Themis PPC64 / TPPC64 Datasheet (Pdf)
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Ebook - Informations About Operating Systems Version: August 15, 2006 | Download
eBook - Informations about Operating Systems Version: August 15, 2006 | Download: www.operating-system.org AIX Internet: AIX AmigaOS Internet: AmigaOS AtheOS Internet: AtheOS BeIA Internet: BeIA BeOS Internet: BeOS BSDi Internet: BSDi CP/M Internet: CP/M Darwin Internet: Darwin EPOC Internet: EPOC FreeBSD Internet: FreeBSD HP-UX Internet: HP-UX Hurd Internet: Hurd Inferno Internet: Inferno IRIX Internet: IRIX JavaOS Internet: JavaOS LFS Internet: LFS Linspire Internet: Linspire Linux Internet: Linux MacOS Internet: MacOS Minix Internet: Minix MorphOS Internet: MorphOS MS-DOS Internet: MS-DOS MVS Internet: MVS NetBSD Internet: NetBSD NetWare Internet: NetWare Newdeal Internet: Newdeal NEXTSTEP Internet: NEXTSTEP OpenBSD Internet: OpenBSD OS/2 Internet: OS/2 Further operating systems Internet: Further operating systems PalmOS Internet: PalmOS Plan9 Internet: Plan9 QNX Internet: QNX RiscOS Internet: RiscOS Solaris Internet: Solaris SuSE Linux Internet: SuSE Linux Unicos Internet: Unicos Unix Internet: Unix Unixware Internet: Unixware Windows 2000 Internet: Windows 2000 Windows 3.11 Internet: Windows 3.11 Windows 95 Internet: Windows 95 Windows 98 Internet: Windows 98 Windows CE Internet: Windows CE Windows Family Internet: Windows Family Windows ME Internet: Windows ME Seite 1 von 138 eBook - Informations about Operating Systems Version: August 15, 2006 | Download: www.operating-system.org Windows NT 3.1 Internet: Windows NT 3.1 Windows NT 4.0 Internet: Windows NT 4.0 Windows Server 2003 Internet: Windows Server 2003 Windows Vista Internet: Windows Vista Windows XP Internet: Windows XP Apple - Company Internet: Apple - Company AT&T - Company Internet: AT&T - Company Be Inc. - Company Internet: Be Inc. - Company BSD Family Internet: BSD Family Cray Inc. -
A Developer's Guide to the POWER Architecture
http://www.ibm.com/developerworks/linux/library/l-powarch/ 7/26/2011 10:53 AM English Sign in (or register) Technical topics Evaluation software Community Events A developer's guide to the POWER architecture POWER programming by the book Brett Olsson , Processor architect, IBM Anthony Marsala , Software engineer, IBM Summary: POWER® processors are found in everything from supercomputers to game consoles and from servers to cell phones -- and they all share a common architecture. This introduction to the PowerPC application-level programming model will give you an overview of the instruction set, important registers, and other details necessary for developing reliable, high performing POWER applications and maintaining code compatibility among processors. Date: 30 Mar 2004 Level: Intermediate Also available in: Japanese Activity: 22383 views Comments: The POWER architecture and the application-level programming model are common across all branches of the POWER architecture family tree. For detailed information, see the product user's manuals available in the IBM® POWER Web site technical library (see Resources for a link). The POWER architecture is a Reduced Instruction Set Computer (RISC) architecture, with over two hundred defined instructions. POWER is RISC in that most instructions execute in a single cycle and typically perform a single operation (such as loading storage to a register, or storing a register to memory). The POWER architecture is broken up into three levels, or "books." By segmenting the architecture in this way, code compatibility can be maintained across implementations while leaving room for implementations to choose levels of complexity for price/performances trade-offs. The levels are: Book I. -
Develop-16 9312 December 1993.Pdf
