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IBM Power 770 and 780 Technical Overview and Introduction

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IBM Power 770 and 780 Technical Overview and Introduction Front cover IBM Power 770 and 780 Technical Overview and Introduction Features the POWER7 processor for advanced multi-core technology Describes MaxCore and TurboCore for redefining performance Discusses enterprise-level RAS in a midrange footprint Giuliano Anselmi Bruno Blanchard Younghoon Cho Christopher Hales Marcos Quezada ibm.com/redbooks Redpaper International Technical Support Organization IBM Power 770 and 780 Technical Overview and Introduction March 2010 REDP-4639-00 Note: Before using this information and the product it supports, read the information in “Notices” on page vii. First Edition (March 2010) This edition applies to the IBM Power 770 (9117-MMB) and IBM Power 780 (9179-MHB) Power Systems servers. © Copyright International Business Machines Corporation 2010. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Notices . vii Trademarks . viii Preface . ix The team who wrote this paper . ix Now you can become a published author, too! . xi Comments welcome. xi Stay connected to IBM Redbooks . xi Chapter 1. General description . 1 1.1 Overview of systems . 2 1.2 Operating environment . 3 1.3 Physical package . 3 1.4 System features . 5 1.4.1 Power 770 system features . 5 1.4.2 Power 780 system features . 6 1.4.3 Minimum features . 7 1.4.4 Power supply features . 9 1.4.5 Processor card features . 9 1.4.6 Summary of processor features . 10 1.4.7 Memory features . 13 1.5 Disk and media features . 16 1.6 I/O drawers . 17 1.6.1 PCI-DDR 12X Expansion Drawers (#5796) . 17 1.6.2 12X I/O Drawer PCIe (#5802 and #5877). 17 1.6.3 I/O drawers and usable PCI slot . 17 1.7 Comparison between models . 18 1.8 Build to Order . 19 1.9 IBM Editions . 19 1.10 Model upgrade . 19 1.10.1 Upgrade considerations . 19 1.11 Hardware Management Console models . 20 1.12 System racks. 21 1.12.1 IBM 7014 Model T00 rack. 21 1.12.2 IBM 7014 Model T42 rack. 22 1.12.3 IBM 7014 Model S25 rack. 22 1.12.4 Feature number 0555 rack . 23 1.12.5 Feature number 0551 rack . 23 1.12.6 Feature number 0553 rack . 23 1.12.7 The AC power distribution unit and rack content . 23 1.12.8 Rack-mounting rules . 25 1.12.9 Useful rack additions. 25 Chapter 2. Architecture and technical overview . 27 2.1 The IBM POWER7 processor . 29 2.1.1 POWER7 processor overview. 30 2.1.2 POWER7 processor core . 31 2.1.3 Simultaneous multithreading. 32 2.1.4 Memory access. 33 © Copyright IBM Corp. 2010. All rights reserved. iii 2.1.5 Flexible POWER7 processor packaging and offerings . 33 2.1.6 On-chip L3 cache innovation and Intelligent Cache . 34 2.1.7 POWER7 processor and Intelligent Energy . 36 2.1.8 Comparison of the POWER7 and POWER6 processors . 36 2.2 POWER7 processor cards . 36 2.3 Memory subsystem . 38 2.3.1 Fully buffered DIMM . 38 2.3.2 Memory placement rules. 38 2.3.3 Memory throughput. 43 2.4 Capacity on Demand. 44 2.4.1 Capacity Upgrade on Demand (CUoD). 44 2.4.2 On/Off Capacity on Demand (On/Off CoD). 44 2.4.3 Utility Capacity on Demand (Utility CoD) . 45 2.4.4 Trial Capacity On Demand (Trial CoD) . 45 2.4.5 Software licensing and CoD . 46 2.5 Drawer interconnection cables . 46 2.6 System bus . 50 2.6.1 I/O buses and GX++ card . 50 2.6.2 FSP bus . 51 2.7 Internal I/O subsystem . 51 2.7.1 Blind-swap cassettes . 52 2.7.2 System ports . 52 2.8 Integrated Virtual Ethernet adapter . 52 2.8.1 IVE subsystem and feature codes . 53 2.9 PCI adapters . ..
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