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IBM Power 575 Supercomputing Node

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IBM Power 575 Supercomputing Node Extreme performance supercomputer building blocks IBM Power 575 supercomputing node with specialized software from IBM, this system is designed to perform and rep- resents the latest Power technology available. Ideal workloads for this system include high performance computing (HPC) applications such as weather and climate modeling, computational chem- istry, physics, computer-aided engineer- ing, computational fluid dynamics and petroleum exploration that require highly Power 575 node intense computations where the work- load is aligned with parallel processing The IBM Power™ 575 supercomputing methodologies. IBM has long been a Highlights node is designed for organizations that leader in these application areas and, require a highly scalable system with ■ Optimized for running large, with this system, enables you to inno- extreme parallel processing perform- highly parallel computationally- vate and mold the future. ance and dense, modular packaging. intensive workloads and Use it in clustered configurations of as algorithms Densely packing up to 448 POWER6™ few as 32 processor cores or in world- processor cores per frame, each one class supercomputer configurations of ■ Application affinity for weather running at 4.7 GHz with innovative thousands of processors. Combined and climate modeling, compu- cooling features, the 32-core tational chemistry, physics, computer-aided engineering, computational fluid dynamics and petroleum exploration Power 575 supercomputing node is the Power 575 is estimated to achieve solve the world’s greatest problems. designed for speed and tuned for per- over five times the GFLOPS per frame Starting with the lightning fast 4.7 GHz formance. Available in increments of as its predecessor with POWER5+™ processor, adding the ultra dense pack- 2U building blocks, hundreds of these technology.1 The radical new approach aging of 32 cores in a 2U node and nodes can be clustered together to to HPC represented by the Power 575 injected with a chilled coolant to enable tackle the world’s greatest problems. system marks another step in the evo- peak performance, this system is a Supported by up to 3.5 TB of memory lution of modular clusters designed to supersonic race car on the IT highway. per frame and super fast interconnects, Feature Benefits Extreme POWER6 performance ● Ability to solve problems faster or tackle even larger problems ● Ability to respond to increasingly complex challenges ● Ability to inject more variables into equations to improve modeling accuracy Innovative modular design ● Ability to buy the exact size system required ● Ability to easily grow the system over time ● Greater packaging density requires less floor space thereby reducing operational costs Radical energy-efficient cooling ● Enables greater performance with a smaller footprint technology ● Supports environmental goals by optimizing energy usage ● Reduces operational costs Ultra-scalable ● Allows for extreme performance ● Enables centralized management of multiple interconnected systems Mainframe-inspired reliability ● Improved assurance that work will not be interrupted ● Better customer satisfaction due to reliable and predictable operations ● Faster repair when required due to sophisticated system diagnostics Extensive software support ● Ability to select the right application to meet your needs Extreme POWER6 performance achieved with 448 processor cores in a all 32 POWER6 processor cores and With years of patent leadership and single footprint (fourteen 32-core nodes with the aid of pumping devices decades of IT experience, it is no sur- packaged in a single 42U 24-inch mounted in the base of the frame, prise that IBM technology is the system frame). Nodes can be config- direct chilled coolant over the proces- industry-leader for processor perform- ured with or without support for internal sors to keep them running at peak ance. The ultra-high frequency of and/or external I/O devices. Compared intensity. POWER6 575 technology provides a to its POWER5+ predecessor, the superscalar design with over twice the Power 575 node delivers twice the In addition, ambient air is directed clock speed and twice the memory packaging density and thereby enables across the remaining components bandwidth of previous IBM generations. substantially higher sustained through- and the entire air cooling load is POWER6 processors feature enhanced put for high performance computing reduced by the integrated rear door simultaneous multithreading with (HPC) applications. heat exchanger located at the rear of support for Hardware Decimal the system. Inside, sealed tubes filled Floating-Point and an AltiVec™ SIMD The highly efficient DC power distribu- with chilled water absorb the