E D I T O R I A L S T A F F Editor-in-Cheek Caroline Rose Technical Buckstopper Dave Johnson Our Boss Greg Joswiak His Boss Dennis Matthews Review Board Pete (“Luke”) Alexander, C. K. Haun, Jim Reekes, Bryan K. (“Beaker”) Ressler, Larry Rosenstein, Andy Shebanow, Gregg Williams Managing Editor Cynthia Jasper Contributing Editors Lorraine Anderson, Philip Borenstein, Robin Cowan, Matt Deatherage, The cover. Mark Jenkins of Rucker Toni Haskell, Judy Helfand, Rebecca Pepper Huggins Design created this cover using Indexer Marc Savage Adobe Photoshop, Adobe Illustrator, Special thanks to Smart Friend Dean Yu for Fractal Design Painter, and a Macintosh his help during Dave Johnson’s sabbatical. Quadra 950. He looks forward to making the leap himself to Macintosh on PowerPC. A R T & P R O D U C T I O N This issue’s CD. The develop Bookmark Production/Art Director Diane Wilcox CD (or the Developer CD Series disc, Technical Illustration Dave Olmos, John Ryan Reference Library edition) for December Formatting Forbes Mill Press 1993 or later contains this issue and all Printing Wolfer Printing Company, Inc. back issues of develop along with the code Film Preparation Aptos Post, Inc. that the articles describe. The develop Production PrePress Assembly issues and code are also available on AppleLink and via anonymous ftp on Photography Sharon Beals ftp.apple.com. Note that some software Online Production Cassi Carpenter and documentation referred to as being on develop, The Apple Technical Journal, a this issue’s CD may be located on the Tool quarterly publication of Apple Computer’s Chest edition rather than the Reference Developer Press group, is published in Library edition of the Developer CD Series March, June, September, and December. -
Introduction to the Cell Multiprocessor
Introduction J. A. Kahle M. N. Day to the Cell H. P. Hofstee C. R. Johns multiprocessor T. R. Maeurer D. Shippy This paper provides an introductory overview of the Cell multiprocessor. Cell represents a revolutionary extension of conventional microprocessor architecture and organization. The paper discusses the history of the project, the program objectives and challenges, the design concept, the architecture and programming models, and the implementation. Introduction: History of the project processors in order to provide the required Initial discussion on the collaborative effort to develop computational density and power efficiency. After Cell began with support from CEOs from the Sony several months of architectural discussion and contract and IBM companies: Sony as a content provider and negotiations, the STI (SCEI–Toshiba–IBM) Design IBM as a leading-edge technology and server company. Center was formally opened in Austin, Texas, on Collaboration was initiated among SCEI (Sony March 9, 2001. The STI Design Center represented Computer Entertainment Incorporated), IBM, for a joint investment in design of about $400,000,000. microprocessor development, and Toshiba, as a Separate joint collaborations were also set in place development and high-volume manufacturing technology for process technology development. partner. This led to high-level architectural discussions A number of key elements were employed to drive the among the three companies during the summer of 2000. success of the Cell multiprocessor design. First, a holistic During a critical meeting in Tokyo, it was determined design approach was used, encompassing processor that traditional architectural organizations would not architecture, hardware implementation, system deliver the computational power that SCEI sought structures, and software programming models. -
PULP June 2011.Cwk (DR)
Newsletter of the Hartford User Group Exchange June, 2011 The PULP Contents: The Quiz 3 Preparing for Lion: Find Your 4 HUGE this month: PowerPC Applications BACKING UP AND 6 General Meeting: June 17th RESTORING FILES The Control Panel -- Extremely 8 The non- “MAC Defender” & Useful see the Editors Corner Calendar 10 See you there! East Hartford Public Library Main St. & Central Ave., East Hartford, CT. Q&A Session: 7:00PM–7:30PM Meeting starts at: 7:30PM VOLUME 30 ISSUE 6 Page 1 Newsletter of the Hartford User Group Exchange June, 2011 The PULP is published monthly by and for members of the Hartford User MEETING LOCATIONS Group Exchange, Inc. (HUGE). HUGE is a nonprofit organization whose East Hartford Public aim is to provide an exchange of information between users of personal Library computers. The PULP is not in any way affiliated with any computer Main & Central Avenue manufacturer or software company. Original, uncopyrighted articles in the Lion’s Room appearing in the PULP may be reproduced without prior permission by (downstairs) other nonprofit groups. Please give credit to the author and the PULP, and send a copy to HUGE. The opinions and views herein are those of the authors and not necessarily those of HUGE. Damages caused by use or abuse of information appearing in the PULP are the sole responsibility of the user of the information. We reserve the right to edit or reject any articles submitted for publication in the PULP. Trademarks used in this publication belong to the respective owners of those trademarks. Editors Corner When I started to put the PULP together and plan for the June meeting I was thinking about a Q&A session, but PS -- As I put the finishing touches on the PULP, a new then there was ‘MAC Defender’. -
