Extreme performance supercomputer building blocks

IBM Power 575 supercomputing node

with specialized software from IBM, this system is designed to perform and rep- resents the latest Power technology available.

Ideal workloads for this system include high performance computing (HPC) applications such as weather and climate modeling, computational chem- istry, physics, computer-aided engineer- ing, computational fluid dynamics and petroleum exploration that require highly Power 575 node intense computations where the work- load is aligned with parallel processing The IBM Power™ 575 supercomputing methodologies. IBM has long been a Highlights node is designed for organizations that leader in these application areas and, require a highly scalable system with ■ Optimized for running large, with this system, enables you to inno- extreme parallel processing perform- highly parallel computationally- vate and mold the future. ance and dense, modular packaging. intensive workloads and Use it in clustered configurations of as algorithms Densely packing up to 448 POWER6™ few as 32 processor cores or in world- processor cores per frame, each one class supercomputer configurations of ■ Application affinity for weather running at 4.7 GHz with innovative thousands of processors. Combined and climate modeling, compu- cooling features, the 32-core tational chemistry, physics, computer-aided engineering, computational fluid dynamics and petroleum exploration Power 575 supercomputing node is the Power 575 is estimated to achieve solve the world’s greatest problems. designed for speed and tuned for per- over five times the GFLOPS per frame Starting with the lightning fast 4.7 GHz formance. Available in increments of as its predecessor with POWER5+™ processor, adding the ultra dense pack- 2U building blocks, hundreds of these technology.1 The radical new approach aging of 32 cores in a 2U node and nodes can be clustered together to to HPC represented by the Power 575 injected with a chilled coolant to enable tackle the world’s greatest problems. system marks another step in the evo- peak performance, this system is a Supported by up to 3.5 TB of memory lution of modular clusters designed to supersonic race car on the IT highway. per frame and super fast interconnects,

Feature Benefits

Extreme POWER6 performance ● Ability to solve problems faster or tackle even larger problems ● Ability to respond to increasingly complex challenges ● Ability to inject more variables into equations to improve modeling accuracy

Innovative modular design ● Ability to buy the exact size system required ● Ability to easily grow the system over time ● Greater packaging density requires less floor space thereby reducing operational costs

Radical energy-efficient cooling ● Enables greater performance with a smaller footprint technology ● Supports environmental goals by optimizing energy usage ● Reduces operational costs

Ultra-scalable ● Allows for extreme performance ● Enables centralized management of multiple interconnected systems

Mainframe-inspired reliability ● Improved assurance that work will not be interrupted ● Better customer satisfaction due to reliable and predictable operations ● Faster repair when required due to sophisticated system diagnostics

