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Computer-On-Modules 2013 « » Computer-on-Modules 2013 « » Flexibility » Scalability Over 15 YEARS » Long solution life COM Experience » Short time-to-market DISTRIBUTED BY TEXIM EUROPE The pulse of innovation » ARM Computer-on-Modules « SMARC - Smart Mobility Architecture (82 x 50 mm) –40°C to +85°C –40°C to +85°C SMARC-sA3874i SMARC-sAMX6i SMARC-sAT30 Processor TI Sitara AM3874, Single core Cortex Freescale i.MX 6 Solo, Dual and Quad NVIDIA® Tegra 3 (Kel-Al), Quad A8, Up to 800MHz Core ARM Cortex-A9, Up to 1.2GHz Core™ ARM Cortex A9 1.2 GHz Memory DDR3 memory, up to 2GB DDR3 up to 2 GB, memory down DDR3, 1 or 2 GB, down soldered down Flash Up to 32GB NAND (optionally) Up to 64GB NAND/eMMC (optionally) Up to 64 GB NAND/eMMC (optionally) Ethernet 10/100/1000 Gbit 10/100/1000 Mbit/sec 10/100/1000 Mbit/sec USB 2x USB 2.0 (one OTG) 3x USB 2.0 port (one OTG) 3x USB 2.0 port (one OTG) Display Parallel LCD 18/24bit Parallel LCD 18/24 bit Parallel LCD 18 / 24 bit LVDS Single Channel LVDS Single Channel 18/24bit LVDS Single Channel 18 bit / 24 bit HDMI HDMI - 18 bit compatible Support for dual channel 24 bit LVDS (Carrier board xmitter) HDMI Graphics 3D graphics acceleration Dual Display HD 1080p encode and Dual Displays HD Video Decode, HD video processing decode 2D and 3D acceleration including MPEG2 HD Video Encode 2D and 3D acceleration GPU ULP GeForce / 12 cores Additional Interface 1x PCIe; I2C; I2S; 4x UART; 2x Up to 3 PCIe x1, MLB150, 12xGPIOs, PCIe Gen 1 x1 lane width, 2 links plus CAN; GPIO Battery and System SDIO, SATA eMMC, 2x SPI, 5x I2C, 2x support signals SATA, SD Card, eMMC, Management; SATA I2S, SPDIF, WDT, 2x CAN, Battery and 2x SPI, 5x I2C, 3x I2S, 4x UART, 12x System Management GPIO, SPDIF, WDT, Battery and System Management Image Capture Interfaces Camera 10bit parallel interface 1x PCAM, 1x CSI 2x Camera Ports CSI-2, dual lane SW Support Windows WEC7, Android, Linux Windows WEC7, Android, Linux Android ICS, Linux Power Typ. 2 Watts tbd 5 Watts typical Thermal Industrial temperature: Commercial temperature: Operating temperature: -40°C to +85°C 0°C to +60°C 0°C to 60°C Industrial temperature: Industrial version planned -40°C to 85°C (800 MHz) » Software & Services for ARM « Bootloader Board Support Package » Configuration Services » For WEC7, Linux, Android available » Customer specific bootloader » QNX, VxWorks on request development and variant handling » Customization and Driver Development Services OS/Licenses Support&Services » Evaluation Images » Getting Started Support » Support for Getting Started » ARM Baseboard & Software Training » Image Building » Enhanced Software Support » Microsoft Embedded Licenses » Customization, Software Development and Migration Services DISTRIBUTED BY TEXIM EUROPE » QorIQ™ Computer-on-Modules « COM Express® QorIQ™ Computer-on-Modules COMe-cP2020* COMe-cP5020* Processor Freescale QorIQ™ P2020 e500 Power Architecture (2x 1.2 Freescale QorIQ™ P5020 (P5010) e5500 Power Architecture GHz commercial temp. / 1.0 GHz industrial temp.) (2x 2.0 GHz (2x 1.6 GHz)) Cache 32 KB L1 instruction cache and 32 KB L1 data cache for 32 KB L1 instruction cache and 32 KB L1 data cache for each core; 512 KB L2 cache with ECC. each core; 512 KB L2 cache/Core; 2MB L3 cache shared Memory Up to 4GB DDR3-667 72-bit Up to 8GB DDR3-1333 MHz ECC Storage/Flash 64kbit I²C EEPROM / up to 2GB NAND