Performance Analysis of Dual Core, Core 2 Duo and Core I3 Intel Processor
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AMD Athlon™ Processor X86 Code Optimization Guide
AMD AthlonTM Processor x86 Code Optimization Guide © 2000 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other applica- tion in which the failure of AMD’s product could create a situation where per- sonal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Trademarks AMD, the AMD logo, AMD Athlon, K6, 3DNow!, and combinations thereof, AMD-751, K86, and Super7 are trademarks, and AMD-K6 is a registered trademark of Advanced Micro Devices, Inc. Microsoft, Windows, and Windows NT are registered trademarks of Microsoft Corporation. -
A Dual Core Processor Has Two Cores (Essentially, Two Cpus on One Chip)
Faculty of Engineering & Information Technology Al-Azhar University-Gaza Dr. Mohammad Aqel Microprocessors and Interfacing (ITCC 3301) Homework (1) Intel Core is a brand name used for various mid-range to high-end consumer and business microprocessors made by Intel. In general, processors sold as Core are more powerful variants of the same processors marketed as entry-level Celeron and Pentium. Similarly, identical or more capable versions of Core processors are also sold as Xeon processors for the server market. The current lineup of Core processors includes the latest Intel Core i7, Intel Core i5 and Intel Core i3, and the older Intel Core 2 Solo, Intel Core 2 Duo, Intel Core 2 Quad, and Intel Core 2 Extreme lines. 1- The original Core brand refers to Intel's 32-bit dual-core x86 CPUs. 2- Unlike the Intel Core, Intel Core 2 is a 64-bit processor, supporting Intel 64. The Core brand comprised two branches: the Duo (dual-core) and Solo (Duo with one disabled core). A dual core processor has two cores (essentially, two CPUs on one die (piece) silicon chip (IC)). Core2Duo is a specific dual-core processor design. Thus, all Core2Duo CPUs are dual-core CPUs, but not all Intel dual-core CPUs are Core2Duo designs. Core 2 is a brand encompassing a range of Intel's consumer 64-bit x86-64 single-, dual-, and quad-core microprocessors based on the Core microarchitecture. The single- and dual-core models are single-die, whereas the quad-core models comprise two dies, each containing two cores, packaged in a multi-chip module. -
Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems. -
CISC Processor - Intel X86
Architecture of Computers and Parallel Systems Part 4: Intel x86 History Ing. Petr Olivka [email protected] Department of Computer Science FEI VSB-TUO Architecture of Computers and Parallel Systems Part 4: Intel x86 History Ing. Petr Olivka [email protected] Department of Computer Science FEI VSB-TUO Architecture of Computers and Parallel Systems Part 4: Intel x86 History Ing. Petr Olivka [email protected] Department of Computer Science FEI VSB-TUO CISC Processor - Intel x86 This chapter will introduce the CISC processors evolution. We will try to illustrate the history on one typical processor, because the comparison of multiple processors simultaneously would not be clear for readers. But the