Programming the Cell Broadband Engine Examples and Best Practices
Front cover Draft Document for Review February 15, 2008 4:59 pm SG24-7575-00 Programming the Cell Broadband Engine Examples and Best Practices Practical code development and porting examples included Make the most of SDK 3.0 debug and performance tools Understand and apply different programming models and strategies Abraham Arevalo Ricardo M. Matinata Maharaja Pandian Eitan Peri Kurtis Ruby Francois Thomas Chris Almond ibm.com/redbooks Draft Document for Review February 15, 2008 4:59 pm 7575edno.fm International Technical Support Organization Programming the Cell Broadband Engine: Examples and Best Practices December 2007 SG24-7575-00 7575edno.fm Draft Document for Review February 15, 2008 4:59 pm Note: Before using this information and the product it supports, read the information in “Notices” on page xvii. First Edition (December 2007) This edition applies to Version 3.0 of the IBM Cell Broadband Engine SDK, and the IBM BladeCenter QS-21 platform. © Copyright International Business Machines Corporation 2007. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Draft Document for Review February 15, 2008 4:59 pm 7575TOC.fm Contents Preface . xi The team that wrote this book . xi Acknowledgements . xiii Become a published author . xiv Comments welcome. xv Notices . xvii Trademarks . xviii Part 1. Introduction to the Cell Broadband Engine . 1 Chapter 1. Cell Broadband Engine Overview . 3 1.1 Motivation . 4 1.2 Scaling the three performance-limiting walls. 6 1.2.1 Scaling the power-limitation wall . 6 1.2.2 Scaling the memory-limitation wall . -
IBM Elastic Storage System 3000: Service Guide Chapter 1
IBM Elastic Storage System 3000 6.0.2 Service Guide IBM SC28-3187-03 Note Before using this information and the product it supports, read the information in “Notices” on page 63. This edition applies to Version 6 release 0 modification 2 of the following product and to all subsequent releases and modifications until otherwise indicated in new editions: • IBM Spectrum® Scale Data Management Edition for IBM® ESS (product number 5765-DME) • IBM Spectrum Scale Data Access Edition for IBM ESS (product number 5765-DAE) IBM welcomes your comments; see the topic “How to submit your comments” on page xiii. When you send information to IBM, you grant IBM a nonexclusive right to use or distribute the information in any way it believes appropriate without incurring any obligation to you. © Copyright International Business Machines Corporation 2019, 2021. US Government Users Restricted Rights – Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Figures.................................................................................................................. v Tables................................................................................................................. vii About this information.......................................................................................... ix Who should read this information...............................................................................................................ix IBM Elastic Storage System information units.......................................................................................... -
Vitex-II Pro: the Platfom for Programmable Systems
