design Systems Abstract Capacitors vary with temperature, bias voltage and age; a phenomenon typically referred to as derating. Libraries of SPICE or S-parameter models are provided by component manufacturers for non-derated components - new capacitors at a specific temperature and bias. Detailed derating data and related methodologies are often considered manufacturer-proprietary. Some manufacturers provide software to generate and display derated models while others specify general derating behavior in data sheets. OEMs have expressed a desire for more detailed and automated power integrity analyses to consider derating effects. Representatives from component manufacturers, OEMs and EDA will discuss these analysis needs and the electrical models required to support such. Audience participation is strongly encouraged to help judge the breadth of industry need in this area and help influence future contributions. TITLE Needs and Capabilities for Modeling of Capacitor Derating Moderator: Image Brad Brim (Cadence) Participants: Istvan Novak (Oracle) Tim Michalka (Qualcomm) Wilmer Companioni (KEMET) Shoji Tsubota (Murata) Sam Chitwood (Cadence) Needs and Capabilities for Modeling of Capacitor Derating Brad Brim (Cadence) 1 Moderator Brad Brim Product Engineering Architect, Cadence Design Systems [email protected] Brad has been in the EDA industry for more than 25 years. His graduate studies and initial commercial contributions were in the area of electromagnetic simulation and passive component modeling for circuit simulation. Some of the products he has worked on include: Momentum, ADS, HFSS, PowerSI and OptimizePI. -
Catalyst™ Software Suite Version 9.5 Release Notes
Catalyst™ Software Suite Version 9.5 Release Notes This release note provides information on the latest posting of AMD’s industry leading software suite, Catalyst™. This particular software suite updates both the AMD Display Driver, and the Catalyst™ Control Center. This unified driver has been further enhanced to provide the highest level of power, performance, and reliability. The AMD Catalyst™ software suite is the ultimate in performance and stability. For exclusive Catalyst™ updates follow Catalyst Maker on Twitter. This release note provides information on the following: z Web Content z AMD Product Support z Operating Systems Supported z New Features z Performance Improvements z Resolved Issues for the Windows Vista Operating System z Resolved Issues for the Windows XP Operating System z Resolved Issues for the Windows 7 Operating System z Known Issues Under the Windows Vista Operating System z Known Issues Under the Windows XP Operating System z Known Issues Under the Windows 7 Operating System z Installing the Catalyst™ Vista Software Driver z Catalyst™ Crew Driver Feedback ATI Catalyst™ Release Note Version 9.5 1 Web Content The Catalyst™ Software Suite 9.5 contains the following: z Radeon™ display driver 8.612 z HydraVision™ for both Windows XP and Vista z HydraVision™ Basic Edition (Windows XP only) z WDM Driver Install Bundle z Southbridge/IXP Driver z Catalyst™ Control Center Version 8.612 Caution: The Catalyst™ software driver and the Catalyst™ Control Center can be downloaded independently of each other. However, for maximum stability and performance AMD recommends that both components be updated from the same Catalyst™ release. -
2018 Annual Report on Form 10-K
2018 ANNUAL REPORT ON FORM 10-K MARCH 2019 DEAR SHAREHOLDERS: From the industry’s first 1GHz CPU to the world’s first GPU delivering a teraflop of computing power, AMD has always stood for pushing the boundaries of what is possible. A few years ago, we made several big bets to accelerate our pace of innovation, strengthen our execution, and enable AMD to deliver a leadership portfolio of computing and graphics processors capable of increasing our share of the $75 billion high-performance computing market. In 2018, we saw those bets begin to pay off as we delivered our second straight year of greater than 20% annual revenue growth and significantly improved our gross margin and profitability from the previous year. REVENUE GROSS MARGIN % R&D INVESTMENT EXPENSE/REVENUE % $ Billions $ Billions $6.5B 38% $1.43B 34% $5.3B 34% 33% $4.3B $1.20B 23% $1.01B 31% 2016 2017 2018 2016 2017 2018 2016 2017 2018 2016 2017 2018 Added $2.2B in revenue Significantly improved gross Increased R&D by more than Significant improvement over the last 2 years margin over last 2 years based 40% over the last 2 years in OPEX leverage on new product portfolio Our newest Ryzen™, EPYC™ and datacenter GPU products contributed more than $1.2 billion of revenue in 2018 and helped us gain share across our priority markets. In 2018, we added 3.9% points of desktop processor unit share, 5.3% points of notebook processor unit share and met our goal of exiting the year with mid-single digit server processor market share. -
