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Entegris Newsletter Zero Defects Zero Defects Entegris Newsletter December 2018 CONTENTS Advanced Materials Science: The Future of — Innovation in the Fourth Industrial Revolution 1. Entegris News • Advanced Materials Science: The Future of Innovation in the Fourth We’re in the Fourth Industrial Revolution, meet the precision, purity, integrity, Industrial Revolution a period of massive transformation for and safety challenges presented by • Entegris Expands State-of-the-Art our world. Artificial intelligence (AI), the need for new engineered materials. Clean Manufacturing Facility in Malaysia virtual reality, augmented reality, internet Specifically, the new materials, more of things (IoT) devices, and the develop- sophisticated integration flows, and 2. Innovation ment of self-driving cars – to name a • Examining the Small, Medium, and increased purity requirements needed Large of Automotive Latent Defects few – are fueling a data revolution. In to achieve higher-performance devices fact, 90% of the world’s data was created add fabrication steps and increase 3. Cost Reduction in the last two years. This data explosion • Enriched 11Boron Trifluoride and process complexity. While many in- is driving the need for not only more chips Hydrogen Mixture for Performance dustries have to do more with less, the Improvement on Applied Materials but the development of more sophisti- semiconductor industry must do more E-500 Implanter cated chips, which presents tremendous with more — at least when it comes opportunities for the semiconductor 4. Yield Improvement to complex manufacturing processes. • Realizing Bottom Line Profits from industry. Every new step added to the manufac- Wafer Carrier Selection This digital transformation demands turing processes creates a potential point 5. Service Highlight a faster and more reliable computing of failure (or more) and solving each of • Entegris Launches Global infrastructure that will be enabled by these challenges can be time-consuming E-Commerce Solution to Support new device architectures (i.e. 3D NAND and costly. With process steps growing Customer Needs memory devices), new engineered ma- to more than 100, even a yield loss terials, and a greater level of material of 0.01% can result in significant purity to manage and utilize the informa- economic impact. tion-rich data created in all applications. While meeting these requirements is no To know more, watch the video easy feat, Entegris is uniquely positioned published in the Reuters Global to help the semiconductor industry Thought Leadership piece Entegris Expands State-of-the-Art Clean ENTEGRIS ASIA A question about Entegris products? Manufacturing Facility in Malaysia Call your customer service center China Singapore Shanghai T +65 6745 2422 On November 8th, 2018, guests from greater emphasis on the performance T +86 21 8023 6500 F +65 6745 4477 Samsung, Micron, and officials from local and reliability of those chips. “These F +86 21 5080 5598 Taiwan government authorities joined Entegris drivers are leading to increased demand Beijing Hsinchu to celebrate the $30 million investment for wafer handling products from our T +86 10 6552 8840 T +886 3 571 0178 in the capacity expansion of its state-of- customers, globally,” said Bertrand Loy, F +86 10 6552 8840 F +886 3 572 9520 the-art clean Kulim facility in Malaysia. president and CEO, Entegris. - 8002 Tainan Xi'an T +886 6 589 6008 With a $30M USD investment, Entegris T +86 29 8860 0785 F +886 6 501 3799 has increased the manufacturing F +86 29 8860 0785 Korea capacity of the Kulim facility by 30%, South East Asia T +81 31 8065 8300 Malaysia F +81 31 8065 8301 ensuring the company is a steadfast T +60 4 427 4200 partner for the leading semiconductor F +60 4 641 3294 makers for years to come. www.entegris.com The Fourth Industrial Revolution is having Publisher: Entegris Asia Editor: Françoise Moign a massive impact on IC manufacturing. Contact [email protected] for New technologies are requiring an permission to reproduce Zero Defects articles enormous numbers of chips and a Entegris, Inc. | Zero Defects | December 2018 INNOVATION Examining the Small, Medium, and Large of Automotive Latent Defects By Entegris Inc. Today, modern vehicles run on over 100 thousand lines of before they are installed in electronics packages that are, in turn digital code1, a number predicted to rise six-fold by 2025, installed into vehicles. and within just ten to twelve years electric and autonomous The cost of a failed chip at the semiconductor fab is relatively vehicles are projected to have about half their value in small (1X). If that chip passes through the packaging process onboard electronics. These are sobering facts when you and is identified in the process of burn-in, the cost of a failure consider that over thirty percent of today’s field failures are has risen to 10X the fab prevention cost. And if that faulty chip attributable to a vehicle’s electronics. makes it into the field and is installed in a vehicle