Optimizing IC Test Via Machine Learning and Decision Theory
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Three-Dimensional Integrated Circuit Design: EDA, Design And
Integrated Circuits and Systems Series Editor Anantha Chandrakasan, Massachusetts Institute of Technology Cambridge, Massachusetts For other titles published in this series, go to http://www.springer.com/series/7236 Yuan Xie · Jason Cong · Sachin Sapatnekar Editors Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures 123 Editors Yuan Xie Jason Cong Department of Computer Science and Department of Computer Science Engineering University of California, Los Angeles Pennsylvania State University [email protected] [email protected] Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota [email protected] ISBN 978-1-4419-0783-7 e-ISBN 978-1-4419-0784-4 DOI 10.1007/978-1-4419-0784-4 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009939282 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Foreword We live in a time of great change. -
Smart Contracts for Machine-To-Machine Communication: Possibilities and Limitations
Smart Contracts for Machine-to-Machine Communication: Possibilities and Limitations Yuichi Hanada Luke Hsiao Philip Levis Stanford University Stanford University Stanford University [email protected] [email protected] [email protected] Abstract—Blockchain technologies, such as smart contracts, present a unique interface for machine-to-machine communication that provides a secure, append-only record that can be shared without trust and without a central administrator. We study the possibilities and limitations of using smart contracts for machine-to-machine communication by designing, implementing, and evaluating AGasP, an application for automated gasoline purchases. We find that using smart contracts allows us to directly address the challenges of transparency, longevity, and Figure 1. A traditional IoT application that stores a user’s credit card trust in IoT applications. However, real-world applications using information and is installed in a smart vehicle and smart gasoline pump. smart contracts must address their important trade-offs, such Before refueling, the vehicle and pump communicate directly using short-range as performance, privacy, and the challenge of ensuring they are wireless communication, such as Bluetooth, to identify the vehicle and pump written correctly. involved in the transaction. Then, the credit card stored by the cloud service Index Terms—Internet of Things, IoT, Machine-to-Machine is charged after the user refuels. Note that each piece of the application is Communication, Blockchain, Smart Contracts, Ethereum controlled by a single entity. I. INTRODUCTION centralized entity manages application state and communication protocols—they cannot function without the cloud services of The Internet of Things (IoT) refers broadly to interconnected their vendors [11], [12]. -
Recommendation to Handle Bare Dies
Recommendation to handle bare dies Rev. 1.3 General description This application note gives recommendations on how to handle bare dies* in Chip On Board (COB), Chip On Glass (COG) and flip chip technologies. Bare dies should not be handled as chips in a package. This document highlights some specific effects which could harm the quality and yield of the production. *separated piece(s) of semiconductor wafer that constitute(s) a discrete semiconductor or whole integrated circuit. International Electrotechnical Commission, IEC 62258-1, ed. 1.0 (2005-08). A dedicated vacuum pick up tool is used to manually move the die. Figure 1: Vacuum pick up tool and wrist-strap for ESD protection Delivery Forms Bare dies are delivered in the following forms: Figure 2: Unsawn wafer Application Note – Ref : APN001HBD1.3 FBC-0002-01 1 Recommendation to handle bare dies Rev. 1.3 Figure 3: Unsawn wafer in open wafer box for multi-wafer or single wafer The wafer is sawn. So please refer to the E-mapping file from wafer test (format: SINF, eg4k …) for good dies information, especially when it is picked from metal Film Frame Carrier (FFC). Figure 4: Wafer on Film Frame Carrier (FFC) Figure 5: Die on tape reel Figure 6: Waffle pack for bare die Application Note – Ref : APN001HBD1.3 FBC-0002-01 2 Recommendation to handle bare dies Rev. 1.3 Die Handling Bare die must be handled always in a class 1000 (ISO 6) clean room environment: unpacking and inspection, die bonding, wire bonding, molding, sealing. Handling must be reduced to the absolute minimum, un-necessary inspections or repacking tasks have to be avoided (assembled devices do not need to be handled in a clean room environment since the product is already well packed) Use of complete packing units (waffle pack, FFC, tape and reel) is recommended and remaining quantities have to be repacked immediately after any process (e.g. -
From Sand to Circuits