The Platform for Programmable Systems Developing high-performance systems with embedded pro- cessors and fast I/O is quite a challenge. To be successful, you Industry’s Fastest must solve the difficult technical FPGA Fabric problems of hardware and Up to 4 IBM PowerPC™ Processors immersed in FPGA Fabric software development, I/O Up to 24 Embedded Rocket I/O™ Multi-Gigabit Transceivers interfacing, and third-party IP Up to 12 Digital Clock Managers integration; you must rigorously XCITE Digitally Controlled Impedance Technology simulate, test, and verify your Up to 556 18x18 Multipliers design; and you must meet Over 10 Mb Embedded Block RAM increasingly difficult deadlines with a cost-effective product that can adapt as industry standards Virtex-II Pro Platform FPGA Family quickly evolve. Benefits are Overwhelming The revolutionary Virtex-II Pro™ Because all of the critical system components (such as microprocessors, memory, IP peripherals, programmable logic, and high-performance I/O) are located on one family, based on the highly successful programmable logic device, you gain a significant performance and productivity Virtex-II architecture, provides a advantage. The Virtex-II Pro FPGA family, along with the Wind River Systems embedded tools and Xilinx ISE development environment, is the fastest, easiest, and unique platform for developing most cost effective method for developing your next generation high-performance high-performance microprocessor- programmable systems. and I/O-intensive applications. With Virtex-II Pro FPGAs, you get: Virtex-II Pro FPGAs provide up to • On-Chip IBM PowerPC Processors – You get maximum performance and ease of use because these are hard cores, operating at peak efficiency, tightly coupled with ™ four embedded 32-bit IBM PowerPC all memory and programmable logic resources. -
I.T.S.O. Powerpc an Inside View
SG24-4299-00 PowerPC An Inside View IBM SG24-4299-00 PowerPC An Inside View Take Note! Before using this information and the product it supports, be sure to read the general information under “Special Notices” on page xiii. First Edition (September 1995) This edition applies to the IBM PC PowerPC hardware and software products currently announced at the date of publication. Order publications through your IBM representative or the IBM branch office serving your locality. Publications are not stocked at the address given below. An ITSO Technical Bulletin Evaluation Form for reader′s feedback appears facing Chapter 1. If the form has been removed, comments may be addressed to: IBM Corporation, International Technical Support Organization Dept. JLPC Building 014 Internal Zip 5220 1000 NW 51st Street Boca Raton, Florida 33431-1328 When you send information to IBM, you grant IBM a non-exclusive right to use or distribute the information in any way it believes appropriate without incurring any obligation to you. Copyright International Business Machines Corporation 1995. All rights reserved. Note to U.S. Government Users — Documentation related to restricted rights — Use, duplication or disclosure is subject to restrictions set forth in GSA ADP Schedule Contract with IBM Corp. Abstract This document provides technical details on the PowerPC technology. It focuses on the features and advantages of the PowerPC Architecture and includes an historical overview of the development of the reduced instruction set computer (RISC) technology. It also describes in detail the IBM Power Series product family based on PowerPC technology, including IBM Personal Computer Power Series 830 and 850 and IBM ThinkPad Power Series 820 and 850. -
Design and Implementation of Clocked Open Core Protocol Interfaces for Intellectual Property Cores and On-Chip Network Fabric
DESIGN AND IMPLEMENTATION OF CLOCKED OPEN CORE PROTOCOL INTERFACES FOR INTELLECTUAL PROPERTY CORES AND ON-CHIP NETWORK FABRIC by Raghu Prasad Gudla A thesis submitted to the faculty of The University of Utah in partial fulfillment of the requirements for the degree of Master of Science Department of Electrical and Computer Engineering The University of Utah May 2011 Copyright c Raghu Prasad Gudla 2011 All Rights Reserved The University of Utah Graduate School STATEMENT OF THESIS APPROVAL This thesis of Raghu Prasad Gudla has been approved by the following supervisory committee members: Kenneth S. Stevens , Chair 01/14/2011 Date Approved Alan L. Davis , Member 01/14/2011 Date Approved Erik L. Brunvand , Member 01/14/2011 Date Approved and by Gianluca Lazzi , Chair of the Department of Electrical and Computer Engineering and by Charles A. Wight, Dean of the Graduate School. ABSTRACT This thesis designs, implements, and evaluates modular Open Core Protocol (OCP) interfaces for Intellectual Property (IP) cores and Network-on-Chip (NoC) that re- duces System-On-Chip (SoC) design time and enables research on different archi- tectural sequencing control methods. To utilize the NoCs design time optimization feature at the boundaries, a standardized industry socket was required, which can address the SoC shorter time-to-market requirements, design issues, and also the subsequent reuse of developed IP cores. OCP is an open industry standard socket interface specification used in this research to enable the IP cores reusability across multiple SoC designs. This research work designs and implements clocked OCP interfaces between IP cores and On-Chip Network Fabric (NoC), in single- and multi- frequency clocked domains. -