before the Automotive recalls are not only damaging to a company’s problem surfaces, the cost can increase to an astronomical reputation but costly to the bottom line, making the impact 1000X the cost of eliminating or preventing the problem at of a corresponding rise in electronic-related recalls unsustain- the fab, not taking into consideration the potential threat to able. One issue that is a known risk to automotive electronics safety or life. is latent defects; failures that do not show up in testing at the semiconductor fab or in subsequent burn-in testing of a compo- TOWARDS A NEW COLLABORATIVE APPROACH nent package. These defects can develop over time, leading to Entegris proposes a New Collaborative Approach to examine failures that can result in safety hazards and expensive recalls. the role of chemical, air, and gas contamination in the formation of defects undiscovered in the semiconductor manufacturing TOWARDS THE PPB LEVEL process. Electronic defects are already a costly problem, but a number of factors could make them a much more significant problem in the future. The value of electronic components in vehicles is rising and largely attributable to digital control and comfort systems, advanced driver assistance systems (ADAS), and the continued development of fully autonomous vehicles. As vehicle cost increases, so does the expectation of “excellence” among buyers, as drivers and passengers become more reliant on embedded systems to guide and control their travels. With electronics increasingly incorporated into safety systems and with the advent of self-driving vehicles, electronic system failures can be potentially life-threatening. This will intensify demand for recalls when problems arise. And as the usage patterns of vehicles increases, there will be more time for costly latent defects to develop. According to Electroiq*, a typical vehicle today contains between 5000 and 8000 microchips (chips). A manufacturer producing 25,000 vehicles per day with a parts-per-million (PPM) chip failure rate may produce 125 vehicles per day with lurking chip Read the paper to learn more quality issues. If nothing changes, that number will multiply as www.entegris.com/automotive more electronics are added to vehicles. In order to overcome these challenges, chipmakers will need to find ways to either economically identify or prevent the creation of less reliable chips and remove them from the supply chain * Process Watch: The Automotive Problem with Semiconductors. Electroiq website. http://electroiq.com/blog/2018 /01/process- watch-the-automotiveproblem-withsemiconductors/ 2 Entegris, Inc. | Zero Defects | December 2018 COST REDUCTION Enriched 11Boron Trifluoride and Hydrogen Mixture for Performance Improvement on Applied Materials E-500 Implanter By Barry Chambers — Entegris, Inc.; Francisco E. Cruz Jr. — ABB Switzerland Ltd. 11 The following information was presented in a poster at the BF3 MIXTURE SELECTION 22nd International Conference on Ion Implantation. Below Entegris offers more than one mixture to allow a single cylinder is a summary highlighting key outcomes. solution that is tailored to customer needs. Supplying the ideal mixture ratio in a single cylinder not only offers simplicity in BACKGROUND use, it also removes the risk of a separate hydrogen cylinder The presence of fluorine in the ion source arc chamber allows and the risk associated with using two cylinders to accomplish fluorine radicals to be created in the ion plasma. Through what ® 11 the same benefit as a single VAC cylinder. The BF3/H2 mixture is known as the halogen cycle, these radicals etch the relatively gas is offered in the VAC package, which is a Subatmospheric cooler tungsten or molybdenum arc chamber, or the arc Gas Sources (SAGS) Type II gas delivery system. The cylinder chamber liner, and deposit the tungsten or molybdenum on the stores the gas mixture at a pressure greater than 500 psig, hotter filament in the ion source, increasing its mass. When the but delivers the mixture at a pressure of less than 14.7 psia. filament mass increases, the filament power supply cannot The chemical stability of BF3 and H2 in this mixture is one of sufficiently heat the filament. This limits the generation of the most important safety and functional characteristics of this electrons needed to sustain the ion source plasma. product. Thermodynamic calculations, as well as experimental The addition of hydrogen to halogen-based implant source evidence, show that no reaction occurs between BF3 and H2 at room or elevated temperatures as exemplified by the reaction gases, such as BF3, has been shown to effectively interrupt the halogen cycle. equation (1). BF3(g) + 1.5H2(g) = B(s) + 3HF(g) ΔrG25°C = 293 kJ (1) SOURCE LIFE For this reason, Entegris offers a 3 year shelf life on the The source life graph (Figure 1) shows an average life of 99 hours VAC 11BF /H . 11 11 3 2 with BF3. Once the BF3/H2 mixture was introduced, the average source life increased 111% to 209 hours (Figure 2).
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