From sand to circuits By continually advancing silicon technology and moving the industry forward, we help empower people to do more. To enhance their knowledge. To strengthen their connections. To change the world. How Intel makes integrated circuit chips www.intel.com www.intel.com/museum Copyright © 2005Intel Corporation. All rights reserved. Intel, the Intel logo, Celeron, i386, i486, Intel Xeon, Itanium, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. 0605/TSM/LAI/HP/XK 308301-001US From sand to circuits Revolutionary They are small, about the size of a fingernail. Yet tiny silicon chips like the Intel® Pentium® 4 processor that you see here are changing the way people live, work, and play. This Intel® Pentium® 4 processor contains more than 50 million transistors. Today, silicon chips are everywhere — powering the Internet, enabling a revolution in mobile computing, automating factories, enhancing cell phones, and enriching home entertainment. Silicon is at the heart of an ever expanding, increasingly connected digital world. The task of making chips like these is no small feat. Intel’s manufacturing technology — the most advanced in the world — builds individual circuit lines 1,000 times thinner than a human hair on these slivers of silicon. The most sophisticated chip, a microprocessor, can contain hundreds of millions or even billions of transistors interconnected by fine wires made of copper. Each transistor acts as an on/off switch, controlling the flow of electricity through the chip to send, receive, and process information in a fraction of a second. -
Microscope Systems and Their Application in Machine Vision
Microscope Systems And Their Application in Machine Vision 1 1 Agenda • What is a microscope system? • Basic setup of a microscope • Differences to standard lenses • Parameters of microscope systems • Illumination options in a microscope setup • Special contrast enhancement techniques • Zoom components • Real-world examples What is a microscope systems? Greek: μικρός mikrós „small“; σκοπεῖν skopeín „observe“ Microscopes help us to look at small things, by enlarging them until we can see them with bare eyes or an image sensor. A microscope system is a system that consists of compatible components which can be combined into different configurations We only look at visible light microscopes We only look at digial microscopes no eyepiece but an image sensor in the object plane The optical magnification is ≥1 Basic setup of a microscope microscopes always show the same basic configuration: Sensor Tube lens: - Images onto the sensor - Defines the maximum sensor size Collimated beam path (infinity conjugated) Objective: - Images to infinity - Holds the system aperture - Defines the resolution of the system Object Differences to standard lenses microscope Finite-finite lens Sensor Sensor Collimated beam path (infinity conjugate) EnthältSystem apertureSystemblende Object Object Differences to standard lenses • Collimated beam path offers several options - Distance between objective and tube lens can be changed . Focusing by moving the objective without changing any optical parameter . Integration of filters, mirrors and beam splitters . Beam -
Second Machine Age Or Fifth Technological Revolution? Different
Second Machine Age or Fifth Technological Revolution? Different interpretations lead to different recommendations – Reflections on Erik Brynjolfsson and Andrew McAfee’s book The Second Machine Age (2014). Part 1 Introduction: the pitfalls of historical periodization Carlota Perez January 2017 Blog post: http://beyondthetechrevolution.com/blog/second-machine-age-or-fifth-technological- revolution/ This is the first instalment in a series of posts (and a Working Paper in progress) that reflect on aspects of Erik Brynjolfsson and Andrew McAfee’s influential book, The Second Machine Age (2014), in order to examine how different historical understandings of technological revolutions can influence policy recommendations in the present. Over the next few weeks, we will discuss the various criteria used for identifying a technological revolution, the nature of the current moment, and the different implications that stem from taking either the ‘machine ages’ or my ‘great surges’ point of view. We will look at what we see as the virtues and limits of Brynjolfsson and McAfee’s policy proposals, and why implementing policies appropriate to the stage of development of any technological revolution have been crucial to unleashing ‘Golden Ages’ in the past. 1 Introduction: the pitfalls of historical periodization Information technology has been such an obvious disrupter and game changer across our societies and economies that the past few years have seen a great revival of the notion of ‘technological revolutions’. Preparing for the next industrial revolution was the theme of the World Economic Forum at Davos in 2016; the European Union (EU) has strategies in place to cope with the changes that the current ‘revolution’ is bringing. -
The History of Computing in the History of Technology