New Virtex™-II Pro Family Extends Platform FPGA Capability with Multi
Virtex-II Pro Platform FPGA Family Product Backgrounder The Virtex-II Pro Platform FPGA solution is arguably the most technically sophisticated silicon and software product in the programmable logic industry. The goal in developing the Virtex-II Pro FPGA was to revolutionize system architecture “from the ground up.” To achieve that objective, circuit engineers and system architects from IBM, Mindspeed, and Xilinx co- developed this advanced Platform FPGA. Engineering teams from top embedded systems companies, including Wind River Systems and Celoxica, worked together with Xilinx software teams to develop the systems software and IP solutions that enable new system architecture. The result is the first Platform FPGA solution capable of implementing ultra-high bandwidth SoC (system-on-a-chip) designs that were previously the exclusive domain of custom ASICs, yet with the flexibility and low development cost of programmable logic. This new solution is expected to usher a new era of leading-edge system architectures in networking applications, embedded systems, and digital signal processing systems. Virtex-II Pro Family Features • Five family members with 3,168 to 50,832 logic cells and 216 to 3,888 Kbits of Block RAM • Based upon Virtex-II IP-Immersion architecture • Multi-gigabit (3.125 Gb/s) serial transceiver blocks, up to 16 per device • PowerPC embedded processor cores, up to four per device Virtex-II Pro Family Key Value Proposition • Platform for Programmable Systems • Enables architectural synthesis • Delivers next generation connectivity standards • Enables a new development paradigm • Delivers leading edge price/performance value Virtex-II Pro Family Highlights The Virtex-II Pro family consists of five members, each with four to 16 RocketIO™ multi- gigabit transceivers based on the Mindspeed SkyRail™ technology. -
XC2VP30-6FFG896C Xilinx Inc. IC FPGA 556 I/O 896FCBGA
XC2VP30-6FFG896C Xilinx Inc. IC FPGA 556 I/O 896FCBGA https://www.fpgamall.com/ Product Not Recommended For New Designs XC2VP30-6FFG896C Xilinx Inc. IC FPGA 556 I/O 896FCBGA 1 R Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet DS083 (v5.0) June 21, 2011 0 Product Specification Module 1: Module 3: Introduction and Overview DC and Switching Characteristics 10 pages 59 pages • Summary of Features • Electrical Characteristics • General Description • Performance Characteristics • Architecture • Switching Characteristics • IP Core and Reference Support • Pin-to-Pin Output Parameter Guidelines • Device/Package Combinations and Maximum I/O • Pin-to-Pin Input Parameter Guidelines • Ordering Information • DCM Timing Parameters • Source-Synchronous Switching Characteristics Module 2: Functional Description Module 4: 60 pages Pinout Information • Functional Description: RocketIO™ X Multi-Gigabit 302 pages Transceiver • Pin Definitions • Functional Description: RocketIO Multi-Gigabit •Pinout Tables Transceiver - FG256/FGG256 Wire-Bond Fine-Pitch BGA Package • Functional Description: Processor Block - FG456/FGG456 Wire-Bond Fine-Pitch BGA Package • Functional Description: PowerPC™ 405 Core - FG676/FGG676 Wire-Bond Fine-Pitch BGA Package • Functional Description: FPGA - FF672 Flip-Chip Fine-Pitch BGA Package - FF896 Flip-Chip Fine-Pitch BGA Package - Input/Output Blocks (IOBs) - FF1148 Flip-Chip Fine-Pitch BGA Package - Digitally Controlled Impedance (DCI) - FF1152 Flip-Chip Fine-Pitch BGA Package - On-Chip Differential Termination - FF1517 Flip-Chip Fine-Pitch BGA Package - Configurable Logic Blocks (CLBs) - FF1696 Flip-Chip Fine-Pitch BGA Package - 3-State Buffers - FF1704 Flip-Chip Fine-Pitch BGA Package - CLB/Slice Configurations - 18-Kb Block SelectRAM™ Resources - 18-Bit x 18-Bit Multipliers - Global Clock Multiplexer Buffers - Digital Clock Manager (DCM) •Routing • Configuration IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision History at the end.