CONTENTS

WELCOME FROM THE GENERAL CHAIR ...... 1 CONFERENCE ORGANIZERS...... 2 CONFERENCE CHAIRS...... 3 ADVISORY COMMITTEE ...... 3 SECRETARY GENERAL ...... 4 ORGANIZING COMMITTEE...... 4 TECHNICAL COMMITTEE ...... 4 Session 1 -- Advanced Packaging & System Integration ...... 5 Session 2 -- Packaging Materials & Processes...... 5 Session 3 -- Packaging Design & Modeling...... 6 Session 4 -- High Density Substrate & SMT...... 6 Session 5 -- Advanced Manufacturing & Packaging Equipment ...... 7 Session 6 -- Quality & Reliability ...... 7 Session 7 -- Solid State Lighting Packaging and Integration ...... 8 Session 8 -- Emerging Technologies ...... 8 Poster Session...... 8 OVERVIEW OF CONFERENCE PROGRAM ...... 9 OVERVIEW OF PROFESSIONAL DEVELOPMENT COURSE...... 10 Monday, August 8, 2011 ...... 10 Introduction of PDC Lecturers ...... 10 OVERVIEW OF TSV / ITRS FORUM ...... 12 Monday, August 8, 2011 ...... 12 Introduction of TSV Forum Speakers ...... 13 Introduction of ITRS ...... 13 OVERVIEW OF INVITED PLENARY KEYNOTES ...... 14 Tuesday, August 9, 2011 ...... 14 Introduction of Invited Plenary Keynote Speakers ...... 14 OVERVIEW OF INVITED SESSION KEYNOTES...... 17 Wednesday, August 10, 2011 ...... 17 Thursday, August 11, 2011...... 18 Introduction of Invited Session Keynote Speakers ...... 18 i OVERVIEW OF ORAL PRESENTATION SESSIONS ...... 21 Wednesday, August 10, 2011 ...... 21 Thursday, August 11, 2011...... 22 ORAL SESSIONS ...... 23 Wednesday, August 10, 8:00AM – 9:20AM ...... 23 Wednesday, August 10, 10:20AM – 12:10PM...... 24 Wednesday, August 10, 13:10PM – 14:50PM...... 26 Wednesday, August 10, 15:50PM – 17:30PM...... 27 Thursday, August 11, 8:00AM – 9:20AM...... 29 Thursday, August 11, 10:20AM – 12:10PM ...... 30 OVERVIEW OF POSTER PRESENTATION SESSIONS...... 32 Poster Session 1 – August 10, Wednesday 09:20AM--10:20AM ...... 32 Poster Session 2 – August 10, Wednesday 14:50PM--15:50PM...... 32 Poster Session 3 – August 11, Thursday 9:20AM--10:20AM...... 32 POSTER SESSION 1 ...... 33 Wednesday, August 10, 9:20AM – 10:20AM ...... 33 POSTER SESSION 2 ...... 36 Wednesday, August10, 14:50PM – 15:50PM...... 36 POSTER SESSION 3 ...... 39 Thursday, August 11, 9:20AM – 10:20AM...... 39 CONFERENCE GUIDELINE...... 42 TRANSPORTATION...... 44 TRANSPORTATION MAP ...... 45 LAYOUT OF CONFERENCE MEETING ROOMS...... 46

ii WELCOME FROM THE GENERAL CHAIR

Started in 1994, the International Conference on Electronic Packaging Technology (ICEPT), sponsored by Electronics Manufacturing and Packaging Technology Society (EMPT), under the leadership of Chinese Institute of Electronics (CIE), has been holding 11 times in Beijing, Shanghai, Shenzhen and Xi’an. This international conference provides a communication platform for experts, researchers, engineers from industry and academy, to exchange the new ideas and emerging technologies on electronics packaging. ICEPT-HDP 2011, organized by Shanghai University and co-organized by ASTRI, Hong Kong, China, will be held in Shanghai from August 8 to 11, 2011. More than 320 abstracts were received and approx. 280 papers were accepted for oral and poster presentation. On behalf of the conference organizers, I would like to express our sincere welcome and thanks to our guests, authors and delegates from more than 20 countries and regions, we look forward to meeting with you in Shanghai. China’s semiconductor industry was initiated in 1956 by the National Science & Technology Program. With the 50 years’ development, it becomes the pillar industry of China. Nowadays, there are over 1000 companies in the semiconductor industry, among them over 250 companies’ key businesses are related to electronics packaging. In 2010, the IC units shipment was approx. 65 billion with the sales revenues of approx. RMB 144 billion, while the discrete units shipment was approx. 274 billion with the sales revenues of approx. RMB 100 billion. Over the decades, 6 key semiconductor industrial bases were established, including Yangtze River Delta, Pearl River Delta, Around Bohai Gulf Area, Midwest Region, Old Industrial Base of Northeast China, Guanzhong – Tianshui Economic Zone. This year is the first year of China’s 12th Five-Year-Plan, four industrial policies, e.g., electronics production promotion, were launched, creating new opportunities to this industry. In order to narrow the technology gap between China and the western developed countries, China packaging industry has to highly focus on the development of the advanced packaging technologies, such as TSV, SiP, WLP, FC, 3D integration, etc.. We wish this conference will be a good communication platform for all the participants to exchange novel ideas, explore new collaborations and promote the global electronics packaging industry to face the historical challenge and opportunity. Also, we hope this conference can enhance the long-term relationship and close collaboration on the electronics packaging between EMPT and other international organizations, such as IEEE-CPMT, IMAPS, iNEMI, ECTC, ESTC and EPTC. Lastly, we are pleased to inform you that the ICEPT-HDP 2012 will be held in Guilin, China, we look forward to seeing you in Shanghai this August and in Guilin next year.

Prof. Keyun BI, General Chair of ICEPT-HDP 2011

1 CONFERENCE ORGANIZERS（会议组织结构）

Directed by 会议指导单位 Department of Higher Education, Ministry of Education, 中华人民共和国教育部高等教育司 China

Department of Telecommunication, Ministry of Industry 中华人民共和国工业和信息化部电子信息司 and Information Technology, China

China International Culture Exchange Center, China 中国国际文化交流中心

Science and Technology Commission of Shanghai 上海市科学技术委员会 Municipality, China

Sponsored by 会议主办单位 Chinese Institute of Electronics, China 中国电子学会

IEEE Component, Packaging, &Manufacturing 国际电气电子工程师联合会电子元件封装和生产技术 Technology Society (IEEE-CPMT) 学会

Organized by 会议承办单位 Electronic Manufacturing & Packaging Technology 中国电子学会电子制造与封装技术分会 Society of the Chinese Institute of Electronics, China

Shanghai University, China 上海大学

Co-organized by 会议协办单位 Key Laboratory of Advanced Display and System 新型显示及应用集成教育部重点实验室（上海大学） Applications of Ministry of Education, Shanghai University, China

Shanghai R&D Public Service Platform for Advanced 上海市新型显示设计制造与系统集成专业技术服务平 display Design, Manufacturing and System Integration 台

Applied Science & Technology Research Institute 中国香港特别行政区香港应用科技研究院 (ASTRI), Hong Kong, China

Beijing Faith Consulting Co., Ltd., China 北京菲尔斯信息咨询有限公司

2 CONFERENCE CHAIRS（大会主席） General Chair Keyun BI Director of China Institute of Electronics (CIE), China President of Electronics Manufacturing & Packaging

Technology Society (EMPT), CIE, China President of Electronics Packaging Society, CSIA, China Co-chairs Min WANG Vice President, Shanghai University, China Rolf ASCHENBRENNER President of IEEE-CPMT, USA Deputy Director of IZM, Fraunhofer, Germany William T. CHEN Former President of IEEE-CPMT Senior Director of ASE, USA Kouchi ZHANG Senior Director and Fellow of Philips Lighting Prof. of Delft University of Technology, Netherlands

ADVISORY COMMITTEE（顾问委员会） Shichang ZOU Academician of CAS; President of Shanghai Integrated Circuit Industry Association, China Juyan XU Academician of CAE; Honorary Director of No. 58 Institute of CETC, China C. P. WONG Dean of School of Eng., CUHK, Hong Kong, China Prof. of Georgia Institute of Technology, USA Rao TUMMALA Pettit Chair Prof. & Director of Packaging Research Center, Georgia Institute of Technology, USA Michael PECHT Director of CALCE, Prof. of Univ. of Maryland, USA James MORRIS Prof. of Portland State University, USA Johan LIU Prof. of Shanghai University, China; Prof. of Chalmers Univ. of Science & Technology, Sweden; Member of Royal Swedish Academy of Engineering, Sweden Xuejun FAN Prof. of Lamar University, USA Tadatomo SUGA Prof. of University of Tokyo, Japan Guoqiang DAI Deputy Director, Ministry of Science & Technology of the People’s Republic of China Wenwu DING Deputy Director, Ministry of Industry and Information Technology of the People’s Republic of China Rulin LIU General Executive Director of CIE, China Shouwen YU Former Vice President of Tsinghua University, China Yintang YANG Vice President of Xidian University, China Tianchun YE General Director of IME, CAS, China Dongkai SHANGGUAN Vice President, Flextronics International, USA Ricky S. W. LEE Prof. of HKUST, Hong Kong, China Kees BEENAKKER Director, Delft University of Technology, Netherlands Roger HOSKENS Director, Philips Lighting, Netherlands Jusheng MA Prof. of Tsinghua University, China 3 Yifan GUO R&D Director, Skyworks, USA Jie XUE Director, Cisco Systems Inc., USA Kuoning CHIANG Prof. of National Tsinghua University, Taiwan, China Ephraim SUHIR Prof. of University of California, USA Moowhan SHIN Prof. of Myongji University, Republic of Korea

SECRETARY GENERAL（大会秘书长） Xicheng WEI Prof. of Shanghai University, China Qing LI EMPT, CIE, China

ORGANIZING COMMITTEE（组织委员会） Chair Jianhua ZHANG Shanghai University, China Co-chairs Xiang WU CETC, China Lixi WAN Institute of Microelectronics, CAS, China Bill LI JCAP, China Ming LI Shanghai JiaoTong University, China Chunqing WANG Harbin Institute of Technology, China Yiping WU Huazhong University of Science & Technology, China James CAI Tsinghua University, China Fei XIAO Fudan University, China Xingsheng LIU Xi’an Institute of Optics & Precision Mechanics,China Tim CHEN YanTai Darbond Electronics Materials Co., Ltd, China Hao TANG Nantong Fujitsu Microelectronics Co., Ltd, China Secretary Xingzao HUANG Beijing Faith Consulting Co., Ltd, China Gang HUANG Beijing Faith Consulting Co., Ltd, China Zhen LI EMPT, CIE, China Yan ZHANG Shanghai University, China

TECHNICAL COMMITTEE（技术委员会） Chair Dr. Daniel SHI R&D Director, ASTRI, Hong Kong, China Co-chairs Prof. Jianhua ZHANG Shanghai University, China Dr. Andy TSENG ASE, USA Prof. Chris BAILEY University of Greenwich, UK Mr. T. ONISHI GJ Tech, HK, China Dr. TongYan TEE Deputy R&D Director, Nepes, Singapore Prof. Sheng LIU Huazhong University of Science & Technology, China Dr. Chiming LAI JCAP, China

4 Chiar for PDC & Forum Wenhui ZHU CTO, TSHT, China Secretary Jinsong ZHANG Shanghai University, China Ms. Tina YANG ASTRI, Hong Kong, China Xiuzheng LU Shanghai University, China Yang LIN Shanghai University, China

Session 1 -- Advanced Packaging & System Integration Chairs Dr. Lixi WAN IMECAS, China Dr. Bing DANG IBM, USA Members Prof. Yufeng JIN Peking University, China Prof. GS KIM Kangnam University, Republic of Korea Dr. Yishao LAI ASE, Taiwan, China Dr. Shan LEI IBM, USA Prof. Gang DONG Xidian University, China Dr. Wei LIN Amkor, USA Dr. Charlie LU Altera, Taiwan,, China Dr. Klaus PRESSEL Infineon, Germany Dr. Ivan SHAM ASTRI, Hong Kong, China Dr. Cheng YANG Intel, China Dr. Charlie ZHAI Nvidia, USA Dr. Herb HUANG SMIC, China Dr. Daniel YU WLCSP, China Dr. Robert LO ITRI, Taiwan, China Dr. Yann GUILLOU ST, France Dr. Boping WU Intel, USA

Session 2 -- Packaging Materials & Processes Chairs Prof. Ming LI Shanghai Jiaotong University, China Dr. Jerry LU Intel, USA Members Dr. Kejun ZENG TI, USA Dr. Daniel LU Henkel, China Prof. Liangliang LI Tsinghua University, China Dr. Xinyu DU Henkel, USA Prof. Zhong CHEN Nanyang Technological University, Singapore Prof. Guoyuan LI South China University of Technology, China Prof. Guangbin DOU Imperial College of London, UK Prof. Jeng-Gong DUH Tsinghua University, Tai Wan, China Prof. Anmin HU Shanghai Jiaotong University, China Prof. Changqing LIU Loughborough University, UK 5 Prof. Young-Bae PARK Andong National University, Republic of Korea Prof. Yanhong TIAN Harbin Institute of Technology, China Mr. Itsuo WATANABE Hitachi Chemicals, Japan Dr. Rong SUN SIAT, China Mr. Su WANG Sinyang, China Dr. Hengyun ZHANG Dowcorning, China Dr. Hong Meng HO SemiWire, Singapore Prof. Xicheng WEI Shanghai University, China

Session 3 -- Packaging Design & Modeling Chairs Prof. Fei QIN Beijing University of Technology, China Dr. Wenhui ZHU CTO, TSHT, China Members Dr. Yong LIU Fairchild, USA Dr. Juergen AUERSPERG IZM, Germany Dr. Zhongping BAO Qualcomm, USA Dr. Willem van DRIEL NXP, Netherlands Prof. Haibo FAN HKUST, Hong Kong, China Dr. Jingen LUAN ST, Singapore Dr. Heinz PAPE Infineon, Germany Dr. Lianxi SHEN Nvidia, USA Dr. Bin XIE ASTRI, China Dr. Hongfei YAN Intel, USA Dr. Xiaohu YAO South China University of Technology, China Dr. Xiaowu ZHANG IME, Singapore Dr. Jeff ZHAO TI, USA Dr. Jiangtao ZHENG IBM, USA Dr. Jack HU Wuhan University, China Dr. Wenchao Tian Xidian University, China Mr. Barry BAI 3DS, China Dr. Sommer Fraunhofer, Germany Dr. Xiujuan ZHAO Philips, Netherlands Prof. Hua LU Greenwich University, UK Dr. Yan ZHANG Shanghai University, China Prof. Xinping ZHANG South China University of Technology, China Dr. Qing ZHOU Intel, china

Session 4 -- High Density Substrate & SMT Chairs Dr. Paul WANG Mitac, Tai Wan, China Prof. Mingyu LI Harbin Institute of Technology, China Members Dr. C.Q. CUI Compass Technology, China Prof. Mingliang HUANG Dalian University of Technology, China 6 Prof. Yuming WANG Tsinghua University, China Dr. Jianhua WU Anadigics, USA Dr. Hong XIE Intel, USA Dr. Youzhi XU Intel, USA Prof. K.C. YUNG HKUST, Hong Kong, China Dr. Xiangyin ZENG LSI, China Dr. Youhong WU Ibiden, Japan

Session 5 -- Advanced Manufacturing & Packaging Equipment Chairs Mr. KH Tan JCAP, China Dr. Chang ZHOU SMEE, China Members Dr. Li-Qiang CAO IMECAS, China Dr. Guohua GAO Fujitsu-NT, China Dr. Edward FENG Linde Gas, China Prof. Xuefeng SHU Taiyuan University of Technology, China Dr. James-Jian ZHANG Numonyx, USA Mr. Hai WU Intel, China Dr. Hong WANG Sinyang, China Dr. Li GONG SUSS, China Prof. Fuliang WANG Central South University, China

Session 6 -- Quality & Reliability Chairs Prof. Daoguo YANG Guilin University of Electronic Technology, China Prof. Chris BAILEY University of Greenwich, UK Members Prof. Chunqing Wang Harbin Institute of Technology, China Dr. Xiuzhen LU Shanghai University, China Prof. Dongyan DING Shanghai Jiaotong University, China Prof. H.C. CHENG Feng Chia University, Tai Wan, China Dr. Klaus GALUSCHKI Siemens Limited China Dr. Zezhong FU Intel, China Prof. Fu GUO Beijing University of Technology, China Dr. Dongming HE Intel, USA Prof. B.T. HAN University of Maryland, USA Dr. Xingjia HUANG Intel, China Dr. Xiaohu LIU IBM, USA Dr. Keith NEWMAN Sun Microsystems, USA Prof. Jun WANG Fudan University, China Dr. Dongji XIE Flextronics, USA Dr. Zhen ZHANG Microsoft, USA Dr. Liping ZHU TriQuint, USA Ms. Gieven DAI Intel, China 7 Mr. Jeffrey LEE IST, Tai Wan, China Dr. Ming XUE Infineon, Singapore

Session 7 -- Solid State Lighting Packaging and Integration Chairs Prof. Sheng LIU Huazhong University of Science & Technology, China Mr. T. ONISHI GJ Tech, Hong Kong, China Dr. ReintsBok Aernout Philips Innovation Campus Shanghai, Netherlands Members Mr. Chunjian FENG Hebei Semi. RI, China Prof. Xu CHEN Tianjin University, China Prof. Yuhua CHENG PKU-SHRIME, China Prof. Ricky LEE HKUST, Hong Kong, China Dr. Ming LI ASM, Hong Kong, China Prof. Peng JIN Shenzhen Graduate School of Peking Univ., China Mr. Lebbai MOHAMED Philiphs, Singapore Dr. Lianqiao YANG Shanghai University, China Dr. Weiqiao Yang Shanghai Solid State Lighting Center, China