Flash + 2MB NOR 64kbit I²C EEPROM / up to 2GB NAND Flash; 2MB NOR Flash; 2nd 2MB SPI NOR Flash for boot recovery purposes; Flash; 2nd 2MB SPI NOR Flash for boot recovery purposes; 512kB MRAM 2x SATA multiplexed with SERDES; 512kB MRAM Micro SD Card MicroSD card slot / bootable MicroSD card slot/ bootable USB 4x USB 2.0 5x USB 2.0 (one channel device capable) PCI Express See SERDES See SERDES SERDES* Options 4x SERDES up to 3.125 Gbps multiplexed across controllers 18x SERDES lanes configurable; pre-selected standard can be configured as: PCIexpress, sRIO, GbE; Example: configurations: 1x PCIe x4 2x PCIe x4 + 4x 1 GbE SGMII + 1x SATA 2x PCIe x1 + 1PCIe x2 2.5 Gbps 2x PCIe x4 + 4x 1 GbE SGMII + 1x XAUI 1x PCIe x2 + 2x 1GbE SGMII 2x PCIe x4 + 1x XAUI + 1x SATA 2x SRIO x1 2.5Gbps + 2x GbE SGMII 2x sRIO x4 + 4x 1 GbE SGMII + 1x SATA 2x SRIO x1 3.125 Gbps 1x SRIO x4 with 1.25/2.5 or 3.125 Gbps Serial 2x UART 2x UART (2x FourWire/ 2x TX/RX) Serial Rapid I/O See SERDES See SERDES Ethernet 3x 10/100/1000 Base-T 1x 10/100/1000 Base-T SPI Yes Yes GPIO 2x GPIO (exclusive with SDHC usage); additional GPIO on 12x GPIO project base I²C 2x I²C 1x I²C IEEE 1588 2x IEEE 1588 control IEEE 1588 control Interface Others 1x SDHC; 1x MDIO (IEEE 802.3 clause 22); 5x IRQ; 1x IRQ 1x SDHC; 2x MDIO (iEEE 802.3 clause 22 + clause 45) OUT; 16 bit eLBC (2 Devices); Processor Local Bus 5x IRQ Interrupts; Processor Local Bus Other Features Watchdog, JTAG debug, Real time clock; LEDs Watchdog, JTAG debug, Aurora debug; Temperatur Monitor; LEDs Bootloader U-Boot U-Boot Operating Systems Linux; Wind River VxWorks 6.9.2 Linux; Wind River VxWorks 6.9.2 Power 12 V +/- 5% (optional RTC supply voltage of 3.3V) 12 V +/- 5% (optional RTC supply voltage of 3.3V) Power Consumption Est. 12W/12V Est. 30W/12V Temperature c-version 0°C to +60°C; i-version -40°C to +70°C 0°C to 60°C Humidity 93% relative Humidity at 40 °C, non-condensing 93% relative Humidity at 40°C, non-condensing (acc. to IEC 60068-2-78) (acc. to IEC 60068-2-78) Compliance Com Express® compact, 95x95 mm Com Express® basic, 95x125 mm * Please consult our sales support team for other processor versions and SERDES configurations. DISTRIBUTED BY TEXIM EUROPE kontron.com/mysafechoice » x86 Computer-on-Modules « The Thermal Concept COM Express® COM Express® ETX® mini (84x55mm) compact (95x95mm) basic (125x95mm) (114x95mm) COM Express® Heatspreader provides: » Identical mechanical size – all COM Express® modules –40°C to +85°C Preliminary fit in the same system –40°C to +85°C » The only surface that needs cooling is the top of the heatspreader » Additional active and passive Heatsinks are available COMe-mSP1 COMe-mTT10 COMe-mCT10 COMe-cSP2 COMe-cXLi2 COMe-cPV2 COMe-cDC2 COMe-cPC2 COMe-cOH# COMe-cTH6 COMe-cCT6 COMe-bPC2 COMe-bAI# COMe-bSC# COMe-bIP# COMe-bHL6 ETX®-DC ETX®-OH (nanoETXexpress-SP) (nanoETXexpress-TT) (microETXexpress®-SP) (microETXexpress®-XL) (microETXexpress®-PV) (microETXexpress®-DC) (microETXexpress®-PC) (microETXexpress®-OH) (ETXexpress®-PC) (ETXexpress®-AI) (ETXexpress®-SC) CPU Intel® Atom™ Intel® Atom™ Intel® Atom™ Intel® Atom™ Intel® Atom™ Intel® Atom™ Intel® Atom™ Intel® Core™ 2 Duo SL9400, AMD® G-Series T16R, T44R, T52R, AMD® eTrinity R-460L, R-452L, Intel® Atom™ Intel® Core™2 Duo SP9300, Intel® Core™ i7-610E, Intel® Core™ i7-2715QE, i7- Intel® Core™ i7-3615QE, i7- Intel® Core™ i-CPUs, future 4th Intel® Atom™ AMD® G-Series, T16R, T40R, CPU