Undocumented X86 Instructions to Control the CPU at the Microarchitecture Level
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SPP 2019.09.0 Component Release Notes
SPP 2019.09.0 Component Release Notes BIOS - System ROM Driver - Chipset Driver - Network Driver - Storage Driver - Storage Controller Driver - Storage Fibre Channel and Fibre Channel Over Ethernet Driver - System Driver - System Management Driver - Video Firmware - Blade Infrastructure Firmware - Lights-Out Management Firmware - Network Firmware - NVDIMM Firmware - PCIe NVMe Storage Disk Firmware - Power Management Firmware - SAS Storage Disk Firmware - SATA Storage Disk Firmware - Storage Controller Firmware - Storage Fibre Channel Firmware - System Firmware (Entitlement Required) - Storage Controller Software - Lights-Out Management Software - Management Software - Network Software - Storage Controller Software - Storage Fibre Channel Software - Storage Fibre Channel HBA Software - System Management BIOS - System ROM Top Online ROM Flash Component for Linux - HPE ProLiant DL380 Gen9/DL360 Gen9 (P89) Servers Version: 2.74_07-21-2019 (Optional) Filename: RPMS/i386/firmware-system-p89-2.74_2019_07_21-1.1.i386.rpm Important Note! Important Notes: None Deliverable Name: HPE ProLiant DL360/DL380 Gen9 System ROM - P89 Release Version: 2.74_07-21-2019 Last Recommended or Critical Revision: 2.72_03-25-2019 Previous Revision: 2.72_03-25-2019 Firmware Dependencies: None Enhancements/New Features: This revision of the System ROM includes the latest revision of the Intel microcode which provides mitigation for an Intel sighting where the system may experience a machine check after updating to the latest System ROM which contained a fix for an Intel TSX (Transactional Synchronizations Extensions) sightings. The previous microcode was first introduced in the v2.70 System ROM. This issue only impacts systems configured with Intel Xeon v4 Series processors. This issue is not unique to HPE servers. Problems Fixed: Addressed an extremely rare issue where a system booting to VMware may experience a PSOD in legacy boot mode. -
Intel® Architecture Instruction Set Extensions and Future Features Programming Reference
Intel® Architecture Instruction Set Extensions and Future Features Programming Reference 319433-037 MAY 2019 Intel technologies features and benefits depend on system configuration and may require enabled hardware, software, or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifica- tions. Current characterized errata are available on request. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Intel does not guarantee the availability of these interfaces in any future product. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1- 800-548-4725, or by visiting http://www.intel.com/design/literature.htm. Intel, the Intel logo, Intel Deep Learning Boost, Intel DL Boost, Intel Atom, Intel Core, Intel SpeedStep, MMX, Pentium, VTune, and Xeon are trademarks of Intel Corporation in the U.S. -
Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems. -
Hardware Realization of an FPGA Processor – Operating System Call Offload and Experiences
Downloaded from orbit.dtu.dk on: Oct 02, 2021 Hardware Realization of an FPGA Processor – Operating System Call Offload and Experiences Hindborg, Andreas Erik; Schleuniger, Pascal; Jensen, Nicklas Bo; Karlsson, Sven Published in: Proceedings of the 2014 Conference on Design and Architectures for Signal and Image Processing (DASIP) Publication date: 2014 Link back to DTU Orbit Citation (APA): Hindborg, A. E., Schleuniger, P., Jensen, N. B., & Karlsson, S. (2014). Hardware Realization of an FPGA Processor – Operating System Call Offload and Experiences. In A. Morawiec, & J. Hinderscheit (Eds.), Proceedings of the 2014 Conference on Design and Architectures for Signal and Image Processing (DASIP) IEEE. General rights Copyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights. Users may download and print one copy of any publication from the public portal for the purpose of private study or research. You may not further distribute the material or use it for any profit-making activity or commercial gain You may freely distribute the URL identifying the publication in the public portal If you believe that this document breaches copyright please contact us providing details, and we will remove access to the work immediately and investigate your claim. Hardware Realization of an FPGA Processor – Operating System Call Offload and Experiences Andreas Erik Hindborg, Pascal Schleuniger Nicklas Bo Jensen, Sven Karlsson DTU Compute – Technical University of Denmark fahin,pass,nboa,[email protected] Abstract—Field-programmable gate arrays, FPGAs, are at- speedup of up to 64% over a Xilinx MicroBlaze based baseline tractive implementation platforms for low-volume signal and system. -
Horizontal PDF Slides