Extensive software support ● Ability to select the right application to meet your needs Extreme POWER6 performance achieved with 448 processor cores in a all 32 POWER6 processor cores and With years of patent leadership and single footprint (fourteen 32-core nodes with the aid of pumping devices decades of IT experience, it is no sur- packaged in a single 42U 24-inch mounted in the base of the frame, prise that IBM technology is the system frame). Nodes can be config- direct chilled coolant over the proces- industry-leader for processor perform- ured with or without support for internal sors to keep them running at peak ance. The ultra-high frequency of and/or external I/O devices. Compared intensity. POWER6 575 technology provides a to its POWER5+ predecessor, the superscalar design with over twice the Power 575 node delivers twice the In addition, ambient air is directed clock speed and twice the memory packaging density and thereby enables across the remaining components bandwidth of previous IBM generations. substantially higher sustained through- and the entire air cooling load is POWER6 processors feature enhanced put for high performance computing reduced by the integrated rear door simultaneous multithreading with (HPC) applications. heat exchanger located at the rear of support for Hardware Decimal the system. Inside, sealed tubes filled Floating-Point and an AltiVec™ SIMD The highly efficient DC power distribu- with chilled water absorb the heat gen- accelerator for added performance. tion module is integrated into the erated in a fully populated rack and hinged lid of the node. This innovative carry it away so it is not released into Arrange 32 of these high-powered power system relies on embedded cir- the datacenter. Similar to the optional engines together in a single slim-line cuitry rather than external wiring, pro- IBM Rear Door Heat eXchanger for rack node with 256 GB of memory and a viding more reliable and efficient power installations, this unit is now integrated dual 2-port 4X host channel adapter, distribution. This power module into the same cooling loop as the rest and you have a system designed for includes precision intelligent monitoring of the system and standard for all speed. One Power 575 node is esti- and control functions that are designed Power 575 systems. mated to achieve over 600 GFLOPS, to help assure power delivery is opti- 4.95 times the performance of its pred- mized at all times and provides alert Years in development by IBM, the ecessor with POWER5+ technology.3 data to the node service processor in industry’s leader in IT patents, this revo- the case of a fault. lutionary dual partnership of cold- Innovative modular design plates and Rear Door Heat eXchanger Mounted in a sleek 2U enclosure, the Radical energy-efficient cooling are integrated into the advanced, inno- Power 575 supercomputing node fea- technology vative design of the Power 575 system. tures innovative, elegant design and With the introduction of the Power 575, Leveraging existing chilled water supply packaging that facilitates ease of serv- IBM is announcing the availability of for air conditioning systems already ice and flexibility. Few systems can new water cooling technology that can located in a majority of datacenters match the extraordinary density help reduce related energy costs. around the globe, this system is Cold-plates are directly mounted over designed to reduce server heat emis- Mainframe-inspired reliability features arrangement. Support for 200v to 240v, sions by up to 80 percent (versus a Among the world-class RAS capabilities 380v to 415v, and 480v three phase comparable air cooled system providing provided in the Power 575 are a power inputs allow clients to enjoy equivalent system performance).4 sophisticated service processor; hot- reduced facility equipment cost and plug, hot-swappable and redundant help improve energy efficiency. The abil- Scale-up or scale-out easily components; IBM Chipkill™ ECC and ity of the 575 to tolerate power distur- Power 575 supercomputing nodes can bit-steering memory; First Failure Data bances is exceptional in comparison to be easily scaled within the system Capture mechanisms; and dynamic most other computing equipment. frame or replicated within the cluster to deallocation of system components. meet growing workload requirements. These capabilities help to increase sys- Extensive software support Equipped with 32 GB of memory in its tem availability and allow more work to The Power 575 supercomputing node minimum configuration, each node be processed with less operational dis- can run both AIX® and Linux® operat- can scale-up to 256 GB. Two hot- ruption. New with POWER6 technology, ing systems simultaneously to provide swappable disk drives allow disk Processor Instruction Retry provides for the flexibility to support a full range of storage capacity from 73.4 GB to the continuous monitoring of processor HPC applications as required. AIX is an 293.6 GB per node. For even greater status with the capability to restart a industrial-strength UNIX® operating disk capacity, the optional 12X I/O processor if certain errors are detected. system (OS) tuned for application per- drawer supports up to 16 Ultra3 SCSI If required, workloads can be redirected formance and delivers exceptional disk bays or the optional 12S expan- to alternate processors, all without dis- scalability for clusters of all sizes. Web- sion drawer for up to 12 hot-swap SAS ruption to application execution. based remote management tools give drives per drawer. administrators centralized control of the The Power 575 system includes struc- system, enabling them to monitor key A Power 575 cluster can scale-out tural elements at the frame level to help resources, including adapter and net- easily and cost-effectively as workload ensure outstanding availability even in work availability, file system status and requirements increase. Each system the event of facility power problems. processor workload. frame accommodates up to 14 nodes. The 575 system frame uses IBM’s Organizations can add system frames leading-edge rack level distributed The 575 node also supports the Linux to build a system cluster with hundreds power conversion architecture to OS allowing a broad choice of applica- of nodes and thousands of processor increase system density, simplify power tions to best fit client needs. Because cores. Each fully populated frame with connection and provide a robust, Linux is an open source technology, it 14 nodes and 448 processor cores is redundant system power supply has the worldwide Linux community estimated to deliver over 8 TFLOPS in a enhancing, contributing and validating single footprint. the Linux kernel. In choosing Linux, ● IBM Engineering and Scientific increase system utilization while helping users can still take advantage of the Subroutine Library (ESSL) and to ensure applications continue to get many reliability and scalability features IBM Parallel ESSL—mathematical the resources they need. VIOS allows designed into the 575. And with a large libraries for both AIX and Linux to for the sharing of disk and optical list of open source, IBM and third party enhance performance of serial, devices as well as communications applications available, Linux offers the parallel and scientific applications. and Fibre Channel adapters to help freedom to use the right applications drive down complexity and systems/ and tools for an organization’s needs. PowerVM™ is the family of technolo- administrative expenses. Also included gies, capabilities and offerings that is support for Multiple Shared Additional cluster management capabili- deliver industry-leading virtualization on Processor Pools, which allows for auto- ties are available through the following IBM POWER processor-based matic non-disruptive balancing of pro- optional IBM Power Systems systems. On the Power 575, PowerVM cessing power between partitions Software products: includes base components provided assigned to the shared pools, and with IBM Power Systems firmware Shared Dedicated Capacity, which ● IBM Parallel Environment (PE)— which includes logical partitioning helps optimize use of processor cycles. a high function development and (LPAR) technologies. In addition, execution environment for parallel optional components and PowerVM PowerVM Enterprise Edition includes all message-passing applications under Editions are designed to provide the features of Standard Edition plus AIX and Linux. advanced virtualization technologies Live Partition Mobility (LPM), which ● Tivoli® Workload Scheduler resulting in efficiencies in resource uti- allows a partition to be relocated from LoadLeveler®—a job scheduler lization and cost savings. These are one server to another with virtually no designed to maximize resource uti- managed through use of a hardware impact to the applications running lization and throughput in a cluster management console (HMC). inside the partition. LPM is designed to environment to get the most out of enable servers to work together to help the resources. PowerVM Standard Edition includes optimize system utilization and energy ● IBM General Parallel File System™ Micro-Partitioning™ and Virtual I/O savings, improve application availability, (GPFS™)—a high-performance, Server (VIOS) capabilities, which are balance critical workloads across multi- shared disk file system providing designed to allow businesses to ple systems and respond to ever- fast data access to all nodes in a changing business demands. cluster. Power 575 at a glance

