Daves Director, Packaging Solutions Development Freescale Semiconductor, Inc

Glenn G. Daves Director, Packaging Solutions Development Freescale Semiconductor, Inc.

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t he Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. iPhone

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Piezo-resistive Bio Sensors effect of Si-Ge discovered Gyroscopes

Accelerometers

Inkjet Heads

Si-Ge Strain Gage

Pressure Sensors

IR Sensors

Digital Light Processors

Resonant Gate Term “MEMS” Tire Pressure Monitors Transistor patented first used iPod

1950’s 1960’s 1970’s 1980’s 1990’s 2000’s 2010’s

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a TM 2 Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. SOURCE: Southwest Center for Microsystems Education (SCME), History of MEMS Learning Module, 2001 • Increasing Accuracy − Increasing precision is desired/demanded over time − Isolation: stable packages that isolate sensor from extraneous stresses

• Increasing Integration − More functions, more chips in a single sense unit − Integration: expanding SiP, PiP, PoP complexity

• Miniaturization − Handheld device space constraints fix maximum volumetric envelope − Miniaturization:

• Increasing Diversity Freescale Pressure Sensor Portfolio − Expanding applications and markets − Customization: Each package customized for the application, market, and environment. Pressure, inertial, optical / consumer, automotive, medical. . . − Design: accuracy required to do all the above well.

• Cost, Cost, Cost − Leverage existing capabilities (test & pkg) and integration, standardization.

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a TM 3 Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. • Design Accuracy

• Isolation Improvement

• Cost

• Applications

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a TM 4 Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. • MEMS designs sometimes experience many revisions. − Inherent functionality − Fabrication process variation − Assembly and board mounting stresses − Environmental conditions

• Current analytic and finite element modeling approaches are insufficient to achieve “first time right” design objectives.

• Research Needs − Automation / Simplification . To enable modeling of statistical variation and complex systems without added labor. − Definition of model boundary conditions . To improve design accuracy and better predict actual performance

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a TM 5 Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. • Conventional wisdom: ceramic as a stable foundation for the system. − But, it is unaffordable and not scalable to miniaturization needs.

• Conventional microelectronics packaging materials (lead frames, substrates, mold compounds, etc.) have attractive pricing but create and transmit more extraneous stresses to the sensor. − Increasing sensitivity requirements are revealing the limitations of applying these packages to MEMS.

• Research Needs − Materials . Create a cost-effective ceramic-like base suitable for many form factors. − Physical Isolation . Design robust sensors that are immune to extraneous stress fields. − Compensation / Trimming . Develop more sophisticated methodologies that cancel-out extraneous stresses.

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a TM 6 Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. • Cost Hierarchy: − Conventional microelectronics paradigm: chip > package > test − Emerging MEMS paradigm: test > package > chip

• Despite the changing cost paradigm, the

overwhelming majority of R&D attention, effort, and dollars are directed towards improving the chips to deliver more sensitivity, integration, etc. SPEA of Courtesy • Research Needs − MEMS Design-for-test / Self-test methodologies . To eliminate the need for custom actuation-based testers & handlers and leverage existing digital tester/handler infrastructure. − Isolation Improvement . To enable leverage of existing digital packaging technologies & cost structures. − Standardization & Integration . One product / one process / one package. Multi-function products = fewer pkgs.

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a TM 7 Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. • Micro-fluidics − Medical and implantable devices, drug delivery, lab-on-chip, etc. − Cooling 3D chip stacks

• 2-D and 3-D Packaging Integration

− Sensing “node” concepts for aerospace and military − Volumetric shrinks − More function in constant volume

• Wafer-level Packaging Plus 3D of Courtesy − ASIC-as-cap-wafer, TSV chip/wafer stacks − Optical packaging: dispensed lenses, etc.

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a TM 8 Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. TM