1 2 Speed, speed, speed $1000 TCR hashing competition D. J. Bernstein Crowley: “I have a problem where I need to make some University of Illinois at Chicago; cryptography faster, and I’m Ruhr University Bochum setting up a $1000 competition funded from my own pocket for Reporting some recent work towards the solution.” symmetric-speed discussions, Not fast enough: Signing H(M), especially from RWC 2020. where M is a long message. Not included in this talk: “[On a] 900MHz Cortex-A7 NISTLWC. • [SHA-256] takes 28.86 cpb ::: Short inputs. • BLAKE2b is nearly twice as FHE/MPC ciphers. • fast ::: However, this is still a lot slower than I’m happy with.” 1 2 3 Speed, speed, speed $1000 TCR hashing competition Instead choose random R and sign (R; H(R; M)). D. J. Bernstein Crowley: “I have a problem where I need to make some Note that H needs only “TCR”, University of Illinois at Chicago; cryptography faster, and I’m not full collision resistance. Ruhr University Bochum setting up a $1000 competition Does this allow faster H design? funded from my own pocket for TCR breaks how many rounds? Reporting some recent work towards the solution.” symmetric-speed discussions, Not fast enough: Signing H(M), especially from RWC 2020. where M is a long message. Not included in this talk: “[On a] 900MHz Cortex-A7 NISTLWC. • [SHA-256] takes 28.86 cpb ::: Short inputs. • BLAKE2b is nearly twice as FHE/MPC ciphers. • fast ::: However, this is still a lot slower than I’m happy with.” 1 2 3 Speed, speed, speed $1000 TCR hashing competition Instead choose random R and sign (R; H(R; M)). -
Microcode Revision Guidance August 31, 2019 MCU Recommendations
microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. -
POWER-AWARE MICROARCHITECTURE: Design and Modeling Challenges for Next-Generation Microprocessors
POWER-AWARE MICROARCHITECTURE: Design and Modeling Challenges for Next-Generation Microprocessors THE ABILITY TO ESTIMATE POWER CONSUMPTION DURING EARLY-STAGE DEFINITION AND TRADE-OFF STUDIES IS A KEY NEW METHODOLOGY ENHANCEMENT. OPPORTUNITIES FOR SAVING POWER CAN BE EXPOSED VIA MICROARCHITECTURE-LEVEL MODELING, PARTICULARLY THROUGH CLOCK- GATING AND DYNAMIC ADAPTATION. Power dissipation limits have Thus far, most of the work done in the area David M. Brooks emerged as a major constraint in the design of high-level power estimation has been focused of microprocessors. At the low end of the per- at the register-transfer-level (RTL) description Pradip Bose formance spectrum, namely in the world of in the processor design flow. Only recently have handheld and portable devices or systems, we seen a surge of interest in estimating power Stanley E. Schuster power has always dominated over perfor- at the microarchitecture definition stage, and mance (execution time) as the primary design specific work on power-efficient microarchi- Hans Jacobson issue. Battery life and system cost constraints tecture design has been reported.2-8 drive the design team to consider power over Here, we describe the approach of using Prabhakar N. Kudva performance in such a scenario. energy-enabled performance simulators in Increasingly, however, power is also a key early design. We examine some of the emerg- Alper Buyuktosunoglu design issue in the workstation and server mar- ing paradigms in processor design and com- kets (see Gowan et al.)1 In this high-end arena ment on their inherent power-performance John-David Wellman the increasing microarchitectural complexities, characteristics. clock frequencies, and die sizes push the chip- Victor Zyuban level—and hence the system-level—power Power-performance efficiency consumption to such levels that traditionally See the “Power-performance fundamentals” Manish Gupta air-cooled multiprocessor server boxes may box. -
A Superscalar Out-Of-Order X86 Soft Processor for FPGA
A Superscalar Out-of-Order x86 Soft Processor for FPGA Henry Wong University of Toronto, Intel [email protected] June 5, 2019 Stanford University EE380 1 Hi! ● CPU architect, Intel Hillsboro ● Ph.D., University of Toronto ● Today: x86 OoO processor for FPGA (Ph.D. work) – Motivation – High-level design and results – Microarchitecture details and some circuits 2 FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT6-LUT 6-LUT6-LUT 3 6-LUT 6-LUT FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT 6-LUT 6-LUT 6-LUT 4 6-LUT 6-LUT FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 5 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 6 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel -
SDG Adhoc Reporting