Session 8 -- Emerging Technologies Chairs Prof. James CAI Tsinghua University, China Dr. Andy TSENG ASE, USA Members Prof. Jim LEU Chiao Tung University, Tai Wan, China Prof. Jintang SHANG Southeast University, China Prof. K. SUGANUMA Osaka University, Japan Dr. Yinghui WANG Tokyo University, Japan Dr. Zhenfeng WANG SIMTech, Singapore Dr. Tieyu ZHENG Intel, USA Prof. Le LUO CAS, China Prof. Yiping WU Huazhong University of Science & Technology, China Prof. Changhai Wang Heriot-Watt University, UK

Poster Session Chairs Dr. Jinsong ZHANG Shanghai University, China Dr. Xiuzhen LU Shanghai University, China

8 OVERVIEW OF CONFERENCE PROGRAM（会议议程总览） Date Time Room 1 Room 2 Room 3 08:30--12:30 PDC-1 PDC-3 -- 12:30--13:30 Lunch (for PDC only) Aug. 8 13:30--17:30 PDC-2 PDC-4 -- 13:00--17:30 -- -- TSV / ITRS Forum 18:00--20:00 Dinner Date Time Multifunctional Hall Chair 08:30--09:30 Opening Ceremony Prof. Song WU, Vice President of Shanghai University, China 09:30--10:40 Plenary Session A (2 Plenary Keynotes) Dr. William CHEN, Senior Director of ASE, USA 10:40--11:10 Coffee Break 11:10--12:20 Plenary Session A (2 Plenary Keynotes) Dr. William CHEN, Senior Director of ASE, USA 12:20--13:30 Lunch Aug. 9 Prof. Johan LIU, Shanghai University, China; University of 13:30--15:15 Plenary Session B (3 Plenary Keynotes) Science & Technology, Sweden 15:15--15:45 Coffee Break 15:45--18:05 Plenary Session B (4 Plenary Keynotes) Prof. Xuejun FAN, Lamar University, USA 18:30--20:30 Banquet Date Time Room 1 Room 2 Room 3 Room 4 Room 5 Oral Session 1 Oral Session 2 Oral Session 3 Oral Session 4 Oral Session 5 08:00--09:20 (4 papers) (4 papers) (4 papers) (4 papers) (4 papers) Poster Session 1, Exhibition & Coffee Break 09:20--10:20 (53 posters for this time slot) Oral Session 6 Oral Session 7 Oral Session 8 Oral Session 9 Oral Session 10 10:20--12:10 (1 invited talk (1 invited talk (1 invited talk (1 invited talk (1 invited talk +4 papers) +4 papers) +4 papers) +4 papers) +4 papers) 12:10--13:10 Lunch Aug. 10 Oral Session 11 Oral Session 12 Oral Session 13 Oral Session 14 Oral Session 15 13:10--14:50 (5 papers) (5 papers) (5 papers) (5 papers) (5 papers) Poster Session 2, Exhibition & Coffee Break 14:50--15:50 (55 posters for this time slot) Oral Session 16 Oral Session 17 Oral Session 18 Oral Session 19 Oral Session 20 15:50--17:30 (1 invited talk (1 invited talk (1 invited talk (5 papers) (5 papers) +3 papers) +3 papers) +3 papers) 18:00--20:00 Dinner Date Time Room 1 Room 2 Room 3 Room 4 Room 5 Oral Session 21 Oral Session 22 Oral Session 23 Oral Session 24 Oral Session 25 08:00--09:20 (4 papers) (4 papers) (4 papers) (4 papers) (4 papers) Poster Session 3, Exhibition & Coffee Break 09:20--10:20 (52 posters for this time slot) Aug. 11 Oral Session 26 Oral Session 27 Oral Session 28 Oral Session 29 Oral Session 30 10:20--12:10 (1 invited talk (1 invited talk (1 invited talk (1 invited talk (1 invited talk +4 papers) +4 papers) +4 papers) +4 papers) +4 papers) 12:10--13:40 Lunch and Awards 13:40--15:00 Technical Forum

9 OVERVIEW OF PROFESSIONAL DEVELOPMENT COURSE Monday, August 8, 2011 Venue Time Topic Speaker Prof. Bill CHEN PDC-1 Tsinghua University, China 08:30--12:30 Signal Integrity and Power Integrity Design for Advanced Electronic Packaging Dr. Jiangqi HE Intel,USA Room 1 12:30--13:30 Lunch

PDC-2 Dr. Yong LIU Fairchild, USA 13:30--17:30 Thermo-mechanical Modeling & Simulation of Prof. Sheng LIU Electronics Packaging & Its Applications HUST, China PDC-3 Dr. Ningcheng LEE Achieving High Reliability of Lead-free Indium,USA 8:30--12:30 Soldering and Flip Chip 3D/TSV Packaging & Dr. Tim CHEN Materials Consideration Darbond, China Room 2 12:30--13:30 Lunch Dr. Tong Yan TEE PDC-4 Nepes, Singapore 13:30--17:30 Wafer Level Package – Design for Reliability & Advanced Failure Analysis Mr. Ming XUE Infineon, Singapore

Introduction of PDC Lecturers Prof. Bill CHEN Tsinghua University, China Dr. Bill Chen is a professor and the head of Department of Information Technology of Yangtze Delta Region Institute of Tsinghua University, Zhejiang. He received his BS and MS degrees from Tsinghua University, China, in 1990 and 1993 respectively, and his PhD from Texas A&M University, USA in 1996. Recently, He was a senior manager with Cisco systems Inc, worked on high performance datacenter networking product design. Previously he was an engineering manager at Andiamo Systems, Inc.. Before that, he worked for Raza Foundries, Inc., Nplab, Inc. and Texas Instruments, Inc.. His main research interests include high performance networking system architectures, high performance low power ASIC technologies, high speed system signal integrity and power integrity design methodologies.

Dr. Jiangqi HE Intel, USA Dr. Jiangqi He is a senior staff engineer of Enterprise Platform Technology Development Division, Intel. He obtained his BS from Xiamen University and PhD from Duke University, in 1992 and 2000 respectively. After that, Dr. He has been worked on packaging technology, power integrity, signal integrity and system level electrical design for more than 10 years at Intel. He has been an active liaison working with multiple universities such as Georgia Tech, University of Arizona, University of Washington and ASU on researches for electrical packaging and system through SRC funding. Dr. He has published more than 40 papers and holds more than 45 patents. He is an IEEE senior member and his current interests are on efficient power delivery technology for high performance computing, on-die & on package power integrity and high frequency power noise versus signaling.

10 Dr. Yong LIU Fairchild, USA Dr. Yong Liu is a Senior Member Technical Staff of Fairchild Semiconductor Corp in South Portland, USA. He is also a Fairchild global team leader of electrical, thermal-mechanical modeling and analysis. His main interest area is advanced IC packaging, modeling and simulation, reliability and assembly process. He has been invited to give keynotes talks and presentations at international conferences Eurosime, ICEPT-HDP, EPTC and universities in US, Europe and China. He has co-authored over 140 papers and filed over 40 US patents. Dr. Liu obtained his BS, MS and PhD degrees in Nanjing University of Science and Technology in 1983, 1987 and 1990 respectively. After that, Dr. Liu studied and worked at different organizations including Zhejiang University of Technology, China in 1994, Tech University of Braunschweig, Germany in 1995, University of Cambridge, England in 1997, and Rensselaer Polytechnic Institute, USA in 1998 and Nortel Networks, USA in 2000. Since he joined Fairchild in 2001, he was awarded the first Fairchild President Award in 2008, Fairchild Key Technologist in 2006 and 2009, Fairchild BIQ award in product innovation in 2005, and Fairchild award for power of pen first place in 2004. Dr. Liu is currently an IEEE Senior member and has been actively in technical committees of IEEE ECTC, EuroSime, ESREF, ESTC, EPTC and ICEPT. Prof. Sheng LIU HUST, China Prof. Sheng Liu is a Changjiang scholar professor of Mechanical Engineering at Huazhong University of Science and Technology, China. He once was a tenured faculty at Wayne State University, USA. He has over 18 years experience in LED/MEMS/IC packaging. He once won prestigious White House/NSF Presidential Faculty Fellow Award in 1995, ASME Young Engineer Award in 1996, NSFC Overseas Young Scientist Award in 1999, IEEE CPMT Exceptional Technical Achievement Award in 2009, and Chinese Electronic Manufacturing and Packaging Technology Society Special Achievement Award in 2009. He has been an associate editor of IEEE Transaction on Electronic Packaging Manufacturing since 1999 and an associate editor of Journal of Frontiers of Optoelectronics in China since 2007. He is currently one of 11 National Committee Members in LED under Ministry of Science and Technology of China from 2006-2011. He obtained his PhD from Stanford University in 1992, his MS and BS degrees from Nanjing University of Aeronautics and Astronautics in 1986 and 1983 respectively. He is ASME Fellow. He has filed and owed more than 100 patents in China and USA, and has published more than 400 technical papers, has given more than 100 keynotes and invited talks, edited more than 9 proceedings in English for ASME and IEEE. Dr. Ningcheng LEE Indium, USA Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder materials for SMT industries. He received his PhD from University of Akron in 1981, and a BS from National Taiwan University in 1973. Dr. Lee is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies”, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials”. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI and SMTA international conferences, and 2008 award from IPC for Honorable Mention Paper: USA Award of APEX conference. He was honored as 2002 SMTA Member of Distinction, and received 2003 Lead-free Co-Operation Award from Soldertec, and received 2006 Exceptional Technical Achievement Award from CPMT. He serves on the SMTA board of directors. Dr. Tim CHEN Darbond, China Dr. Tim Chen is currently the general manager of Darbond Electronic Materials, China. He is elected as a “Thousand Talents Plan” distinguished scholar by China central government, as well as a “Taishan Scholar” overseas distinguished scholar by Shandong provincial government in 2010. He was the Global Business Director of Packaging for Honeywell Electronic Materials. Prior to joining Honeywell, Dr. Chen worked at Henkel Corp in Asia as the Greater China General Manager for Electronic material business. Prior to Henkel, he had 15 years work experience in the US and held positions at Intel, BP AMOCO Polymers. Dr. Chen received his PhD from University of Nebraska-Lincoln. He had a Post-Doctor Research Associate experience with Professor Alex Jen, he has been working on electronics materials, opto-electronic materials and electronic packaging areas for 20 years. He has more than 50 scientific and technical publications in electronic materials, processes, and applications, especially in semiconductor area and holds more than 40 US patents in the field.

11 Dr. Tong Yan TEE Nepes, Singapore Dr. Tong Yan Tee has over 15 years of working experience in semiconductor industry, mainly on IC packaging in the areas of R&D management, capability development and strategic planning. He is Deputy R&D Director of Nepes Singapore, heading the R&D of 12-inch wafer bumping, wafer level packaging, and emerging technologies. Previously he has worked in Hewlett Packard, Institute of Microelectronics, STMicroelectronics, and Amkor Technology on various technical and management positions. Throughout his career, Dr. Tee has won 13 ST Corporate Awards for his achievement, 2 best paper awards, 6 US patents filed and over 150 publications in journals, conferences and book chapters. Dr. Tee is also a conference short course instructor, journal guest editor, IEEE Senior Member, and serves in the organizing and technical committees of several international conferences. He was the General Chair of EPTC 2008 conference. He is listed in Who’s Who in the World, 2007.

Mr. Ming XUE Infineon, Singapore Mr. Ming Xue is the head of failure analysis lab of Infineon Asia Pacific. He obtained a degree in radio technology from Xi’an JiaoTong University, China in 1982. He started to work in Navigational Aids International, Shanghai in 1982, where he worked for 10 years as a product designer/project manager for products in radio receiver, radio transmitter, and wireless remote control system of navigational aids signal. In 1992, he joint Seagate technology international Singapore as a product engineer, and worked 4 years in PCBA process and FA lab. In 1995, he joint Siemens Component, now, Infineon Technologies Singapore as Senior FA engineer. Currently, he is senior manager of the failure analysis lab. In his 16 years semiconductor backend experience, his job involves IC chip and package failure analysis, package reliability characterization, process quality risk management, qualification, customer return and printed circuit board assembly support. He is listed in Who’s Who in Science and Engineering.

OVERVIEW OF TSV / ITRS FORUM Monday, August 8, 2011

Venue Time Chairs Topic Speakers

Dr. Wolf JURGEN 13:00--13:30 3D Wafer Level System Integration IZM, Germany

Dr. Yasumitsu ORII Room 3 13:30--14:00 Dr. Wenhui Future Challenges in 3D-IC Packaging IBM, Japan (TSV) ZHU Dr. Frank LAI 14:00--14:30 TSV Key Technology for Next Generation Packaging Qtech, China

14:30--15:00 Q & A

15:00--15:30 Coffee Break

Speakers

Room 3 Dr. William Dr. Bill BOTTOM 3MTS, USA 15:30--17:30 Dr. Bernd APPELT ASE, USA (ITRS) CHEN Prof. Ricky LEE HKUST, HK, China Dr. Yishao LAI ASE, Global, TW, China

12 Introduction of TSV Forum Speakers Dr. Wolf JURGEN IZM, Germany Dr. Wolf Juergen received a MS degree in Electrical Engineering. In 1994, he joined Fraunhofer Institute for Reliability and Micro integration (IZM), Berlin and has worked as group & project manager in the field of wafer level packaging and system-in-package (SiP). Since 2011 he is the head of department HDI&WLP/ASSID, responsible for the coordination and management of ASSID - “All Silicon System Integration Dresden-ASSID” with its 300 mm Wafer Level Integration. He manages as well as participates in a number of research projects on European and international level. He is an European representative in the technical working group Assembly & Packaging of ITRS, JEC, JIC and a board member of EURIPIDES as well as member of IEEE and SMTA. He has authored and co-authored more than 50 papers and holds a number of patents.

Dr. Yasumitsu ORII IBM, Japan Dr. Yasumitsu Orii received a BS from Osaka University, Japan. He is a Senior Technical Staff Member working in 3D Integration for IBM Research Tokyo. He joined the IBM Japan in 1986. In 1996, he developed Flip Chip on FPC technique for IBM Hard Disk Drive to realize the enhancement of HDD performance and the slim form factor. Since 2003 he has started the development of ultra thin SiP/PoP for Digital Consumer Electronics Products and he developed C2 as a ultra fine pitch flip chip interconnection technique. In 2009, he was transferred to IBM Research Tokyo to focus on the development of 3D-IC packaging. Dr. Orii received an Excellent Research Award from the Micro Joining Committee of Japan Welding Society in 1996 and a Best Paper Award from ICEP-2008. He was a chair of Technical Program Committee of ICEP-2009 in Kyoto, ICEP-2010 in Sapporo and ICEP-2011 in Nara. He will be a general chair of ICEP-2012 in Tokyo.

Dr. Frank LAI Q-technology, China Dr. Frank Lai is the VP engineer of Kunshan Q technology Ltd. He worked for Ambit Ltd as process engineer in 2002, and he entered Suzhou Walton technology Ltd as process section manager and product section manager from 2003 to 2007, then he worked for Q-technology limited till now. He has rich experience in module engineering, TSV package engineering and TSV package division.

Introduction of ITRS International Technology Roadmap for Semiconductors (ITRS) serves as guideline for the global semiconductor industry, providing a 15 year outlook for 16 sectors of the industry and a 25 years projection of technology needs for emerging research devices and materials. As the industry moves into the era of More Moore and More than Moore, the role of ITRS is becoming even more crucial and critical for continuing progress. This workshop is conducted by the 2011 ITRS Assembly and Packaging working group, focusing on the major technology developments, difficult challenges, and potential solutions for the 2011 ITRS Assembly and Packaging Chapter. The coverage will include Au & Cu wire bond, flip chip BGA and flip chip CSP, wafer level packaging technologies, 3D and 2.5D TSV technology developments, as well as special applications including Optoelectronic Packaging, Automotive Electronics, and Medical Electronics.

13 OVERVIEW OF INVITED PLENARY KEYNOTES Tuesday, August 9, 2011 Multifunctional Hall Time Topic Speaker Organization Molding Technologies – A New Way for Fraunhofer, 09:30--10:05 Dr. Rolf ASCHENBRENNER System Integration Germany Novel Grapheme for Ultra-capacitors Georgia Institute of 10:05--10:40 Prof. C.P. WONG Energy Storage Applications Technology, USA 10:40--11:10 Coffee Break Product Oriented Photonics Packaging ASTRI, HongKong, 11:10--11:45 Dr. Enboa WU Solutions China From LEDification to Digitalization- 11:45--12:20 Dr. Guoqi ZHANG Philips, Netherlands Challenges and Solutions 12:20--13:30 Lunch Future of Electronics Packaging and Georgia Institute of 13:30--14:05 Prof. Rao TUMMALA Advanced Manufacturing for It Technology, USA A New Approach to Qualification For the University of 14:05--14:40 Prof. Michael PECHT Electronics Industry Maryland, USA Thermal Packaging of Optoelectronic Yonsei University, 14:40--15:15 Prof. Moo-Whan SHIN Devices Republic of Korea 15:15--15:45 Coffee Break A New Approach Towards Nano- University of Tokyo, 15:45--16:20 Prof. Tadatomo SUGA packaging Technology Japan JCET and Its Latest Packaging 16:20--16:55 Dr. Weiping LI JCET, China Technologies Emerging Technologies: CMOS Image 16:55--17:30 Dr. Thorsten MATTHIAS EV Group, Austria Sensor Wafer Level Packaging Organic Light Emitting Diodes (OLEDs): Prof. Min WANG (Vice President) Shanghai University, 17:30--18:05 New Generation Display and Lighting Prof. Jianhua ZHANG China Technology and Their Packaging Solutions

Introduction of Invited Plenary Keynote Speakers Dr. Rolf ASCHENBRENNER Fraunhofer, Germany Dr. Rolf Aschenbrenner received his B.S and M.S. degrees from the University of GieBen, Germany in 1986 and 1991, respectively. From 1991 to 1992, he worked at the University of GieBen and was engaged in a project for the German Space Lab Mission D2. In 1993, he joined the Research Center of Microperipheric Technologies at the Technical University of Berlin. Since 1994, he has been employed at the Fraunhofer Institute of Reliability & Micro-integration Berlin (IZM), where he is presently head of the department of System Integration & Interconnection Technologies. From 2000, he was Deputy Director of the Fraunhofer Institute IZM. In 2005, he was awarded the “iNEMI International Recognition Award”. As a member of the IEEE CPMT Society Board of Governors, Dr. Aschenbrenner has worked as a European representative on the Conference Advisory Board Committee, and played an active role in the globalization of IEEE CPMT in terms of membership and chapter development. He is a Senior Member of IEEE and served as Technical and IEEE CPMT Vice President of Conferences. In 2010, he became IEEE CPMT President.

