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2017-GFP-Final-Program.Pdf Herzlich Willkommen to the 14th International Conference on Group IV Photonics On behalf of the organization committee, it is our pleasure to welcome you to the 14th Conference on Group IV Photonics (GFP 2017) that will take place from the 23rd to the 25th of August 2017 at the Grand Hyatt Berlin, Germany. It will be preceded by a workshop on Silicon Photonics Computer Aided Design (CAD) flows on the afternoon of the 22nd organized by leading simulation and design tool providers. An industry session on Wednesday afternoon is specially aimed at recent/future graduates as well as experienced researchers who want to be informed/stay abreast of opportunities and recent trends in industrial use of the technology. Best Paper, Best Student Paper and Best Poster Awards have been generously endowed by our sponsors. A sponsored Welcome Reception and a sponsored Gala Dinner on Thursday night will give participants the opportunity to connect in an informal setting. Since the inception of the conference in 2004, we have witnessed evolving foci as the Group IV Photonics field has matured and diversified into different materials, wavelengths and applications. This year, we have added a fourth topic, “Sensing and Instrumentation”, to the preexisting “Novel Materials, Nanophotonics and Processes”, “Photonic Devices” and “Application and Systems”, in order to emphasize the diversification of applications from a very communications centric focus. Beyond Sensing and Communications, Silicon Photonics for Quantum Technologies is also represented in this year’s conference. Notably this year, amongst the talks selected by the technical program committees, a good number of papers treat the extension of Group IV Photonics to visible wavelengths with help of Silicon Nitride waveguides, coherent light generation with (Si)GeSn materials, novel passive devices with subwavelength structures, as well as the direct growth of III- V compound semiconductors onto Silicon substrates. GFP remains a focused, single track conference giving researchers the opportunity to get a comprehensive update of the latest developments in the field in a structured manner without having to “cut corners”. We hope it will give you the opportunity to get new insights, reconnect with previous colleagues and make bonds with new research partners in a friendly and stimulating environment. Bis bald in Berlin! Jeremy Witzens Lars Zimmermann Conference General Chair Conference Program Chair RWTH Aachen University IHP Germany Germany 1 Group IV Photonics Conference Committee List 2017 General Chair Jeremy Witzens, RWTH Aachen University, Germany Program Chair Lars Zimmermann, IHP, Germany Novel Materials, Nanophotonics and Processes Topic Co-Chairs Goran Mashanovich, University of Southampton, UK Jurgen Michel, Massachusetts Institute of Technology, USA Committee Members Dan Buca, Forschungszentrum Jülich, Germany Tsuyoshi Horikawa, National Institute of Advanced Industrial Science and Technology, Japan Andrew Knights, McMaster University, Canada Chuanbo Li, Institute of Semiconductors, CAS, China Andrea Melloni, Politecnico di Milano, Italy Haisheng Rong, Intel, USA Mitsuru Takenaka, University of Tokyo, Japan Alexei Tchelnokov, CEA-LETI, France Li Yang, Futurewei, USA Photonic Devices Topic Co-Chairs Joyce Poon, University of Toronto, Canada Laurent Vivien, CNRS & University Paris Sud, France Committee Members Charles Baudot, ST Microelectronics, France Pavel Cheben, National Research Council, Canada Il-Sug Chung, Technical University of Denmark, Denmark Jean Marc Fedeli, CEA-LETI, France Shayan Mookherjea, University of California at San Diego, USA Hon Ki Tsang, The Chinese University of Hong Kong, China Dries Van Thourhout, Ghent University, Belgium Ming Wu, University of California at Berkeley, USA Winnie Ye, Carleton University, Canada Linjie Zhou, Shanghai Jiao Tong University, China 2 Sensing and Instrumentation Topic Co-Chairs Andrew Poon, The Hong Kong University of Science and Technology, China Christian Koos, Karlsruhe Institute of Technology, Germany Committee Members Ali Adibi, Georgia Tech, USA Eric Cassan, Université Paris Sud, France Daoxin Dai, Zhejiang University, China Patrick Guo-Qiang Lo, IME, Singapore Siegfried Janz, National Research Council, Canada Laura Lechuga, Spanish National Research Council, Spain Junfeng Song, Jilin University, China Pol van Dorpe, KU-Leuven & IMEC, Belgium Silicon Photonics Applications and Systems Topic Co-Chairs Po Dong, Nokia – Bell Labs, USA Koji Yamada, National Institute of Advanced Industrial Science and Technology, Japan Committee Members Wim Bogaerts, Ghent University, Belgium Long Chen, Acacia, USA Lukas Chrostowski, The University of British Columbia, Canada Hiroshi Fukuda, NTT, Japan Yu