DOCSLIB.ORG

The PCB Magazine, May 2015

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
The PCB Magazine, May 2015 & ETCHING Electroplating May 2015 PLATING 22 Through-Holes with Different Geometry: A Novel and High-Productivity Process ENEPIG: 44 The Plating Process May 2015 • The PCB Magazine 1 13th ANNUAL MEPTEC MEMS TECHNOLOGY SYMPOSIUM Enabling the Internet of Things: Foundations of MEMS Process, Design, Packaging & Test MEMS based products are key en- ablers in the Internet of Things (IoT) Wednesday, May 20, 2015 revolution. The availability of large numbers of reliable and cost-effec- Holiday Inn San Jose Airport • San Jose, California tive MEMS sensors and actuators KEYNOTE SPEAKER has driven an explosion in the num- DIAMOND SPONSOR ber of IoT applications to reach the Creating a Trillion Sensors Based Future market. The Internet of Things is Dr. Janusz Bryzek pushing MEMS technology to new Chair, TSensors Summits levels of performance and bringing forth new requirements. Sensors are one of the eight exponential technologies enabling growth of goods and services faster than This event will showcase advances growth of demand for them. Exponential technologies enable Exponen- in core technologies that form the tial Organizations (ExO), which demonstrate sales growth to a billion SILVER SPONSOR foundation of the creation of MEMS- dollars in one to three years. New Exponential organizations are expected based products. Experts from the to replace 40% of Fortune 500 companies in the coming decade, in a field will present the latest innova- similar mode to Kodak replacement by Instagram in 2012. Presented will tions in MEMS fabrication processes, an amazing showcase of available sensor based products. packaging, assembly, & test. Insight will be provided as to new technolo- EXHIBITING COMPANIES TO DATE gies, materials and software that will fuel the creation of new devices cou- pled with traditional MEMS technol- ogies to address new markets and new requirements for the Internet of Things. We explore how the four foundations of MEMS technologies are expanding to include such excit- ing new techniques as 3D printing, flexible electronics and novel mate- rials. We hope you will join us to learn from experts about practical, com- mercial and significant technology advances in MEMS Test, Design, Pro- cess and Packaging, each driving key MEMS enabled products. Come hear about the technologies that form the “Sensory System” at the heart of the Internet of Things – it’s not just about the network! Symposium Committee ASSOCIATION SPONSORS SUPPORTING SPONSOR •Gene Burk, IMT •Sean Cahill, Maxim Integrated •MaryAnn Maher, SoftMEMS •Ramesh Ramadoss, Microprobe REGISTER ONLINE TODAY AT MEPTEC.ORG May Featured Content PLATING & ETCHING This month, features from Michael Carano (RBP Chemical Technology), a team from Dow Chemicals Company, and George Milad (Uyemura) share their perspectives on plating and etching issues. 8 Optimization of Acid Copper 22 Electroplating Through-Holes Electrodeposition Processes for with Different Geometry: High-Throwing Power DC Plating A Novel and High-Productivity by Michael Carano Process by Elie Najjar, Leon Barstad, Jayaraju Nagarajan, Marc Lin, Maria Rzeznik and Mark Lefebvre 44 ENEPIG: The Plating Process by George Milad 4 The PCB Magazine • May 2015 C MAY 2015 ONT VOLUME 5 NUMBER 5 THE DEFINITIVE E INTERACTIVE MAGAZINE NTS DEDICATED TO THE GLOBAL PCB INDUSTRY thepcbmagazine.com INTERVIEWS VIDEO INTERVIEWS 50 NEW Multi-Part Interview! 