Samsung Galaxy Note 10+ 3D Time of Flight

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module Deep analysis of the rear 3D sensing module with Sony’s 2nd Generation CIS SP20484 - IMAGING report by Taha AYARI & Audrey LAHRACH Laboratory analysis by Véronique LE TROADEC January 2020 – Sample 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 1 Table of Contents

Overview / Introduction 4 Manufacturing Process 83 o Executive Summary o NIR ToF Image Sensor Die Front-End Process & Fabrication Unit o Reverse Costing Methodology o Flood Illuminator NIR VCSEL Process Flow & Fabrication Unit Company Profile 8 o Summary of the main parts o Sony Cost Analysis 94 o SEMCO o Summary of the cost analysis o Trumpf o Yields Explanation & Hypotheses o Samsung Galaxy Note10+ Teardown o NIR Camera Module Market Analysis 16  Pixel Array, BSI & Optical Front-End Cost o Forecast & Supply chains  NIR ToF Image Sensor Wafer & Die Cost Physical Analysis 20 o Flood Illuminator Module o Summary of the Physical Analysis  NIR VCSEL Front-End Cost o 3D Sensing System Assembly  NIR VCSEL Probe Test, Thinning & Dicing  Module Views  NIR VCSEL Die Wafer Cost  Module Opening  Component Cost  System Cross-Section o 3D ToF Module o NIR Camera Module  Lens Module & Component Cost  Module View & Dimensions  Complete System Price  Module Cross-Section Technical & Cost Comparison 71 o NIR ToF Image Sensor o Galaxy S10 vs. Galaxy Note 10+  Die Overview & Dimensions o Oppo Rx17 Pro vs. Galaxy Note 10+  Die Process  Die Cross-Section Feedbacks 121  Die Process Characteristic SystemPlus Consulting services 123 o Flood Illuminator  Module View & Dimensions  Module Cross-Section o NIR VCSEL Die  Die View & Dimensions  Die Process  Die Cross-Section  Die Process Characteristic ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 2 Executive Summary

Overview / Introduction o Executive Summary o Reverse Costing Methodology The reverse costing analysis is conducted in 3 phases: o Glossary

Company Profile & Supply Chain • Package is analyzed and measured Market Analysis • The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking Physical Analysis Teardown • Setup of the manufacturing process. Physical Comparison analysis

Manufacturing Process Flow

Cost Analysis • Setup of the manufacturing environment Feedbacks • Cost simulation of the process steps Related Reports Costing analysis About System Plus

• Supply chain analysis • Analysis of the selling price Selling price analysis

Overview / Introduction Main camera Company Profile o Sony Wide angle camera o SEMCO Flash o Trumpf ToF camera o Samsung Galaxy Note10+ Front camera Teardown ToF VCSEL

Market Analysis Telephoto camera

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports

About System Plus

Dimensions o Height: 162.3 mm o Width: 77.2 mm o Thickness: 7.9 mm

Weight o 198 g

Overview / Introduction

Company Profile o Sony o SEMCO o Trumpf o Samsung Galaxy Note10+ Teardown

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports

About System Plus

Company Profile & Supply Chain

Market Analysis

Physical Analysis o 3D ToF Module o NIR Camera Module o Overview o Cross-Section o NIR ToF Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o Flood Illuminator Module o Overview o Cross-Section o NIR VCSEL Die o Views & Dimensions o Die Cross-section o Die process

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports

About System Plus

©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 7 3D Depth Sensing Module – Image Sensor Die Overview & Dimensions Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports

About System Plus

Die Image Sensor - Overview ©2020 by System Plus Consulting©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 8 Image Sensor Die – Die Delayering – Pixels Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports

About System Plus

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports

About System Plus

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports

About System Plus

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports

About System Plus

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports

About System Plus

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison o Galaxy S10 vs. Galaxy Note 10+ o Oppo Rx17 Pro vs. Galaxy Note 10+

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports

About System Plus

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison o Galaxy S10 vs. Galaxy Note 10+ o Oppo Rx17 Pro vs. Galaxy Note 10+

Manufacturing Process Flow

Cost Analysis

Feedbacks 2019 2019 Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow o Global Overview o NIR Image Sensor Die Front- End Process o NIR Image Sensor Process Flow o NIR Image Sensor Fabrication Unit o NIR VCSEL Process Flow o NIR VCSEL Fabrication Unit

Cost Analysis

Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Cost Analysis

Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o NIR Camera Module Cost o Flood Illuminator Module Cost o 3D ToF Module Cost

Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o NIR Camera Module Cost o Flood Illuminator Module Cost o 3D ToF Module Cost

Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o NIR Camera Module Cost o Flood Illuminator Module Cost o 3D ToF Module Cost

Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o NIR Camera Module Cost o Flood Illuminator Module Cost o 3D ToF Module Cost

Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

Market Analysis IMAGING IMAGING • Sony’s 3D Time-of-Flight Depth Sensing Camera Module • Status of the Camera Module Industry 2019 – Focus on Wafer Physical Analysis • Panasonic’s 3D Time-of-Flight Depth Sensing Camera Level Optics • 3D Imaging & Sensing 2018 Physical Comparison Module • STMicroelectronics’ Near Infrared Camera Sensor in the • Status of the CMOS Image Sensor Industry 2018 Manufacturing Process Flow Apple iPhone X • VCSELs - Technology, Industry and Market Trends 2019 • Apple iPhone X – Infrared Dot Projector Cost Analysis • Orbbec’s Front 3D Depth Sensing System in the Oppo Find X Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis Physical Analysis Custom Analyses Physical Comparison (>130 analyses per year)

Manufacturing Process Flow Cost Analysis Reports Feedbacks (>60 reports per year) About System Plus o Company services o Contact Costing Tools

Trainings

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis FRANKFURT/MAIN Europe Sales Office

Physical Comparison NANTES LYON KOREA Headquarter YOLE HQ YOLE Manufacturing Process Flow TOKYO PHOENIX YOLE KK YOLE Inc. Cost Analysis GREATER CHINA YOLE Feedbacks

About System Plus o Company services o Contact

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