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Computational and Experimental Investigations of Laser Drilling and Welding for Microelectronic Packaging Computational and experimental investigations of laser drilling and welding for microelectronic packaging A Dissertation Submitted to the faculty of the Worcester Polytechnic Institute in partial fulfillment of the requirements for the Degree of Doctor of Philosophy in Mechanical Engineering by Wei Han 10 May 2004 Approved: ___________________________________________________________ Prof. Ryszard J. Pryputniewicz, Major Advisor ____________________________________________________________________ Prof. Cosme Furlong, Member, Dissertation Committee ____________________________________________________________________________ Prof. Yiming (Kevin) Rong, Member, Dissertation Committee _________________________________________________________________________ Prof. Gretar Tryggvason, Member, Dissertation Committee Dr. Thomas Marinis, Draper Laboratory, Cambridge, MA Member, Dissertation Committee Prof. John M. Sullivan, Jr., Graduate Committee Representative Copyright © 2004 by NEST – NanoEngineering, Science, and Technology CHSLT – Center for Holographic Studies and Laser micro-mechaTronics Mechanical Engineering Department Worcester Polytechnic Institute Worcester, MA 01609-2280 All rights reserved 2 SUMMARY Recent advances in microelectronics and packaging industry are characterized by a progressive miniaturization in response to a general trend toward higher integration and package density. Corresponding to this are the challenges to traditional manufacturing processes. Some of these challenges can be satisfied by laser micromachining, because of its inherent advantages. In laser micromachining, there is no tool wear, the heat affected zone can be localized into a very small area, and the laser micromachining systems can be operated at a very wide range of speeds. Some applications of laser micromachining include pulsed Nd:YAG laser spot welding for the photonic devices and laser microdrilling in the computer printed circuit board market. Although laser micromachining has become widely used in microelectronics and packaging industry, it still produces results having a variability in properties and quality due to very complex phenomena involved in the process, including, but not limited to, heat transfer, fluid flow, plasma effects, and metallurgical problems. Therefore, in order to utilize the advantages of laser micromachining and to achieve anticipated results, it is necessary to develop a thorough understanding of the involved physical processes, especially those relating to microelectronics and packaging applications. The objective of this Dissertation was to study laser micromachining processes, especially laser drilling and welding of metals or their alloys, for the microscale applications. The investigations performed in this Dissertation were based on analytical, computational, and experimental solutions (ACES) methodology. More specifically, the studies were focused on development of a consistent set of equations representing 3 interaction of the laser beam with materials of interest in this Dissertation, solution of these equations by finite difference method (FDM) and finite element method (FEM), experimental demonstration of laser micromachining, and correlation of the results. The contributions of this Dissertation include: 1) development of a finite difference method (FDM) program with color graphic interface, which has the capability of adjusting the laser power distributions, coefficient of energy absorption, and nonlinear material properties of the workpiece as functions of temperature, and can be extended to calculate the fluid dynamic phenomena and the profiles of laser micromachined workpieces, 2) detailed investigations of the effect of laser operating parameters on the results of the profiles and dimensions of the laser microdrilled or microwelded workpiece, which provide the guideline and advance currently existing laser micromachining processes, 3) use, for the first time, of a novel optoelectronic holography (OEH) system, which provides non-contact full-field deformation measurements with sub- micrometer accuracy, for quantitative characterization of thermal deformations of the laser micromachined parts, 4) experimental evaluations of strength of laser microwelds as the function of laser power levels and number of microwelds, which showed the lower values than the strength of the base material due to the increase of hardness at the heat affected zone (HAZ) of the microwelds, 4 5) measurements of temperature profiles during laser microwelding, which showed good correlations with computational results, 6) detailed considerations of absorption of laser beam energy, effect of thermal and aerodynamic conditions due to shielding gas, and the formation of plasma and its effect on laser micromachining processes. The investigations presented in this Dissertation show viability of the laser micromachining processes, account for the considerations required for a better understanding of laser micromachining processes, and provide guideline which can help explaining and advancing the currently existing laser micromachining processes. Results of this Dissertation will facilitate improvements and optimizations of the state-of-the-art laser micromachining techniques and enable the emerging technologies related to the multi-disciplinary field of microelectronics and packaging for the future. 