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Program ICEC 2014 Dresden, Germany The 27th International Conference on Electrical Contacts ICEC 2014 Dresden, Germany Program June 22 – 26, 2014 International Congress Center Dresden (ICD) & MARITIM Hotel www.icec2014.org Welcome of the Chairs of ICEC 2014 Welcome to the City of Dresden The 27th International Conference on Electrical On behalf of the city of Dresden, I congratulate you on your Contacts will be held from June 22 - 26, 2014 decision to carry out the 27th International Conference on at the International Con gress Center Dresden, Electrical Contacts (ICEC) in our beautiful city. You will Germany. notice – Dresden has a lot to offer. It is one of the leading business locations in Germany and has excellent prospects The first ICEC was organized by Dr. Ragnar Holm and Prof. for further growth – a success which is based on courageous R. E. Armington and held at the University of Maine in 1961. lighthouse policy. We have invested in high technology and Since then, ICEC has been held in Germany three times in the research associated with it. And it has paid off. (Munich, Berlin, Nuremberg). Dresden is a top location in the key sectors of microelectro- The purpose of the ICEC 2014 in Dresden is to provide a nics, nanotechnology, new materials and life sciences. The forum for the presentation and discussion of the latest re - world's leading enterprises such as GlobalFoundries, Glaxo search and development in the field of electrical contacts SmithKline Biologicals, OF ARDENNE or Novaled operate in and other related fields all while promoting an exchange of Dresden. Many companies from various industries are scientific and technical knowledge between specialists from deeply rooted in the city. They take advantage of a coopera- all over the world. tive local research milieu with excellent institution from Max-Planck, Helmholtz, Leibniz or Fraunhofer Society. The Throughout its history, the ICEC has greatly contributed to diversity of industries is a major reason for the sustained the development of this field and to the promotion of inter- positive development of the economy of Dresden. national collaboration. Not least impressive ”Elbflorenz“ with its unique quality of life: the Frauenkirche, the Semper Opera House, the Green Sincerely yours Vault, the trendy district of New Town, the picturesque Elbe Valley – in Dresden, it is easy to keep the balance between Univ.-Prof. Dr.-Ing. Frank Berger work and leisure. TU Ilmenau, Germany We are delighted that your international conference, com - bines culture and economy and connects your and our success story. We wish you a pleasant stay and useful new contacts. Dirk Hilbert Deputy Mayor, Head of Department of Economic Affairs 2 3 Organized by Advisory Group VDE, Association for Electrical, Electronic & Information Chairman W. Johler (Switzerland) Technologies ETG, the Power Engineering Society whithin VDE General Secretary J. B. P. Williamson (UK) ITG, Information Technology Society within VDE Members A. R. Neuhaus (Austria) R. S. Timsit (Canada) Organizing Committee J. G. Zhang (China) N. Ben Jemaa (France) Chairman F. Berger (TU Ilmenau) F. Berger (Germany) H. Inoue (Japan) Members M. Anheuser (SIEMENS AG) P. van Dijk (Netherlands) G. Becker M. Runde (Norway) I. Buresch (Wieland Werke AG) B. Miedzinski (Poland) V. Behrens (Doduco GmbH) L. Sjögren (Sweden) P. Braumann P. Slade (USA) H. Draxler (Zettler Electronics GmbH) B. Gehlert Honorary Members K.-H. Schröder (Germany) (Heraeus Materials Technology GmbH) T. Takagi (Japan) S. Großmann (TU Dresden) J. Kulsetas (Norway) C. Holzapfel E. Walczuk (Poland) (Schleifring und Apparatebau GmbH) Th. J. Schöpf (USA) U.-M. Kersten B. Martin (IMS Connector Systems GmbH) P. Meckler (E-T-A GmbH) W. Pump (ABB Stotz Kontakt GmbH) H. Schmidt (Tyco Electronics AMP GmbH) Th. J. Schöpf (EATON Corporation, USA) K.-H. Schröder 4 5 ICEC 2014 - Program Overview Conference ICEC 2014 Program Time Plenary Exhibition ▼ ▼ ▼ ■ Monday, June 23, 2014 Sunday, June 22, 2014 17:00 - 19:00 Registration Set up Exhibition 8:00 - 10:00 Monday, June 23, 2014 Registration 08:00 Registration 10:00 Opening Session 10:00 - 10:30 Room: Plenary 10:30 01. Fundamentals 12:30 Lunch Opening Session – Welcome 13:30 02. Materials I W. Johler, Chairman of the International Advisory Group 15:30 Coffee Break F. Ruchay, stellv. Leiter des Amtes für Wirtschaftsförderung der 16:00 03. Connectors Stadt Dresden 18:00 Get Together – F. Berger, Conference Chairman Poster Session with Buffet 10:30 - 12:30 Room: Plenary Tuesday, June 24, 2014 01. Fundamentals 07:30 Registration 08:00 04. Arc Interuption/DC Chairman: J. B. P. Williamson, Williamson Interface Ltd., UK 10:00 Coffee Break Co-Chairman: K.