J7F3 Mini-ITX Motherboard Series
Mainboard Diagram J7F3 Mini-ITX Motherboard Series -SiS 741CX Northbridge + SiS 964 Southbridge Chipsets -Support Socket-462 AMD Geode NX processor -Support Front Side Bus 133MHz -Single Channel DDR2 400 Memory DIMM -Support 2 Serial ATA Devices with RAID 0, 1 -Support 2xAD Connector With Expansion Daughter-boards -Ethernet LAN Supported -AC’97 6 Channel Audio CODEC -VIA VT6307S IEEE1394a Controller for J7F3E -17 x 17CM Mini-ITX Form Factor Features and Benefits Support Socket 462 AMD Geode™ NX Processor The AMD Geode™ NX processor family gives product designers a wide range of options in low-power, high-performance processors. Based on Mobile AMD Athlon™ processor technology, AMD NX processors deliver superior computing performance for applications including thin-client, point-of-sale terminals, kiosks, high-end printers, and home media systems. AMD Geode Solutions have received new model numbers to better reflect total performance beyond just megahertz. This presentation of attributes gives designers greater understanding of the capabilities of AMD Geode Solutions. SiS 741CX Northbridge Chipset and SiS964 Southbridge Chipset The SiS741CX chipset can be combined with three different AMD Geode NX processors, including the AMD Geode™ NX 1250@6W processor*, AMD Geode™ NX 1500@6W processor** and AMD Geode™ NX 1750@14W processor***, enabling development of a wider variety of products for different market segments. The SiS741CX chipset supports the AMD Geode NX processor family, DDR266 front side bus, as well as high-speed DDR333 DRAM. Furthermore, the SiS741CX chipset incorporates SiS's revolutionary HyperStreaming™ Technology, which provides multiple divided pipelines for data, allows data to be sent concurrently, and separates data for easier memory retrieval, resulting in a remarkable reduction in latency versus traditional chipsets. -
GS30 Product Overview
GS30 0.15-µm CMOS Standard Cell/Gate Array Version 1.0 February, 2001 Copyright Texas Instruments Incorporated, 2001 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the materials, methods, techniques, or apparatus described herein are the exclusive property of Texas Instruments. No disclosure of information or drawings shall be made to any other person or organization without the prior consent of Texas Instruments. IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this war- ranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WAR- RANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. -
Cadence Design Systems, Inc
Confidential Cadence Design Systems, Inc. February/March 2019 Safe Harbor Statement and Regulation G Safe Harbor Statement The following discussion contains forward looking statements, and our actual results may differ materially from those expectations discussed here. Additional information concerning factors that could cause such a difference can be found in our Form 10-Q for the quarter ended September 29, 2018, our Form 10-K for the year ended December 29, 2018, the company’s future filings with the Securities and Exchange Commission and the cautionary statements regarding forward-looking statements in our February 19, 2019 earnings press release for the quarter ended December 29, 2018. Regulation G In addition to financial results prepared in accordance with Generally Accepted Accounting Principles, or GAAP, this presentation will also contain certain non-GAAP financial measures. Cadence management believes that in addition to using GAAP results in evaluating our business, it can also be useful to measure results using certain non-GAAP financial measures. Investors and potential investors are encouraged to review the reconciliation of