Poster Session

CONTENTS WELCOME FROM THE GENERAL CHAIR ................................................................................1 CONFERENCE ORGANIZERS......................................................................................................2 CONFERENCE CHAIRS.................................................................................................................3 ADVISORY COMMITTEE .............................................................................................................3 SECRETARY GENERAL ................................................................................................................4 ORGANIZING COMMITTEE.........................................................................................................4 TECHNICAL COMMITTEE ...........................................................................................................4 Session 1 -- Advanced Packaging & System Integration ............................................................5 Session 2 -- Packaging Materials & Processes............................................................................5 Session 3 -- Packaging Design & Modeling................................................................................6 Session 4 -- High Density Substrate & SMT...............................................................................6 Session 5 -- Advanced Manufacturing & Packaging Equipment ................................................7 Session 6 -- Quality & Reliability ...............................................................................................7 Session 7 -- Solid State Lighting Packaging and Integration ......................................................8 Session 8 -- Emerging Technologies ...........................................................................................8 Poster Session..............................................................................................................................8 OVERVIEW OF CONFERENCE PROGRAM ...............................................................................9 OVERVIEW OF PROFESSIONAL DEVELOPMENT COURSE................................................10 Monday, August 8, 2011 .......................................................................................................................10 Introduction of PDC Lecturers ..................................................................................................10 OVERVIEW OF TSV / ITRS FORUM ..........................................................................................12 Monday, August 8, 2011 .......................................................................................................................12 Introduction of TSV Forum Speakers .......................................................................................13 Introduction of ITRS .................................................................................................................13 OVERVIEW OF INVITED PLENARY KEYNOTES ...................................................................14 Tuesday, August 9, 2011 .......................................................................................................................14 Introduction of Invited Plenary Keynote Speakers ...................................................................14 OVERVIEW OF INVITED SESSION KEYNOTES.....................................................................17 Wednesday, August 10, 2011 ................................................................................................................17 Thursday, August 11, 2011....................................................................................................................18 Introduction of Invited Session Keynote Speakers ...................................................................18 i OVERVIEW OF ORAL PRESENTATION SESSIONS ................................................................21 Wednesday, August 10, 2011 ................................................................................................................21 Thursday, August 11, 2011....................................................................................................................22 ORAL SESSIONS ..........................................................................................................................23 Wednesday, August 10, 8:00AM – 9:20AM .........................................................................................23 Wednesday, August 10, 10:20AM – 12:10PM......................................................................................24 Wednesday, August 10, 13:10PM – 14:50PM.......................................................................................26 Wednesday, August 10, 15:50PM – 17:30PM.......................................................................................27 Thursday, August 11, 8:00AM – 9:20AM.............................................................................................29 Thursday, August 11, 10:20AM – 12:10PM .........................................................................................30 OVERVIEW OF POSTER PRESENTATION SESSIONS............................................................32 Poster Session 1 – August 10, Wednesday 09:20AM--10:20AM .........................................................32 Poster Session 2 – August 10, Wednesday 14:50PM--15:50PM...........................................................32 Poster Session 3 – August 11, Thursday 9:20AM--10:20AM...............................................................32 POSTER SESSION 1 .....................................................................................................................33 Wednesday, August 10, 9:20AM – 10:20AM .......................................................................................33 POSTER SESSION 2 .....................................................................................................................36 Wednesday, August10, 14:50PM – 15:50PM........................................................................................36 POSTER SESSION 3 .....................................................................................................................39 Thursday, August 11, 9:20AM – 10:20AM...........................................................................................39 CONFERENCE GUIDELINE........................................................................................................42 TRANSPORTATION......................................................................................................................44 TRANSPORTATION MAP ............................................................................................................45 LAYOUT OF CONFERENCE MEETING ROOMS.....................................................................46 ii WELCOME FROM THE GENERAL CHAIR Started in 1994, the International Conference on Electronic Packaging Technology (ICEPT), sponsored by Electronics Manufacturing and Packaging Technology Society (EMPT), under the leadership of Chinese Institute of Electronics (CIE), has been holding 11 times in Beijing, Shanghai, Shenzhen and Xi’an. This international conference provides a communication platform for experts, researchers, engineers from industry and academy, to exchange the new ideas and emerging technologies on electronics packaging. ICEPT-HDP 2011, organized by Shanghai University and co-organized by ASTRI, Hong Kong, China, will be held in Shanghai from August 8 to 11, 2011. More than 320 abstracts were received and approx. 280 papers were accepted for oral and poster presentation. On behalf of the conference organizers, I would like to express our sincere welcome and thanks to our guests, authors and delegates from more than 20 countries and regions, we look forward to meeting with you in Shanghai. China’s semiconductor industry was initiated in 1956 by the National Science & Technology Program. With the 50 years’ development, it becomes the pillar industry of China. Nowadays, there are over 1000 companies in the semiconductor industry, among them over 250 companies’ key businesses are related to electronics packaging. In 2010, the IC units shipment was approx. 65 billion with the sales revenues of approx. RMB 144 billion, while the discrete units shipment was approx. 274 billion with the sales revenues of approx. RMB 100 billion. Over the decades, 6 key semiconductor industrial bases were established, including Yangtze River Delta, Pearl River Delta, Around Bohai Gulf Area, Midwest Region, Old Industrial Base of Northeast China, Guanzhong – Tianshui Economic Zone. This year is the first year of China’s 12th Five-Year-Plan, four industrial policies, e.g., electronics production promotion, were launched, creating new opportunities to this industry. In order to narrow the technology gap between China and the western developed countries, China packaging industry has to highly focus on the development of the advanced packaging technologies, such as TSV, SiP, WLP, FC, 3D integration, etc.. We wish this conference will be a good communication platform for all the participants to exchange novel ideas, explore new collaborations and promote the global electronics packaging industry to face the historical challenge and opportunity. Also, we hope this conference can enhance the long-term relationship and close collaboration on the electronics packaging between EMPT and other international organizations,

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