20 ENIG & ENEPIG IPC Standards Update A Conversation (and Day) with Joe Fjelstad 54 The Importance of Harmonized Standards that Benefit All Pete Starkey Interviews Amphenol’s Sean Keating 60 Five Keys for Success in PCB Manufacturing COLUMNS 56 Best Practices 101: Part 7 by Steve Williams NEWS HIGHLIGHTS 42 Market 52 Supplier/New Product 64 Quick-Turn Circuit Board Shops by Karl Dietz 62 Mil/Aero007 70 Top Ten PCB007 Highlights EXTRAS 72 Events Calendar 73 Advertisers Index & Masthead 6 The PCB Magazine • May 2015 FEATURE Optimization of Acid Copper Electrodeposition Processes for High-Throwing Power DC Plating by Michael Carano quantify the capability of a fabricator to prof- RBP CHEMICAL TECHNOLOGY itably produce traditional boards. The ability to image conductor lines, and perhaps even more important, the insulating airspace be- Introduction tween them, is considered a key characteristic. Perhaps one of the three most fundamen- With surface mount components, a dramatic tal aspects of printed circuit fabrication is the decrease in plated via hole diameter require- metallization and electroplating of through- ments occurred, and as a result, via holes have hole vias and blind via interconnections. Ide- become simple vertical interconnections. Now, ally, one should also include fine-line imaging under competition from laser drilling, both of increasingly smaller feature sizes and via for- drill bit and machine technology have driven mation, whether by mechanical or laser meth- mechanical holes capability much smaller. ods. Indeed, the foundation of technology In the most recent release of the IPC Tech- roadmaps should, at the very least, encompass nology Roadmap, PTH and blind via diameters a discussion of line widths and spaces, PTH and aspect ratios have been defined as to the and blind via aspect ratios, and a metric that technology sector where the boards are used. In defines acceptability of plating uniformity and order to provide a list of key attributes (layer throwing power. These same parameters have counts, board thickness, number and diam- been used for nearly four decades to quickly eters of vias, etc.) for the PCB, emulators are 8 The PCB Magazine • May 2015 FEATURE OPTIMIZation OF ACID COPPER ELECTRODEPOSITION PROCESSES continues employed. Emulators (synthetic) are representa- For purposes of this paper, throwing power tions of a category of product, combining the at- is defined as the minimum electroplated thick- tributes common to the type to avoid concerns ness in the center of the PTH, divided by the about disclosure of specific company-proprietary thickness on the PTH surface (excluding copper designs. Technologists from around the world were asked to provide their respective view of the PCB technology required for the emulator. This exercise is critical in developing and un- derstanding roadmaps. As an example, Table 1 below lists the minimum mechanical via hole sizes for the various emulators. Table 2 depicts the maximum aspect ratio of mechanically drilled plated through-holes for the respective emulators. The Challenge It is quite clear from the two tables that there are rather high-aspect ratio vias that must be plated. It is understood that it is desirable to achieve as close to 100% throwing power as possible. At a minimum, market surveys have shown that for reliability, productivity, and performance purposes, a minimum of 80-85% throwing power is required. Further, process engineers desire to minimize plating on the conductor traces in order to minimize under- Figure 1: Throwing power: 1.0 mil minimum hole cut and circuit width destruction due to final thickness and 1.3 mil surface thickness. Throwing etching. power is 1.0/1.3 mil, or 77%. Table 1: Minimum hole diameter for mechanically drilled vias (mm, rounded to whole number). (Source: IPC Technology Roadmap, 2015) 10 The PCB Magazine • May 2015 FEATURE OPTIMIZation OF ACID COPPER ELECTRODEPOSITION PROCESSES continues foil). Figure 1 illustrates the definition of throw- K = Solution resistance ing power. d = Hole diameter While in Figure 1 the throwing power L = Length of hole is 77%, one would prefer throwing power of 100%. Electroplating of high-aspect ratio It is important to keep this in mind when through-holes becomes increasingly more dif- designing plating processes for high-aspect ratio ficult as via diameters decrease and board thick- circuit boards. As circuit boards become more nesses increase. Figure 1 depicts a condition complex in their designs, more attention must aptly named “dog-boning” for its thinness in be paid to plating cell design, plating chemistry, the center of the via. anodes and plating racks, electrical connections The following equation illustrates a