The History of Computing in the History of Technology Michael S. Mahoney Program in History of Science Princeton University, Princeton, NJ (Annals of the History of Computing 10(1988), 113-125) After surveying the current state of the literature in the history of computing, this paper discusses some of the major issues addressed by recent work in the history of technology. It suggests aspects of the development of computing which are pertinent to those issues and hence for which that recent work could provide models of historical analysis. As a new scientific technology with unique features, computing in turn can provide new perspectives on the history of technology. Introduction record-keeping by a new industry of data processing. As a primary vehicle of Since World War II 'information' has emerged communication over both space and t ime, it as a fundamental scientific and technological has come to form the core of modern concept applied to phenomena ranging from information technolo gy. What the black holes to DNA, from the organization of English-speaking world refers to as "computer cells to the processes of human thought, and science" is known to the rest of western from the management of corporations to the Europe as informatique (or Informatik or allocation of global resources. In addition to informatica). Much of the concern over reshaping established disciplines, it has information as a commodity and as a natural stimulated the formation of a panoply of new resource derives from the computer and from subjects and areas of inquiry concerned with computer-based communications technolo gy. -
Summarizing CPU and GPU Design Trends with Product Data
Summarizing CPU and GPU Design Trends with Product Data Yifan Sun, Nicolas Bohm Agostini, Shi Dong, and David Kaeli Northeastern University Email: fyifansun, agostini, shidong, [email protected] Abstract—Moore’s Law and Dennard Scaling have guided the products. Equipped with this data, we answer the following semiconductor industry for the past few decades. Recently, both questions: laws have faced validity challenges as transistor sizes approach • Are Moore’s Law and Dennard Scaling still valid? If so, the practical limits of physics. We are interested in testing the validity of these laws and reflect on the reasons responsible. In what are the factors that keep the laws valid? this work, we collect data of more than 4000 publicly-available • Do GPUs still have computing power advantages over CPU and GPU products. We find that transistor scaling remains CPUs? Is the computing capability gap between CPUs critical in keeping the laws valid. However, architectural solutions and GPUs getting larger? have become increasingly important and will play a larger role • What factors drive performance improvements in GPUs? in the future. We observe that GPUs consistently deliver higher performance than CPUs. GPU performance continues to rise II. METHODOLOGY because of increases in GPU frequency, improvements in the thermal design power (TDP), and growth in die size. But we We have collected data for all CPU and GPU products (to also see the ratio of GPU to CPU performance moving closer to our best knowledge) that have been released by Intel, AMD parity, thanks to new SIMD extensions on CPUs and increased (including the former ATI GPUs)1, and NVIDIA since January CPU core counts. -
Reverse Engineering Integrated Circuits Using Finite State Machine Analysis
Proceedings of the 50th Hawaii International Conference on System Sciences | 2017 Reverse Engineering Integrated Circuits Using Finite State Machine Analysis Jessica Smithy, Kiri Oler∗, Carl Miller∗, David Manz∗ ∗Pacific Northwest National Laboratory Email: fi[email protected] yWashington State University Email: [email protected] Abstract are expensive and time consumptive but extremely accurate. Due to the lack of a secure supply chain, it is not possible Alternatively, there are a variety of non-destructive imaging to fully trust the integrity of electronic devices. Current methods for determining if an unknown IC is different from methods of verifying integrated circuits are either destruc- an ’assumed-good’ benchmark IC. However, these methods tive or non-specific. Here we expand upon prior work, in often only work for large or active differences, and are which we proposed a novel method of reverse engineering based on the assumption that the benchmark chip has not the finite state machines that integrated circuits are built been corrupted. What is needed, and what we will detail upon in a non-destructive and highly specific manner. In in the following sections, is an algorithm to enable a fast, this paper, we present a methodology for reverse engineering non-destructive method of reverse engineering ICs to ensure integrated circuits, including a mathematical verification of their veracity. We must assume the worst case scenario in a scalable algorithm used to generate minimal finite state which we have no prior knowledge, no design documents, machine representations of integrated circuits. no labeling, or an out-of-production IC. The mathematical theory behind our approach is pre- 1. -