14

Prof. C.P. WONG GT, USA Prof. C.P. Wong is currently Dean of the Faculty of Engineering at the Chinese University of Hong Kong. He is on a no-pay long leave from Georgia Institute of Technology (GT). Prior to joining GT in 1996, he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992. His research interests lie in the fields of polymeric electronic materials, electronic, photonic and MEMS packaging and interconnect, interfacial adhesions, nano-functional material syntheses and characterizations, nano-composites. He received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Educational Activity Board Outstanding Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class 1934 Distinguished Professor Award, the IEEE CPMT Field Award in 2006 and the IEEE CPMT David Feldman Award in 2009. He holds over 50 U.S. patents, and has published over 1,000 technical papers, co-authored and edited 10 books and is a member of the National Academy of Engineering of the USA since 2000.

Dr. Enboa WU ASTRI, Hong Kong, China Dr Enboa Wu joined ASTRI in 2005. As Vice President and Group Director, and Founder of the Material & Packaging Technologies Group, he is responsible for development and commercialization of technologies in areas of LED chips, packaging, and applications to lighting and display; renewable energy harvest by piezo, wind and CPV; batteries; CMOS image sensor TSV packaging and compact cameras; printed electronics; healthcare electronics; and micro-systems. Dr Wu has over 20 years of experience in electronics, opto-electronics, materials, and precision metrology areas. In his previous post as Deputy General Director of ERSO/ITRI in Taiwan, Dr Wu founded ERSO's Advanced Packaging Technologies Center and managed its Flat Panel Display Technologies Center. Dr. Wu received his PhD degree from the University of California, Berkeley. Prior to joining ASTRI, he had also served as a professor at National Taiwan University for 15 years. Dr. Wu is an ASME Fellow.

Dr. Guoqi ZHANG Philips, Netherlands Dr. G.Q. Zhang is Philips’ fellow for SSL and Sr. Director for SSL open innovation, mainly working on SSL technology strategy, roadmap and partnership. Within Delft University of Technology, the Netherlands, as the director of DIMES centre for SSL technologies, he is heading a multi-disciplinary research team working on solutions for various fundamental and application challenges related to SSL. Prof. Zhang has been playing active and renowned role in shaping the global technology landscape of Semiconductors and SSL.

Prof. Rao TUMMALA GT, USA Prof. Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC at Georgia Tech since 1994. Prior to joining Georgia Tech, he was an IBM Fellow He is known as the father of LTCC having developed 61-layer LTCC with copper and copper-polymer thin film materials. He has received many industry, academic and professional society awards including Industry Week’s award for improving U.S. competitiveness, IEEE‘s David Sarnoff, Major Education and Sustained Technical awards, etc.. He was recently honored by the Indian Semiconductor Association with the 2011 TechnoVisionary Award, received the highest IEEE award in packaging at the 61st ECTC for his contributions in package integration research, cross-disciplinary education and globalization of packaging. Prof. Tummala has published 426 technical papers, holds 74 patents and inventions; authored several books. He is a Fellow of IEEE, IMAPS, and the American Ceramic Society, and a member of the National Academy of Engineering in USA and in India. He is past President of both IEEE-CPMT and the IMAPS Societies. 15 Prof. Michael PECHT University of Maryland, USA Prof. Michael Pecht is a world renowned expert in strategic planning, design, test, prognostics, IP and risk assessment of electronic products and systems. In 2010, he received the IEEE Exceptional Technical Achievement Award for his innovations in the area of prognostics and systems health management. In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society’s Lifetime Achievement Award. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, a SAE Fellow and an IMAPS Fellow. He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum. He is chief editor for Microelectronics Reliability and an associate editor for the IEEE Transactions on Components and Packaging Technology. He is the founder and Director of CALCE at the University of Maryland. The CALCE Center received the NSF Innovation Award in 2009. He is also a Chair Professor in Mechanical Engineering and a Professor in Applied Mathematics at the University of Maryland. He has written more than twenty books on product reliability, development, use and supply chain management and over 400 technical articles. He has also written a series of books of the electronics industry in China, Korea, Japan and India.

Prof. Moo-Whan SHIN Yonsei University, Republic of Korea Prof. Moo Whan Shin is one of world-wide leaders in thermal design & packaging of optoelectronics including high power LEDs and solar cells. He received M.S. and PhD degrees from the North Carolina State University, USA in 1988 and 1991, respectively. He is currently a Professor in the School of Integrated Technology at Yonsei University, Korea. He holds 28 patents and published more than 185 papers on thermal packaging and high power semiconductor devices. He worked for the Seoul Semiconductor Company for two years as a Technical Consultant. He has given more than 30 invited talks at international conferences and seminars on the subject of thermal packages of optoelectronic devices. He has received an excellent green technology research award from the Ministry of Education and Science and Technology. He is currently a President of Korea Society of Optoelectronics. He serves Korean government as a member of Presidential Committee on Green Growth. He is a director of ISA (International Solid State Lighting Alliance) as well.

Prof. Tadatomo SUGA University of Tokyo, Japan Prof. Tadatomo Suga received PhD degree from the University of Stuttgart in 1983, while performing his PhD research at the Max-Planck Institute für Metallforschung, Stuttgart. In 1984, he became a member of Faculty of Engineering, the University of Tokyo, and since 1993, he has been professor of the School of Engineering. He was also a director of National Institute of Materials Science (NIMS) conducting Interconnect Design Group and the chair of IEEE CPMT Society Japan Chapter. His researches focus on micro-systems integration and packaging, and development of interconnect technology, especially a room temperature bonding technique for 3D integration: Surface Activated Bonding (SAB). He has advocated also the importance of environmental aspects of packaging technology and is well-known as the key organizer of Japanese roadmap of lead-free soldering and International Eco-design Conference.

Dr. Weiping LI JCET, China Dr. Weiping Li is the Corporate VP of Laminate Packaging and Overseas Sales of JCET. Prior to his current responsibility, he was GM of JCET’s North American Operations. Dr Li graduated from Georgia Institute of Technology with a PhD in Materials Science and worked at Delphi Delco, Motorola Semiconductor and Amkor in R&D and product management areas. He was selected as one of the “1000 Elite Overseas Chinese Returnees” by the Central Government in 2009 and is a member of the Steering Committee for the National Key Lab for High-Density Packaging.

16 Dr. Thorsten MATTHIAS EV Group, Austria Dr. Thorsten Matthias is the director of business development at EV Group headquarters in St. Florian, Austria. In this role he is responsible for overseeing EVG’s worldwide business development. Dr. Matthias received his PhD degree in Technical Physics in 2002 from Vienna University of Technology, Austria. He started working at EV Group in October 2002. In his current position he works in 3D integration, MEMS, photovoltaics, LED, and nanotechnology. Since 2002, Dr. Matthias is involved in the field of 3D integration. He has co-authored 3 books and multiple papers on 3D integration with a special focus on thin wafer handling and chip stacking.

Prof. Jianhua ZHANG Shanghai University, China Prof. Jianhua Zhang is one of leading scholar of Photoelectronic and Mechanical Engineering in Shanghai University. She is the head of LED&OLED Centers, and the leader of Shanghai Research Platform for New Display Design,Fabrication and System Applications. From 2001 to 2002, she was Research Associate at City University of Hong Kong. From 2002 to 2003, she was Postdoctoral Research Fellow at Heriot-Watt University. She has been studying on the advance packaging technology and process, optoelectronic devices, organic elcetronics in Shanghai University. She established LED Packaging & Reliability Center in 2007 and OLED University-Industires Joint Center in 2008. She occupied over 90 papers and 40 Chinese patents. In 2010, she and her team was awarded by Shanghai government for their achievements in hight density chip interconnection technology and applications.

OVERVIEW OF INVITED SESSION KEYNOTES Wednesday, August 10, 2011 Session Venue Time Topic Speaker Dr. C.H. WANG Room 1 10:20--10:50 Trends in MEMS Packaging Heriot-Watt University, UK Session A Mr. Han Yu Room 1 15:50--16:20 Bottom-up Through Silicon Via (TSV) Filling Sinyang, China An Overview of Room Temperature Wafer Dr. Chenxi WANG Room 2 10:20--10:50 Direct Bonding: Alignment, Mechanism and Tokyo University, Japan Session B Application Three Years of Fine Copper Wire Bonding in Mr. Bernd APPELT Room 2 15:50--16:20 High Volume Manufacturing ASE, USA Dr. Yishao LAI Room 3 10:20--10:50 Reliability Modeling for Electronic Packages ASE, USA Session C Design and Reliability of Power Electronics Prof. Hua LU Room 3 15:50--16:20 Modules University of Greenwich, UK Effect of Substrate Surface Treatment on the Dr. Lingwen KONG Session D Room 4 10:20--10:50 Bondability of Wire Bonding SCC, China Reliability Modeling of Power Electronics Prof. Chris BAILEY Session F Room 5 10:20--10:50 Components University of Greenwich, UK

17 OVERVIEW OF INVITED SESSION KEYNOTES (Cont.) Thursday, August 11, 2011 Session Venue Time Topic Speaker Dr. T. ONISHI Session G Room 1 10:20--10:50 LED Packaging Study by Tear-down Approaching GJ Tech, HK, China Advanced Epoxy Molding Compound Technology Mr. Tom XIE Session B Room 2 10:20--10:50 & Marketing Trend Henkel, China Dr. Minggang HOU Session C Room 3 10:20--10:50 Advanced Package Design Driven by Simulation ANSYS, China Several Co-design Issues Using DfX for Solid Prof. Sheng LIU Session H Room 4 10:20--10:50 State Lighting HUST, China Effect of Interfacial Reaction on Reliability of Flip Prof. Mingliang Session F Room 5 10:20--10:50 Chip Lead-free Solder Joints HUANG, DLUT, China

Introduction of Invited Session Keynote Speakers A01 Dr. C.H. Wang Heriot-Watt University, UK Dr. Changhai Wang received his B.S. degree from Jilin University. He obtained his M.S. and PhD. degrees from Heriot-Watt University in Edinburgh. After several years of research work in nonlinear optical materials, electro-optic devices and optical sensors at Heriot-Watt University, he moved to Imperial College, London, to work on copper column based bumping methods for flip-chip assembly. He returned to Heriot-Watt University in 2000 to take up a lecturer position in Microsystems engineering. His key research interests include development of assembly and packaging techniques for MEMS and microsysms, fabrication of metallic and polymer structures for RF-MEMS and micro-fluidic devices, and integrated sensors for package reliability and environmental monitoring applications. In1997 he was awarded a one-year Enterprise Fellowship in Optoelectronics by the Royal Society of Edinburgh. He has published more than 90 papers across several research fields and holds two patents in MEMS packaging. A02 Mr. Han YU Sinyang, China Mr. Han Yu is the Deputy Director of Marketing Dept. of Shanghai Sinyang Semiconductor Materials Co., Ltd, which is focusing on the research and development, design, manufacturing, sales and services in electronic materials and its relevant surface treatment equipments. Mr. Yu has rich knowledge and experience in advanced packaging and semiconductor front-end manufacturing fields. Prior to joining Shanghai Sinyang, Mr. Yu was the senior engineer for several years in Global Foundries Singapore.

B01 Dr. Chenxi WANG Tokyo University, Japan Dr. Chenxi Wang received his B.E. and M.E. degrees from Harbin Institute of Technology, China, in 2002 and 2004, respectively, and his PhD degree from the University of Tokyo in 2009. He is currently working as a research fellow at The University of Tokyo awarded by Japan Society for the Promotion of Science (JSPS). From 2001 to 2004, He worked on microjoining techniques for electronic packaging and modeling of flip chip solder joint. From 2005, he joined Microsystem integration and packaging laboratory of The University of Tokyo. He has published more than 30 papers and holds 2 Japan patents. He received many awards, including the Best Paper Awards of ICEPT in 2003, 2007 and 2010, Chinese Government Award for Outstanding Student Abroad in 2007, Young Award of IEEE CPMT Symposium Japan 2010, and the Dean Award of School of 18 Engineering at The University of Tokyo in 2010, the Best Presentation Award of 2nd AWJTC in 2011. He is an active member in IEEE, CPMT society, Japan Institute of Electronics Packaging (JIEP) and The Electrochemical Society (ECS).

B02 Dr. Bernd Appelt ASE, USA Dr. Bernd Appelt got his PhD degree from the U of Mainz, Germany. He worked in IBM for 23 years in polymer systems characterization. He held various management positions in product and process development as well as manufacturing engineering. In 2003 he joined ASE Group as director of substrates engineering. His current position is director of business development and product promotion. Bernd holds more than 50 patents in electronic packaging and is a frequent presenter at electronics conferences. He is also a member of the roadmap committees of the ITRS Packaging & Assembly Group, IPC Substrates group and iNEMI Substrates Working Group.

B03 Mr. Tom XIE Henkel, China Mr. Tom Xie is working for Henkel Huawei Electronics Co., Ltd. as R & D Manager. He has nearly 10 years experience in research and development of epoxy molding compounds. As the main inventor, he had participated in national 863 project and obtained 4 China national patents and 2 PCT international patents. At the same time, more than 20 of his academic papers were published in various domestic and international academic conferences and journals, including three papers which were awarded city natural science second prize and third prize. During his R&D career, he developed lots of new EMC products, including KL-G100/S, GR360A-ST, GR640HV-L1/S4, GR640A, KL-G900HC / P and other Henkel core products. These products are widely used in discrete devices, IC and other semiconductor market to achieve high sales revenue for Henkel.

C01 Dr. Yi-shao LAI ASE Group, Taiwan, China Dr. Yi-Shao Lai received his PhD degree from the University of Texas at Austin in 2002, and M.S. and B.S. degrees from National Central University, Taiwan. Dr. Lai is a Director with Group R&D of Advanced Semiconductor Engineering (ASE), Inc., where he is leading Central Product Solutions with a focus on strategic planning and development of next-generation and mainstream electronic and photonic packaging, substrate technologies, as well as profitable new technologies. He is an Associate Editor for Microelectronics Reliability, a Guest Editor for IEEE Transactions on Components and Packaging Technologies and ASME Transactions Journal of Electronic Packaging, the Editor for ASE Technology Journal, and serves on the Editorial Advisory Board of Recent Patents on Electrical Engineering. Dr. Lai is an IEEE Senior Member and a recipient of the Outstanding Technical Achievement Award by IEEE Tainan Section. He was named Outstanding Young Engineer by Electronic & Photonic Packaging Division of American Society of Mechanical Engineers, Chinese Institute of Engineers, and Chinese Society of Mechanical Engineers. Dr. Lai has over 550 technical publications and is the inventor of more than 45 patents.

C02 Prof. Hua LU University of Greenwich, UK Dr. Hua Lu is a Reader (Associate Professor) in computational science at the University of Greenwich, UK. He received his PhD degree in Computational Physics from the University of Edinburgh, UK, in 1992 and M.S. degree in Condensed Matter Physics from Wuhan University, China, in 1988. He has worked in many research areas in the field of physics and engineering in his career. Currently his research interests are numerical analysis of electronics devices and reliability prediction methods, design and manufacturing optimization methods and their applications in industries.

19 C03 Mr. Minggang HOU ANSYS, China Mr. Minggang Hou joined Ansys Corporation as a Senior Application Engineer in 2010 focusing in Signal Integrity, Power Integrity and EMI. He supports tools such as Ansoft Designer™, Nexxim™, SIwave™, HFSS™ and Q3D™. Mr. Hou worked in high speed design for over 11 years. Prior to joining Ansys, he held the position of a Senior Technical Marketing Engineer in Mentor Graphics for Hyperlynx™ serial, including Signal Integrity, Power Integrity, Analog and Thermal productions. Before join Mentor, he worked as Hardware Design and Signal Integrity Engineer at Huawei Corporation where he was responsible for the Signal and Power Integrity analysis of PCB and ASIC. He also focused on high speed electrical interconnect testing and modeling research. He received B.S. degree in Control Engineering from Harbin Industry Technology University, China. D01 Dr. Lingwen KONG SCC, China Dr. Lingwen Kong graduated from HUST, China. He is the chief engineer of SCC and responsible for investment, business development and R & D of new product of PCB. He has 10+ patents in China and 20+ papers published. Dr. Kong has rich experience in characteristic impedance matching, processing of high density, materials development, heat sink technologies, machining and packaging substrate, etc.