model and solution agitation. This paper will also pres- that provides insight into the difficulty factor ent various techniques on improving and en- encountered when aspect ratios increase. It is hancing throwing power for high-aspect ratio not as simple as it looks. As the model illustrates, plated through-holes, with a focus on direct board thickness has a much greater influence current (DC) plating. on degree of difficulty than does via diameter. Essentially, board thickness directly influences Acid Copper Electroplating: ohmic resistance through the via. Resistance is Theoretical Aspects inversely proportional to plating propagation. In order to enhance plating uniformity (defined not only as plating thickness across the PCB surface but in the via as well), en- gineers should understand that there are several factors that influence plating unifor- mity. The Fishbone diagram below details in concise fashion those parameters that influ- Where: ence throwing power, plating distribution E = Voltage drop down hole (energy lost) and overall quality of the finished printed cir- J = Cathode current density cuit board. Table 2: Aspect ratio, mechanically drilled hole via (max ratio). May 2015 • The PCB Magazine 11 FEATURE OPTIMIZATION OF ACID COPPER ELECTRODEPOSITION PROCESSES continues Figure 2: These factors and their influence on plating distribution will be presented throughout this paper. Acid Copper Electroplating for
Load more

Recommended publications
  • Characterization of Copper Electroplating And
    CHARACTERIZATION OF COPPER ELECTROPLATING AND ELECTROPOLISHING PROCESSES FOR SEMICONDUCTOR INTERCONNECT METALLIZATION by JULIE MARIE MENDEZ Submitted in partial fulfillment of the requirements For the degree of Doctor of Philosophy Dissertation Advisor: Dr. Uziel Landau Department of Chemical Engineering CASE WESTERN RESERVE UNIVERSITY August, 2009 CASE WESTERN RESERVE UNIVERSITY SCHOOL OF GRADUATE STUDIES We hereby approve the thesis/dissertation of _____________________________________________________ candidate for the ______________________degree *. (signed)_______________________________________________ (chair of the committee) ________________________________________________ ________________________________________________ ________________________________________________ ________________________________________________ ________________________________________________ (date) _______________________ *We also certify that written approval has been obtained for any proprietary material contained therein. TABLE OF CONTENTS Page Number List of Tables 3 List of Figures 4 Acknowledgements 9 List of Symbols 10 Abstract 13 1. Introduction 15 1.1 Semiconductor Interconnect Metallization – Process Description 15 1.2 Mechanistic Aspects of Bottom-up Fill 20 1.3 Electropolishing 22 1.4 Topics Addressed in the Dissertation 24 2. Experimental Studies of Copper Electropolishing 26 2.1 Experimental Procedure 29 2.2 Polarization Studies 30 2.3 Current Steps 34 2.3.1 Current Stepped to a Level below Limiting Current 34 2.3.2 Current Stepped to the Limiting
    [Show full text]
  • Resume Wonsub Chung
    Resume Wonsub Chung Contact Information Wonsub Chung, ph.D. Professor Division of Material Science & Engineering Pusan National University 2, Busandaehak-ro 63beon-gil, Geumjeong-gu Busan, 46241 Korea e-mail:[email protected] Tel: +82-51-510-2386 H.P. : +82-10-8517-0855 Fax : +82-51-514-4457 Personal DOB : 1-23-1957, Male, Married, Born in South Korea Education Ph.D., Materials Science and Engineering. 1985-1989 Kyushu University, Hukuoka, Japan(Advisor: Prof. Ono Yoichi) Thesis: A Basic Study on Gas Reduction of Calcium Ferrite M.S., Materials Science and Engineering, 1983-1985 Pusan National University, Busan, South Korea (Advisor: Prof. Kyusub Song) Thesis: B.S., Materials Science and Engineering, 1978-1983 Pusan National University, Busan, South Korea, Major Career ∎ 1989-1992 Chief Researcher RIST(Research Institute of Industrial Science & Technology) Iron Ore Melting Reduction Research Project Team ∎ 1993-Present : Professor Pusan National University Division of Material Science & Engineering ∎ 1999-2000 Exchange professor Colorado School of Mines, Colorado, USA Research Interests Energy saving and Radiation Heat transfer and dissipation Study on Water Electrolysis Using Radiation and Electrical Energy Study on Reduction of Covalent Bonding Energy of Reaction Using Radiation and Electric Energy A study on the gasification reaction of coal using radiant energy Electrochemical anodic oxidation and deposition Corrosion and prevention of metallic materials (Mg, Al alloys and steels) Surface physics and chemistry Expertise
