DOCSLIB.ORG

Electronics-1979-11-22.Pdf

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Electronics-1979-11-22.Pdf NOVEMBER 22, 1979 EIA FORECASTS PENTAGON COMPUTER PUSH/88 C-MOS microprocessor matches n-channel performance/ 111 D-a converter provides bit-slice processor with fast analog output/ 140 FOUR DOLLARStA McGRAW-HILL PUBLICATION 1111 Ellec ron I 4 8 .. ••• % Coding wipes out errors in microprocessor systems ( Over the last decade, Models 3006, 3299 and 3386 Trimpot® trimming • potentiometers have set the standards for cermet trimmers. And, because these dependable models offer the best performance per dollar around, they'll be standards for a long time to corne. All models are sealed for board processing. Boums exclusive Swage-BondTmtermination process virtually eliminates pin termination failure. Cermet elements offer essentially infinite resolution. Multi-fingered wrap-around wiper design reduces contact resistance variation and open circuit problems. Here are the specs: II 3006 3299 3386 d. Res. Range 10 Ohms to 10 Ohms to 10 Ohms to 2Megohms 5Megonms 2Megohms Res. Tolerance 10% 10% 10% Power Rating .75 W @ 70°C .5 W @ 70°C .5 W @85 °C Tempco 100 ppm/°C 100 ppm/°C 100 ppm/°C CRV 3% 3% 1% Adjustment 15 turns 25 turns Single-turn (top or side (top or side adj.) adj.) Size 3/4" rect. 3/8" square 3/8" square Pin Patterns 3styles 5styles 14 styles me-proven trimmers, backed by the Boums reputation for adership, performance and quality at cost-effective prices. Call write today for your new 94-page TR-1 trimmer catalog. Or, see e EEM directory, Volume 2, pages 3726, 3736 and 3746. Timely Offer: Write to Trimmer Application Engineering on your company letterhead. While supply lasts, we'll send you a free trimmer design aid kit detailing all specifications and drawings. TRIMPOt DIVISION, BOURNS, INC., 1200 Columbia Avenue, Riverside, CA 92507. Phone: 714 781-5320. TWX: 910 332-1252. European Headquarters: Boums AG, Zugerstrasse 74 6340 Baar, Switzerland. Phone: 042 33 33 33. Telex: 78722. For Immediate Application—Circle 120 For Future Application—Circle 220 YOUR CHIPS COME IN MITEL'S 'CHIP+ CHIP' TOUCH-TONE® RECEIVER. At Mitel Semiconductor, we practice one-upmanchip. The MT8860 DTMF Decoder and the MT8865 Band Split Filter are the lowest cost 100 per cent semiconductor solutions to acomplete DTMF receiver available. Smaller than conventional receivers, this chip-set features separate filter and decoder components with applications ranging from switching systems to mobile radio. FEATURES • 12 mW power dissipation. • Single supply voltage from 4.5 to 13 volts. • 14 dB signal to noise ratio. • Exceptionally low talk-off rate (less than three hits on Mitel test tape). • 30 dB dynamic range. • 30 dB precise dial tone rejection. Now available for immediate delivery. LAUNCHING THE CHIPS OF TOMORROW. MITEL SEMICONDUCTOR United States: 1735 Jefferson Davis Highway, Suite 1009, Arlington, Virginia, U.S.A. 22202. Telephone 17031 243-1600 1223 Westchester Pike, Havertown, Pennsylvania, U.S.A. 19083. Telephone 12151449-5556. 2321 Morena Blvd., Suite M, San Diego, California, U.S.A. 92110. Telephone 17141 276-3421. Canada: P.O. Box 13089, Kanata, Ottawa, Ontario, Canada K2K 1X3. Telephone 16131 592-2122, Telex: 053-4596, TVVX: 610-562-8529. 18 Airport Blvd., Bromont, Quebec, Canada JOE 1LO. Telephone 15141 534-2321, Telex: 05-267474. Europe: Hamilton Road, Slough, Berkshire, England SL1 4C1Y. Telephone 0753-36137, 0753-36138, Telex: 847730 Fredericiagade 16, Suite 309, 1310 Copenhagen K, Denmark. Telephone 1011 119302, Telex: 27246 Asia: Park-In Commercial Centre, Suite 1423, 56 Dundas Street, Mong Kok, Kowloon, Hong Kong. Telephone 3-318256, Telex: 64235. Copyright 1979 Mitel Corporation Circle 1 on reader service card Registered Trademark of AT&T eri We and Intel have something in common- responsiveness to customer needs? I.Gary Bard, President, Aydin Controls. screen can be addressed individually— and very rapidly. That's opened up all sorts of feature and capability possibilities. "With Inters 1ntellec® development system and ICE86TM in-circuit emulation, we've been able to take advantage of the 8086 by quickly developing sophisticated proprietary software. I. Gary Bard: "We've carved out adominant position "And the Intellec system helps us be responsive in the video graphics marketplace by listening to the needs of our large OEM customers by customiz- carefully to our customers and giving them the features ing software. In amatter of days, we can develop and capabilities they need. To do that, though, unique capabilities for acustomer, store the program we need to take advantage of the leading edge of in PROM and deliver it to the field. microcomputer technology. "In fact, that's what Intel microcomputers and "That's where Intel comes in. They've consistently software development tools are all about: quicker delivered the 'leading edge' products. More important, solutions more economically." they understand that our success depends upon Intel microcomputer products and ahigh level of proprietary value-added. So in development systems can make the addition to hardware, Intel has always given us competitive difference