F01 Prof. Chris BAILEY University of Greenwich, UK Prof. Chris Bailey received his PhD degree in Computational Modeling in 1988, and an MBA in Technology Management in 1996. He has published over 200 papers on Design and Simulation of micro/nano-technology based processes and products and has worked on many UK and EU projects. Chris is a member of the NAFEMS Multi-Physics Modelling working group, a member of the Board of Governors of IEEE-CPMT society, and a UK Committee member of IMAPS. In 2007 he was and Programme Chair for High Density Packaging Conference in Shanghai, China, and also the local organizer of the IEEE sponsored EuroSime conference in London. In 2008 he was the General Chair for the Electronics System-integration Technology Conference (ESTC-2008) in Greenwich, London. Chris is also a member of the Board of Governors for IEEE CPMT. In 2011, Chris is the Technical Chair for IEEE Nanotechnology conference in Portland (USA). F02 Prof. Mingliang HUANG DLUT, China Prof. M.L. Huang received his PhD degree from Dalian University of Technology. From 1998 to 2000, he worked at Electronic Packaging Center, City University of Hong Kong, as a Research Associate. From 2003-2004, he worked at Center for Electronic Packaging Materials, Korea Advanced Institute of Science and Technology, as a Research Fellow. From 2004 to 2006, he worked at Fraunhofer IZM, Germany, as a Humboldt Research Fellow. Since 2006, he has been a professor and the director of Electronic Packaging Materials Lab at Dalian University of Technology. Now his researches focus on the interfacial reaction, electro migration, reliability of fine-pitch lead-free solder interconnects, and co-deposition of eutectic Au-Sn alloys for LED packaging.

G01 Mr. T ONISHI GJ Tech, Hong Kong, China Mr. Onishi is the managing director of Grand Joint Technology Ltd, formed in Hong Kong in 1997. Grand Joint Technology Ltd. is a microelectronics assembly process consulting company involved in Materials, Design, Process, and Analysis for Bare Die Product, COB, SMT, Packaging, COF, LCD Modules, EL products, LED packaging & LED device. Mr. Onishi received the “Die Products Industry Achievement award” at the 8th Annual International KGD Packaging and Test Workshop.

H01 Prof. Sheng LIU HUST, China (See Page 11 for short biography) 20 OVERVIEW OF ORAL PRESENTATION SESSIONS Wednesday, August 10, 2011 Room 1 Room 2 Room 3 Room 4 Room 5 Oral Session 1 Oral Session 2 Oral Session 3 Oral Session 4 Oral Session 5 (Session A) (Session B) (Session C) (Session D) (Session F) Prof. Yufeng JIN Prof. Jintang SHANG Prof. Fei QIN Dr. Paul WANG Prof. Daoguo YANG Chairs Prof. G.S. KIM Prof. Peng JIN Dr. Wenhui ZHU Dr. Lingwen KONG Dr. Zikai HUA A-001, A-002, B-002, B-005, C-002, C-003, D-006, D-009, F-001, F-002, 08:00--09:20 A-003, A-004, B-010, B-011, C-005, C-006, D-013, D-015, F-003, F-005, 09:20--10:20 Poster Session 1 (53 papers), Exhibition & Coffee Break Oral Session 6 Oral Session 7 Oral Session 8 Oral Session 9 Oral Session 10

(Session A) (Session B) (Session C) (Session D) (Session F) Dr. Yishao LAI Dr. Hengyun ZHANG Dr. Tongyan TEE Prof. Mingyu LI Prof. Chunqing Wang Chairs Prof. Gang DONG Prof. Fei XIAO Dr. Heinz PAPE Prof. Mingliang HUANG Dr. Xiuzhen LU 10:20--10:50 Invited Talk Invited Talk Invited Talk Invited Talk Invited Talk A-006, A-013, B-014, B-015, C-007, C-008, D-016, D-017, F-006, F-007, 10:50--12:10 A-030, A-020, B-016, B-026, C-012, C-014, D-018, D-019, F-011, F-060, Lunch: 12:10--13:10 Room 1 Room 2 Room 3 Room 4 Room 5 Oral Session 11 Oral Session 12 Oral Session 13 Oral Session 14 Oral Session 15 (Session A) (Session B) (Session C) (Session E) (Session F) Dr. Lionel CADIX Prof. Liangliang LI Dr. Haibo FAN Mr. K.H. TAN Prof. Dongyan DING Chairs Dr. Daniel YU Prof. Mingyu LI Dr. Hongfei YAN Dr. Li GONG Dr. Klaus GALUSCHKI A-022, A-025, A-026, B-018, B-019, B-028, C-016, C-017, C-022, E-011, E-010, E-007, F-018, F-019, F-020, 13:10--14:50 A-028, A-014, B-029, B-031, C-025, C-034, E-006, E-003, F-021, F-023, 14:50--15:50 Poster Session 2 (55 papers), Exhibition & Coffee Break Oral Session 16 Oral Session 17 Oral Session 18 Oral Session 19 Oral Session 20

(Session A) (Session B) (Session C) (Session F) (Session F) Dr. Ivan SHAM Dr. Ningcheng LEE Dr. Jianqi HE Dr. Zezhong FU Dr. Ming XUE Chairs Dr. Klaus PRESSE Dr. J.G. DUH Dr. Jiangtao ZHENG Prof. Jun WANG Prof. Kailing PAN Invited Talk Invited Talk Invited Talk F-027, F-028, F-038, F-043, F-044, F-046, 15:50--17:30 A-038, A-040, A-042, B-032, B-033, B-036, C-035, C-036, C-039, F-039, F-042, F-051, F-052,

21 OVERVIEW OF ORAL PRESENTATION SESSIONS (Cont.) Thursday, August 11, 2011 Room 1 Room 2 Room 3 Room 4 Room 5 Oral Session 21 Oral Session 22 Oral Session 23 Oral Session 24 Oral Session 25 (Session G) (Session B) (Session C) (Session F) (Session F) Dr. Barry ZHONG Prof. Liqiang CAO Prof. Bill CHEN Dr. Boyi WU Dr. Chenxi WANG Chairs Dr. Xiaobing LUO Prof. Yanhong TIAN Prof. Hua LU Dr. Ivan SHAM Dr. Min MIAO G-010, G-004, B-039, B-044, C-042, C-043, F-053, F-054, F-062, F-063, 08:00--09:20 G-005, G-008, B-055, B-061, C-045, C-047, F-057, F-058, F-065, F-070,

09:20--10:20 Poster Session 3 (52 papers), Exhibition & Coffee Break Oral Session 26 Oral Session 27 Oral Session 28 Oral Session 29 Oral Session 30

(Session G) (Session B) (Session C) (Session H) (Session F) Mr. T. ONISHI Prof. Hao TANG Dr. Yan ZHANG Prof. James CAI Prof. Chris BAILEY Chairs Prof. Xu CHEN Dr. Bing AN Dr. Qing ZHOU Dr. Andy TSENG Dr. Yanrong ZHANG 10:20--10:50 Invited Talk Invited Talk Invited Talk Invited Talk Invited Talk G-012, G-016, B-065, B-067, C-052, C-054, H-001, H-002, F-071, F-077, 10:50--12:10 G-017, G-020, B-072, B-074, C-060, C-061, H-004, H-008, A-024, A-037,

22 ORAL SESSIONS Note: Only the contact information of the first author is provided because of the length limitation of the conference program. Wednesday, August 10, 8:00AM – 9:20AM Session1: Advanced Packaging & System B-010 8:40 –9:00 Integration Comparison of nano-additives influence on properties of Date Wednesday, August 10, 2011 the bi-modal solder pastes for special applications Janusz Sitek1, Yan Zhang, Shiwei Ma, Johan Liu, Yulai Ga, Time 8:00AM-9:20AM Qijie Zha, Marek Koscielski, Krystyna Bukat, Aneta Venue Room 1 Arazna, Malgorzata Jakubowska, A.Mlozniak Prof. Yufeng JIN Chairs Tele and Radio Research Institute, Poland Prof. G. S. KIM B-011 9:00 –9:20 A-001 8:00 –8:20 Investigation of Palladium Coverage on Bonded Balls of Highly reliable silicon or glass package to printed wiring Palladium-coated Copper Wires board interconnections 1 1 Kay-Soon Goh , Teck-Kheng Lee, Wei Koh, Hun-Shen Ng, Xian Qin ,Nitesh Kumbhat, Venky Sundaram, Rao Hong-Meng Ho Tummala Semicon Fine Wire Pte Ltd., Singapore Georgia Institute of Technology, USA

A-002 8:20 –8:40 Session3: Packaging Design & Modeling Challenges in Developing Cost-effective System-in-Package (sip) for Tire Pressure Monitoring Date Wednesday, August 10, 2011 System(TPMS) Time 8:00AM-9:20AM Ivan M.L. SHAM1, Carlos S.W.CHOW, Ling JING, Jack Venue Room 3 Y.YEUNG, Supen Chen Prof. Fei QIN Chairs Hong Kong Applied Science & Technology Research Dr. Wenhui ZHU Institute, Hong Kong, China C-002 8:00 –8:20 A-003 8:40 –9:00 Thermal performance of high power LED package based Electromigration Performance of Through Silicon Via on LTCC (TSV) Mingsheng Ma, Zhifu Liu, Yongxiang Li1 Zhicheng Lv1, Run Chen, YuZhe Wang, Xuefang Wang, Shanghai Institute of Ceramics, Chinese Academy of Sheng Liu Sciences, China Huazhong University of Science & Technology,China C-003 8:20 –8:40 A-004 9:00 –9:20 A Test Structure Designed for Vias in Multi-layer Package Challenges in 3D Integration Due to Differences in Silicon Substrate and System Design Environments SUN Ling1, YANG Ling-ling, Sun Hai-yan Tsunwai Gary Yip 1, Benedict Lau Nantong university, China Rambus Inc., USA C-005 8:40 –9:00 Computer Simulation of the Electro-migration and Session2: Packaging Materials & Processes Optimization of Assembly Designs 1 Date Wednesday, August 10, 2011 Xiaoxin ZHU , Hua Lu, Chris Bailey Time 8:00AM-9:20AM University of Greenwich, UK Venue Room 2 C-006 9:00 –9:20 Prof. Jintang SHANG A novel Wirebond-BGA CPU package Chairs Prof. Peng JIN WANG Qidong1, CAO Liqiang, LI Jun, GUO Xueping, B-002 8:00 –8:20 GAO Wei, LIU Shuhua, GUIDOTTI Daniel, WAN Lixi Growth Behavior of Prismatic Cu6Sn5 and Its Effect on Institute of Microelectronics, Chinese Academy of Mechanical Properties of Eutectic Sn-Ag Solder Joints Sciences, China Ming Yang, Mingyu Li1, Ling Wang, Yonggao Fu, Jongmyung Kim Session4: High Density Substrate & SMT Shenzhen graduate school, Harbin Institute of Technology, Date Wednesday, August 10, 2011 China Time 8:00AM-9:20AM B-005 8:20 –8:40 Venue Room 4 High Temperature Lead-Free Solder Joints Via Mixed Dr. Paul WANG Powder System Chairs Dr. Lingwen KONG Hongwen Zhang, Ning-Cheng Lee1 D-006 8:00 –8:20 Indium Corporation, USA Solder Preform Application 23 Hu yu1, Gong yihua, Lu shijun, Shen ming Prof. Daoguo YANG Chairs Siemens Center Shanghai, China Dr. Zikai HUA D-009 8:20 –8:40 F-001 8:00 –8:20 Study on the Thermal Fatigue Reliability of Plated The stress-strain behaviors of solder joints during thermal Through Holes in PCB fatigue process 1 Xiong Ji1 Geng Zhiting , Heqing, Cheng Guohai, Ma Jusheng Beihang University, China North China Electric Power University, China D-013 8:40 –9:00 F-002 8:20 –8:40 Silver Nitric-An Innovative Process Indicator for In situ measurement of stress evolution in Sn-based solder Oxidation of PCB with OSP Surface Finish joint under electromigration based on X-ray diffraction Eric Hou, DF Chung, Paul Wang1 technique 1 Mitac Technology Development Center, China Hongwen He , Haiyan Zhao, Guangchen Xu, Limin Ma and Fu Guo D-015 9:00 –9:20 Tsinghua University, China Research on Dimensional Change Characteristics of Printed Circuit Board Films F-003 8:40 –9:00 Liangjie Zhou1, Dong Liu, Zaifei Tao, Rubin Zou, Non-Destructive Diagostics of Electronic Devices 1 Weisheng Xia, Fengshun Wu Ping Li , Yuan Chen Huazhong University of Science & Technology, China National Key Laboratory of Reliability Physics and Application of Electronic component, China Session5: Quality & Reliability F-005 9:00 –9:20 Residual Stress in NCF-Bonded COG Packages during Date Wednesday, August 10, 2011 Manufacturing Process Time 8:00AM-9:20AM Jie Guo1, Guanghua Wu, Xiancai Chen, Bo Tao Venue Room 5 Huazhong University of Science & Technology, China

Wednesday, August 10, 10:20AM – 12:10PM Session6: Advanced Packaging & System Formic acid vapor treated Cu-Cu direct bonding at low Integration temperature Wenhua Yang1, Hiroyuki Shintani, Masatake Akaike, Date Wednesday, August 10, 2011 Tadatomo Suga Time 10:20AM-12:10PM The University of Tokyo, Japan Venue Room 1 Dr. Yishao LAI Chairs Prof. Gang DONG Session7: Packaging Materials & Processes Invited Talk 10:20 –10:50 Date Wednesday, August 10, 2011 Trends in MEMS packaging Time 10:20AM-12:10PM Dr. C.H. WANG Venue Room 2 Dr. Hengyun ZHANG Heriot-Watt university, UK Chairs Prof. Fei XIAO A-006 10:50 –11:10 Invited Talk 10:20 –10:50 Thermal Analysis and Improvement of High Power An Overview of Room-Temperature Wafer Direct Electronic Packages Bonding: Alignment, Mechanism and Application Zhimin Wan1, Ling Xu, Yang Zhang, Mingxiang Chen, Dr. Chenxi WANG Xiaobing Luo, Junjie Chen, Sheng Liu Huazhong University of Science & Technology, China Tokyo University, Japan A-013 11:10 –11:30 B-014 10:50 –11:10 Design and optimization of Redistribution Layer (RDL) on Pitting corrosion behavior of Sn-07Cu alloy in simulated TSV interposer for high frequency applications marine atmosphere environment and the effect of trace gallium Qinghu Cui, Yunhui Zhu, Shenglin Ma, Jing Chen, Min 1 Miao, Yufeng Jin1 Aiping Xian , Zhong Yan Peking University, China Institute of Metal Research, Chinese Academy of Sciences, China A-030 11:30 –11:50 B-015 11:10 –11:30 System in Package(SiP) Development for Universal Transport Interface Application electronic products The application of inkjet direct writing in solar cell fabrication: an overview XIE Jianyou, GUO Xiaowei, ZHU Wenhui, WANG 1 Yongzhong, LI Xizhou, XIA Guofeng1 and QIN Fei Zhaoting Xiong , Changqing Liu Beijing University of Technology, China Loughborough University, UK A-020 11:50 –12:10 B-016 11:30 –11:50 24 Electromigration Behavior in In-situ Cu6Sn5 Reinforced SCC, China Eutectic SnAg Composite Solder Joints D-016 10:50 –11:10 1 Xiaoya Wang , Mengting Han, Limin Ma, Guangchen Xu, Design for Manufacturability of PTH Solder Fill in Thick Fu Guo Board with OSP Finish Beijing University of Technology, China Shing Chang, Rocky Wang, Yu Xiang, William Shi, Paul B-026 11:50 –12:10 Wang 1 Formation and Migration of Au-Pd-Ni-Sn Quaternary Mitac Technology Development Center, China Intermetallic Compound in the Microbumps with A D-017 11:10 –11:30 Au/Pd/Ni(P) Surface Finish 1 Investigation on cracked solder ball of BGA component Wei-Hsiang Wu, Y.C.Lin, Cheng-En Ho Miao Cai1, Boyi Wu, Dongji Xie, Daoguo Yang, Yuan Tao, Yuan Ze University, Taiwan, China Fei Zhou Guilin University of Electronic Technology, China Session8: Packaging Design & Modeling D-018 11:30 –11:50 Date Wednesday, August 10, 2011 Void mechanism research and control in solder joint Time 10:20AM-12:10PM Xie xiaoqiang1, Zhao Zhenqing Venue Room 3 Samsung Semiconductor Prof. Tongyan TEE D-019 11:50 –12:10 Chairs Dr. Heinz PAPE Direct and Indirect Strain Measurement of Flexible PCBs Invited Talk 10:20--10:50 Luciano Arruda1, Luciano Sahdo, Cristiano Coimbra Reliability Modeling for Electronic Packages Nokia Institute of Technology, Brazil Dr. Yishao LAI ASE, USA Session10: Quality & Reliability C-007 10:50--11:10 Date Wednesday, August 10, 2011 High Density Packaging for Automotive Applications Time 10:20AM-12:10PM 1 Sommer Johann-Peter , Michel B., Hofmann,Thomas, Venue Room 5 Gottwald,Th, Neumann,A, Podlasly,A Prof. Chunqing WANG Chairs Fraunhofer Research Institute for Electronic Nano Dr. Xiuzhen LU Systems, Germany Invited Talk 10:20--10:50 C-008 11:10--11:30 Reliability Modeling of Power Electronics Components Study of Joule Heating Effects in Lead-Free Solder Joints Prof. Chris BAILEY under Electromigration University of Greenwich, UK Guangchen Xu1, Fu Guo, Andre Lee, K.N. Subramanian, Neil Wright F-006 10:50 –11:10 Beijing University of Technology, China Investigation on soldering reliability in terminal electrodes C-012 11:30--11:50 of MLCC GuangHua Shi1, ShengXiang Bao 3D Modeling and Electrical Characteristics of Through-Silicon-Vias (TSVs) in 3D Integrated Circuits University of Electronic Science & Technology of China, Lei Liang, Min Miao1, Zhensong Li, Shufang Xu, Xin Sun China Peking University, China F-007 11:10 –11:30 Migration of Silver and Copper on Power Packaging C-014 11:50--12:10 Substrates Simulation of Reconfigurable Antenna Based on RF Yunhui Mei1, Guo-Quan Lu, Xu Chen, Gang Chen, Susan Switch 1 Luo Tian Wenchao , Cao Yanrong, Sun Hao Tianjin University, China Xidian University, China F-011 11:30 –11:50 Study on embedded-type MCM temperature field analysis Session9: High Density Substrate & SMT and thermal placement optimization Date Wednesday, August 10, 2011 Huang Chunyue1, Wei Hegeng Time 10:20AM-12:10PM Guilin University of Electronic Technology, China Venue Room 4 F-060 11:50 –12:10 Prof. Mingyu LI An advanced solder ball impact test method and its system Chairs Prof. Mingliang HUANG Zhang Yanbo1 Invited Talk 10:20--10:50 The Hong Kong University of Science & Technology, Effect of Substrate Surface Treatment on the Bondability Hong Kong, China of Wire Bonding Dr. Lingwen KONG

