NIAGARA 2 OPENS the FLOODGATES Niagara 2 Design Is Closest Thing Yet to a True Server on a Chip by Harlan Mcghan {11/6/06-01}
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Sun Fire E2900 Server
Sun FireTM E2900 Server Just the Facts February 2005 SunWin token 401325 Sun Confidential – Internal Use Only Just The Facts Sun Fire E2900 Server Copyrights ©2005 Sun Microsystems, Inc. All Rights Reserved. Sun, Sun Microsystems, the Sun logo, Sun Fire, Netra, Ultra, UltraComputing, Sun Enterprise, Sun Enterprise Ultra, Starfire, Solaris, Sun WebServer, OpenBoot, Solaris Web Start Wizards, Solstice, Solstice AdminSuite, Solaris Management Console, SEAM, SunScreen, Solstice DiskSuite, Solstice Backup, Sun StorEdge, Sun StorEdge LibMON, Solstice Site Manager, Solstice Domain Manager, Solaris Resource Manager, ShowMe, ShowMe How, SunVTS, Solstice Enterprise Agents, Solstice Enterprise Manager, Java, ShowMe TV, Solstice TMNscript, SunLink, Solstice SunNet Manager, Solstice Cooperative Consoles, Solstice TMNscript Toolkit, Solstice TMNscript Runtime, SunScreen EFS, PGX, PGX32, SunSpectrum, SunSpectrum Platinum, SunSpectrum Gold, SunSpectrum Silver, SunSpectrum Bronze, SunStart, SunVIP, SunSolve, and SunSolve EarlyNotifier are trademarks or registered trademarks of Sun Microsystems, Inc. in the United States and other countries. All SPARC trademarks are used under license and are trademarks or registered trademarks of SPARC International, Inc. in the United States and other countries. Products bearing SPARC trademarks are based upon an architecture developed by Sun Microsystems, Inc. UNIX is a registered trademark in the United States and other countries, exclusively licensed through X/Open Company, Ltd. All other product or service names mentioned -
Design of a Rad-Hard Efuse Trimming Circuit For
Master Thesis 2018 DESIGN OF A RAD-HARD EFUSE TRIMMING CIRCUIT FOR BANDGAP VOLTAGE REFERENCE FOR LHC EXPERIMENTS UPGRADES Supervisors: Student: Prof. Maher Kayal1 Mustafa Beşirli Dr. Adil Koukab1 Dr. Stefano Michelis2 CERN-THESIS-2018-084 28/06/2018 1School of Engineering (STI), Electronics Laboratory (ELAB), EPFL. 2Experimental Physics Department, Microelectronics Section (EP-ESE-ME), CERN. Electronics Laboratory, STI/ELAB Electrical and Electronic Engineering Section 22 June 2018 2 ACKNOWLEDGEMENTS At the end of the two years of my master’s studies, I would like to thank all the people who supported me during this significant period of my life. First, I would like to thank Prof. Maher Kayal for having given me the chance to work in ELAB and I would like to express my gratitude to Prof. Adil Koukab for having given me the opportunity to work in collaboration with CERN and for supervising my thesis. I would like to express my appreciation to Stefano Michelis for his constant help and precious advices during the development of this project and for providing me vast amount of knowledge on rad-hard analog design. I would also like to thank Federico Faccio for his valuable advices and I would like to express my gratitude to Giacomo Ripamonti for his consistent support during the design and test of my chip. These years were very important for my professional career and personal development. I would like to thank all my friends at EPFL and at CERN; it was nice to meet them. I would also like to express my gratitude to my friends in Turkey for their consistent supports. -
5V/12V Efuse with Over Voltage Protection and Blocking FET Control Check for Samples: TPS2592AA, TPS2592AL, TPS2592BA, TPS2592BL, TPS2592ZA