-H. Schröder, Germany 10:30 05. Contacts/Connectors 10:30 The Threshold Welding Current for Large Area Closed 12:30 Lunch Contacts with Two or Three points of Contact 13:30 06. Materials II/Vacuum P. G. Slade, FIEEE, USA and Refractory Contacts 10:50 Enhancing the contact interface by matching the 15:30 Coffee Break surface pressure and current density distribution 16:00 Albert-Keil-Ceremony M. Leidner, H. Schmidt, S. Sachs, S. Thoss, Tyco 17:00-19:00 Poster Session Electronics AMP GmbH, Germany; M. Myers, TE Wednesday, June 25, 2014 Connectivity, USA 07:30 Registration 11:10 The Influence of Multiscale Roughness on the Real 08:00 07. Sliding Contacts/Fretting Contact Area and Contact Resistance between 10:00 Coffee Break Real Reference Surfaces 10:30 08. Reliability/Environmental X. Zhang, R. L. Jackson, Auburn University, USA 12:30 Lunch 11:30 Increased contact resistance of switching contacts 13:30 09. Modelling and Simulation during current carrying 15:30 Coffee Break M. Weis, AC²T research GmbH, Austria; W. Johler, 16:00 10. Power Contacts TE Connectivity Solutions GmbH, Switzerland 19:00 Conference Dinner 11:50 Oxygen diffusion process on the copper surface by (Ball room Maritim) contact resistance Thursday, June 26, 2014 H. Kikuchi, I. Minowa, Tamagawa University, Japan 07:30 Registration Contact Blow-Apart Forces: Experience in Molded 08:00 11. New Technologies 12:10 Case Circuit Breaker Contact Systems 10:00 Coffee Break J. Ferree, Siemens Industry Inc., USA; M. Anheuser, 10:30 12. Arc Interruption/Materials L. Petrovic, Siemens AG, Germany 11:50 Closing Session 12:00 Lunch 12:30 - 13:30 Room: Exhibition 13:00-19:00 Technical Program (Tour) Lunch 6 7 13:30 - 15:30 Room: Plenary 16:00 - 18:00 Room: Plenary 02. Materials I 03. Connectors Chairman: R. S. Timsit, Timron Scientific Consulting Inc., Canada Chairman: P. van Dijk, PVDIJK B.V., 's-Hertogenbosch, Netherlands Co-Chairman: P. Braumann, Germany Co-Chairman: I. Buresch, Wieland Werke AG, Germany 13:30 A Switchgear Manufacture's Perspective of 16:00 Electrical behavior of golden automotive connec- Contact Material Requirements tors under vibration tests S. Kosse, W. Hartmann, N. Wenzel, C. Schuh, S. Noël, A. Brézard-Oudot, Laboratoire de Génie M. Anheuser, Siemens AG, Germany Electrique de Paris Supélec, France 13:50 New microstructure investigations of arc damaged 16:20 Novel Silver-Palladium Electrolyte for Electrical silver/tinoxide electrodes by means of FIB- Contacts technique F. Talgner, U. Manz, S. Berger, B. Weyhmüller, Umicore C. Selzner, F. Mücklich, Saarland University, Germany Galvanotechnik GmbH, Germany; A. Pfund, Forschungs- institut Edelmetalle und Metallchemie, Germany 14:10 Optimisation of material erosion and welding performance by metal oxides and magnetic 16:40 Connector Level Performance Evaluation of a New particles High Speed Reel to Reel Electroplated Silver E. Yee Kin Choi, C. Bourda, A. Vassa, Metalor Palladium Alloy Contact Finish Technologies, France; E. Carvou, J. B. Mitchell, M. Myers, TE Connectivity, USA; H. Schmidt, TE University of Rennes 1, France; N. Benjemaa, Connectivity, Germany Contelec, France 17:00 Prediction of Force-Displacement Relation of 14:30 An evaluation of Ag/W and Ag/Metal Oxide arcing Stamped Spring of Copper-based Materials contact combinations for circuit breaker applica- Y. Hattori, K. Furukawa, AutoNetworks Technologies, tions Ltd., Japan; H. Hamasaki, F. Yoshida, Hiroshima C. Leung, T. Bergemann, Metalor Technologies, USA; University, Japan C. Bourda, Metalor Technologies, France 17:20 Failure Mechanism of Sliding Electrical Contacts 14:50 Contact Material Effects on Dynamic Contact with Various Plated Materials Sticking Y. Zhou, B. Yao, S. Ge, C. Hong, J. Zhang, Beijing T. Mützel, M. Bender, R. Niederreuther, Umicore AG & University of Posts and Telecommunications, China Co. KG, Germany 17:40 The electrical contact resistance endurance of 15:10 Welding Behavior in Making and Breaking heterogeneous Ag/Sn interfaces subjected to Operations of Electrical Contacts fretting wear Q. Wang, C. Liu, Z. Li, D. Liu, L. Jinyou, Y. Xiaocheng, O. Perrinet, J. Laporte, S. Fouvry, LTDS, Ecole Huazhong University of Science and Technology, Centrale de Lyon, France; O. Alquier, PSA - Centre China; X. Wu, Wuhan University of Technology, China Technique, France 15:30 - 16:00 Room: Exhibition 18:00 - 20:00 Room: Exhibition Coffee Break Get Together and Poster Session with Buffet (please see page 20 ff. for poster title and authors) 8 9 ■ Tuesday, June 24, 2014 10:30 - 12:30 Room: Plenary 05. Contact/Connectors 7:30 - 10:00 Chairman: W. Johler, Tyco Electronics Logistics AG, Switzerland Registration Co-Chairman: H. Schmidt, Tyco Electronics AMP GmbH, Germany 8:00 - 10:00 Room: Plenary 10:30 Electrical and Tribological Characteristics of Copper Containing Diamond-like Carbon Nano- 04. Arc Interruption/DC composite Coating on Brass Substrate Sliding Chairman: B. Miedzinski, Wroclaw University of Technology, Poland against Brass Ball Co-Chairman: M. Anheuser, Siemens AG, Germany R. Hombo, N. Kato, T. Nozu, N. Inayoshi, Denso Corporation, Japan; T. Takeno, H. Miki, T. Takagi, 08:00 Hybrid switches in protective devices for low-volta- Tohoku University, Japan; J. Fontaine, M. Belin, LTDS, ge DC grids at commercial used buildings France P. Meckler, F. Gerdinand, E-T-A GmbH, Germany; R.
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