    [Show full text]
  • Electroless Copper Plating a Review: Part I
    Electroless Copper Plating A Review: Part I By Cheryl A. Deckert Electroless, or autocatalytic, metal plating is a non- necessary components of an electro- electrolytic method of deposition from solution. The less plating solution are the metal salt minimum necessary components of an electroless and a reducing agent. The source of plating solution are a metal salt and an appropriate copper is a simple cupric salt, such as reducing agent. An additional requirement is that the copper sulfate, chloride or nitrate. solution, although thermodynamically unstable, is Various common reducing agents stable in practice until a suitable catalyzed surface is have been suggested7 for use in elec- introduced. Plating is then initiated upon the catalyzed troless copper baths, namely formal- surface, and the plating reaction is sustained by the dehyde, dimethylamine borane, boro- catalytic nature of the plated metal surface itself. This hydride, hypophosphite,8 hydrazine, definition of electroless plating eliminates both those sugars (sucrose, glucose, etc.), and solutions that spontaneously plate on all surfaces dithionite. In practice, however, vir- (“homogeneous chemical reduction”), such as silver tually all commercial electroless cop- mirroring solutions; also “immersion” plating solu- per solutions have utilized formalde- tions, which deposit by displacement a very thin film of hyde as reducing agent. This is a a relatively noble metal onto the surface of a sacrificial, result of the combination of cost, less noble metal. effectiveness, and ease
    [Show full text]
  • Advanced Semiconductor Plating – Key Fundamentals
    Process Application Note PAN100 Advanced Semiconductor Plating – Key Fundamentals Cody Carter and John Ghekiere, ClassOne Technology Introduction In semiconductor processing, each of the hundreds, millions, even billions of individual features on a given product wafer must meet tight specifications in order to achieve the product quality and yields required in today’s fabs. Literally, every individual feature must be engineered to near perfection. In electrochemical deposition (ECD) processes, fabs must have the ability to produce well-formed features that are not only void-free but also of perfect dimension; and all of this must be accomplished within an acceptable total system cost and oper- ating cost. ClassOne has developed this Advanced Semiconductor Plating Series to provide theory and practice guidance for today’s elec- troplating engineers and operators to help them optimize their processes. Because of the broad scope of the topic, this series is arranged in four parts, as follows: Part 1: Key Fundamentals and How to Dial In Target Plated Thickness Part 2: Factors Affecting Localized Plating Rates and How to Optimize Cross-wafer Uniformity Part 3: Wafer and Feature Effects and How to Optimize Feature Uniformity Part 4: System-level Factors and How to Establish Repeatable Plating Performance Individual Wafer in an Electrolytic Cell A fundamental understanding of the basic electrolytic cell Figure 1. Electrolytic cell provides a valuable baseline from which to more deeply explore the specialized plating applications in the semicon- ductor industry. The most advanced plating applications for semiconductor manufacturing are based on the same principles as a standard, electrolytic cell. Figure 1 depicts an electrolytic cell with the following functional components: positive and negative electrodes, electrolyte, and power supply.