TPS2592AA, TPS2592AL TPS2592BA, TPS2592BL TPS2592ZA www.ti.com SLVSC11B –JUNE 2013–REVISED NOVEMBER 2013 5V/12V eFuse with Over Voltage Protection and Blocking FET Control Check for Samples: TPS2592AA, TPS2592AL, TPS2592BA, TPS2592BL, TPS2592ZA 1FEATURES APPLICATIONS 2• 12 V eFuse – TPS2592Ax • HDD and SSD Drives • 5 V eFuse – TPS2592Bx • Set Top Boxes • 4.5 V – 18 V Protection – TPS2592Zx • Servers / AUX Supplies • Integrated 28mΩ Pass MOSFET • Fan Control • Fixed Over-Voltage Clamp (TPS2592Ax/Bx) • PCI/PCIe Cards • Absolute Maximum Voltage of 20V • Switches/Routers • 2 A to 5 A Adjustable I (±15% Accuracy) LIMIT PRODUCT INFORMATION(1) • Reverse Current Blocking Support FAULT PART NO UV OV CLAMP Status • Programmable OUT Slew Rate, UVLO RESPONSE • Built-in Thermal Shutdown TPS2592AA 4.3 V 15 V Auto Retry Active • UL Recognition Pending TPS2592BA 4.3 V 6.1 V Auto Retry Active TPS2592AL 4.3 V 15 V Latched Active • Safe during Single Point Failure Test TPS2592BL 4.3 V 6.1 V Latched Active (UL60950) TPS2592ZA 4.3 V — Auto-retry Active • Small Foot Print – 10L (3mm x 3mm) VSON TPS2592ZL 4.3 V — Latched Preview (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com DESCRIPTION The TPS2592xx family of eFuses is a highly integrated circuit protection and power management solution in a tiny package. The devices use few external components and provide multiple protection modes. They are a robust defense against overloads, shorts circuits, voltage surges, excessive inrush current, and reverse current. -
Dynamic Helper Threaded Prefetching on the Sun Ultrasparc® CMP Processor
Dynamic Helper Threaded Prefetching on the Sun UltraSPARC® CMP Processor Jiwei Lu, Abhinav Das, Wei-Chung Hsu Khoa Nguyen, Santosh G. Abraham Department of Computer Science and Engineering Scalable Systems Group University of Minnesota, Twin Cities Sun Microsystems Inc. {jiwei,adas,hsu}@cs.umn.edu {khoa.nguyen,santosh.abraham}@sun.com Abstract [26], [28], the processor checkpoints the architectural state and continues speculative execution that Data prefetching via helper threading has been prefetches subsequent misses in the shadow of the extensively investigated on Simultaneous Multi- initial triggering missing load. When the initial load Threading (SMT) or Virtual Multi-Threading (VMT) arrives, the processor resumes execution from the architectures. Although reportedly large cache checkpointed state. In software pre-execution (also latency can be hidden by helper threads at runtime, referred to as helper threads or software scouting) [2], most techniques rely on hardware support to reduce [4], [7], [10], [14], [24], [29], [35], a distilled version context switch overhead between the main thread and of the forward slice starting from the missing load is helper thread as well as rely on static profile feedback executed, minimizing the utilization of execution to construct the help thread code. This paper develops resources. Helper threads utilizing run-time a new solution by exploiting helper threaded pre- compilation techniques may also be effectively fetching through dynamic optimization on the latest deployed on processors that do not have the necessary UltraSPARC Chip-Multiprocessing (CMP) processor. hardware support for hardware scouting (such as Our experiments show that by utilizing the otherwise checkpointing and resuming regular execution). idle processor core, a single user-level helper thread Initial research on software helper threads is sufficient to improve the runtime performance of the developed the underlying run-time compiler main thread without triggering multiple thread slices. -
Sun SPARC Enterprise T5440 Servers
Sun SPARC Enterprise® T5440 Server Just the Facts SunWIN token 526118 December 16, 2009 Version 2.3 Distribution restricted to Sun Internal and Authorized Partners Only. Not for distribution otherwise, in whole or in part T5440 Server Just the Facts Dec. 16, 2009 Sun Internal and Authorized Partner Use Only Page 1 of 133 Copyrights ©2008, 2009 Sun Microsystems, Inc. All Rights Reserved. Sun, Sun Microsystems, the Sun logo, Sun Fire, Sun SPARC Enterprise, Solaris, Java, J2EE, Sun Java, SunSpectrum, iForce, VIS, SunVTS, Sun N1, CoolThreads, Sun StorEdge, Sun Enterprise, Netra, SunSpectrum Platinum, SunSpectrum Gold, SunSpectrum Silver, and SunSpectrum Bronze are trademarks or registered trademarks of Sun Microsystems, Inc. in the United States and other countries. All SPARC trademarks are used under license and are trademarks or registered