Yu, Huazhong University of Science and Technology, China Jason Liow, IME, Singapore Peter O'Brien, Tyndall Institute, Ireland Richard Piton, Seagate, UK Vladimir M. Stojanovic, University of California-Berkeley, USA 3 Table of Contents Program-at-a-Glance..........................................................Inside Front Cover Welcome Letter..............................................................................................1 Committee List ..............................................................................................2 Exhibitor Guide..............................................................................................5 Sponsors ........................................................................................................8 Program........................................................................................................11 Photography Clause ....................................................................................38 Author Index ................................................................................................39 Hotel Map ..........................................................................Inside Back Cover 4 GROUP IV PHOTONICS CONFERENCE 2017 EXHIBITOR GUIDE ePIXfab-The European Silicon Photonics Alliance LioniX International CONTACT: ABDUL RAHIM CONTACT: DOUWE GEUZEBROEK ePIXfab-The European Silicon Photonics Alliance LioniX International iGent Tower, Technologiepark-Zwijnaarde 15 Hengelosestraat Wicherink Ghent, Belgium 9052 Enschede The Netherlands Phone: + 0032 471 581 274 7521AN Email: [email protected] Website: www.epixfab.eu Phone: + 31 53 20 30 053 Email: [email protected] ePIXfab is a European alliance of organizations that Website: www.lionix-int.com promotes silicon photonics science, technology, and application through a fabless model for the development LioniX International is a leading global provider of of silicon photonic circuits based on existing photonics customized microsystem solutions, in particular integrated and CMOS infrastructure. photonics-based, in scalable production volumes. We provide customized solutions for OEM’s and System Integrators, from design to fully assembled modules, by vertical integration in scalable production volumes. We maintain our technology leadership secured by a strong IP position. Information Gatekeepers, Inc. LioniX International focuses on Photonic Integrated CONTACT: HUI PAN Circuits (PIC) enabled modules based on its proprietary waveguide technology (TriPleX™), in addition to its other Information Gatekeepers, Inc. core competences micro-fluidics, opto-fluidics and 1340 Soldiers Field Road, Ste. 5 MEMS. As a vertical integrated company, we deliver a Boston, MA 02135 USA complete solution to our OEM customers: from initial design through volume manufacturing of products. Phone: + 617 782 5033 Email: [email protected] Our PIC modules and additional competences can be used Website: www.igigroup.com in a suite of applications in Telecom/Datacom, Life Science, Metrology and is offered as well in our Information Gatekeepers, Inc. is a publisher, trade show technology services. organizer, consultancy and information service provider in the fields of fiber optics, high-speed Internet, wireless, and emerging telecom markets. For more information, visit www.igigroup.com. 5 GROUP IV PHOTONICS CONFERENCE 2017 EXHIBITOR GUIDE Nanosystec GmbH Photon Design Ltd. CONTACT: GUENTER HUMMELT CONTACT: DOMINIC GALLAGHER Nanosystec GmbH Photon Design Ltd. Marie-Curie-Strasse 6 34 Leopold Street Gross Umstadt Germany Oxford 64823 United Kingdom OX4 1TW Phone: + 49 6078 78254 0 Phone: + 44 1865 324990 Email: [email protected] Email: [email protected] Website: www.nanosystec.com Website: www.photond.com Nanosystec offers several instruments which are very Photon Design was started in 1992 and supplies a wide useful for the work with silicon wafers and chips. range of innovative photonics CAD tools to most of the Nanotest is ideal for optical and electrical testing of chips World's leading photonic companies, universities and and for wafers up to 12“ diameter at temperatures up to government research labs, with customers in 35 countries 100° C. Nanoglue with Optospin is capable of active around the world. Our CAD products include tools for alignment of optical elements and fibers within a few both passive and active (semiconductor) optical seconds. Dispensing of the resin and UV curing is fully components and optical circuit modeling. automated. If the loss budget allows passive placement of optical fibers with our system Nanoplace is a viable option. One or several fibers are placed in front of the channels of the PIC and fixed with glue and subsequent UV curing. PhoeniX Software Physik Instrumente
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