Z510, Z530 E6xx / E6xxT N2600, N2800, D2700 Z510, Z530 Z520PT D510, D410, N450, D525 N270 SU9300, Intel® Celeron® M T40N, T56N R-260H N2600, N2800, D2700 SL9400, SU9300, T9400, P8400, i7-620LE, i7-620UE, 2655LE, i7-2610UE, i5-2515E, 3612QE, i7-3555LE, i7-3517UE, Generation (formerly codename N270 T52R, T40E, T56N Processor 722, 723 Celeron® M575 i5-520E i3-2310OE, i3-2340UE, Celeron® i5-3610ME, i3-3210ME, Haswell) B810E, 847E i3-3217UE CPU Clock 1.1 GHz up to 1.6 GHz 0.6 GHz up to 1.6 GHz Up to 2x 2.13 GHz Up to 1.6 GHz 1.33 GHz Up to 2x 1.66 GHz 1.6 GHz Up to 2x 1.86 GHz Up to 2x 1.6 GHz Up to 4x 2.0 GHz Up to 2x 2.13 GHz Up to 2x 2.53 GHz Up to 2x 2.53 GHz Up to 2x 2.5 GHz resp. 4x 2.1 GHz Up to 2x 2.7 GHz resp. 4x 2.3 tbd 1.6 GHz Up to 2x 1.65 GHz CPU Clock GHz Cache 32 kB Instruction Cache + 24 kB 32 kB Instruction Cache + 32 KB Instructions cache + 32 kB Instruction Cache + 512 kB L2 Up to 1 MB L2 512kB L2 Up to 6 MB L2 512 kB L2 tbd 32 KB Instructions cache Up to 6 MB L2 Up to 4 MB L2 Up to 6 MB L2 Cache Up to 6 MB L2 tbd 512 kB L2 2x 512 kB L2 Cache L1/512 kByte L2 24 kB L1 Cache, 512 kB L2 Cache 24 KB L1 Cache, 1MB L2 Cache 24 kB L1, up to 512kB L2 + 24 KB L1 Cache, 1MB L2 Cache Chipset Intel® SCH US15W Intel® PCH EG20 / EG20T Intel® SCH NM10 Express Intel® SCH US15W Intel® SCH US15WPT Intel® 82801HM Intel® 945GSE, Intel® GS45, AMD® FCH A50M AMD® A70 Intel® SCH NM10 Express Intel® GS45, ICH9M SFF, Intel® Intel® Mobile Platform Controller Intel® Mobile Platform Controller tbd Intel® 8 series chipset Intel® 945GSE, ICH7M AMD® FCH A55M Chipset ICH7M ICH9M SFF GM45, ICH9EM, Intel® GL40, Hub QM57 Hub QM67 resp. HM65 (formerly codename Haswell) Computer-on-Modules for Extreme ICH9M Bus Speed 400/533 MHZ FSB n/a n/a 400/533 MHz FSB 533 MHz FSB 667/800 MHz 400/533 MHz FSB 800/1066 MHz FSB 800/1066 MHz FSB tbd n/a 800/1066 MHz FSB 800/1066 FSB n/a n/a n/a 400/533 MHz 1066 MHz FSB Bus Speed Temperatures Memory Onboard up to 2 GB DDR2 Onboard up to 2 GB DDR2-800 Onboard up to 4 GB DDR3 Up to 2 GB DDR2 Onboard up to 2 GB DDR2 Up to 2x 2 GB DDR2/DDR3 Up to 2 GB DDR2 Up to 4 GB DDR3 Up to 2x 4 GB DDR3 Up to 2x 4 GB DDR3 Up to 4 GB DDR3 Up to 2x 4 GB DDR3, Up to 2x 4 GB DDR3, Dual Up to 2x 8 DDR3, Dual Channel Up to 2x 8 GB DDR3, Dual Up to 2 GB DDR2 Up to 4 GB DDR3 Memory (800/1066 MHz) (industrial temperature range) Dual Channel Channel with ECC with ECC Channel Mission-critical applications in the military, aerospace, Hard Disk 1x onboard SSD up to 4 GByte, 2x SerialATA 300, 1x microSD- 2x Serial ATA external supporting 2x SerialATA (RAID 0,1), 1x PATA 1x SerialATA, 1x PATA, Optional 3x SerialATA 2x SerialATA (AHCI), 1x PATA, 3x SerialATA 2, 4x SerialATA 3 4x SerialATA 600 2x SerialATA 2 4x SerialATA 2, 1x PATA 4x SerialATA 2 2x SerialATA 3, 2x SerialATA 3, 4x SerialATA3 2x SerialATA (AHCI), 2x SerialATA (AHCI), Hard Disk 1 SDIO port (shared with GPIO) Card Slot on GPIO alternatively, 3Gb/s alternatively: 1x SATA + industrial temperature range SSD optional SSD flash onboard 1x PATA (optional Flash onboard) PATA (on Type 2 only) 2x SerialATA 2 2x SerialATA 2 2x PATA 2x PATA transportation, energy and industrial automation markets offer 1x SATA 300, 1x SATA E2 SSD up 1x SATA onBoard SSD Flash drive onboard PATA (on Type 2 only) PATA (on Type 2 only) the biggest challenges for extended temperature designs.
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