trademarks of SPARC International, Inc. in the United States and other countries. Products bearing SPARC trademarks are based upon an architecture developed by Sun Microsystems, Inc. UNIX is a registered trademark in the United States and other countries, exclusively licensed through X/Open Company, Ltd. T5440 Server Just the Facts Dec. 16, 2009 Sun Internal and Authorized Partner Use Only Page 2 of 133 Revision History Version Date Comments 1.0 Oct. 13, 2008 - Initial version 1.1 Oct. 16, 2008 - Enhanced I/O Expansion Module section - Notes on release tabs of XSR-1242/XSR-1242E rack - Updated IBM 560 and HP DL580 G5 competitive information - Updates to external storage products 1.2 Nov. 18, 2008 - Number -
Design of Variation-Tolerant Circuits for Nanometer CMOS Technology: Circuits and Architecture Co-Design
Design of Variation-Tolerant Circuits for Nanometer CMOS Technology: Circuits and Architecture Co-Design by Mohamed Hassan Abu-Rahma A thesis presented to the University of Waterloo in ful¯llment of the thesis requirement for the degree of Doctor of Philosophy in Electrical and Computer Engineering Waterloo, Ontario, Canada, 2008 °c Mohamed Hassan Abu-Rahma 2008 I hereby declare that I am the sole author of this thesis. This is a true copy of the thesis, including any required ¯nal revisions, as accepted by my examiners. I understand that my thesis may be made electronically available to the public. ii Abstract Aggressive scaling of CMOS technology in sub-90nm nodes has created huge challenges. Variations due to fundamental physical limits, such as random dopants fluctuation (RDF) and line edge roughness (LER) are increasing signi¯cantly with technology scaling. In addition, manufacturing tolerances in process technology are not scaling at the same pace as transistor's channel length due to process control limitations (e.g., sub-wavelength lithography). Therefore, within-die process varia- tions worsen with successive technology generations. These variations have a strong impact on the maximum clock frequency and leakage power for any digital circuit, and can also result in functional yield losses in variation-sensitive digital circuits (such as SRAM). Moreover, in nanometer technologies, digital circuits show an in- creased sensitivity to process variations due to low-voltage operation requirements, which are aggravated by the strong demand for lower power consumption and cost while achieving higher performance and density. It is therefore not surprising that the International Technology Roadmap for Semiconductors (ITRS) lists variability as one of the most challenging obstacles for IC design in nanometer regime. -
Day 2, 1640: Leveraging Opensparc
Leveraging OpenSPARC ESA Round Table 2006 on Next Generation Microprocessors for Space Applications G.Furano, L.Messina – TEC-EDD OpenSPARC T1 • The T1 is a new-from-the-ground-up SPARC microprocessor implementation that conforms to the UltraSPARC architecture 2005 specification and executes the full SPARC V9 instruction set. Sun has produced two previous multicore processors: UltraSPARC IV and UltraSPARC IV+, but UltraSPARC T1 is its first microprocessor that is both multicore and multithreaded. • The processor is available with 4, 6 or 8 CPU cores, each core able to handle four threads. Thus the processor is capable of processing up to 32 threads concurrently. • Designed to lower the energy consumption of server computers, the 8-cores CPU uses typically 72 W of power at 1.2 GHz. G.Furano, L.Messina – TEC-EDD 72W … 1.2 GHz … 90nm … • Is a cutting edge design, targeted for high-end servers. • NOT FOR SPACE USE • But, let’s see which are the potential spin-in … G.Furano, L.Messina – TEC-EDD Why OPEN ? On March 21, 2006, Sun made the UltraSPARC T1 processor design available under the GNU General Public License. The published information includes: • Verilog source code of the UltraSPARC T1 design, including verification suite and simulation models • ISA specification (UltraSPARC Architecture 2005) • The Solaris 10 OS simulation images • Diagnostics tests for OpenSPARC T1 • Scripts, open source and Sun internal tools needed to simulate the design and to do synthesis of the design • Scripts and documentation to help with FPGA implementation -
