REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module Deep analysis of the rear 3D sensing module with Sony’s 2nd Generation CIS SP20484 - IMAGING report by Taha AYARI & Audrey LAHRACH Laboratory analysis by Véronique LE TROADEC January 2020 – Sample 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16
[email protected] www.systemplus.fr ©2020 by System Plus Consulting | SP20484 - Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module 1 Table of Contents Overview / Introduction 4 Manufacturing Process 83 o Executive Summary o NIR ToF Image Sensor Die Front-End Process & Fabrication Unit o Reverse Costing Methodology o Flood Illuminator NIR VCSEL Process Flow & Fabrication Unit Company Profile 8 o Summary of the main parts o Sony Cost Analysis 94 o SEMCO o Summary of the cost analysis o Trumpf o Yields Explanation & Hypotheses o Samsung Galaxy Note10+ Teardown o NIR Camera Module Market Analysis 16 Pixel Array, BSI & Optical Front-End Cost o Forecast & Supply chains NIR ToF Image Sensor Wafer & Die Cost Physical Analysis 20 o Flood Illuminator Module o Summary of the Physical Analysis NIR VCSEL Front-End Cost o 3D Sensing System Assembly NIR VCSEL Probe Test, Thinning & Dicing Module Views NIR VCSEL Die Wafer Cost Module Opening Component Cost System Cross-Section o 3D ToF Module o NIR Camera Module Lens Module & Component Cost Module View & Dimensions Complete System Price Module Cross-Section Technical & Cost Comparison 71 o NIR ToF Image Sensor o Galaxy S10 vs. Galaxy Note 10+ Die Overview & Dimensions o Oppo Rx17 Pro vs.