    [Show full text]
  • Copper Plating Standard Operating Procedure Faculty Supervisor: Prof
    Copper Plating Standard Operating Procedure Faculty Supervisor: Prof. Robert White, Mechanical Engineering (x72210) Safety Office: Peter Nowak x73246 (Just dial this directly on any campus phone.) (617)627-3246 (From off-campus or from a cell phone) Tufts Emergency Medical Services are at x66911. For more information on Copper plating see: W.H. LI, J.H. YE and S.F.Y. LI. “Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features”, Journal of Applied Electrochemistry 31: 1395–1397, 2001. Revised: September 21, 2012 Warning: Both copper sulfate and sulfuric acid cause eye and skin irritation and burns. Causes digestive and respiratory tract irritation with burns. Very dangerous if swallowed. 1. Material Requirements: 1.1 Equipment: Two 1000 mL glass beakers, 2 4L rectangular glass tanks, , stainless steel tweezers, plating bath (polypropylene), 10” by 10” hotplate, FloKing filtration pumping system, small probe thermometer, DC power supply, two 16” long banana to alligator clip wires, two binder clips, threaded Teflon rod, 6” long 1.2 Chemicals: Copper sulfate, sulfuric acid “Technic Copper FB Bath Ready to Use” contains copper sulfate (5-10%), sulfuric acid (15-20%), chloride ions, and brightener “Technic Copper FB Brightener” contains proprietary materials but is not considered hazardous by the OSHA Hazard Communication Standard (29 CFR 1910.1200). 1.2.1 Hazards associated with chemicals (copper sulfate, sulfuric acid): 1.2.1.1 Exposure to particulates or solution may cause conjunctivitis, ulceration, and corneal abnormalities. Causes eye irritation and possible burns. 1.2.1.2 Causes skin irritation and possible burns.
    [Show full text]
  • Automatic Electroplating Equipment Brochure
    Electroplating Equipment Water rinsing Super capacity with cotton core filtration system filtration system Pipe design to prevent Quantitative copper deposits Addition System 344 Bloor Street W, Suite 607, Toronto, ON Canada M5S 3A7 www.lprglobal.com | www.uskoreahotlink.com Tel.: +1 416-423-5590 E-Mail: [email protected] Introduction LPR Global provides fully automated horizontal and vertical electroplating lines for surface treatment of integrated circuits, consumer electronics, home appliances, automotive components, and medical parts. With over 50 years of experience in designing and manufacturing plating solutions, our electroplating and electroless plating lines achieve uniform plating thickness that minimizes chemical solution waste and post-process grinding work. We introduced our first automated plating equipment to PCB and electronics manufacturers in 1992 and won South Korea’s President Award that year for this innovative technology. Today our plating lines are installed worldwide at plants making PCBs, automotive parts, and consumer electronics. Industry Applications ▪ PCB & Semiconductor ▪ Optical Film ▪ Consumer Electronics ▪ Renewable Energy ▪ Automotive ▪ Medical https://www.uskoreahotlink.com/products/machinery/Electroplating-Equipment-Finishing Our Capabilities Surface Materials Applications Processes Plating on Plastic ABS • Home appliance parts: • Ni-Cr ABS Coating, refrigerator and washing • Ni-3 - Cr Plating, machine exterior parts such as • Ni-Au Plating, trims, door grills, handles and • ABS Plating with Direct
    [Show full text]
  • High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Processes
    High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Processes Saminda Dharmarathna, PhDa aMacDermidEnthone, 227 Freight Street, Waterbury, CT 06702 Ivan Li, PhDb, Maddux Syb, Eileen Zengc, Bob Weid, William Bowermana, Kesheng Feng, PhDa aMacDermidEnthone, 227 Freight Street, Waterbury, CT 06702 bMacDermidEnthone Global Development Application Center Taiwan cMacDermidEnthone Global Development Application Center Suzhou dMacDermidEnthone Global Development Application Center Shanghai ABSTRACT The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors. Copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards. Here we discuss innovative DC copper metallization formulations for hoist lines and VCP (Vertical Continues Plating) applications with high thermal reliability and throughput for high aspect ratio PCB manufacturing. The formula has a wide range of operation for current density. Most importantly plating at high current density using this DC high throw acid copper process offers high throughput, excellent thermal reliability, and improved properties for present-day PCB manufacturing. The operating CD range is 10 – 30 ASF where microdistribution of ≥ 85 % for AR 8:1 is achievable. This formulation offers bright ductile deposits where plating parameters are optimized for improved micro-distribution and the properties of the plated Cu deposit such as tensile strength and elongation. The thermal reliability and properties of the deposits were examined at different bath ages. Measured properties are Elongation ≥ 18% and tensile strength ≥ 40,000 psi.