Overview of Sun Integrated Lights out Manager
Overview of Sun Integrated Lights Out Manager February 2008 Sun Microsystems, Inc. Copyright © 2008 Sun Microsystems, Inc., 4150 Network Circle, Santa Clara, California 95054, U.S.A. All rights reserved. U.S. Government Rights - Commercial software. Government users are subject to the Sun Microsystems, Inc. standard license agreement and applicable provisions of the FAR and its supplements. Use is subject to license terms. This distribution may include materials developed by third parties. Parts of the product may be derived from Berkeley BSD systems, licensed from the University of California. UNIX is a registered trademark in the U.S. and in other countries, exclusively licensed through X/Open Company, Ltd. X/Open is a registered trademark of X/Open Company, Ltd. All SPARC trademarks are used under license and are trademarks or registered trademarks of SPARC International, Inc. in the United States and other countries. Products bearing SPARC trademarks are based upon an architecture developed by Sun Microsystems, Inc. Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries. AMD and Opteron are trademarks or registered trademarks of Advanced Micro Devices. Sun, Sun Microsystems, the Sun logo, Java, Solaris, Sun Blade, Sun Fire, and Sun SPARC Enterprise are trademarks or registered trademarks of Sun Microsystems, Inc. in the U.S. and other countries. This product is covered and controlled by U.S. Export Control laws and may be subject to the export or import laws in other countries. Nuclear, missile, chemical biological weapons or nuclear maritime end uses or end users, whether direct or indirect, are strictly prohibited. -
Ultrasparc-III Ultrasparc-III Vs Intel IA-64
UltraSparc-III UltraSparc-III vs Intel IA-64 vs • Introduction Intel IA-64 • Framework Definition Maria Celeste Marques Pinto • Architecture Comparition Departamento de Informática, Universidade do Minho • Future Trends 4710 - 057 Braga, Portugal [email protected] • Conclusions ICCA’03 ICCA’03 Introduction Framework Definition • UltraSparc-III (US-III) is the third generation from the • Reliability UltraSPARC family of Sun • Instruction level Parallelism (ILP) • Is a RISC processor and uses the 64-bit SPARC-V9 architecture – instructions per cycle • IA-64 is Intel’s extension into a 64-bit architecture • Branch Handling • IA-64 processor is based on a concept known as EPIC (Explicitly – Techniques: Parallel Instruction Computing) • branch delay slots • predication – Strategies: • static •dynamic ICCA’03 ICCA’03 Framework Definition Framework Definition • Memory Hierarchy • Pipeline – main memory and cache memory – increase the speed of CPU processing – cache levels location – several stages that performs part of the work necessary to execute an instruction – cache organization: • fully associative - every entry has a slot in the "cache directory" to indicate • Instruction Set (IS) where it came from in memory – is the hardware "language" in which the software tells the processor what to do • one-way set associative - only a single directory entry be searched – can be divided into four basic types of operations such as arithmetic, logical, • two-way set associative - two entries per slot to be searched (and is extended to program-control -
RESEARCH INSIGHTS – Hardware Design: FPGA Security Risks
