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SN74TVC3306 Dual Voltage Clamp Datasheet

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SN74TVC3306 Dual Voltage Clamp Datasheet Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN74TVC3306 SCDS112D –MARCH 2001–REVISED DECEMBER 2014 SN74TVC3306 Dual Voltage Clamp 1 Features 3 Description The SN74TVC3306 device provides three parallel 1• Designed to Be Used in Voltage-Limiting Applications NMOS pass transistors with a common unbuffered gate. The low on-state resistance of the switch allows • 3.5-Ω On-State Connection Between connections to be made with minimal propagation Ports A and B delay. • Flow-Through Pinout for Ease of Printed Circuit The device can be used as a dual switch, with the Board Trace Routing gates cascaded together to a reference transistor. • Direct Interface With GTL+ Levels The low-voltage side of each pass transistor is limited • Latch-Up Performance Exceeds 100 mA Per to a voltage set by the reference transistor. This is JESD 78, Class II done to protect components with inputs that are sensitive to high-state voltage-level overshoots. • ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model Device Information(1) – 200-V Machine Model PART NUMBER PACKAGE BODY SIZE (NOM) – 1000-V Charged-Device Model SM8 (8) 3.00 mm x 2.80 mm SN74TVC3306 US8 (8) 2.30 mm x 2.00 mm 2 Applications (1) For all available packages, see the orderable addendum at • Voltage Level Translation the end of the data sheet. • Signal Switching • Bus Isolation 4 Simplified Schematic GATE B1 B2 B3 8 7 6 5 1 2 3 4 GND A1 A2 A3 The SN74TVC3306 device has bidirectional capability across many voltage levels. The voltage levels documented in this data sheet are examples. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74TVC3306 SCDS112D –MARCH 2001–REVISED DECEMBER 2014 www.ti.com Table of Contents 1 Features .................................................................. 1 7.10 Typical Characteristics............................................ 6 2 Applications ........................................................... 1 8 Parameter Measurement Information .................. 6 3 Description ............................................................. 1 9 Detailed Description .............................................. 7 4 Simplified Schematic............................................. 1 9.1 Overview ................................................................... 7 5 Revision History..................................................... 2 9.2 Functional Block Diagram ......................................... 7 6 Pin Configuration and Functions ......................... 3 9.3 Feature Description................................................... 7 9.4 Device Functional Modes.......................................... 7 7 Specifications......................................................... 4 7.1 Absolute Maximum Ratings .................................... 4 10 Application and Implementation.......................... 8 7.2 ESD Ratings ............................................................ 4 10.1 Application Information............................................ 8 7.3 Recommended Operating Conditions....................... 4 10.2 Typical Application ................................................. 8 7.4 Thermal Information.................................................. 4 11 Power Supply Recommendations ..................... 10 7.5 Electrical Characteristics........................................... 5 12 Layout................................................................... 10 12.1 Layout Guidelines ................................................. 10 7.6 Switching Characteristics (AC, VGATE = 3.3 V, Translating Down)...................................................... 5 12.2 Layout Example .................................................... 10 7.7 Switching Characteristics (AC, VGATE = 2.5 V, 13 Device and Documentation Support ................. 10 Translating Down)...................................................... 5 13.1 Trademarks ........................................................... 10 7.8 Switching Characteristics (AC, VGATE = 3.3 V, 13.2 Electrostatic Discharge Caution............................ 10 Translating Up) .......................................................... 5 13.3 Glossary ................................................................ 10 7.9 Switching Characteristics (AC, VGATE = 2.5 V, Translating Up) .......................................................... 5 14 Mechanical, Packaging, and Orderable Information ........................................................... 10 5 Revision History Changes from Revision C (March 2002) to Revision D Page • Added Applications, Device Information table, Pin Functions table, Handling Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .............................................................. 1 • Deleted Ordering Information table. ....................................................................................................................................... 1 • Changed the RON parameter in the Electrical Characersitics table. ....................................................................................... 5 2 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: SN74TVC3306 SN74TVC3306 www.ti.com SCDS112D –MARCH 2001–REVISED DECEMBER 2014 6 Pin Configuration and Functions Top View DCT OR DCU PACKAGE (TOP VIEW) GND 1 8 GATE A1 2 7 B1 A2 3 6 B2 A3 4 5 B3 Pin Functions PIN TYPE DESCRIPTION NAME NO. A1 2 I/O I/O of gate 1 A2 3 I/O I/O of gate 1 A3 4 I/O I/O of gate 1 B1 5 I/O I/O of gate 2 B2 6 I/O I/O of gate 2 B3 7 I/O I/O of gate 2 GATE 8 I Gate pin. Set high to enable the switches. Connect to B1 (VBIAS) for translation application. GND 1 — Ground Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: SN74TVC3306 SN74TVC3306 SCDS112D –MARCH 2001–REVISED DECEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings(1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT (2) VI Input voltage range –0.5 7 V (2) VI/O Input/output voltage range –0.5 7 V Continuous channel current 128 mA IIK Input clamp current VI < 0 –50 mA Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and input/output negative-voltage ratings may be exceeded if the input and input/output clamp-current ratings are observed. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2500 V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification JESD22-C101, V 2000 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN MAX UNIT VI/O Input/output voltage 0 5 V VGATE GATE voltage 0 5 V IPASS Pass transistor current 64 mA TA Operating free-air temperature –40 85 °C 7.4 Thermal Information SN74TVC3306 THERMAL METRIC(1) DCT DCU UNIT 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 220 227 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: SN74TVC3306 SN74TVC3306 www.ti.com SCDS112D –MARCH 2001–REVISED DECEMBER 2014 7.5 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT VIK II = -18 mA, VGATE = 0 –1.2 V IIH VI = 5 V, VGATE = 0 5 μA Ci(GATE) VI = 3 V or 0 11 pF Cio(off) VO = 3 V or 0, VGATE = 0 4 6 pF Cio(on) VO = 3 V or 0, VGATE = 3 V 10.5 12.5 pF VGATE = 4.5 V 3.5 5.5 VI = 0, IO = 64 mA VGATE = 3 V 4.7 7 (2) Ron VGATE = 2.3 V 6.3 9.5 Ω VI = 2.4 V, IO = 15 mA VGATE = 4.5 V 4.8 7.5 VI = 1.8 V, IO = 15 mA VGATE = 4.5 V 4.5 5 (1) All typical values are at TA = 25°C. (2) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two (A or B) terminals. 7.6 Switching Characteristics (AC, VGATE = 3.3 V, Translating Down) over recommended operating free-air temperature range, VGATE = 3.3 V, VIH = 3.3 V, VIL = 0, and VM = 1.15 V (unless otherwise noted) (see Figure 2) FROM TO CL = 50 pF CL = 30 pF CL = 15 pF PARAMETER UNIT (INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX tPLH 0 0.8 0 0.6 0 0.3 A or B B or A ns tPHL 0 1.2 0 1 0 0.5 7.7 Switching Characteristics (AC, VGATE = 2.5 V, Translating Down) over recommended operating free-air temperature range, VGATE = 2.5 V, VIH = 2.5 V, VIL = 0, and VM = 0.75 V (unless otherwise noted) (see Figure
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