25 Wednesday, August 10, 13:10PM – 14:50PM Session11: Advanced Packaging & System Institute of Microelectronics Chinese Academy of Integration Sciences, China B-028 13:50--14:10 Date Wednesday, August 10, 2011 Large-scale synthesis of silver nanoparticles by polyol Time 13:10PM-14:50PM process for low temperature sintering-bonding application Venue Room 1 Jianfeng Yan1, Guisheng Zou, Xiaoyu Wang, Hailin Bai, Dr. Lionel CADIX Chairs Fengwen Mu and Aiping Wu Dr. Daniel YU Tsinghua University, China A-022 13:10--13: 30 B-029 14:10--14:30 Electrical Characterization of Cylindrical and Annular TS Influence of nano-TiO2 reinforcements on the wettability V for Combined Application Thereof and interfacial reactions of novel lead-free Sn3.5Ag0.5Zn Xin Sun, Qinghu Cui, Yunhui Zhu, Zhiyuan Zhu, Min Miao, 1 composite solder/Cu solder joints Jing Chen, Yufeng Jin S. Y. Chang, L. C. Tsao1, F. S. Wang and L. P. Feng Peking University, China Pingtung University of Science & Technology, Taiwan, A-025 13:30--13:50 China Investigation of various options of CTBGA adhesives for B-031 14:30--14:50 bend performance enhancements in portable Properties of ferroelectric thin film capacitor for embedded electronic products 1 passive applications SHI Hongbin and UEDA Toshitsugu Ning Zhao1, Lixi Wan and Shuhui Yu WASEDA University, Japan Institute of Microelectronics, Chinese Academy of A-026 13:50--14:10 Sciences, China Reliability Optimization for Multilayer Circuits for Active RFID Tag on Rigid and Flexible Substrates Session13: Packaging Design & Modeling Huang Jingyuan1, Zhang Zheming, Chen Haibin and Wu Jingshen Date Wednesday, August 10, 2011 The Hong Kong University of Science & Technology, Time 13:10PM-14:50PM Hong Kong, China Venue Room 3 Dr. Haibo FAN A-028 14:10--14:30 Chairs Halogen-free corner bond adhesive for array-based SMT Dr. Hongfei YAN packages and the impact on board-level solder C-016 13:10--13:30 joint reliability Optimisation of Heatsink Design for a Ruggedised LCD SHI Hongbin1 and UEDA Toshitsugu Display 1 WASEDA University, Japan Hua Lu , Chris Bailey A-014 14:30 –14:50 University of Greenwich, UK Low temperature thermocompression bonding based on C-017 13:30-13:50 copper nanostructure for 3D packaging The electrical design of high-speed and high-density ASIC Mingxian Cai1, Mingxiang Chen, Sheng Liu package 1 Huazhong University of Science and Technology, China Tao Wenjun , Li Jun, Zhou Yunyan, Wang Qidong, Cao Liqiang, WAN Lixi Institute of Microelectronics, Chinese Academy of Session12: Packaging Materials & Processes Sciences, China Date Wednesday, August 10, 2011 C-022 13:50--14:10 Time 13:10PM-14:50PM Drawing the packaging landscape for CFL applications Venue Room 2 E.P.B.J. de Bruin1, P.Dijkstra, F.J. Sluijs, J.H.J. Jansen Prof. Liangliang LI Chairs NXP Semiconductors, Netherlands Prof. Mingyu LI C-025 14:10--14:30 Co-chair Diffusion-induced Stresses in the Intermetallic Compound B-018 13:10--13:30 Layer of Solder Joints Preparation of rod-shaped and spherical Silver XIA Guofeng, QIN Fei1, AN Tong, LI Wei nanoparticles & application for Packaging materials Beijing University of Technology, China Jinting Jiu1 and Masaya Nogi C-034 14:30--14:50 Osaka University, Japan Development of Low-cost Wafer Level Package

B-019 13:30--13:50 through Integrated Design and Simulation Analysis Mechanical and Thermal Analysis of TSV interposer Tong Yan Tee1, Glen Siew, Haoyang Chen, Serine Soh, In Filling with Pure Sn, Cu and Cu-Cored Solder 1 Sook Kang, Jong Heon Kim, Hun Shen Ng, Teck Kheng Ran He , Huijuan Wang, Jing Zhou, Xueping Guo, Daquan Lee, Germaine Hoe, Shan Gao Yu and Lixi Wan 26 Nepes, Singapore Session15: Quality & Reliability Session14: Advanced Manufacturing Date Wednesday, August 10, 2011 Technologies & Packaging Equipment Time 13:10PM-14:50PM Date Wednesday, August 10, 2011 Venue Room 5 Prof. Dongyan DING Time 13:10PM-14:50PM Chairs Venue Room 4 Dr. Klaus GALUSCHKI Mr. K.H. TAN F-018 13:10--13:30 Chairs Dr. Li GONG Failure Analysis of Thick Film Resistors on Stainless Steel as Sensing Elemnets E-011 13:10--13:30 1 Channel Quality Comparison for OOG IO Bus Designs Zongyang Zhang , Zhimin Wan, Simin Wang, Sheng Liu Y. L. Li1, Xiaoning Ye Huazhong University of Science & Technology, China Intel Corporation, Taiwan, China F-019 13:30--13:50 E-010 13:30--13:50 Effects of combined thermal and vibration loadings on the wire bond integrity Simulations for a novel fluid dispensing technology based K.A. Kamaludin, M. Mirgkizoudi1, C. Liu, S. Riches on the gas-liquid slug flow Peng Peng, Jianhua Zhang, Jinsong Zhang1 Loughborough University, UK Shanghai University, China F-020 13:50--14:10 E-007 13:50--14:10 Size Effects in Microscale Solder Joint of Electronic Packaging Laser Bonding System for Semiconductor Device and L.M. Yin1, W.Y. Li, S.Wei, Z.L. Xu MEMS Encapsulation Yuanhao Huang, Maoyu Li, Yuneng Lai, Jianhua Zhang1 Chongqing University of Science & Technology, China Shanghai University, China F-021 14:10--14:30 E-006 14:10--14:30 Bonding Wire Options and Their Impact on Product Reliability Investigation of high speed microbump formation through Charles J. Vath, III1 and Richard Holliday electrodeposition enhanced by megasonic agitation Yingtao Tian, Changqing Liu1, David Hutt, Bob Stevens, ComSol Consulting Pte. Ltd., Singapore David Flynn, Marc P.Y. Desmulliez F-023 14:30--14:50 Loughborough University, UK Correlation between Ag Content and Cu Pad Consumption E-003 14:30--14:50 in Lead-Free Solder Joints under Electron Current Stressing Multi-layer transparent film cut mark detection visual 1 system design C. N. Chen, B. Z. Chen, W. H. Wu, and C. E. Ho Bangmao Xiang1, Jiankui chen, Yongan Huang, Zhoupin Yuan Ze University, Taiwan, China Yin Huazhong University of Science & Technology, China

Wednesday, August 10, 15:50PM – 17:30PM Session16: Advanced Packaging & System Printed Circuit Board Electrical Design for Wafer-Level Integration Packaging (WLP) Boping Wu1 and Tingting Mo Date Wednesday, August 10, 2011 Intel Corporation, USA Time 15:50PM-17:20PM A-042 17: 00--17:20 Venue Room 1 The Flip Chip market and supply chain is being reshaped Dr. Ivan SHAM Chairs by new requirements and technologies Dr. Klaus PRESSE Lionel Cadix1 and Christophe Zinck Invited Talk 15:50–16:20 Yole Developpement, France Bottom-up Through Silicon Via (TSV) Filling

Mr. Han Yu Sinyang, China Session17: Packaging Materials & Processes A-038 16:20--16:40 Date Wednesday, August 10, 2011 Nanoprecision Aligned Wafer Direct Bonding and Its Time 15:50PM-17:20PM Outlook Venue Room 2 Dr. Ningcheng LEE Chenxi Wang1 and Tadatomo Suga Chairs The University of Tokyo, Japan Dr. J. G. DUH A-040 16:40--17:00 Invited Talk 15:50–16:20 27 Three Years of Fine Copper Wire Bonding in High Volume F-027 15:50 –16:10 Manufacturing Dynamic Bending Test and Simulation of PBGA Packages Mr. Bernd APPELT Lin LONG1, Guoyuan LI, Pengfei ZHANG, Bin XIE, ASE, USA Xunqing SHI B-032 16: 20--16:40 South China University of Technology, China Towards Quantitative Microstructural Modeling for 3D F-028 16:10 –16:30 Electronic Packaging Leakage failure Analysis of pole pieces used for traveling 1 Zhiyong Wu and Zhiheng Huang wave tube Sun Yat-sen University, China Li Peng1, Bao Sheng Xiang, Shi Guanghua, Lai Weiming, B-033 16:40--17:00 Rao Zhenzhen Conjecture on The Chemical Stability and Corrosion School of microelectronics and Solid-State Electronics, Resistance of Cu-Al and Au-Al Intermetallics in Ball China Bonds F-038 16:30 –16:50 C. D. Breach1 and T.K. Lee Plasma Decapsulation of plastic IC packages with copper ProMat Consultants, Singapore wire bonds for failure analysis 1 B-036 17:00--17:20 J. Tang , H. Ye, J.B.J. Schelen and C.I.M. Beenakker Improving Plated Copper Adhesion for Metallisation of Delft University of Technology, Netherlands Glass PCBs F-039 16:50 –17:10 Baofeng He1, Dennis Patrick Webb and Jon Petzing Reliability analysis on the solder joints in space cable Loughborough University, UK connectors 1 Zhang Xiao-chao , Zhang Zhen-ming, Yangmeng Session18: Packaging Design & Modeling Beijing Spacecrafts, China F-042 17:10 –17:30 Date Wednesday, August 10, 2011 Numerical Simulation and Experiments on the Time 15:50PM-17:20PM Performance of LED Subjected to Thermal Shock Venue Room 3 Xulong Gui1, Xiaobing Luo, Sheng Liu Chairs Dr. Jianqi HE Wuhan National Lab for Optoelectronics, China Dr. Jiangtao ZHENG Invited Talk 15:50–16:20 Design and Reliability of Power Electronics Modules Session20: Quality & Reliability Prof. Hua LU Date Wednesday, August 10, 2011 University of Greenwich, UK Time 15:50PM-17:30PM C-035 16: 20--16:40 Venue Room 5 Heat dissipation design for a high density-high power chip Dr. Ming XUE Chairs package Prof. Kailing PAN Jing zhou1, Liqiang Cao, Xueping Guo, Qidong Wang, F-043 16:10 –16:30 Daquan Yu, Lixi Wan Institute of Microelectronics, Chinese Academy of Transmission Electron Microscopy Investigations on the Sciences, China Growth of Tin Whiskers from CeSn3 Substrate Cai-Fu Li ,Zhi-Quan Liu1, Jian-Ku Shang C-036 16:40--17:00 Institute of Metal Research, Chinese Academy of Sciences, Experimental investigation of gas flow in copper channel China carbon nanotubes coated micro coolers Wang Dianxiao1, Wang Xiaojing, Wang Jia, Li Zongshuo, F-044 16:30 –16:50 Fu Yifeng, Liu Johan A General Weibull Model for Reliability Estimate of Shanghai University, China Anisotropic Conductive Adhesive Joining technology using Accelerated Degradation Data C-039 17:00--17:20 Guang-hua Wu1, Xian-cai Chen, Bo Tao, Zhou-ping Yin The elastic anisotropy of Sn-based intermetallics in solder Huazhong University of Science & Technology, China joints: A first-principles calculation Rong An1, Wei Liu, Chunjin Hang, Yanhong Tian, F-046 16:50 –17:10 Chunqing Wang Electrochemical Corrosion Behavior of Sn-0.75Cu Solder Harbin Institute of Technology, China Joints in NaCl Solution 1 Y. F. Gao, C. Q. Cheng, M.L. Huang, L.H. Wang, J. Zhao Session19: Quality & Reliability Dalian University of Technology, China F-051 17:10 –17:30 Date Wednesday, August 10, 2011 In situ electro-mechanical experiments and mechanics Time 15:50PM-17:30PM modeling of tensile cracking in indium tin oxide thin films Venue Room 4 on polyimide substrates Dr. Zezhong FU 1 Chairs Cheng Peng, Zheng Jia, Dan Bianculli, Teng Li , Jun Lou Prof. Jun WANG 28 University of Maryland, USA Yasmine Rosunally F-052 17:10 –17:30 University of Greenwich, UK Prognostics and Reliability Assessments of Light Emitting Diode Packaging Thamo Sutharssan, Chris Bailey1, Stoyan Stoyanov and

Thursday, August 11, 8:00AM – 9:20AM Session21: Solid State Lighting Packaging & B-055 8:40–9:00 Integration Employment of electroplated and sputtered Ni-Zn films for Date Thursday, August 11, 2011 under bump metallization with Sn-3.0Ag-0.5Cu solder attached during liquid reactions Time 8:00AM-9:20AM H.M. Lin, J.G. Duh1 Venue Room 1 National Tsing-Hua University, Taiwan, China Dr. Barry ZHONG Chairs Dr. Xiaobing LUO B-61 9:00–9:20 G-010 8:00–8:20 Viscosity and thermal conductivity of alumina microball/epoxy composites 3D Silicon-Based Integration Packaging for Light Emitting Hui Yu, Liangliang Li1, Longhao Qi Diodes Bin Cao1, Mingxiang Chen, Kai Wang, Xiaogang Liu, Tsinghua University, China Feng Jiao, Shengjun Zhou, Sheng Liu Wuhan National Laboratory for Optoelectronics, China Session 23: Packaging Design & Modeling G-004 8:20--8:40 Date Thursday, August 11, 2011 Effects of YAG: Ce Phosphor Paricle Size on Optical Time 8:00AM-9:20AM Performance of White LEDs Venue Room 3 1 Zongyuan Liu , Sheng Liu, Cheng Li and Binghai Yu Prof. Bill CHEN Chairs Foshan Nationstar Optoelectronics Co. Ltd., China Prof. Hua LU G-005 8:40--9:00 C-042 8:00–8:20 Study of high power light-emitting diode module failure Vibration and bondability analysis of fine-pitch Cu wire mechanism under an accelerated aging test bonding Bulong Wu, Xiaobing Luo1 and Sheng Liu Chang-Lin Yeh1, Ying-Chih Lee , Yi-Shao Lai Huazhong University of Science & Technology, China Advanced Semiconduct Engineering Inc. Taiwan, China G-008 9:00--9:20 C-043 8:20--8:40 Freeform Lens Design for Uniform Illumination with Failure mechanisms of Ni/Sn3.0Ag0.5Cu/OSP flip chip Extended Source solder joints under high current stressing Dan Wu, Kai Wang, Sheng liu1 S. Ye, M. L. Huang1, L. D. Chen, S. M. Zhou Wuhan National Laboratory for Optoelectronics, China Dalian University of Technology, China C-045 8:40--9:00 Session 22: Packaging Materials & Processes Simulation for the contact resistance of a single anisotropic conductive adhesive particle with rough surface Date Thursday, August 11, 2011 1 Time 8:00AM-9:20AM Xiancai Chen , Bo Tao,Zhouping Yin Venue Room 2 Huazhong University of Science & Technology, China Prof. Liqiang CAO C-047 9:00--9:20 Chairs Prof. Yanhong TIAN Wire sweep study for SOT package array matrix molding with simulation and experimental analysis B-039 8:00--8:20 1 A study on the low temperature sintering-bonding through Jiale Han , Haibin Chen, Ke Xue, Fei Wong, Karina Ag nanoparticles in-situ formed from Ag2O microparticles Leung, Ivan Shiu, Jingshen Wu Fengwen Mu1, Guisheng Zou, Jianfeng Yan, Hailin Bai The Hong Kong University of Science & Technology, and Aiping Wu Hong Kong, China Tsinghua University, China B-044 8:20–8:40 Session 24: Quality & Reliability Effect of electromigration on interfacial reaction of Date Thursday, August 11, 2011 Ni/Sn-3.0Ag-0.5Cu/Cu solder joint in flip chip package Time 8:00AM-9:20AM L. D. Chen, M. L. Huang1, S. Ye, S. M. Zhou, Y. M. Ye, J. F. Venue Room 4 Wang, X. Cao Dr. Boyi WU Chairs Dalian University of Technology, China Dr. Ivan SHAM