    [Show full text]
  • E-Brite 205-K Ultra Bright and Leveling Acid Copper Plating Process
    E-Brite 205-K Ultra Bright and Leveling Acid Copper Plating Process E-Brite 205-K produces exceptionally fast, bright, ductile deposits with low internal stress which is necessary for successful plating on plastics (POP). It is the best leveling acid copper available at all normal and especially low current densities. It smoothes out surface defects for subsequent nickel/chrome plating. E-Brite 205-K has excellent brightness and coverage in low current density areas making it an ideal process for plating parts with complicated shapes. E-Brite 205-K is a non dye-type acid copper process. The deposit is softer and easier to buff than dye acid copper processes. It produces consistent results due to excellent bath stability which minimizes start-up problems eliminating the need for major adjustments after idle periods or weekend shut- downs. There are no harmful breakdown products thus eliminating the need for frequent carbon treatment. The bath is tolerant to variations in working conditions and impurities lending to ease of operation and process control. The bath is very tolerant to additive overload as long as the balance is maintained. Corrective additions produce immediate results. E-Brite 205-K is economical to operate. The consumption of the brightener component is superior to that of dye acid copper processes. Before using the E-Brite 205-M-10X, E-Brite 205-KA-5X and E-Brite 205-KR-5X concentrates, they should be diluted to single strength using DI Water. These additives must not be mixed together for any reason. Their effectiveness for brightness and leveling will be greatly diminished.
    [Show full text]
  • COPPER GLEAMTM Cupulse Copper Plating Process for PWB Metallization Applications
    Technical Data sheet COPPER GLEAMTM CuPulse Copper Plating Process For PWB Metallization Applications Regional Product N.America Availability Japan/Korea Asia Europe Description The COPPER GLEAMTM CuPulse Process was designed for copper plating of printed circuit boards using PPR current. The combination of the CuPulse formulation and optimized PPR waveforms can dramatically reduce acid copper plating times compared to traditional DC electroplating. These productivity gains are made while maintaining excellent physical properties and the reliability of the copper deposit. The COPPER GLEAM CuPulse Process is especially suited for reducing cycle times on thick-panel, high- aspect ratio designs. Advantages Unsurpassed performance on thick-panel, high-aspect ratio applications Stable, consistent plating performance over the lifetime of the bath Novel analytical methods help the process remain in control and at the enhanced set points during operation—the analytical procedures are quick and simple to run Excellent through-hole leveling performance Advantages Over Reduced plating cycles for a wide range of product difficulties, board Conventional DC thickness and hole diameters Excellent surface-to-hole deposit thickness ratio/throwing power Systems Uniform deposit thickness from the top of the hole to the center of the hole—no “dog bone-shaped” holes Excellent performance on blind-vias—laser or controlled depth drilled and mixed-technology designs UNRESTRICTED – May be shared with anyone ®TM Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow 886- 00504-1013 Page 1 of 9 COPPER GLEAMTM CuPulse Copper Plating Process / Interconnect Technologies 10/2013, Rev. 0 Technical Data sheet Make-up Quanitites for 100 gallon (100 liter) tank size Component Metric (100 liters) U.S.
    [Show full text]
  • In-Process Recycling of Rinse Water from Copper Plating Operations Using Electrical Remediation by H.M
    Technical Article In-Process Recycling of Rinse Water From Copper Plating Operations Using Electrical Remediation by H.M. Garich, R.P. Renz, CEF, E.J. Taylor, & J.J. Sun* The copper plating industry generates large amounts Introduction & Background of contaminated rinse water. A novel system has been The electronics industry is the second largest basic industry developed to recycle the spent rinse water back to the in the world, surpassed only by the agriculture industry.1 rinsing operation. This system integrates electrowin- Virtually all electronics are mounted on printed wiring ning and ion-exchange for the effi cient removal of boards (PWB).2 The PWB not only provides a structural metal contaminants, such as copper. The system uti- surface for electronics components on which to be mounted, lizes integrated ion-exchange electrodes for the simul- but also provides an electrical connection for the compo- taneous removal of anions and cations in solution. nents. A PWB is formed by placing a patterned conductive After treatment, heavy metal concentration and TDS layer of metal atop of an inert substrate. The conductive are reduced, and the pH is neutralized. Consequently, surface is often composed of copper for several reasons:3 treated water can be recycled back to the rinse opera- tion. As an added benefi t, the cell has the ability to be • Copper is relatively inexpensive when compared with regenerated in-situ. other metals; copper is also in stable supply; • Copper has a high electrical conductivity; • Copper has a high plating effi ciency, offers good plating coverage and offers good throwing power and • Copper is less stringently regulated by the EPA than some other plating metals.