selection of one typical processor is complicated due to a variety of products and manufactures in the past 30 years. We have decided to describe in this presentation one of the best- known and longest mass-produced processors in existence. We definitely do not want to say that it is the best technology or that these are processors with the highest performance! The Intel x86 processors are the selected product line. Intel 8080 (Year-Technology-Transistors-Frequency-Data bus-Address Bus) Y: 1974 T: NMOS 6μm Tr: 6000 F: 2MHz D: 8b A: 16b This 8 bit processor is not directly the first member of x86 series, but it can not be skipped. It is one of the first commercially successful microprocessors. This microprocessor became the basis for a number of the first single-board computers and its instruction set inspired other manufacturers to develop 8-bit processors. -
Intel® Core™ Microarchitecture • Wrap Up
EW N IntelIntel®® CoreCore™™ MicroarchitectureMicroarchitecture MarchMarch 8,8, 20062006 Stephen L. Smith Bob Valentine Vice President Architect Digital Enterprise Group Intel Architecture Group Agenda • Multi-core Update and New Microarchitecture Level Set • New Intel® Core™ Microarchitecture • Wrap Up 2 Intel Multi-core Roadmap – Updates since Fall IDF 3 Ramping Multi-core Everywhere 4 All products and dates are preliminary and subject to change without notice. Refresher: What is Multi-Core? Two or more independent execution cores in the same processor Specific implementations will vary over time - driven by product implementation and manufacturing efficiencies • Best mix of product architecture and volume mfg capabilities – Architecture: Shared Caches vs. Independent Caches – Mfg capabilities: volume packaging technology • Designed to deliver performance, OEM and end user experience Single die (Monolithic) based processor Multi-Chip Processor Example: 90nm Pentium® D Example: Intel Core™ Duo Example: 65nm Pentium D Processor (Smithfield) Processor (Yonah) Processor (Presler) Core0 Core1 Core0 Core1 Core0 Core1 Front Side Bus Front Side Bus Front Side Bus *Not representative of actual die photos or relative size 5 Intel® Core™ Micro-architecture *Not representative of actual die photo or relative size 6 Intel Multi-core Roadmap 7 Intel Multi-core Roadmap 8 Intel® Core™ Microarchitecture Based Platforms Platform 2006 20072007 Caneland Platform (2007) MP Servers Tigerton (QC) (2007) Bensley Platform (Q2’06)/ Glidewell Platform (Q2’06) ) DP Servers/ Woodcrest (Q3’06) DP Workstation Clovertown (QC) (Q1’07) Kaylo Platform (Q3’06)/ Wyloway Platform (Q3 ’06) UP Servers/ Conroe (Q3’06) UP Workstation Kentsfield (QC) (Q1’07) Bridge Creek Platform (Mid’06) Desktop -Home Conroe (Q3’06) Kentsfield (QC) (Q1’07) Desktop -Office Averill Platform (Mid’06) Conroe (Q3’06) Mobile Client Napa Platform (Q1’06) Merom (2H’06) All products and dates are preliminary 9 Note: only Intel® Core™ microarchitecture QC refers to Quad-Core and subject to change without notice. -
Nt* and Rtl* INT 2Eh CALL Ntdll!Kifastsystemcall
