REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module Deep analysis of the rear 3D sensing module with Sony’s 2nd Generation CIS SP20484 - IMAGING report by Taha AYARI & Audrey LAHRACH Laboratory analysis by Véronique LE TROADEC January 2020 – Sample 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 1 Table of Contents Overview / Introduction 4 Manufacturing Process 83 o Executive Summary o NIR ToF Image Sensor Die Front-End Process & Fabrication Unit o Reverse Costing Methodology o Flood Illuminator NIR VCSEL Process Flow & Fabrication Unit Company Profile 8 o Summary of the main parts o Sony Cost Analysis 94 o SEMCO o Summary of the cost analysis o Trumpf o Yields Explanation & Hypotheses o Samsung Galaxy Note10+ Teardown o NIR Camera Module Market Analysis 16 Pixel Array, BSI & Optical Front-End Cost o Forecast & Supply chains NIR ToF Image Sensor Wafer & Die Cost Physical Analysis 20 o Flood Illuminator Module o Summary of the Physical Analysis NIR VCSEL Front-End Cost o 3D Sensing System Assembly NIR VCSEL Probe Test, Thinning & Dicing Module Views NIR VCSEL Die Wafer Cost Module Opening Component Cost System Cross-Section o 3D ToF Module o NIR Camera Module Lens Module & Component Cost Module View & Dimensions Complete System Price Module Cross-Section Technical & Cost Comparison 71 o NIR ToF Image Sensor o Galaxy S10 vs. Galaxy Note 10+ Die Overview & Dimensions o Oppo Rx17 Pro vs. Galaxy Note 10+ Die Process Die Cross-Section Feedbacks 121 Die Process Characteristic SystemPlus Consulting services 123 o Flood Illuminator Module View & Dimensions Module Cross-Section o NIR VCSEL Die Die View & Dimensions Die Process Die Cross-Section Die Process Characteristic ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 2 Executive Summary Overview / Introduction o Executive Summary o Reverse Costing Methodology The reverse costing analysis is conducted in 3 phases: o Glossary Company Profile & Supply Chain • Package is analyzed and measured Market Analysis • The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking Physical Analysis Teardown • Setup of the manufacturing process. Physical Comparison analysis Manufacturing Process Flow Cost Analysis • Setup of the manufacturing environment Feedbacks • Cost simulation of the process steps Related Reports Costing analysis About System Plus • Supply chain analysis • Analysis of the selling price Selling price analysis ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 3 Samsung Galaxy Note10+ Teardown Overview / Introduction Main camera Company Profile o Sony Wide angle camera o SEMCO Flash o Trumpf ToF camera o Samsung Galaxy Note10+ Front camera Teardown ToF VCSEL Market Analysis Telephoto camera Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks Related Reports About System Plus Dimensions o Height: 162.3 mm o Width: 77.2 mm o Thickness: 7.9 mm Weight o 198 g Samsung Galaxy Note10+ Overview ©2020 by System Plus Consulting ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 4 Rear Sensing Module Overview / Introduction Company Profile o Sony o SEMCO o Trumpf o Samsung Galaxy Note10+ Teardown Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 5 Summary of the Physical Analysis Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o 3D ToF Module o NIR Camera Module o Overview o Cross-Section o NIR ToF Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o Flood Illuminator Module o Overview o Cross-Section o NIR VCSEL Die o Views & Dimensions o Die Cross-section o Die process Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks Related Reports About System Plus Samsung Galaxy Note10+ 3D sensing Assembly – Camera Module & Flood Illuminator ©2020 by System Plus Consulting ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 6 3D Depth Sensing Module Cross-Section Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o 3D ToF Module o NIR Camera Module o Overview o Cross-Section o NIR ToF Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o Flood Illuminator Module o Overview o Cross-Section o NIR VCSEL Die o Views & Dimensions o Die Cross-section o Die process Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 7 3D Depth Sensing Module – Image Sensor Die Overview & Dimensions Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o 3D ToF Module o NIR Camera Module o Overview o Cross-Section o NIR ToF Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o Flood Illuminator Module o Overview o Cross-Section o NIR VCSEL Die o Views & Dimensions o Die Cross-section o Die process Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks Related Reports About System Plus Die Image Sensor - Overview ©2020 by System Plus Consulting©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 8 Image Sensor Die – Die Delayering – Pixels Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o 3D ToF Module o NIR Camera Module o Overview o Cross-Section o NIR ToF Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o Flood Illuminator Module o Overview o Cross-Section o NIR VCSEL Die o Views & Dimensions o Die Cross-section o Die process Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks Related Reports About System Plus Image Sensor Die – Pixels Deprocessing – SEM View ©2020 by System Plus Consulting ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 9 Image Image Sensor Die – Die Cross-Section – Substrate Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o 3D ToF Module o NIR Camera Module o Overview o Cross-Section o NIR ToF Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o Flood Illuminator Module o Overview o Cross-Section o NIR VCSEL Die o Views & Dimensions o Die Cross-section o Die process Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 10 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o 3D ToF Module o NIR Camera Module o Overview o Cross-Section o NIR ToF Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o Flood Illuminator Module o Overview o Cross-Section o NIR VCSEL Die o Views & Dimensions o Die Cross-section o Die process Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 11 VCSEL Die Overview & Dimensions Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o 3D ToF Module o NIR Camera Module o Overview o Cross-Section o NIR ToF Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o Flood Illuminator Module o Overview o Cross-Section o NIR VCSEL Die o Views & Dimensions o Die Cross-section o Die process Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 12 VCSEL Die process Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o 3D ToF Module o NIR Camera Module o Overview o Cross-Section o NIR ToF Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o Flood Illuminator Module o Overview o Cross-Section o NIR VCSEL Die o Views & Dimensions o Die Cross-section o Die process Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 13 Galaxy S10 (rear) vs. Galaxy Note 10+ – VCSEL Die Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Physical Comparison o Galaxy S10 vs. Galaxy Note 10+ o Oppo Rx17 Pro vs. Galaxy Note 10+ Manufacturing Process Flow Cost Analysis Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 14 Samsung vs. Oppo– NIR ToF Image Sensor