    [Show full text]
  • Copper Electrodeposition in a Magnetic Field
    Portland State University PDXScholar Dissertations and Theses Dissertations and Theses 1985 Copper electrodeposition in a magnetic field Hiroshi Takeo Portland State University Follow this and additional works at: https://pdxscholar.library.pdx.edu/open_access_etds Part of the Biological and Chemical Physics Commons Let us know how access to this document benefits ou.y Recommended Citation Takeo, Hiroshi, "Copper electrodeposition in a magnetic field" (1985). Dissertations and Theses. Paper 3550. https://doi.org/10.15760/etd.5438 This Thesis is brought to you for free and open access. It has been accepted for inclusion in Dissertations and Theses by an authorized administrator of PDXScholar. Please contact us if we can make this document more accessible: [email protected]. AN ABSTRACT OF THE THESIS OF Hiroshi Takeo for the Master of Science in Physics presented June 21, 1995. Title: Copper Electrodeposition in a Magnetic Field APPROVED BY MEMBERS OF THE THESIS COMMITTEE: Carl G. Bachhuber Donald G. Howar Nan-Teh Hsu The effect of a magnetic field on copper electrodeposition was investigated. was electrodeposited onto square copper cathodes 1 sq cm in area from an aqueous solution (0.5 M Cuso4 , 0.5 M H2so4), A glass cell was placed between the pole pieces of an electromagnet, and the magnetic fields applied were in the range from 0 to 12.5 kG. The current density was in the range from 80 mA/sq cm to 880 mA/sq cm. In each of the experiments, ce 11 current, ce 11 voltage, and cell 2 temperature were monitored with a microcomputer. The weight change, deposit surface and cross section morphology, and hardness were also found.
    [Show full text]
  • Copper and Copper Alloys: Studies of Additives
    Copper and Copper Alloys: Studies of Additives Igor Volov Submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy in the Graduate School of Arts and Sciences COLUMBIA UNIVERSITY 2013 © 2012 Igor Volov All rights reserved Abstract Copper and Copper Alloys: Studies of Additives Igor Volov Electrodeposition of copper is used extensively for the fabrication of electrical interconnects in semiconductor device manufacturing and in printed circuit board production, as well as other industries. Copper is often plated from an acidic copper sulfate electrolyte with a number of inorganic and organic constituents. Electrolyte enables filling of complex surface geometries with desired internal and surface properties. Continuing miniaturization of modern microelectronics requires a highly controlled electrodeposition process and also requires interconnect materials with improved electromigration and stress migration resistances. Thus, current research deals with two avenues that have a potential to improve the process of copper electroplating and extend copper technology to meet the challenges of future device dimensions. The improvement in the plating process of copper is being sought by the integration of an iron redox couple (Fe3+/Fe2+) to copper electrolytes. Certain benefits of incorporating Fe3+/Fe2+ subsystem in combination with inert anode to the electrolyte have been previously recognized, though without regards to the impact that Fe3+/Fe2+ can exert on the behavior of additives. Organic additives are essential constituents of all copper plating baths. Therefore, we studied how the presence of Fe3+/Fe2+ affects organics additives, with focus on two representative components: polyethylene glycol (PEG) and bis(3-sulfopropyl)-disulfide (SPS). Electrochemical studies on a rotating disk electrode (RDE) and microfluidic device showed that the behavior of PEG during copper deposition is not affected in the presence of Fe3+ and Fe2+ ions.
    [Show full text]