non-GAAP financial measures with their most direct comparable GAAP financial results, including those set forth in our February 19, 2019 press release and our CFO Commentary for the quarter ended December 29, 2018, both of which can be found in the quarterly earnings section of the investor relations portion of our website at cadence.com. 2 © 2019 Cadence Design Systems, Inc. All rights reserved. Cadence-at-a-glance • Leading provider of system design enablement (SDE) solutions – software, hardware, and IP • Mission critical technology for designing today’s electronic systems • Culture of innovation - more than 20 significant new products in last 3 years • Subscription software model with very high customer renewal rates and loyalty • Revenue: ~$2.14B • Headquarters in Silicon Valley ~7500 employees worldwide NASDAQ: CDNS; S&P 500 & Nasdaq 100 indexes 3 © 2019 Cadence Design Systems, Inc. -
Cadence Design Systems, Inc. 2020 Proxy Statement
NOTICE OF 2020 ANNUAL MEETING OF STOCKHOLDERS The 2020 Annual Meeting of Stockholders of CADENCE DESIGN SYSTEMS, INC., a Delaware corporation, will be held as follows: When: Where: April 30, 2020 Cadence San Jose Campus 1:00 p.m. Pacific Time 2655 Seely Avenue, Building 10 San Jose, California 95134 Items of Business: The purpose of the 2020 Annual Meeting of Stockholders is to consider and take action on the following: 1. To elect the nine directors named in the proxy statement to serve until the 2021 Annual Meeting of Stockholders and until their successors are elected and qualified, or until the directors’ earlier death, resignation or removal. 2. To approve the amendment of the Omnibus Equity Incentive Plan. 3. To vote on an advisory resolution to approve named executive officer compensation. 4. To ratify the selection of PricewaterhouseCoopers LLP as the independent registered public accounting firm of Cadence for its fiscal year ending January 2, 2021. 5. To vote on a stockholder proposal regarding special stockholder meetings, if properly presented at the meeting. 6. To transact such other business as may properly come before the meeting or any adjournment or postponement thereof. These items of business are more fully described in the proxy statement accompanying this notice. Record Date: Holders of Cadence Design Systems, Inc. common stock at the close of business on March 2, 2020 are entitled to notice of and to vote at the 2020 Annual Meeting of Stockholders and any adjournment or postponement thereof. How to Vote: Your vote is important to us. Please cast your vote promptly via the internet, telephone or mail. -
ATI Catalyst™ Software Suite Version 10.2 Release Notes
ATI Catalyst™ Software Suite Version 10.2 Release Notes This release note provides information on the latest posting of AMD’s industry leading software suite, ATI Catalyst™. This particular software suite updates both the AMD Display Driver, and the ATI Catalyst™ Control Center. This unified driver has been further enhanced to provide the highest level of power, performance, and reliability. The ATI Catalyst™ software suite is the ultimate in performance and stability. For exclusive ATI Catalyst™ updates follow CatalystMaker on Twitter. This release note provides information on the following: z Web Content z AMD Product Support z Operating Systems Supported z New Features z Performance Improvements z Resolved Issues for All Windows Operating Systems z Resolved Issues for the Windows 7 Operating System z Resolved Issues for the Windows Vista Operating System z Resolved Issues for the Windows XP Operating System z Known Issues Under All Windows Operating Systems z Known Issues Under the Windows 7 Operating System z Known Issues Under the Windows Vista Operating System z Known Issues Under the Windows XP Operating System z Installing the ATI Catalyst™ Vista Software Driver z ATI Catalyst™ Crew Driver Feedback ATI Catalyst™ Release Note Version 10.2 1 Web Content The Catalyst™ Software Suite 10.2 contains the following: z ATI Radeon™ display driver 8.702 z HydraVision™ for both Windows XP, Vista and Windows 7 z WDM Driver Install Bundle z Southbridge/IXP Driver z ATI Catalyst™ Control Center Version 8.702 Caution: The ATI Catalyst™ software driver and the ATI Catalyst™ Control Center can be downloaded independently of each other.