Review of the State-Of-The-Art in Power Electronics Suitable for 10-Kw Military Power Systems
Total Page：16
File Type：pdf, Size：1020Kb
ORNL/TM-2003/209 REVIEW OF THE STATE-OF-THE-ART IN POWER ELECTRONICS SUITABLE FOR 10-KW MILITARY POWER SYSTEMS R. H. Staunton B. Ozpineci T. J. Theiss L. M. Tolbert* Oak Ridge National Laboratory *The University of Tennessee (Joint appointment with the Oak Ridge National Laboratory and the University of Tennessee) This report was prepared as an account of work sponsored by an agency of the United States Government. Neither the United States Government nor any agency thereof, nor any of their employees, makes any warranty, express or implied, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any information, apparatus, product, or process disclosed, or represents that its use would not infringe privately owned rights. Reference herein to any specific commercial product, process, or service by trade name, trademark, manufacturer, or otherwise, does not necessarily constitute or imply its endorsement, recommendation, or favoring by the United States Government or any agency thereof. The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or any agency thereof. ORNL/TM-2003/209 Engineering Science & Technology Division REVIEW OF THE STATE-OF-THE-ART IN POWER ELECTRONICS SUITABLE FOR 10KW MILITARY POWER SYSTEMS R. H. Staunton B. Ozpineci T. J. Theiss L. M. Tolbert October 2003 Manuscript completed: September 2003 Date Published: December 2003 Prepared by the OAK RIDGE NATIONAL LABORATORY Oak Ridge, Tennessee 37831 managed by UT-BATTELLE, LLC for the U.S. DEPARTMENT OF ENERGY Under contract DE-AC05-00OR22725 TABLE OF CONTENTS Page LIST OF FIGURES .............................................................................................................................. iv LIST OF TABLES................................................................................................................................ v ACRONYMS, ABBREVIATIONS, AND INITIALISMS .................................................................. vi EXECUTIVE SUMMARY .................................................................................................................. viii ABSTRACT.......................................................................................................................................... x 1. INTRODUCTION ........................................................................................................................ 1 1.1 BACKGROUND................................................................................................................ 1 1.2 PURPOSE OF REPORT .................................................................................................... 1 1.2.1 Scope of Work ....................................................................................................... 2 1.2.2 Report Outline........................................................................................................ 2 1.3 APPROACH ...................................................................................................................... 3 2. REQUIREMENTS AND TOPOLOGIES FOR MOBILE POWER SUPPLIES ......................... 5 2.1 POWER REQUIREMENTS FOR ARMY APPLICATIONS............................................ 5 2.2 ALTERNATOR SYSTEM AND MANUFACTURERS ................................................... 5 2.3 SURGE REQUIREMENTS FOR THE TEP SYSTEM ..................................................... 7 2.4 LIKELY INVERTER TOPOLOGIES OF THE POWER ELECTRONICS ...................... 8 2.4.1 Circuit Topologies for Mobile Power Supplies ..................................................... 8 2.4.2 Active Rectification............................................................................................... 11 2.4.3 Energy Storage....................................................................................................... 13 3. MARKET SURVEY OF COMMERCIALLY AVAILABLE POWER ELECTRONICS ......... 15 3.1 AVALIBILITY OF RELIABLE COMMERCIAL INVERTERS...................................... 15 3.2 PACKAGING OF COMMERCIAL INVERTERS ............................................................ 15 3.3 MOTOR DRIVE AND MICROTURBINE CIRCUITRY AND FEATURES................... 19 3.4 DATA OBTAINED ON MOTOR DRIVE MANUFACTURERS..................................... 21 3.5 DATA OBTAINED ON DISTRIBUTED ENERGY RESOURCES INVERTER MANUFACTURERS ......................................................................................................... 23 3.6 SURVEY OF MOTOR DRIVE MANUFACTURERS...................................................... 25 3.7 SURVEY OF DISTRIBUTED ENERGY RESOURCES INVERTER MANUFACTURERS ......................................................................................................... 33 3.8 ASSESSMENT AND RANKING OF INVERTER MANUFACTURERS ....................... 36 3.9 VARIABLE-SPEED ALTERNATIVE.............................................................................. 41 4. ADDITIONAL DESIGN CONSIDERATIONS .......................................................................... 44 4.1 EFFECTS OF EMI ON THE TQM SYSTEM ................................................................... 44 4.1.1 Predicted Effects of a HEMP................................................................................. 44 4.1.2 HEMP Test Facility ............................................................................................... 47 4.1.3 Protective Methods against EMP........................................................................... 48 ii 4.1.4 TEP System Application........................................................................................ 48 4.2 RELIABILITY ISSUES ..................................................................................................... 49 4.2.1 Effects of Environmental Stressors on Reliability................................................. 49 4.2.2 Upper Bounds on MTBF ....................................................................................... 52 5. DIRECTLY APPLICABLE ADVANCES IN TECHNOLOGY ................................................. 53 5.1 WIDE-BANDGAP SEMICONDUCTORS FOR USE IN POWER APPLICATIONS ..... 53 5.1.1 Properties of Wide-Bandgap Semiconductors ....................................................... 54 5.1.2 Commercial Availability of Wafers....................................................................... 59 5.1.3 Commercially Available Wide-Bandgap Semiconductor-Based Power Devices.. 59 5.1.4 Forecasting the Future............................................................................................ 59 5.2 CRYOGENIC POWER ELECTRONICS TECHNOLOGIES REVIEW .......................... 60 5.2.1 Cryogenic Power Device ....................................................................................... 60 5.2.2 Cryogenic Power Converters ................................................................................. 61 5.2.3 CPE System and Control ....................................................................................... 65 6. SUMMARY AND RECOMMENDATIONS .............................................................................. 67 6.1 TECHNOLOGY SUMMARY............................................................................................ 67 6.2 RECOMMENDATIONS FOR PRODUCT DEVELOPMENT ......................................... 68 7. REFERENCES ............................................................................................................................ 70 APPENDIX A – PRODUCT INFORMATION FROM MOTOR DRIVE VENDORS ..................... 74 APPENDIX B – PRODUCT INFORMATION FROM DISTRIBUTED ENERGY RESOURCES VENDORS ........................................................................................................................................ 81 B.1 VENDORS AND MANUFACTURERS............................................................................ 81 B.2 ADDITIONAL VENDORS................................................................................................ 88 DISTRIBUTION.................................................................................................................................... 90 iii LIST OF FIGURES Figure Page 2.1 Simplified diagram of an inverter-based power source supplied by an energy storage device and an alternator............................................................................. 8 2.2 Simplified diagrams of dc link converter power converter circuits........................................ 9 2.3 Simplified diagram of a cycloconverter ................................................................................. 10 2.4 Simplified diagram of a HFLC............................................................................................... 10 2.5 Alternator voltage rectified and filtered in a simple rectifier/capacitor circuit to create a dc voltage with ripple................................................................................. 11 3.1 Well-packaged motor drive with inverter power electronics located in the upper left corner of the casing behind layers of circuit boards and the front display............. 16 3.2 Large cabinet with compact inverter module ......................................................................... 17 3.3 Capstone microturbine (30 kW) and Elliot microturbine (80 kW)......................................... 17 3.4 Bowman inverter location....................................................................................................... 18