heat gen- accelerator for added performance. tion module is integrated into the erated in a fully populated rack and hinged lid of the node. This innovative carry it away so it is not released into Arrange 32 of these high-powered power system relies on embedded cir- the datacenter. Similar to the optional engines together in a single slim-line cuitry rather than external wiring, pro- IBM Rear Door Heat eXchanger for rack node with 256 GB of memory and a viding more reliable and efficient power installations, this unit is now integrated dual 2-port 4X host channel adapter, distribution. This power module into the same cooling loop as the rest and you have a system designed for includes precision intelligent monitoring of the system and standard for all speed. One Power 575 node is esti- and control functions that are designed Power 575 systems. mated to achieve over 600 GFLOPS, to help assure power delivery is opti- 4.95 times the performance of its pred- mized at all times and provides alert Years in development by IBM, the ecessor with POWER5+ technology.3 data to the node service processor in industry’s leader in IT patents, this revo- the case of a fault. lutionary dual partnership of cold- Innovative modular design plates and Rear Door Heat eXchanger Mounted in a sleek 2U enclosure, the Radical energy-efficient cooling are integrated into the advanced, inno- Power 575 supercomputing node fea- technology vative design of the Power 575 system. tures innovative, elegant design and With the introduction of the Power 575, Leveraging existing chilled water supply packaging that facilitates ease of serv- IBM is announcing the availability of for air conditioning systems already ice and flexibility. Few systems can new water cooling technology that can located in a majority of datacenters match the extraordinary density help reduce related energy costs. around the globe, this system is Cold-plates are directly mounted over designed to reduce server heat emis- Mainframe-inspired reliability features arrangement. Support for 200v to 240v, sions by up to 80 percent (versus a Among the world-class RAS capabilities 380v to 415v, and 480v three phase comparable air cooled system providing provided in the Power 575 are a power inputs allow clients to enjoy equivalent system performance).4 sophisticated service processor; hot- reduced facility equipment cost and plug, hot-swappable and redundant help improve energy efficiency. The abil- Scale-up or scale-out easily components; IBM Chipkill™ ECC and ity of the 575 to tolerate power distur- Power 575 supercomputing nodes can bit-steering memory; First Failure Data bances is exceptional in comparison to be easily scaled within the system Capture mechanisms; and dynamic most other computing equipment. frame or replicated within the cluster to deallocation of system components. meet growing workload requirements. These capabilities help to increase sys- Extensive software support Equipped with 32 GB of memory in its tem availability and allow more work to The Power 575 supercomputing node minimum configuration, each node be processed with less operational dis- can run both AIX® and Linux® operat- can scale-up to 256 GB. Two hot- ruption. New with POWER6 technology, ing systems simultaneously to provide swappable disk drives allow disk Processor Instruction Retry provides for the flexibility to support a full range of storage capacity from 73.4 GB to the continuous monitoring of processor HPC applications as required. AIX is an 293.6 GB per node. For even greater status with the capability to restart a industrial-strength UNIX® operating disk capacity, the optional 12X I/O processor if certain errors are detected. system (OS) tuned for application per- drawer supports up to 16 Ultra3 SCSI If required, workloads can be redirected formance and delivers exceptional disk bays or the optional 12S expan- to alternate processors, all without dis- scalability for clusters of all sizes. Web- sion drawer for up to 12 hot-swap SAS ruption to application execution. based remote management tools give drives per drawer. administrators centralized control of the The Power 575 system includes struc- system, enabling them to monitor key A Power 575 cluster can scale-out tural elements at the frame level to help resources, including adapter and net- easily and cost-effectively as workload ensure outstanding availability even in work availability, file system status and requirements increase. Each system the event of facility power problems. processor workload. frame accommodates up to 14 nodes. The 575 system frame uses IBM’s Organizations can add system frames leading-edge rack level distributed The 575 node also supports the Linux to build a system cluster with hundreds power conversion architecture to OS allowing a broad choice of applica- of nodes and thousands
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