29 F-053 8:00–8:20 Session 25: Quality & Reliability Thermomigration in Lead-Free Solder Joints at low Date Thursday, August 11, 2011 Ambient Temperature Time 8:00AM-9:20AM Lan Ding, Yuan Tao, Yiping Wu1 Venue Room 5 Huazhong University of Science & Technology, China Dr. Chenxi WANG Chairs F-054 8:20--8:40 Dr. Min MIAO Improved Humidity Resistance of Leaded Packages F-062 8:00--8:20 through Solder Dip Process 1 Comparison of charge injection in SiO2 and Si3N4 for Yeoh Lai Seng , Ng Eng Keat, Gooi Boon Hooi Capacitive RF MEMS switches Spansion Inc., Malaysia Gang Li1, Ulrik Hanke and Xuyuan Chen F-057 8:40--9:00 Vestfold University College, Norway Crosstalk Analysis and Optimization of High-Speed F-063 8:20--8:40 Interconnects 1 Finite element simulation of interfacial crack propagation Haidong Wang , Jian Song, Fengman Liu, Haifei Xiang, behavior in BGA solder interconnects Wei Gao, Lixi Wan Hong-Bo Qin1, Bin Li, Xun-Ping Li, Xin-Ping Zhang Institute of Microelectronics, Chinese Academy of South China University of Technology, China Sciences, China

F-058 9:00--9:20 F-065 8:40--9:00 Characterization of the hot-cutting defects produced during Effect of rapid thermal cycles on the microstructure of single solder joint the processing of alumina green tape 1 Zeng Chao, Wang Chunqing, Tian Yanhong1, Liu Wei, An Jibing Chen, Yiping Wu , Bing An rong, Hang Chunjing Wuhan National Laboratory for Optoelectronics, China Harbin Institute of Technology, China F-070 9:00--9:20 Theoretical analysis on the element diffusion during thermomigration 1 Yuan Tao, Lan Ding, Yiping Wu , Boyi Wu Huazhong University of Science & Technology, China

Thursday, August 11, 10:20AM – 12:10PM Session 26: Solid State Lighting Packaging & G-020 11:50--12:10 Integration Novel Cooling Solutions for LED Solid State Lighting 1 Date Thursday, August 11, 2011 Kai Zhang , David G. W. Xiao, Haibo Fan, Xiaohua Time 10:20AM-12:10PM Zhang, Zhaoli Gao, Matthew M. F. Yuen The Hong Kong University of Science & Technology, Venue Room 1 Hong Kong, China Mr. T. ONISHI Chairs Prof. Xu CHEN Invited Talk 10:20–10:50 Session 27: Packaging Materials & Processes LED packaging study by tear down approaching Date Thursday, August 11, 2011 Mr. T. ONISHI Time 10:20AM-12:10PM GJ Tech, HK, China Venue Room 2 Prof. Hao TANG G-012 10:50--11:10 Chairs Dr. Bing AN Static and Dynamic Analysis for High Power Light Emitting Diodes Street Lamp under Wind Load Invited Talk 10:20–10:50 Xiaogang Liu1, Zhaohui Chen, Sheng Liu Advanced Epoxy Molding Compound Technology & Wuhan National Lab for Optoelectronics, China Marketing Trend Dr. Tom XIE G-016 11:10--11:30 Henkel, China Effect of Plating Parameters on the Au-Sn

Co-electrodeposition for Flip Chip-LED Bumps B-065 10:50--11:10 J. L. Pan, M. L. Huang1 Microstructure and mechanical properties of Dalian University of Technology, China Sn3Ag0.5Cu3Bi0.05Cr/Cu joints Fei Lin, Wenzhen Bi, Guokui Ju, Xicheng Wei1 G-017 11:30--11:50 Shanghai University, China Effects of die-attach materials on the optical durability and thermal performances of HP-LED B-067 11:10--11:30 Luqiao Yin, Lianqiao Yang, Guangming Xu, Weiqiao Yang, Design, fabrication of through silicon vias based on Shuzhi Li, Jianhua Zhang1 suspended photoresist thin film and its application in Shanghai university, China silicon interposer 30 Ziyang Wu, Chuanguo Dou, Yanhong Wu, Heng Yang1 HUST, China Shanghai Institute of Microsystems and Information H-001 10:50--11:10 Technology, Chinese Academy of Sciences, China Copper Pillar Bump (CPB) Technology Progress Overview B-072 11:30--11:50 Wei Koh 1, PhD, Barry Lin Three Years of Fine Copper Wire Bonding in High Volume Powertech Technology Inc. Manufacturing H-002 11:10--11:30 B. K. Appelt1, Louie Huang, Yi-Shao Lai and Scott Chen Mechanical testing and analysis of polymer based ASE Group Inc., USA flexible solar cell and full cell packaging B-074 11:50--12:10 Xing Chen1, Sheng Liu Investigation of various pad structure influence for copper Wuhan National Lab for Optoelectronics, China wire bondability H-004 11:30--11:50 Qiang Chen1, Zhenqing Zhao, Hai Liu, Jonghyun Chae, Die Bonding of Single Emitter Semiconductor Laser with Myungkee Chung Nano-Scale Silver Paste Samsung Semiconductor China R&D, China Yi Yan, Xu Chen1, Xing-Sheng Liu, Guo-Quan Lu

Tianjin University, China Session 28: Packaging Design & Modeling H-008 11:50--12:10 Date Thursday, August 11, 2011 Packaging of High Power Density Double Quantum Well Time 10:20AM-12:10PM Semiconductor Laser Array using Double-side Cooling Venue Room 3 Technology Dr. Yan ZHANG Jingwei Wang1, Pu Zhang, Lingling Xiong, Xiaoning Li, Chairs Dr. Qing ZHOU Chenhui Peng, Zhenbang Yuan, Lu Guo, Xingsheng Liu Invited Talk 10:20–10:50 Xi’an Focuslight Technologies Co., Ltd., China Advanced package design driven by simulation Dr. Minggang HOU Session 30: Quality & Reliability ANSYS, China Date Thursday, August 11, 2011 C-052 10:50–11:10 Time 10:20AM-12:10PM Main cause of resonance appeared around 7.5GHz on the Venue Room 5 frequency response of S-parameters of PWB Prof. Chris BAILEY 1 Chairs Zhang Nian Yong, Men Chuan, Takeshi Kawai , Ren Wei, Dr. Yanrong ZHANG Wu Xiao Qing Invited Talk 10:20–10:50 Xi’an Jiaotong University, China Effect of Interfacial Reaction on Reliability of Flip Chip C-054 11:10--11:30 Lead-free Solder Joints Solder Ball Drop Reliability Investigations: BGA versus Prof. Mingliang HUANG WLP DLUT, China 1 Amarinder Singh Ranouta, Xuejun Fan F-071 10:50--11:10 Lamar University, USA TEM Study on the Cu Wire Stitch Bonding Interface C-060 11:30--11:50 XingJie Liu1, TeChun Wang, YuQi Cong, JiaJi Wang, On the analysis of dynamic effect in the impact stage of Fudan University die pick-up process F-077 11:10--11:30 Bo Peng1, YongAn Huang, ZhouPing Yin and YouLun Xiong The Effect of Thermal aging on the mechanical properties Huazhong University of Science & Technology, China of molding compounds and the reliability of electronic packaging

C-061 11:50--12:10 Daoguo Yang1, Zaipu Cui A new RF Capacitive Accelerometer Embedded in LTCC Guilin University of Electronic Technology, China Packaging Substrate 1 Rui Cao, Zhe Wang, Yufeng Jin , Min Miao, Hua Gan A-024 11:30--11:50 Peking University, China Investigations on microstructures and properties of low Ag content Sn-Ag-Cu lead-free solder alloys 1 Wei guoqiang , Wan zhonghua Session 29: Emerging Technologies South China University of Technology, China Date Thursday, August 11, 2011 A-037 11:50--12:10 Time 10:20AM-12:10PM Chip-on-board (COB), Wafer-level Packaging of LEDs Venue Room 4 Using Silicon Substrates and Hot-formed Glass-bubble Prof. James CAI Chairs Caps Dr. Andy TSENG Hui Yu, Jintang Shang1, Chao Xu, Xinhu Luo, Jingdong Invited Talk 10:20–10:50 Liu and Li Zhang Several Co-design Issues Using DfX for Solid State Southeast University, China Lighting Prof. Sheng LIU 31 OVERVIEW OF POSTER PRESENTATION SESSIONS Poster Session 1 – August 10, Wednesday 09:20AM--10:20AM Area 1 Area 2 Area 3 Area 4 Area 5 (Session A) (Session B) (Session C) (Session D) (Session F) A-007, A-008, A-009, B-001, B-004, B-006, C-001, C-009, C-010, D-001, D-002, D-003, F-004, F-008, F-010, Chairs: A-011, A-012, A-015, B-007, B-009, B-012, C-013, C-015, C-018, D-005, D-007, D-008, F-012, F-013, F-014, Dr. Jinsong ZHANG A-016, A-019, B-013, B-017, B-020, C-019, C-020, C-021, D-010, D-012, F-015, F-016, F-017, Dr. Xiuzhen LU B-021, B-022, B-023, C-024, C-026, F-022, F-024, B-024, B-025, B-027,

Poster Session 2 – August 10, Wednesday 14:50PM--15:50PM Area 1 Area 2 Area 3 Area 4 Area 5 (Session A) (Session B) (Session C) (Session E) (Session F) A-021, A-023, A-027, B-037, B-040, B-041, C-027, C-028, C-029, E-002, E-004, E-005, F-025, F-029, F-030, Chairs: A-031, A-032, A-033, B-042, B-043, B-045, C-030, C-031, C-033, E-008, E-009, F-031, F-032, F-033, Dr. Jinsong ZHANG A-034, A-036, A-043, B-046, B-047, B-048, C-037, C-038, C-040, F-035, F-036, F-041, Dr. Xiuzhen LU B-049, B-050, B-051, C-041, C-044, C-046, F-045, F-047, F-048, B-052, B-053, B-054, F-049, F-050,

Poster Session 3 – August 11, Thursday 9:20AM--10:20AM

Area 1 Area 2 Area 3 Area 4 Area 5

(Session G) (Session B) (Session C) (Session H) (Session F) G-001, G-003, G-006, B-056, B-057, B-058, C-048, C-049, C-050, H-003, H-005, H-007, F-055, F-056, F-059, Chairs: G-007, G-013, G-014, B-059, B-060, B-064, C-053, C-056, C-057, H-009, H-010, H-011, F-061, F-064, F-066, Dr. Jinsong ZHANG G-015, G-018, G-019, B-066, B-070, B-071, C-058, C-059, C-062, H-012, H-013, H-014, F-069, F-074, F-075, Dr. Xiuzhen LU B-073, H-015, F-076, F-079, F-080, F-081, F-082,

32

POSTER SESSION 1 Note: Only the contact information of the first author is provided because of the length limitation of the conference program. Wednesday, August 10, 9:20AM – 10:20AM Area 1 (Session A): Advanced Packaging & Using Thick BCB as Dielectric at Wafer Level 1 System Integration Jiajie Tang , Xiao Chen, Xiaowei Sun, Le Luo A-007 Shanghai Institute of Microsystem and Information Technology, China Finite element stress analysis of 3D TSV stack subject to large temperature loading Zhiyuan Zhu, Wenping Kang, Yunhui Zhu, Min Yu, Min Area 2 (Session B): Packaging Materials & Miao, Jing Chen, Yufeng Jin1 Processes Peking University, China B-001 A-008 The Improvement of Bondability and Die-Shear force of A Low Cost TSV Interposer Fabrication Process and Its Chips Thermosonically Bonded to Flex Substrates by Modeling Depositing a Nickel Layer Yunhui ZHU, Shenglin MA, Qinghu CUI, Wenping KANG, Cheng-Li Chuang1, Jong-Ning Aoh, Chi-Chuan Pan Zhiyuan ZHU, Xin SUN, Guanjiang WANG, Mengmeng Chung Shan Medical University, Taiwan, China 1 ZHANG, Jing CHEN, Min MIAO, Yufeng JIN B-004 Peking University, China Effect of organic acid fluxes on wetting of Sn-Bi solder A-009 on Cu surface 3D integration of Pressure Sensor System with Through H. C. Shi, A. P. Xian1 Silicon Via (TSV) Approach Institute of Metal Research, Chinese Academy of 1 Tao WANG , Jian CAI, Qian WANG, Hao ZHANG, Sciences, China Zheyao WANG B-006 Tsinghua University, China Fragility Suppression Via BGA With SAC105Ti Ball A-011 Weiping Liu, Ning-Cheng Lee1, Simin Bagheri, Polina Experimental study on EFO process of thermosonic wire Snugovesky, Jason Bragg, Russell Brush, Blake Harpe bonding by using high-speed video record Indium Corporation, USA Xiang Kang1, Han Lei B-007 Central South University, China Superhydrophobic nickel films fabricated by A-012 electro/electroless deposition Feifei Tian1, Anmin Hu, Ming Li, Dali Mao The Effect of Polyethylene Glycols upon Copper Electrodeposition in Methanesulfonate Electrolytes Shanghai Jiao Tong University, China Chunhua Ji1, Huiqin Ling, Ming Li, Dali Mao B-009 Shanghai JiaoTong University, China Preparation and Microstructure of Functionally Gradient A-014 Diamond/SAC Composite Solder Bumps Zhong Ying1, Zhang Wei, Wang Chunqing, Wang Chunyu Low temperature thermocompression bonding based on copper nanostructure for 3D packaging Harbin Institute of Technology, China B-012 1 Mingxian Cai , Mingxiang Chen, Sheng Liu Retarding the Electromigration Effects on the Sn-Ag-Cu Wuhan National Lab for Optoelectronics, China Solder Joints by Micro-sized Metal-Particles A-015 Reinforcement 1 Ultra-Low Leak Detection of Cu/Sn SLID for High Limin Ma, Guangchen Xu, Fu Guo , Xitao Wang Density Wafer Level Packaging Beijing University of Technology, China B-013 1 Ani Duan , Knut Aasmundtveit, Nils Hoivik Galvanic Corrosion of Couple with Different Metal Vestfold University College, Norway Substrates and Ni-C Fill Conductive Silicon Rubber A-016 Hu Zhou1, Zhidong Xia, Zhe Li, Xiaohei Liu, Fu Guo Development of deep reactive ion etching of tapered via Beijing University of Technology, China holes for TSV interconnection B-017 1 Xiao CHEN , Jiajie TANG, Wenguo NING, Gaowei XU, Polymer nanocomposites for screen printed electronic Le LUO interconnections Shanghai Institute of Microsystem and Information Kamil Janeczek1, Aneta Arazna, Konrad Futera, Grazyna Technology, Chinese Academy of Sciences, China Koziol, Malgorzata Jakubowska, Anna Młozniak, A-019 Wojciech Steplewski Fabrication of Integrated Microwave Passive Devices Tele and Radio Research Institute, Poland

33 B-020 C-013 Nanoindentation for measuring mechanical properties of FE simulation of joint volume effect on fracture behavior Sn-Ag-Cu-RE BGA solder joints of BGA structure Sn3.0Ag0.5Cu solder interconnects Wang Lifeng1, LIU Meirna, Tian Chong jun, Yang under lap shear loading Wenxuan J.M. Xia1, X.P. Li, X. Ma, X.P. Zhang Harbin University of Science & Technology, China South China University of Technology, China B-021 C-015 Influence of rare earth addition on the microstructure of Investigation of bulk resistance for metal-coated polymer Sn-Cu-Ni solder and interfacial reaction of particles used in anisotropic conductive adhesive Cu/Sn-Cu-Ni/Cu microscale solder joints Xiancai Chen1, Bo Tao, Zhouping Yin 1 Wei Li , Min-Bo Zhou, Xiao Ma, Xin-Ping Zhang Huazhong University of Science & Technology, China South China University of Technology, China C-018 B-022 A Study of Thermal Behavior of High Power Electroless and Eletroplating Copper on Liquid Crystal Double-Quantum-Well Semiconductor Laser Polymer (LCP) for High Frequency Applications Pu Zhang1, Xiaochen Ding, Jingwei Wang, Xiaoning Li, Meisheng Zhou1, Wenlong Zhang, Ming Li, Dongyan Ding Lingling Xiong, Chenhui Peng, Xiang Ou, Xingsheng Liu Shanghai Jiao Tong University, China Xi'an Institute of Optics and Precision Mechanics, B-023 Chinese Academy of Sciences, China Preparation and properties of conductive polymer doped C-019 with Ag-coated fiber glass for EMI shielding Investigation on Lead-free Solder Joint Reliability of Xiaohei Liu1, Zhidong Xia, Bo Yuan,Mengke Zhao, Fu Edge-Bonded CBGA under Temperature Cycling 1 Guo Y. Sing Chan, Fubin Song, S. W. Ricky Lee Beijing University of Technology, China The Hong Kong University of Science and Technology, B-024 Hong Kong, China Preparation and deposition process of Cu/Al powder in C-020 conductive polymer for EMI shielding Design optimization on the CoB LED module Gong Yu-bing1 1 Xing zhang , Zhidong Xia, Shaofan Zhao, Yong Gao Guilin University of Electronic Technology, China Beijing University of Technology, China, C-021 B-025 Molecular Dynamics Simulation for the Bonding Energy Enhanced thermoelectric figure of merit of Bi2Te3-based of Metal-SWNT Interface thin-film microcooler with non-planar barrier structure Yahui Zhang1, Zhili Hu, Yan Zhang, Lilei Ye, Johan Liu 1 Leilei Han , Chunqing Wang Shanghai University, China Harbin Institute of Technology, Nangang, China C-024 B-027 A Constitutive Model for Lead-free Solders by Size Effect on Coalescence of Intermetallic Compounds Considering Damage Effects at High Strain Rates in Reflowed Sn-Ag-Cu Solder Balls and Sn-Ag-Cu/Cu WANG Xuming, QIN Fei1, AN Tong Solder Joints Beijing University of Technology, China Min-Bo Zhou1, Xiao Ma, Xin-Ping Zhang C-026 South China University of Technology, China Influence of Interfacial Delamination on Temperature Distribution of QFN Packages Area 3 (Session C): Packaging Design & BAN Zhaowei, QIN Fei1, WANG Xuming Modeling Beijing University of Technology, China C-001 The Copper Stud Bumping Shaping Simulation Based on Area 4 (Session D): High Density Substrate & Thermal-Solid couple analysis SMT Zhang Shanshan1 D-001 Anyang Institute of Technology, China Study on Solder Joint Image Segmentation Techniques C-009 Based on Matlab Signal Integrity Simulation for SiP Using GTLE ZHU Shao-hua1,WU Zhao-hua,SUN Yu-feng 1 Jia Jia , Liqiang Cao, Lixi Wan Guilin University of Electronic Technology, China Institute of Microelectronics, Chinese Academy of D-002 Science, China Pad Design, Soldering Technology and Reliability of C-010 Package on Package Modeling of kink effect for undoped polycrystalline Yuming Wang1, Jian Cai, Wang Beibei, Yang Xinghua silicon thin-film transistors Tsinghua University, China Hongyu He1, Xueren Zheng D-003 Guangdong University of Technology, China SMD Reliability Research Base on Stolkarts Fatigue 34 Model improved color consistency Zhao Wang1, Heming Zhao, Wenzhong Lou, Liu Shengjun Zhou1, Sheng Liu Chuanqin , Hanwei Li, Li Jin Shanghai Jiao Tong University, China North university of China, China F-012 D-005 Tensile Properties of PV ribbons with Sn-Pb-X Coating Study on Intelligent Identification Technology of Solder Xuewei Wu, Dongyan Ding1, Yanting Zhou, Bai Han, Joints Defects Based on LMBP Neural Network Yunhong Yu, Xulin Sun, Ming Li, Dali Mao 1 WU Zhao-hua Shanghai Jiao Tong University, China GuiLin University of Electronic Technology, China F-013 D-007 Tin whisker formation on electroless tin films deposited Study on the Heat Dissipation of the Thermal Via in T/R on lead-frame alloys Modules Based on BP-GA Ting Liu, Yiqing Wang, Dongyan Ding1, Klaus-Peter Tang-wen Bi1, De-jian Zhou Galuschki, Yu Hu, Angela Gong, Ming Li, Dali Mao GuiLin University of Electronic Technology, China. Shanghai Jiao Tong University, China D-008 F-014 The intelligent detection method study of PQFP solder Influence of Reflow Atmosphere on the Lead-Free Solder joint defects based on improved neural network Joints Tianxiang Yan1, Dejian Zhou Yanting Zhou, Dongyan Ding1, Bai Han, Xuewei Wu, Guilin University of Electronic Technology, China Xulin Sun, Yunhong Yu, Ming Li, Dali Mao D-010 Shanghai Jiao Tong University, China Mechanical and Thermal Analysis of 3D embedded F-015 capacitor filling with conductive adhesive 1 Phase Segregation under Reversed Current Stressing in Huijuan Wang , Daquan Yu, Ran He, Fengwei Dai, Eutectic Sn-based Solder Joints Xueping Guo, Lixi Wan Sihan Liu1, Guangchen Xu, Fu Guo, Andre Lee, K.N. Institute of Microelectronics Chinese Academy of Subramanian, Sciences, China Beijing University of Technology, China