ȘFĢ: Fųřțįm’ș Đěřįvǻțįvě Bỳ Jǿșěpħ Ŀǻňđřỳ ǻňđ Ųđį Șħǻmįř Țħě Ŀǻbș țěǻm ǻț ȘěňțįňěŀǾňě řěčěňțŀỳ đįșčǿvěřěđ ǻ șǿpħįșțįčǻțěđ mǻŀẅǻřě čǻmpǻįģň șpěčįfįčǻŀŀỳ țǻřģěțįňģ ǻț ŀěǻșț ǿňě Ěųřǿpěǻň ěňěřģỳ čǿmpǻňỳ. Ųpǿň đįșčǿvěřỳ, țħě țěǻm řěvěřșě ěňģįňěěřěđ țħě čǿđě ǻňđ běŀįěvěș țħǻț bǻșěđ ǿň țħě ňǻțųřě, běħǻvįǿř ǻňđ șǿpħįșțįčǻțįǿň ǿf țħě mǻŀẅǻřě ǻňđ țħě ěxțřěmě měǻșųřěș įț țǻķěș țǿ ěvǻđě đěțěčțįǿň, įț ŀįķěŀỳ pǿįňțș țǿ ǻ ňǻțįǿň-șțǻțě șpǿňșǿřěđ įňįțįǻțįvě, pǿțěňțįǻŀŀỳ ǿřįģįňǻțįňģ įň Ěǻșțěřň Ěųřǿpě. Țħě mǻŀẅǻřě įș mǿșț ŀįķěŀỳ ǻ đřǿppěř țǿǿŀ běįňģ ųșěđ țǿ ģǻįň ǻččěșș țǿ čǻřěfųŀŀỳ țǻřģěțěđ ňěțẅǿřķ ųșěřș, ẅħįčħ įș țħěň ųșěđ ěįțħěř țǿ įňțřǿđųčě țħě pǻỳŀǿǻđ, ẅħįčħ čǿųŀđ ěįțħěř ẅǿřķ țǿ ěxțřǻčț đǻțǻ ǿř įňșěřț țħě mǻŀẅǻřě țǿ pǿțěňțįǻŀŀỳ șħųț đǿẅň ǻň ěňěřģỳ ģřįđ. Țħě ěxpŀǿįț ǻffěčțș ǻŀŀ věřșįǿňș ǿf Mįčřǿșǿfț Ẅįňđǿẅș ǻňđ ħǻș běěň đěvěŀǿpěđ țǿ bỳpǻșș țřǻđįțįǿňǻŀ ǻňțįvįřųș șǿŀųțįǿňș, ňěxț-ģěňěřǻțįǿň fįřěẅǻŀŀș, ǻňđ ěvěň mǿřě řěčěňț ěňđpǿįňț șǿŀųțįǿňș țħǻț ųșě șǻňđbǿxįňģ țěčħňįqųěș țǿ đěțěčț ǻđvǻňčěđ mǻŀẅǻřě. (bįǿměțřįč řěǻđěřș ǻřě ňǿň-řěŀěvǻňț țǿ țħě bỳpǻșș / đěțěčțįǿň țěčħňįqųěș, țħě mǻŀẅǻřě ẅįŀŀ șțǿp ěxěčųțįňģ įf įț đěțěčțș țħě přěșěňčě ǿf șpěčįfįč bįǿměțřįč věňđǿř șǿfțẅǻřě). Ẅě běŀįěvě țħě mǻŀẅǻřě ẅǻș řěŀěǻșěđ įň Mǻỳ ǿf țħįș ỳěǻř ǻňđ įș șțįŀŀ ǻčțįvě. İț ěxħįbįțș țřǻįțș șěěň įň přěvįǿųș ňǻțįǿň-șțǻțě Řǿǿțķįțș, ǻňđ ǻppěǻřș țǿ ħǻvě běěň đěșįģňěđ bỳ mųŀțįpŀě đěvěŀǿpěřș ẅįțħ ħįģħ-ŀěvěŀ șķįŀŀș ǻňđ ǻččěșș țǿ čǿňșįđěřǻbŀě řěșǿųřčěș. Ẅě vǻŀįđǻțěđ țħįș mǻŀẅǻřě čǻmpǻįģň ǻģǻįňșț ȘěňțįňěŀǾňě ǻňđ čǿňfįřměđ țħě șțěpș ǿųțŀįňěđ běŀǿẅ ẅěřě đěțěčțěđ bỳ ǿųř Đỳňǻmįč Běħǻvįǿř Țřǻčķįňģ (ĐBȚ) ěňģįňě. Mǻŀẅǻřě Șỳňǿpșįș Țħįș șǻmpŀě ẅǻș ẅřįțțěň įň ǻ mǻňňěř țǿ ěvǻđě șțǻțįč ǻňđ běħǻvįǿřǻŀ đěțěčțįǿň. Mǻňỳ ǻňțį-șǻňđbǿxįňģ țěčħňįqųěș ǻřě ųțįŀįżěđ. -
The Intel X86 Microarchitectures Map Version 2.0
The Intel x86 Microarchitectures Map Version 2.0 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • Variant: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128 -
Inside Intel® Core™ Microarchitecture and Smart Memory Access an In-Depth Look at Intel Innovations for Accelerating Execution of Memory-Related Instructions
White Paper Inside Intel® Core™ Microarchitecture and Smart Memory Access An In-Depth Look at Intel Innovations for Accelerating Execution of Memory-Related Instructions Jack Doweck Intel Principal Engineer, Merom Lead Architect Intel Corporation Entdecken Sie weitere interessante Artikel und News zum Thema auf all-electronics.de! Hier klicken & informieren! White Paper Intel Smart Memory Access and the Energy-Efficient Performance of the Intel Core Microarchitecture Introduction . 2 The Five Major Ingredients of Intel® Core™ Microarchitecture . 3 Intel® Wide Dynamic Execution . 3 Intel® Advanced Digital Media Boost . 4 Intel® Intelligent Power Capability . 4 Intel® Advanced Smart Cache . 5 Intel® Smart Memory Access . .5 How Intel Smart Memory Access Improves Execution Throughput . .6 Memory Disambiguation . 7 Predictor Lookup . 8 Load Dispatch . 8 Prediction Verification . .8 Watchdog Mechanism . .8 Instruction Pointer-Based (IP) Prefetcher to Level 1 Data Cache . .9 Traffic Control and Resource Allocation . 10 Prefetch Monitor . 