5 ACKNOWLEDGEMENTS First of all, I would like to express my deep gratitude to my advisor, Prof. Ryszard J. Pryputniewicz, for his guidance and support in the development of this Dissertation. Without his support, this work would be impossible. Thanks are also extended to the members of my Dissertation committee; Prof. Cosme Furlong, Prof. Yiming Rong, Prof. Gretar Tryggvason, Dr. Thomas Marinis, and Prof. John M. Sullivan, Jr., for their time and assistance in this work. Also, I would like to thank Mr. Shivananda Pai Mizar and Mr. Peter Hefti for their invaluable assistance throughout my experimental work, Mr. Adam Klempner and Mr. Ryan Marinis, for their aid during the completion of the experimental work. I would also like to thank all the other members of the Center for Holographic Studies and Laser micro-mechaTronics (CHSLT) for their support and help. I would like to express my great gratitude to my parents and sister, for their endless love and encouragement throughout my studies at WPI. Finally, my very special thanks to my husband, Mingzhe Li, for his profound love, patience, understanding, and unconditional support throughout the development of this Dissertation. I would not have been able to complete this work without his support. 6 TABLE OF CONTENTS Copyright 2 Summary 3 Acknowledgement 6 Table of contents 7 List of figures 10 List of tables 17 Nomenclature 18 1. Objectives 23 2. Introduction 24 2.1. Overview 24 2.2. Methodologies 28 2.3. Dissertation organization 29 3. Literature review 31 3.1. Theoretical and numerical studies 32 3.2. Experimental studies 39 4. Theoretical analysis 44 4.1. General heat transfer problem for laser material processing 45 4.1.1. Governing equation 45 4.1.2. Boundary conditions 46 4.1.3. Analytical solution 48 4.2. Laser drilling 49 4.2.1. One-dimensional model for laser drilling 51 4.2.2. Energy transport in multiple phases 56 4.2.3. Material removal mechanism 61 4.3. Laser welding 75 4.3.1. Thresholds of laser welding 77 4.3.1.1. Conduction welding 77 4.3.1.2. Keyhole welding 79 4.3.2. Laser welding mechanism 81 4.3.3. Metallurgical aspects of laser welding 85 4.3.3.1. Laser welding on stainless steel 87 4.3.3.2. Laser welding on copper 89 7 4.3.4. Thermal stress problem in laser welding 89 4.4. Theoretical considerations 95 4.4.1. Consideration of laser beam properties 95 4.4.2. Consideration of energy absorption 100 4.4.3. Consideration of plasma formation 104 4.4.4. Consideration of shielding gas 112 4.4.5. Consideration of surface emissivity 113 5. Computational investigations 115 5.1. Finite difference method 115 5.1.1. Finite difference process 115 5.1.2. Computer solution 119 5.1.3. Model geometry 122 5.1.4. Simulation of laser beam intensity 123 5.1.5. Convergence analysis 123 5.2. Finite element method 126 5.3. Results of computational investigations 127 5.3.1. Results of FDM calculations 127 5.3.2. Results of FEM calculations 138 6. Experimental investigations 149 6.1. The Nd:YAG laser system 149 6.2. Experimental investigations of laser microdrilling 152 6.2.1. SEM characterization of surface topography for microdrilling 153 6.2.2. Effect of laser power 154 6.2.3. Effect of laser pulse length 157 6.2.4. Effect of number of pulses 158 6.2.5. Effect of laser pulse frequency 162 6.2.6. Effect of laser focal position 164 6.3. Experimental investigations of laser microwelding 168 6.3.1. Laser microwelding experiments on thin metal sheets 169 6.3.1.1. SEM characterization of surface topography 169 6.3.1.2. Effect of laser power 170 6.3.1.3. Effect of laser pulse length 172 6.3.1.4. Effect of laser focal position 172 6.3.2. Evaluations of laser microwelding experiments 174 6.3.2.1. OEH measurements of thermal deformations 175 6.3.2.1.1. Theory of OEH measurements 175 6.3.2.1.2. Results of OEH measurements 178 6.3.2.2. Tensile tests for the strength of laser microwelds 182 6.4. Correlation between computational and experimental results of temperature distributions 187 6.4.1. Temperature distributions 187 8 6.4.2. Melting zone profile 194 7. Conclusions and future works 198 8. References 204 Appendix A. The finite difference equations for a finite object 213 Appendix B. Stability analysis
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