RESEARCH INSIGHTS Hardware Design: FPGA Security Risks www.nccgroup.trust CONTENTS Author 3 Introduction 4 FPGA History 6 FPGA Development 10 FPGA Security Assessment 12 Conclusion 17 Glossary 18 References & Further Reading 19 NCC Group Research Insights 2 All Rights Reserved. © NCC Group 2015 AUTHOR DUNCAN HURWOOD Duncan is a senior consultant at NCC Group, specialising in telecom, embedded systems and application review. He has over 18 years’ experience within the telecom and security industry performing almost every role within the software development cycle from design and development to integration and product release testing. A dedicated security assessor since 2010, his consultancy experience includes multiple technologies, languages and platforms from web and mobile applications, to consumer devices and high-end telecom hardware. NCC Group Research Insights 3 All Rights Reserved. © NCC Group 2015 GLOSSARY AES Advanced encryption standard, a cryptography OTP One time programmable, allowing write once cipher only ASIC Application-specific integrated circuit, non- PCB Printed circuit board programmable hardware logic chip PLA Programmable logic array, forerunner of FPGA Bitfile Binary instruction file used to program FPGAs technology CLB Configurable logic block, an internal part of an PUF Physically unclonable function FPGA POWF Physical one-way function CPLD Complex programmable logic device PSoC Programmable system on chip, an FPGA and EEPROM Electronically erasable programmable read- other hardware on a single chip only memory -
Computer Architectures an Overview
Computer Architectures An Overview PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 25 Feb 2012 22:35:32 UTC Contents Articles Microarchitecture 1 x86 7 PowerPC 23 IBM POWER 33 MIPS architecture 39 SPARC 57 ARM architecture 65 DEC Alpha 80 AlphaStation 92 AlphaServer 95 Very long instruction word 103 Instruction-level parallelism 107 Explicitly parallel instruction computing 108 References Article Sources and Contributors 111 Image Sources, Licenses and Contributors 113 Article Licenses License 114 Microarchitecture 1 Microarchitecture In computer engineering, microarchitecture (sometimes abbreviated to µarch or uarch), also called computer organization, is the way a given instruction set architecture (ISA) is implemented on a processor. A given ISA may be implemented with different microarchitectures.[1] Implementations might vary due to different goals of a given design or due to shifts in technology.[2] Computer architecture is the combination of microarchitecture and instruction set design. Relation to instruction set architecture The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the execution model, processor registers, address and data formats among other things. The Intel Core microarchitecture microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. -
14Nm Finfet Technology
14LPP 14nm FinFET Technology Highlights Enabling Connected Intelligence • 14nm FinFET technology GLOBALFOUNDRIES 14LPP 14nm FinFET process technology platform is + Manufactured in state-of-the-art ideal for high-performance, power-efficient SoCs in demanding, high-volume facilities in Saratoga County, New York applications. + Volume production in Computing, 3D FinFET transistor technology provides best-in-class performance and Networking, Mobile and Server power with significant cost advantages from 14nm area scaling. 14LPP applications technology can provide up to 55% higher device performance and 60% • Ideal for high-performance, lower total power compared to 28nm technologies. power-efficient SoC applications + Cloud / Data Center servers Lg Gate length shrink enables + CPU and GPU performance scaling + High-end mobile processors + Automotive ADAS FET is turned on its edge + Wired and wireless networking + IoT edge computing • Lower supply voltage • Comprehensive design ecosystem • Reduced off-state leakage + Full foundation and complex • Faster switching speed IP libraries – high drive current + PDK and reference flows supported by major EDA and IP partners + Robust DFM solutions Target Applications and Solutions • Complete services and Mobile Apps Processor High Performance Compute & Networking supply chain support 60% power reduction 60% power reduction 2x # cores + Regularly scheduled MPWs 80% higher performance, >2.2GHz >3GHz maximum performance + Advanced packaging and test solutions, including 2.5/3D products 45% area reduction