10 Summary . .11 Author’s Bio . .11 Learn More . .11 References . .11 2 Intel Smart Memory Access and the Energy-Efficient Performance of the Intel Core Microarchitectures White Paper Introduction The Intel® Core™ microarchitecture is a new foundation for Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art, power-efficient multi-core microarchi- tecture delivers increased performance and performance per watt, thus increasing overall energy efficiency. Intel Core microarchitecture extends the energy-efficient philosophy first delivered in Intel's mobile microarchitecture (Intel® Pentium® M processor), and greatly enhances it with many leading edge microarchitectural advancements, as well as some improvements on the best of Intel NetBurst® microarchitecture. -
Intel Mobile CPU (2007-2010)
Intel Mobile CPU (2007-2010) Brand Core 2 Extreme Core 2 Quad Core 2 Extreme Core i7 Processor # X9000 X9100 Q9000 Q9100 QX9xxx Voltage Extreme Extreme Power optimized Standard V Standard V Extreme Codename Penryn 6M Penryn QC Auburndale Clarksfield Platform Santa Rosa Montevina Montevina Calpella Micro-architecture Core MA Core MA Nehalem # of Core Dual Core Quad Core Dual Core Quad Core Hyper-Threading N/A 2 threads/core 2 threads/core Intel 64 Intel 64 Intel 64 Intel 64 VT VT Extended VT-x/d Extended VT-x/d EIST(SpeedStep) EIST(SpeedStep) EIST(SpeedStep) IDA N/A IDA Turbo Mode Cache 6MB L2 2x3MB L2 2x6MB 512KB L2+4MB L3 1MB L2+8MB L3 FSB FSB 800 FSB1066 FSB1066 PCIe x16/DMI PCIe x16/DMI Memory interface N/A N/A DDR3 x2 DDR3 x2 GPU core N/A N/A GPU core N/A Package PGA PGA rPGA989 rPGA989 Socket Socket P Socket P Process Technology 45nm 45nm 45nm 45nm # of Die 1 2 2 2 2(CPU+GMCH) 1 TDP 44W 45W 45W 45W 35W 45W? 45W? 55W Launch Q1'08 Q2'08 Q1'09 Q3'08 Q3'08 Q3'09 09 09 Q3'09 Brand Atom Celeron Core 2 Duo Core 2 Duo Core 2 Duo Processor # N2xx 7xx T8100/8300 T9300/9500 SP9200/9400 P8400/8600 P9500 T9400/9600 Voltage Standard V Standard V ULV Standard V Power optimized Power optimized Standard V Codename Diamondville SC Pineview SC Pineview DC Penryn Penryn 3M Penryn 6M Penryn 6M Penryn 3M Penryn 6M Platform Montevina Santa Rosa Montevina Micro-architecture Silverthorne Lincroft Core MA Core MA Core MA # of Core Single Core Single Core Dual Core Single Core Dual Core Dual Core Hyper-Threading 2 threads/core 2 threads/core N/A N/A N/A Intel -
Intel® Technology Journal the Original 45Nm Intel Core™ Microarchitecture
Volume 12 Issue 03 Published October 2008 ISSN 1535-864X DOI: 10.1535/itj.1203 Intel® Technology Journal The Original 45nm Intel Core™ Microarchitecture Intel Technology Journal Q3’08 (Volume 12, Issue 3) focuses on Intel® Processors Based on the Original 45nm Intel Core™ Microarchitecture: The First Tick in Intel’s new Architecture and Silicon “Tick-Tock” Cadence The Technical Challenges of Transitioning Original 45nm Intel® Core™ 2 Processor Performance Intel® PRO/Wireless Solutions to a Half-Mini Card Power Management Enhancements Greater Mobility Through Lower Power in the 45nm Intel® Core™ Microarchitecture Improvements in the Intel® Core™ 2 Penryn Processor Family Architecture Power Improvements on 2008 Desktop Platforms and