VMware Deliverable Release Notes This document does not apply to HPE Superdome servers. For information on HPE Superdome, see the following links: HPE Integrity Superdome X HPE Superdome Flex Information on HPE Synergy supported VMware ESXi OS releases, HPE ESXi Custom Images and HPE Synergy Custom SPPs is available at: VMware OS Support Tool for HPE Synergy Information on HPE Synergy Software Releases is available at: HPE Synergy Software Releases - Overview SPP 2021.04.0 Release Notes for VMware vSphere 6.5 BIOS (Login Required) - System ROM Driver - Network Driver - Storage Controller Firmware - Network Firmware - NVDIMM Firmware - Storage Controller Firmware - Storage Fibre Channel Software - Management Software - Storage Controller Software - Storage Fibre Channel Software - System Management BIOS (Login Required) - System ROM Top ROM Flash Firmware Package - HPE Apollo 2000 Gen10/HPE ProLiant XL170r/XL190r Gen10 (U38) Servers Version: 2.42_01-23-2021 (Recommended) Filename: U38_2.42_01_23_2021.fwpkg Important Note! Important Notes: None Deliverable Name: HPE Apollo 2000 Gen10/HPE ProLiant XL170r/XL190r Gen10 System ROM - U38 Release Version: 2.42_01-23-2021 Last Recommended or Critical Revision: 2.42_01-23-2021 Previous Revision: 2.40_10-26-2020 Firmware Dependencies: None Enhancements/New Features: Updated the support for Fast Fault Tolerant Memory Mode (ADDDC) to improve system uptime. Added support to the BIOS/Platform Configuration (RBSU) Time Zones to add Dublin/London (UTC+1). This support also requires the latest version of iLO Firmware, version 2.40 or later. Problems Fixed: This revision of the System ROM includes the latest revision of the Intel microcode which provides a fix for a potential machine check exception under heavy stress with short loops of instructions. -
Hardware Architecture
Hardware Architecture Components Computing Infrastructure Components Servers Clients LAN & WLAN Internet Connectivity Computation Software Storage Backup Integration is the Key ! Security Data Network Management Computer Today’s Computer Computer Model: Von Neumann Architecture Computer Model Input: keyboard, mouse, scanner, punch cards Processing: CPU executes the computer program Output: monitor, printer, fax machine Storage: hard drive, optical media, diskettes, magnetic tape Von Neumann architecture - Wiki Article (15 min YouTube Video) Components Computer Components Components Computer Components CPU Memory Hard Disk Mother Board CD/DVD Drives Adaptors Power Supply Display Keyboard Mouse Network Interface I/O ports CPU CPU CPU – Central Processing Unit (Microprocessor) consists of three parts: Control Unit • Execute programs/instructions: the machine language • Move data from one memory location to another • Communicate between other parts of a PC Arithmetic Logic Unit • Arithmetic operations: add, subtract, multiply, divide • Logic operations: and, or, xor • Floating point operations: real number manipulation Registers CPU Processor Architecture See How the CPU Works In One Lesson (20 min YouTube Video) CPU CPU CPU speed is influenced by several factors: Chip Manufacturing Technology: nm (2002: 130 nm, 2004: 90nm, 2006: 65 nm, 2008: 45nm, 2010:32nm, Latest is 22nm) Clock speed: Gigahertz (Typical : 2 – 3 GHz, Maximum 5.5 GHz) Front Side Bus: MHz (Typical: 1333MHz , 1666MHz) Word size : 32-bit or 64-bit word sizes Cache: Level 1 (64 KB per core), Level 2 (256 KB per core) caches on die. Now Level 3 (2 MB to 8 MB shared) cache also on die Instruction set size: X86 (CISC), RISC Microarchitecture: CPU Internal Architecture (Ivy Bridge, Haswell) Single Core/Multi Core Multi Threading Hyper Threading vs. -
Broadwell Skylake Next Gen* NEW Intel NEW Intel NEW Intel Microarchitecture Microarchitecture Microarchitecture
15 лет доступности IOTG is extending the product availability for IOTG roadmap products from a minimum of 7 years to a minimum of 15 years when both processor and chipset are on 22nm and newer process technologies. - Xeon Scalable (w/ chipsets) - E3-12xx/15xx v5 and later (w/ chipsets) - 6th gen Core and later (w/ chipsets) - Bay Trail (E3800) and later products (Braswell, N3xxx) - Atom C2xxx (Rangeley) and later - Не включает в себя Xeon-D (7 лет) и E5-26xx v4 (7 лет) 2 IOTG Product Availability Life-Cycle 15 year product availability will start with the following products: Product Discontinuance • Intel® Xeon® Processor Scalable Family codenamed Skylake-SP and later with associated chipsets Notification (PDN)† • Intel® Xeon® E3-12xx/15xx v5 series (Skylake) and later with associated chipsets • 6th Gen Intel® Core™ processor family (Skylake) and later (includes Intel® Pentium® and Celeron® processors) with PDNs will typically be issued no later associated chipsets than 13.5 years after component • Intel Pentium processor N3700 (Braswell) and later and Intel Celeron processors N3xxx (Braswell) and J1900/N2xxx family introduction date. PDNs are (Bay Trail) and later published at https://qdms.intel.com/ • Intel® Atom® processor C2xxx (Rangeley) and E3800 family (Bay Trail) and late Last 7 year product availability Time Last Last Order Ship Last 15 year product availability Time Last Last Order Ship L-1 L L+1 L+2 L+3 L+4 L+5 L+6 L+7 L+8 L+9 L+10 L+11 L+12 L+13 L+14 L+15 Years Introduction of component family † Intel may support this extended manufacturing using reasonably Last Time Order/Ship Periods Component family introduction dates are feasible means deemed by Intel to be appropriate. -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References .............................................