D-012 F-016 A new measurement method and electrical design for high Simulation and Experimental Investigation for Board density optoelectronics integration 1 Level Package-on-Package in Drop Test Fengman Liu , Baoxia Li, Yunyan Zhou, Wei Gao, Haifei Zerui Fan, Xiaohu Yao1 Xiang, Haidong Wang, Jian Song, Zhihua Li, Kun Yang,Liqiang Cao,Lixi Wan South China University of Technology, China Institute of Microelectronics, Chinese Academy of F-017 Science, China Preparation and Properties of Electroless Deposited NiP, NiWP as Barrier Layer on p-type Si 1 Area 5 (Session F): Quality & Reliability Yuhang Xin , Anmin Hu, Ming Li, Dali Mao F-004 Shanghai Jiao Tong University, China. A Damage model for SnAgCu Solder under Thermal F-022 Cycling Application of Response Surface Methods in Lead-free Hui Xiao1, Xiaoyan Li, Na Liu, Yongchang Yan, Solder Joints of Plastic Ball Grid Array Thermal Fatigue Beijing University of Technology, China Life Prediction Zhao Qiang1, Dejian Zhou F-008 GuiLin University of Electronic Technology, China Irregular tin whisker growth on the surface of Sn-3.8Ag-0.7Cu-1.0RE solder joints F-024 Hu Hao1, Jun Tian, Guangchen Xu, Fu Guo, Yonglun Oxidation behavior of Sn-9Zn-3Bi-XCr solders under Song high-temperature condition 1 Beijing University of Technology, China Jing Hu , Anmin Hu,Ming Li, Dali Mao F-010 Shanghai Jiao Tong University, China In situ measurement and binning system of LED for

35 POSTER SESSION 2 Wednesday, August10, 14:50PM – 15:50PM Area 1 (Session A): Advanced Packaging & Area 2 (Session B): Packaging Materials & System Integration Processes A-021 B-037 An Application of System in Package Technology: UTI Improving the Thermal Conductivity of Epoxy Resins ZHU Wenhui1, GUO Xiaowei, WEI Jianyou, WANG with Mesogenic Units for Electronic Packaging 1 Yongzhong, LI Xizhou, QIN Fei, XIA Guofeng Jingfeng Hao , Dayong Gui, Jianhong Liu, Wentao Zeng Tian shui Hua tian Microelectronics Co., Ltd, China Shenzhen University, China A-023 B-040 Thermal cycling reliability of edge and corner bonded Deformation characteristics of micrometer coarse-grained package stackable very thin fine pitch ball grid array aluminum wires exposed under ultrasonic at room assemblies temperature 1 SHI Hongbin1 and UEDA Toshitsugu. Hongjun JI, Mingyu LI WASEDA University, Japan Shenzhen Graduate School, Harbin Institute of A-027 Technology, China Development Process of Phosphor Coating with Screen B-041 Printing for White Light Emitting Diode Packaging Synthesis and Characterization of Benzocyclobutene- Shan Yu1, Liang Yang, Feng Jiao, Huai Zheng, Mingxiang Functionalized Siloxane Thermoset with a Cyclic Chen, Sheng Liu Structure 1 Wuhan National Laboratory for Optoelectronics, China Jun Yang , Mingfei Sun, Yuanrong Cheng, Fei Xiao A-031 Fudan University, China Process characterization and optimization of copper TSV i B-042 nterconnection The study on the shaping of electroplated Copper Pillar Shenglin Ma, Yunhui Zhu, Xin Sun, Min Miao, Jin Chen, Bumping 1 Yufeng Jin 1 Ying Han , Hongqi Sun, Su Wang, Ming Li, Jiangyan Sun Peking University, China Shanghai Jiaotong University, China A-032 B-043 Process development of multi-layer stacked chip module Solder wetting on the substrates with Tin finish 1 Shenglin Ma, Xin Sun, Yunhui Zhu, Wenping Kang, Cai Chen, Lei Zhang and J. K. Shang Qinghu Cui, Min Miao, Jin Chen, Yufeng Jin1 Institute of Metal Research, Chinese Academy of Peking University, China Sciences, China A-033 B-045 Wafer Level Vacuum Packaging for MEMS Device by Elecromigration-induced failure of Ni/Sn3.0Ag0.5Cu/ Solder Sealing ENEPIG flip chip solder joint 1 Bing An1, Gan-ran Tang, Ya-nan Sun, Yi-ping Wu S.M. Zhou, M.L. Huang , L.D. Chen, S. Ye, Y.M. Ye, J.F. Huazhong University of Science & Technology, China Wang, X. Cao A-034 Dalian University of Technology, China Wafer-level Chip-to-Wafer Integration of High-Sensitivity B-046 MEMS and IC Effect of Solder Volume on Interfacial Reaction Between Gaowei Xu1, Peili Yan, Xiao Chen, Wenguo Ning, Le Luo, Sn-3Ag-0.5Cu Solder Ball and Cu Pad After Multiple Jiwei Jiao Reflows 1 Shanghai Institute of Microsystem and Information Luwei Liu, Mingliang Huang Technology, Chinese Academy of Sciences, China Dalian University of Technology, China A-036 B-047 Preparation of Micro-nano Glass Cavities by a Novel Hot Mechanical Properties and Electrochemical Corrosion Forming Process Behavior of Al-Cu Solder Joints with solder alloys of 1 Sn-Zn-Al, Sn-Zn-Ag, Sn-Zn-Ag-Al Xinhu Luo, Jintang Shang , Hui Yu, Jingdong Liu 1 Southeast University, China N. Kang, M. L. Huang Dalian University of Technology, China A-043 B-048 Solution to Leakage of Polyimide-structural Wafer Level Recent progress in the studies of low melting Sn-based Package 1 Pb-free solder alloys Dong Chen , CM Lai, KH Tan, Li Zhang, XinJiang Long Yang Lin1, Luqiao Yin, Xicheng Wei Jiangyin Changdian Advanced Package Co., LTD, China Shanghai University, China B-049 Effects of soldering time and cooling rates on microstructures of intermetallic compounds in Sn-Ag/Cu 36 soldering reaction Sciences, China L. Y. Gu, L. Qu, H. T. Ma1 C-031 Dalian University of Technology, China A novel cooling structure for electronic package B-050 Jun Li1, Xueping Guo, Jing Zhang, Liqiang Cao, Lixi Wan Effect of Electromigration on Creep Rupture Life of Institute of Microelectronics, Chinese Academy of Sn-Ag-Cu Solder Joints Sciences, China H. Y. Liu, Q. S. Zhu1, Z. G. Wang, J. K. Shang C-033 Institute of Metal Research, Chinese Academy of Power Integrity Simulation for Multilayer Power Sciences, China Distribution Networks Based on GTLE and Via Model B-051 Yunyan Zhou1, Lixi Wan, Shuhua Liu, Liqiang Cao, Jia jia Thermal and Dielectric Properties of Bismaleimide- Institute of Microelectronics, Chinese Academy of Triazine resin/Boron Nitride Composite Sciences, China Xiaoliang Zeng, Shuhui Yu1, Rong Sun, Ruxu Du C-037 Shenzhen Institutes of Advanced Technology, Chinese Geometric optimization of Carbon nanotubes(CNTs) Academy of Sciences, China microchannel with liquid flow B-052 Wang Dianxiao1, Wang Xiaojing, Wang Jia, Li Zongshuo Carboxyl-Terminated Polyesterimide/Epoxy Resin Shanghai University, China System: Preparation and Thermomechanical Properties C-038 Dayong Gui1, XinMiao, Jingfeng Hao, Wentao Zeng, Current optimization of different chips for High Power Jianhong Liu Light-emitting diodes Shenzhen University, China Liang Yang, Sheng Liu1, Run Chen, Zhicheng Lv B-053 Huazhong University of Science & Technology, China Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu C-040 lead-free solder joints Effects of Package Type, Die Size, Material and Lina Niu, Yanhong Tian1, Chunqing Wang Interconnection on the Junction-to-Case Thermal Harbin Institute of Technology, China Resistance of Power MOSFET Packages B-054 Cong Yue1, Jun Lu, Xiaotian Zhang, Yueh-Se Ho Dielectric properties of BaTiO3 -based mu ltilayered thin Agape Package Manufacturing Ltd., China films for capacitors prepared by sol-gel technique C-041 Bin Li1, Chunqing Wang, Wei Zhang, Ying Zhong, Weiwei Modeling and Design of Coplanar Structure in QFP80 Wu Package for RFIC Applications Harbin Institute of Technology, China Sun haiyan1, Wu jianhui Southeast University, China Area 3 (Session C): Packaging Design & C-044 Modeling Thermal Stress Simulation of PBGA under Natural Convection Using A Fluid-solid Coupling Method C-027 Zhimin Wan, Ling Xu, Xiaobing Luo1, Sheng Liu Morphology and nano-indentation properties of Huazhong University of Science & Technology, China intermetallic compounds in solder joints ZHONG Weixu, QIN Fei1, AN Tong C-046 Beijing University of Technology, China Low Electromagnetic Interference Optoelectronic Packaging of a 40Gbps Optical Transceiver C-028 WAN Lixi1, LI Zhihua, LI Baoxia, LIU Fengman, LI Jun, 3D Modeling and Simulation of Heat Transfer for SONG Jian, XIANG Haifei & ZHONG Hanmei Internal Channel Cooling of 3D-Chip Stacks Institute of Microelectronics, Chinese Academy of 1， Jing Zhang Guidotti.Daniel, Xueping Guo, Jing Zhou, Sciences, China Liqiang Cao, Daquan Yu, Lixiwan

Institute of Microelectronics, Chinese Academy of Sciences, China Area 4 (Session E): Advanced Manufacturing C-029 Technologies & Packaging Equipment Modeling and Finite-Element Full-wave Simulation of E-002 Glass Interposer with TGVs (Through-Glass-Vias) for 3D Development of a three-dimensional integrated solder packaging ball bumping & bonding method for MEMS devices Zhang jing1, Sun xiaofeng, Yu daquan, Cao liqiang, Wan Lei Yang1, Wei Liu, Chunqing Wang, Yanhong Tian lixi Harbin Institute of Technology, China Institute of Microelectronics, Chinese Academy of E-004 Sciences, China Technology of Embedded Capacitance And Resistance Hu Shaohua1 C-030 Shennan Circuit Co., China Ultra-Wideband Noise Isolation on Power Distribution Network of High-speed Package Substrate E-005 Baoxia Li1 and Lixi Wan An Experimental Investigation on Thermal Contact Institute of Microelectronics, Chinese Academy of Resistance Across Metal Contact Interfaces Xiaobing Luo1, Han Feng, Jv Liu, Minglu Liu and Sheng 37 Liu Dongliang Wang1,Yuan Yuan, Le Luo Huazhong University of Science & Technology, China Shanghai Institute of Micro-system and Information E-008 Technology, Chinese Academy of Sciences, China Novel Design of Handling System for Silicon Wafer F-035 Thinning Effect of Fixation Method on Solder Joint Vibration Cao Li1, Xuefang Wang, Shengjun Zhou, Chang Hu, Fatigue Reliability of High Density PCB Assembly Sheng Liu Xueli. Qi1, Bin. Zhou, Yijun. Xu, Yunfei. En, Guoyuan. LI Huazhong University of Science & Technology, China South China University of Technology, China E-009 F-036 Study of GaN-based light-emitting diodes with double Study on the adhesion and reliability of epoxy molding roughened surfaces compound and shaped Pd preplated leadframes 1 Lianqiao Yang , Jianzheng Hu, Meijuan Fu, Jianhua Mingzhi Ni1, Wenjing Zhang, Ming Li, Dali Mao Zhang Shanghai Jiao Tong University, China Shanghai University, China F-041

The Common Failure Mechanisms of Plastic Area 5 (Session F): Quality & Reliability Encapsulated Devices Induced by Package Defect F-025 Yuan Chen1, Ping Li SOP Package Surface Discoloration after PCT Test The Fifth Electronics Research Institute of Ministry of Mu-Chun Wang1, Hsin-Chia Yang, Chuan-Hsi Liu, Industry and Information Technology, China Ren-Hau Yang F-045 Minghsin University of Science & Technology, Taiwan, The impact of wire bonding on the transmission China performance of high-speed links in SiP F-029 YANG Kun1, GAO Wei, LI Zhihua, WAN Lixi The solder volume effect on the creep behavior of BGA Institute of Microelectronics, Chinese Academy of structure Cu/Sn-3.0Ag-0.5Cu/Cu joints Science, China 1 X.P.Li , J.M. Xia, X.P. Zhang F-047 South China University of Technology, China Vibration Reliability Test and Analysis for Vibration- F-030 Induced Solder Joint Failure of PBGA Assembly 1 Reliability of discoloration of silver colloid for Bin ZHOU , Yunfei EN, Xueli QI microelectronic package Science and Technology on Reliability Physics and Rao zhenzhen1, Bao Shengxiang, Shi Guanghua, Li Application of Electronic Component Laboratory, China Peng,, Ye Jianhai F-048 University of Electronic Science & Technology of China, Study of Junction Temperature with degradation of High China Power Light-emitting diodes F-031 Quan Chen, Xiaobing Luo1, Run Chen, Sang Wang, The Technology Study of BGA Solder Joint Zhaohui Chen, Sheng Liu Two-dimensional Shape in the Information Extraction Huazhong University of Science & Technology, China 1 Wan Yuan , Zhou De-jian, Zhu Shao-hua F-049 Guilin University of Electronic Technology, China Drop Impact Test on High Power Light Emitting Diodes F-032 Module Kirkendall Voids Evolution in Sn-Ag-In Solder Bumps Tao Peng, Xuefang Wang, Run Chen, Qin zhang, Sheng 1 and Its Effect on Reliability Liu Dongliang Wang1,Yuan Yuan, Qiuping Huang, Wenguo Huazhong University of Science & Technology, China Ning, Le Luo F-050 Shanghai Institute of Micro-system and Information Application of silicon stress sensor in flip chip packaging Technology, Chinese Academy of Sciences, China system F-033 Chengjie Jiang1, Fei Xiao, Heng Yang, Chuanguo Dou Effect of indium addition on the formation of large Fudan University, Shanghai China Ag3Sn plate in Sn-Ag solder bumps