ERC Machine Shop Operational Policy
College of Engineering --- Colorado State University Machine Shop Operational Policy Engineering Research Center November 2011 Table of Contents 1.0 Introduction and Context ................................................................................................................... - 1 - 1.1 Purpose ........................................................................................................................................... - 1 - 1.2 Introduction .................................................................................................................................... - 1 - 1.3 Contact Information ....................................................................................................................... - 1 - 2.0 Safety: Rules, Procedures and Guidelines ......................................................................................... - 1 - 2.1 General Shop Safety Rules and Conduct: ...................................................................................... - 1 - 2.2 Personal Protective Equipment (Eyes, Ears, Respiration, Body, Hands) ...................................... - 3 - 2.2.1. Protective Clothing ................................................................................................................. - 3 - 2.2.2 Eye Protection ......................................................................................................................... - 3 - 2.2.3 Protective Gloves ................................................................................................................... -
The Impact of the Technological Revolution on Labour Markets and Income Distribution
Department of Economic & Social Affairs FRONTIER ISSUES 31 JULY 2017 The impact of the technological revolution on labour markets and income distribution CONTENTS Executive Summary .................................................... 1 1. Introduction ....................................................... 3 2. A new technological revolution? ....................................... 4 A. Technological progress and revolutions ............................. 4 B. Economic potential of the new technological breakthroughs ............. 7 3. Long term and recent trends .......................................... 8 A. Productivity trends .............................................. 8 B. Sectoral employment shifts and work conditions ..................... 11 C. Income inequality .............................................. 14 4. How does technological innovation affect labour markets and inequality? ..... 17 A. Job destruction and job creation ................................. 17 B. Occupational shifts, job polarization and wage inequality .............. 20 C. Technology and globalization .................................... 21 D. Technology and market structures. .22 E. Technology and the organization of work ........................... 23 F. Technology and the informal sector ............................... 23 G. Technology and female labour force participation .................... 24 5. Looking ahead: What will technology mean for labour and inequality? ........ 26 A. The future of technological progress ............................... 26 -
The Machine That Changed the World
Leggi e ascolta. The machine that changed the world Between the late 1700s and the late 1800s, factories, machines and hundreds of new inventions changed the lives of millions of people. Today we call this time the Industrial Revolution – and the energy for that revolution came from one important invention: the Watt Steam Engine. Before the Industrial Revolution, most machines were a few simple parts – and they needed animals, wind or water to move them. At the time, people made everything by hand – from furniture and clothes to houses and ships. Then, in May 1765, a young Scottish engineer called James Watt invented a new type of steam engine. It quickly changed the world. High Five Exam Trainer . Oral presentation 13, CLIL History p. 64 © Oxford University Press PHOTOCOPIABLE A steam engine burns coal to heat water and to change it into steam. Then the hot steam moves the parts of the engine. Watt’s Steam Engine was much more efficient than the first steam engines – it used less coal and it could produce enough energy to move big, heavy machines. It could also work faster, and it could turn a wheel. This was important because people could use it to move the parts of machines in factories. Soon, new factories appeared all over Britain. At the same time, people invented new factory machines to make lots of different products. These factories needed new workers, so millions of people left their villages and went to work in the towns. Some factory towns quickly developed into big cities. Other engineers later changed the design of Watt’s Steam Engine.