Microarchitecture Mobility Thin and Small Form-Factor Packaging for Intel® Processors Based on Original 45nm The First Six-Core Intel® Xeon™ Microprocessor Intel Core™ Microarchitecture More information, including current and past issues of Intel Technology Journal, can be found at: http://developer.intel.com/technology/itj/index.htm Volume 12 Issue 03 Published October 2008 ISSN 1535-864X DOI: 10.1535/itj.1203 Intel® Technology Journal The Original 45nm Intel Core™ Microarchitecture Articles Preface iii Foreword v Technical Reviewers vii Original 45nm Intel® Core™ 2 Processor Performance 157 Power Management Enhancements in the 45nm Intel® Core™ Microarchitecture 169 Improvements in the Intel® Core™ 2 Penryn Processor Family Architecture 179 and Microarchitecture Mobility Thin and Small Form-Factor Packaging -
Intel Roadmap Directions 2006 a Resource Guide for Cios and IT Professionals
Intel Roadmap Directions 2006 A Resource Guide for CIOs and IT Professionals October – December 2006 Continuing its initiatives to constantly increase performance of desktop, mobile and server platforms, Intel now ushers in a path- breaking technology that is sure to change the world of computers. Intel has launched the industry's first Quad-Core processors that provide breakthrough performance and capabilities. Quad-Core Intel® Xeon® processors for the ultimate in powerful, dense and energy efficient servers and Intel® Core™2 Extreme Quad-Core processors for desktop platforms. This edition of the Intel Roadmap Directions gives you more information on the new Multi-Core microarchitecture for servers, desktops and shows you how they will impact the performance of your IT infrastructure. Redefining performance with Multi-Core IT managers are continually faced with providing more Intel multi-core platforms will enhance computing experience services to more users, meeting higher performance by: expectations, storing and managing ever-growing amounts l Improving performance of today’s existing multi-threaded of data, maintaining availability and stability, and improving applications security. To meet many of these challenges, they’ve turned l Boosting overall system performance while remaining to Intel® Itanium® 2 processors and Intel® Xeon® processors. within acceptable power and thermal envelopes And now a transformative technology such as the Intel® multi-core processor-based platform has come along to l Increasing responsiveness of applications in multi-tasking dramatically push performance to a new level, solve pressing environments challenges, and provide new avenues for innovation. Today’s l Enabling new applications and humanlike intelligence in multi-core server processors are a critical industry inflection desktop, laptop, and other small form factors that may point. -
Intel® Core™2 Duo Mobile Processor for Intel® Centrino® Duo Mobile Processor Technology
Intel® Core™2 Duo Mobile Processor for Intel® Centrino® Duo Mobile Processor Technology Datasheet September 2007 Document Number: 314078-004 INFORMATIONLegal Lines and Disclaimers IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.