38 POSTER SESSION 3

Thursday, August 11, 9:20AM – 10:20AM Area 1 (Session G): Solid State Lighting B-056 Packaging & Integration Synthesis and Characterization of a Novel Liquid Silicone G-001 Rubber (LSR) Incorporated with Phenyl-POSS Wentao Zeng1, Dayong Gui, Jianhong Liu, Jingfeng Hao Analysis of thermal spreading resistance in high power LED package and its design optimization Shenzhen University, China. Shaojie Dong1, Qiang Zhou, Minghua Wang, Xiaoqing B-057 Jiang, Jianyi Yang The evolution of interfacial microstructure of Sn3.5Ag Zhejiang University, China solder bump with Cu under-bump metallization 1 G-003 Jinglin Bi, Anmin Hu, Ming Li , Dali Mao Structural Design and Heat Dissipation Research of Shanghai Jiao Tong University, China Integrated 3W White LED Miner’s Lamp B-058 Rongbin Ren1, Daoguo Yang, Dongjing Liu Effect of Al2O3 addition in Sn-Ag-Cu solder balls on the Guilin University of Electronic Technology, China microstructure and shearing strength of BGA packages G-006 with immersion Sn surface finish Precise model of phosphor geometry of conventional L. C. Tsao1, M. W. Wu, L. P. Feng dispensing in LEDs packaging Pingtung University of Science & Technology, Taiwan, Huai Zheng, Jinlong Ma1,Xiaobing Luo1 and Sheng Liu China Huazhong University of Science & Technology, China B-059 G-007 Magnetic and Dielectric Property of FeAlSi/BaTiO3/ Epoxy Composite Effect of the amount of phosphorous silicone gel on the 1 optical properties of phosphor-converted white Wenhu Yang, Shuhui Yu , Rong Sun light-emitting diodes packaging Shenzhen Institutes of Advanced Technology, China Run Hu, Xiaobing Luo1 and Sheng Liu B-060 Huazhong University of Science & Technology, China Research on SiCp/Cu Composites Preparation and G-013 Thixo-forming Process Simulation 1 Effects of grooves substrate on interfacial resistance for Kaikun Wang LED modules University of Science & Technology Beijing, China Tao Peng, Mingxiang Chen, Xiaogang Liu, Sheng Liu1 B-064 Wuhan National Lab for Optoelectronics, China Improvement of Copper Wire Bonding on Pre-Plated G-014 Leadframe 1 Research on heat dissipation of high heat flux multi-chip Bing An , Lan Ding, Techun Wang, Tailieh Lu, Liangquan white GaN-based LED lamp Sun, Yiping Wu Fengze Hou1, Daoguo Yang, G.Q. Zhang Huazhong University of Science & Technology, China Guilin University of Electronic Technology, China B-066 G-015 The application of Ni lids in ceramic hermetic package 1 Study of light emitting diodes for the application of plant ZHANG ZhiHong , HE KaiQuan, XIONG HuaBing, LI growth in green house MaoSong, XU Yang Lianqiao Yang1, Jianzheng Hu, Zunmiao Chen, Jianhua Institue of solid state circuit, China Zhang B-070 Shanghai university, China Reliability improvement of epoxy molding compound on G-018 TO252 1 The reliability of high-power LEDs under temperature Hongjie Liu , Wei Tan, Lanxia Li cycles Jiangsu HHCK advanced material Co., Ltd., China Fan Huang, Luqiao Yin, Lianqiao Yang, Jianhua Zhang1 B-071 Shanghai university, China The effect of Wax on the properties of epoxy molding G-019 compound properties 1 Thermal Analysis of Multi-chip Module High Power LED Wei Tan , Hongjie Liu, Lanxia Li,Yanshu Wan Packaging Jiangsu HHCK advanced material Co., Ltd., China Pan Kai-lin, Ren Guo-tao1, Li Peng, Huang Peng B-073 Guilin University of Electronic Technology, China Improvement of Smart Card Mechanical Properties Yi Xiao1, Jianfeng Zeng, Yucai Huang, Jonghyun Chae, Area 2 (Session B): Packaging Materials & Myungkee Chung Processes Samsung Semiconductor China R&D, China

39 Area 3 (Session C): Packaging Design & Shanghai Jiao Tong University, China Modeling H-005 C-048 Self-assembly of three-dimensional microstructures in A vertical distribution LTCC duplexer MEMS via fluxless laser reflow soldering LeiYang1, Wei Liu, ChunqingWang, Yanhong Tian Xing Mengjiang1, Yang Yintang, Li Yuejin Harbin Institute of Technology, China Research Institute of Microelectronics, Xidian University, China H-007 C-049 A New Packaging Structure for High Power Light Emitting Diode for Projection Display Application Design of Band-pass Filter based on Different Materials in 1 LTCC/LTCF Technology Xiaoning Li , Chenhui Peng, Lingling Xiong, Pu Zhang, Li Yuejin1, Xing Mengjiang, Yang Yintang, Jingwei Wang, Xingsheng Liu Xi'an Institute of Optics and Precision Mechanics, Research Institute of Microelectronics, Xidian University, Chinese Academy of Sciences, China China H-009 C-050 Printed monopole antenna with extremely wide Optimized Design of a Novel Broadband LTCC Balun for bandwidth on liquid crystal polymer substrates Wireless Application Xia Zhang1, Xiaorong Yan, Johan Liu, Jian Yang, James Xing Mengjiang1, Zhao Yingbo, Li Yuejin, Yang Yintang Morris Xidian University, China Institute of Microelectronics, Chinese Academy of C-053 Sciences, China Complete Small Signal Equivalent Circuit Model of H-010 10Gb/s TOSA Package EML Module 1 Realization of Functionalized Substrate with Embedded ChengZhi Xu , KunZhong Lu Active Components Huazhong University of Science & Technology, China Xia Zhang1, Xueping Guo, Xin Gu, Lingwen Kong, C-056 Liqiang Cao, Lixi Wan The Effect of Initial Warpage of Top Component on POP Institute of Microelectronics, Chinese Academy of Assembly Sciences, China Xiang Qiu1, Jun Wang H-011 Fudan University, China Thermal Management Characterization of Active C-057 Component Embedded into Organic Substrate 1 The fatigue failure analysis of 3D SiP with Thouth Silicon Xueping Guo , Xia Zhang, Jing Zhou, Liqiang Cao, Lixi Via Wan Wenping Kang, Yang He, Zhiyuan Zhu, Min Miao, Jing Institute of Microelectronics, Chinese Academy of Chen, Yufeng Jin1 Sciences, China Peking University, China H-012 C-058 Effects of Micron-Sized Metal Particles on the Mechanical Properties of In-Sn Thermal Interface Effect of Thermal Shock Profile on solder joint of WLCSP 1 Materials RongHua Hong , Jun Wang 1 Xu Zhang , Guangchen Xu, Fu Guo Fudan University, China. Beijing University of Technology, China C-059 H-013 Simulation Studies on PECVD SiO2 Process Aiming at Interfacial Reaction between the Thermopile Materials TSV Application 1 and Eutectic Sn-Based Solders Fangdong Yang , Fuyun Zhu, Min Yu, Haixia Zhang, 1 Shen Li, Ran Zhao, Guangchen Xu , Fu Guo Yufeng Jin Beijing University of Technology, China Peking University, China H-014 C-062 Thin Film Encapsulation for OLED Display using Electrical Simulation and Measurement of IPD with Silicon Nitride and Silicon Oxide Composite Coating Multilayer Thin Film Technology for WLP 1 R Z Sang, H Zhang, L long, B wei, Z K Hua, X Y Wu, and Glen Siew, Serine Soh, Tong Yan Tee , Haoyang Chen, In J H zhang1 Soo Kang, Jong Heon Kim Shanghai University, China Nepes, Singapore H-015

New permeation rate measurement for thin film

encapsulation of organic light emitting diodes Area 4 (Session H): Emerging Technologies Hao zhang, Minyan Zhang, Renzheng Sang, Li Long, Bin H-003 Wei, Jianhua Zhang1 Optimized interdigitated electrode design for GaN-based Shanghai University, China light-emitting diodes 1 Shengjun Zhou , Bin Cao, Pei Wang, Wei Wei, Zhiyin Gan, Sheng Liu

40 Area 5 (Session F): Quality & Reliability Guo Han1, Wang Shuidi, Cai Jian, Jia Songliang F-055 Tsinghua University, China The influence of electromigration and aging on the F-074 reliability of SnAgCu lead-free solder joint at 100C Study of internal stress on electroplating copper used in Guoqiang Wei1, Jian Yao Through Silicon Via filling South China University of Technology, China Xue Feng1, Haiyong Cao, Xianxian Yu, Ming Li F-056 Shanghai Jiaotong University, China Effects of the hardness of Ni/Pd/Au-plated MIS F-075 leadframes on the pull force of wedge bond Optimized Reliability Test and Simulate Analyses for High Power interdigitated electrode design for GaN-based LED light-emitting diodes Zhu Wei-tao1, Pan Kai-lin, Li Peng 1 Guilin University of Electronic Technology, China Rui Guo, Ming Li , Weiping Li, Dali Mao Shanghai Jiao Tong University, China F-076 Numerical Analysis of Temperature and Humidity Effects F-059 on the Reliability of High Power Light Emitting Diode A Comparative Investigation of the Electromigration 1 Huang Jing , Pan Kai-lin, Li Peng, Wang Shuangping behavior between Wedge-type and Linetype Guilin University of Electronic Technology, China Cu/Sn3.0Ag0.5Cu/Cu Interconnects F-079 Wu Yue, Min-Bo Zhou, Xun-Ping Li, Xiao Ma, Xin-Ping Corrosion Behavior and Electrochemical Migration of Zhang1 64Sn-35Bi-1Ag Solder Doped with Zn in NaCl Solution South China University of Technology, China and High Humid Thermal Condition for Electronic F-061 Packaging Failure Analysis Techniques for High Power Light L. Hua1, J. S. Zhang Emitting Diodes Hubei University of Education, China Run Chen1, Qin Zhang, Tao Peng, Feng Jiao, Sheng Liu F-080 Huazhong University of Science & Technology, China A New Commixing Sample Preparation Technology for F-064 the Interface Analysis of Second Wire Bonding with TEM Sample Preparation Device for Molding Compound XingJie Liu1, HaoNan Pu, JiaJi Wang Adhesion Test Fudan University, China Qin Lu1, Wenjing Zhang, Ming Li, Dali Mao F-081 Shanghai Jiao Tong University, China A Numerical Method on Thermal-humidity Behavior F-066 of Electronic Packaging Reliability Study on High Power LED with Chip on Yue Mei, Xiaohu Yao 1 Board South China University of Technology, China Dongjing Liu1, D.G. Yang, Rongbin Ren, Fengze F-082 Hou, Chao Huang Guilin University of Electronic Technology, China Research of the Effects of Microvia Layout on the Printed Circuit Board to the Thermal Fatigue Life of F-069 Fan-Out WCLSP Solder Joints Study of Multilayer AlN Ceramic Package Thermal HU Jiazheng1, WU Zhaohua Resistance Measurement Guilin University of Electronic Technology, China

41 CONFERENCE GUIDELINE（温馨提示）

Welcome to ICEPT-HDP 2011. Please read this guideline carefully, we will be more than happy to serve you. 感谢各位嘉宾代表对本次大会的关注与支持，为了更好地为您提供服务，请您留意会务组温馨提示：

1. Please wear your badge at all times. 会议期间参会者请佩戴代表证，并凭此参加各项活动。 2. Prepare your coupon ready for the meals during the conference as showed in the table below. 代表凭票用餐, 会议期间用餐时间和地点如下表所示。

日期 (Date) 时间 (Time) 用餐地点 (Location) 早餐：一楼塞纳阳光西餐厅 07:00-08:30 Breakfast: Saina Sunshine Restaurant ( 1st floor) August 8 午餐：明轩中餐厅 12:30-13:30 Monday Lunch: Mingxuan Restaurant 晚餐：一楼塞纳阳光西餐厅 18:00-20:00 Dinner: Saina Sunshine Restaurant (1st floor) 早餐：一楼塞纳阳光西餐厅 07:00-08:30 Breakfast：Saina Sunshine Restaurant (1st floor) August 9 午餐：一楼塞纳阳光西餐厅及明轩中餐厅 12:20-13:30 Tuesday Lunch: Saina Sunshine Restaurant & Mingxuan Restaurant (1st floor) 晚宴：二楼宴会厅 18:30-20:30 Conference Banquet: Banquet Hall (2nd floor) 早餐: 一楼塞纳阳光西餐厅 07:00-08:00 Breakfast: Saina Sunshine Restaurant (1st floor) August 10 午餐：一楼塞纳阳光西餐厅及明轩中餐厅 12:10-13:10 Wednesday Lunch: Saina Sunshine Restaurant & Mingxuan Restaurant (1st floor) 晚餐：一楼明轩中餐厅 18:00-20:00 Dinner: Mingxuan Restaurant (1st floor) 早餐: 一楼塞纳阳光西餐厅 07:00-08:00 August 11 Breakfast: Saina Sunshine Restaurant (1st floor) Thursday 午餐、颁奖：一楼明轩中餐厅 12:10-13:40 Lunch and Award: Mingxuan Restaurant(1st floor)

3．Free internet is available for the participants of the conference. Other services like laundry, telephone etc should be paid by yourself, please contact the hotel directly. 会议期间由会务组安排住宿的代表房间上网免费。其它洗衣和电话等服务，请跟总服务台联系、费用自理； 4．Please take care of your valuables including cell phones, laptops and wallet. 请妥善保管好自己随身携带手机、电脑、钱包等贵重物品； 5．Location of Tea Break, Exhibition, and Posters: On the second floor 茶歇、展览、张贴地点：二楼 6．For more details, please read the conference programs. Please switch your phone to silence during conference time and help keep the auditoria in good order. 会议期间的具体安排请查阅会议日程安排，在会场参会的代表，请将手机调成震动状态，请不要大声喧哗， 随意走动，请您配合保持良好的会场秩序。 7．The conference ends at 14:00 on the 11th of August. Please check-out before 14:00, otherwise, the hotel will charge for another half-day. If you need to stay longer days, please ask for helps through conference registration desk in advance to keep your room at the same charge rate. Please mind your departure time to avoid any delay on your trip.

42 会议结束时间：8 月 11 日下午 14:00，请需要退房的代表根据自已的行程清理好行李物品提前办理好退房手 续(如 14:00 前没退房，酒店将加收入住代表半天房费)；如需继续住宿的参会代表请提前向组委会说明，会务 组负责和宾馆协调保留房号，但费用自理（按会议价算）；请参会代表注意自己的返程时间，以免晚点！ 8．Please contact the ticket center in the hotel for booking your return ticket in advance. 需要预订返程票的代表请直接跟您所住酒店的票务中心联系，提前预定； 9．The Riverfront Business Hotel Tel: 021-58969966 酒店联系电话：021-58969966 10．Contacts of Conference Organizers: 会议现场联系： ORGANIZING COMMITTEE: Xicheng Wei (Cell: 13916455151) Ronnie Li QING (Cell: 13910774338) Fenghua Gan (Cell: 15821588261) Gang Huang (Cell: 13917571770) 组织委员会

韦习成（手机：13916455151） 李清（手机：13910774338） 甘凤华（手机：15821588261） 黄刚（手机：13917571770） TECHNICAL COMMITTEE: Daniel Shi (Cell: 00852-66297508) Jingsong Zhang (Cell: 13681843438) Xiuzhen Lu (Cell: 13042180386) Maoyu Li (Cell: 13764479646)

技术委员会

史训清（手机：00852-66297508） 张金松（手机：13681843438） 路秀真（手机：13042180386） 李懋瑜（手机：13764479646）

SHORT COURSE Tina Yang (Cell: 13428781411) Wenhui Zhu (Cell: 18809382656)

课程培训

杨冰冰（手机：13428781411） 朱文辉（手机：18809382656）

43 TRANSPORTATION（交通方式）

Riverfront Business Hotel- Shanghai 上海浦东龙东商务酒店 Address: No.3000, Longdong Avenue, Pudong, Shanghai 地址：上海市浦东张江高科技园区 龙东大道 3000 号 Website: http://www.longdonghotel.com/

Airport Transportation  Taking Taxi from Pudong International Airport to the hotel about 25 minutes and RMB80.  Taking Taxi from Hongqiao Airport to the hotel about 40 minutes and RMB110.  Taking MTRO Line 2 from Pudong International Airport or Hongqiao Airport to Guanglan Station and interchanging Taxi to the hotel about 6 munites and RMB13. 机场交通  从上海浦东国际机场乘坐出租车程到酒店，单程约 25 分钟、80 元。  从上海虹桥机场乘坐出租车程到酒店，单程约 40 分钟、110 元。  从上海浦东国际机场或上海虹桥机场乘坐地铁 2 号线至广兰路站，换乘出租车，单程 6 分钟、13 元。 Public Transportation  Taking Zhagnjiang Circle Line bus from Zhangjiang High-tech Station of MTRO Line 2 to Zhangdong Station.  Taking No 989 bus from Longyang Road Station of MTRO Line 2 to Yangfang Station. 公共交通：  乘坐地铁 2 号线至张江高科站，换乘张江环线巴士到张东路站下车。  乘坐地铁 2 号线至龙阳路站，换乘 989 路巴士到洋房站下车。

Tips: MTRO Line 2 runs across Huangpu River from the west to the east in Shanghai City and connects Hongqiao Railway Station/Hongqiao Airport (Puxi) and Guanglan Station/Pudong International Airport (Pudong).

提示: 地铁 2 号线穿越黄浦江连接上海的浦西和浦东，浦西停靠虹桥火车站和虹桥机场，浦东停靠广兰路站和浦 东国际机场。 Self-drving:  Driving along HuNing Thruway (A11) or HuHang Thruway (A8) to Pudong International Airport, corssing Xupu Bridge to Outer-Ring Tunnel and away the ramp at Longdong Avenue. 自驾车：  沿沪宁高速公路（A11 公路）或沪杭高速公路（A8 公路）往浦东国际机场方向行驶，过徐浦大桥前往外环隧 道方向，龙东大道出口匝道驶下。

44 TRANSPORTATION MAP

45 LAYOUT OF CONFERENCE MEETING ROOMS（会场布局）

46