Processor cores 32 4.7 GHz POWER6 processor cores per node

Cache 4 MB L2 cache per processor core 32 MB L3 cache shared per two cores

RAM (memory) Up to 256 GB per node

Internal disk Two SAS small form factor disks per node (73.4 GB or 146.8 GB 10K rpm)

I/O One integrated SAS controller for internal disks One integrated SAS connector for SAS disk drawer connection Two integrated dual-ported 10/100/1000 Ethernet ports Optional dual-port 10 Gigabit Optical Ethernet Four optional PCIe adaptor slots (two PCI risers each with two PCIe adapters) Optional dual 2-port 4x Host Channel Adapter (takes one PCI slot) Optional I/O drawer providing 20 blind-swap 64-bit PCI-X slots and up to 16 Ultra3 SCSI disk bays Optional I/O drawer providing 12 hot-swap SAS drives

PowerVM virtualization technologies POWER Hypervisor™ Dynamic LPAR; Virtual LAN (Memory to memory inter-partition communication) PowerVM Standard Edition (optional) Micro-Partitioning with up to 10 micro-partitions per processor, 254 per node; Multiple Shared Processor Pools; Virtual I/O Server; Shared Dedicated Capacity; PowerVM Lx86 PowerVM Enterprise Edition (optional) PowerVM Standard Edition plus Live Partition Mobility

Operating systems AIX V5.3 with the 5300-08 Technology Level SUSE Linux Enterprise Server (SLES) 10 SP2 for POWER or later; Red Hat Enterprise Linux 4.6 for POWER (RHEL4.6) or later; RHEL5.2 or later

Frame features Power requirements 200v to 240v; 380v to 415v; or 480v AC (3-phase at 50/60 Hz) Cooling requirements Chilled inlet water supply/return required for all systems. System frame dimensions 79.5"H x 29.5"W x 60.0"D (201.3 cm x 75 cm x 152.4 cm); weight: 3,650 lb (1,656 kg)2

Warranty (limited) 9 hours per day, Monday through Friday (excluding holidays), next-business-day for one year at no additional cost; on-site (varies by country). Warranty service upgrades and maintenance are available.

For more information To learn more about IBM Power 575 supercomputing nodes, contact your IBM marketing representative or IBM Business Partner, or visit the © Copyright IBM Corporation 2008 following Web sites: IBM Systems and Technology Group Route 100 Somers, NY 10589 ● ibm.com/systems/power/ Produced in the United States ● ibm.com/servers/aix April 2008 ● ibm.com/linux/power All Rights Reserved This publication was developed for products ● ibm.com/common/ssi and/or services offered in the United States. IBM may not offer the products, features, or services discussed in this publication in other countries. The information may be subject to change without notice. Consult your local IBM business contact for information on the products, features and services available in your area. All statements regarding IBM future directions and intent are subject to change or withdrawal without notice and represent goals and objectives only. IBM, the IBM logo, AIX, Chipkill, General Parallel File System, GPFS, LoadLeveler, Micro- Partitioning, Power, POWER5+, POWER6, Power Hypervisor, PowerVM, System p5 and Tivoli are trademarks or registered trademarks of International Business Machines Corporation in the United States, other countries or both. A full list of U.S. trademarks owned by IBM may be found at: ibm.com/legal/copytrade.shmtl. Linux is a trademark of Linus Torvalds in the United States, other countries or both. UNIX is a registered trademark of The Open Group in the United States, other countries or both. Other company, product and service names may be trademarks or service marks of others. IBM hardware products are manufactured from new parts, or new and used parts. Regardless, our warranty terms apply. This equipment is subject to FCC rules. It will comply with the appropriate FCC rules before 1 Based on IBM calculations of GFLOPS for final delivery to the buyer. a fully populated single Power 575 frame with Information concerning non-IBM products was 4.7 GHz POWER6 processors compared to a obtained from the suppliers of these products fully populated single System p5™ 575 frame or other public sources. Questions on the with 1.9 GHz POWER5+ processors. capabilities of the non-IBM products should be 2 Populated with 14 Power 575 nodes. Weight addressed with the suppliers. will vary when disks, adapters and other When referring to storage capacity, total TB peripherals are installed. equals total GB divided by 1000; accessible 3 Based on IBM calculations of GFLOPS for capacity may be less. 32 POWER6 processor cores running at All performance information was determined in a 4.7 GHz (single node) compared to controlled environment. Actual results may vary. 16 POWER5+ processor cores running at Performance information is provided “AS IS” 1.9 GHz (single node). and no warranties or guarantees are expressed 4 Based on IBM calculations of energy use for or implied by IBM. Buyers should consult other Power 575 nodes versus a comparable air sources of information, including system cooled system providing equivalent system benchmarks, to evaluate the performance of a performance. system they are considering buying.

POD03010-USEN-01