for your company. the software development tools we need to be For more information, contact your responsive to our customers' needs. local Intel sales office or distributor, or "Take the Intel®8086, their 16-bit micro - write Intel Corporation, Literature Dept., computer, for example. It's enabled us to 3065 Bowers Ave., Santa Clara, CA technologically leapfrog the competi- 95051. Telephone (408) 987-6475. tion. The raster graphics state-of-the- art is limited by monitor technology to amillion elements. Coincidentally— unnnotaannnégamo, noocorpouounu or not —the 8086 with its million byte r,nnannomannu addressability means each dot on the InterskadeeDevdopmentSystem Circle #2 for information intel delivers. Electronics rvue The International Magazine of Electronics Technology Vol. 52, No. 24 •November 22, 1979 39 Electronics Review Highlights IEDM: All-silicon devices will match SOS in performance, 39 MEMORIES: Intel to disclose 16-K static secrets, 40 Cover: Hamming for microprocessors, 103 SOLID STATE: Silicon nitride seals ion implants on GaAs, 41 Circuit specifics show how the pervasive IEEE: New president seeks belated board support, 41 algorithm for error detection and correction COMPONENTS: Transducer sports an SOS diaphragm, 42 AEROSPACE: Do cosmic rays spell death to VLSI in space? 44 worked out by Richard Hamming is being DISPLAYS: 40-character LCD made like an integrated circuit, 46 used in 8- and 16-bit systems PACKAGING & PRODUCTION: UV system goes submicrometer, 46 Cover is by Art Director Fred Sklenar. COMMERCIAL: IC content of voice-stress analyzers is mystery, 48 MILITARY: Tropospheric radio uses digital circuitry, 50 Vertical-MOS gains in power market, 85 NEWS BRIEFS: 50 V-MOS field-effect transistors, with their 63 Electronics International inherently high gain and switching-speed GREAT BRITAIN: Ultrasonics yields simple fuel injector, 67 characteristics, are threatening to take the WEST GERMANY: PCM audio proposal would ease disk manufacture, 68 FRANCE: Superfast signal analyzers use analog memories, 70 discrete power transistor market away from AROUND THE WORLD: 72 bipolar devices. 85 Probing the News COMPONENTS: V-MOS outmuscles bipolar for power, 85 Fast C-MOS process challenges n-MOS, 111 MILITARY: EIA sees good news at Pentagon, 88 A complementary-MOS process using two WORD PROCESSING: IBM 5520 widens office beachhead, 92 levels of polysilicon interconnections brings CONSUMER: Chip pinch causes Christmas game shortage, 96 n-MOS speed and C-MOS power frugality MEETINGS: Midcon breaks attendance record, 98 together in a microcomputer family. 103 Technical Articles COMMUNICATIONS: Applying Hamming code to microprocessors, 103 A-d conversion: catching the drift, 123 SOLID STATE: PC-MOS microcomputer attains n-MOS speed, 111 Digital and analog techniques are combined DESIGNER'S CASEBOOK: LC network adapts PLL for overtones, 118 Tone detector sharpens digital filter's response, 118 to combat temperature-induced linearity D-a converter simplifies hyperbolic clock, 121 and offset errors in the analog-to-digital DATA ACQUISITION: Correcting errors digitally in data acquisition, 123 converters of data acquisition systems — MICROPROCESSORS: Adding flexibility to TV control system, 132 inexpensively. COMPONENTS: Fast d-a unit mates with bit slices, 140 ENGINEER'S NOTEBOOK: Three-chip scale zeroes tare weight, 146 .. and in the next issue RAM diagnostic program performs nondestructive check, 148 Electronics industry executives look at the 153 New Products year ahead .. an overview of this year's IN THE SPOTLIGHT: Single-board computer is fast, powerful, 153 Scientific computer costs $16,500, 156 International Electron Devices Meet- INSTRUMENTS: Analyzer covers 21 GHz, and more, 160 ing .. a scaled-down process for bipolar SEMICONDUCTORS: 32-K E-PROM starts as 64-K, 168 memories. MICROCOMPUTERS & SYSTEMS: LSI-11 memory has two ports, 176 DATA ACQUISITION: Converter accepts BCD inputs, 184 MATERIALS: 203 Departments Publisher's letter, 4 Readers' comments, 6 News update, 8 People, 14 Editorial, 24 Meetings, 26 Electronics newsletter, 33 Washington newsletter, 55 Washington commentary, 56 International newsletter, 63 Engineer's newsletter, 150 Products newsletter, 197 New literature, 205 Services Employment opportunities, 210 Reprints available, 233 Reader service card, 237 Electronics/November 22, 1979 3 Electronics Publisher's letter Like more than a few of today's During "a streak of unemploy- EDITOR-IN-CHIEF:
Load more

Recommended publications
  • "Bob" Schreiner
    Oral History of Robert “Bob” Schreiner Interviewed by: Stephen Diamond Recorded: June 10, 2013 Mountain View, California CHM Reference number: X6873.2014 © 2013 Computer History Museum Oral History of Robert “Bob” Schreiner Stephen Diamond: We're here at the Computer History Museum with Bob Schreiner. It's June 10th, 2013, and we're going to talk about the oral history of Synertek and the 6502. Welcome, Bob. Thanks for being here. Can you introduce yourself to us? Robert “Bob” Schreiner: Okay. My name is Bob Schreiner. I'm an ex-Fairchilder, one of the Fairchildren in the valley, and then involved in running a couple of other small semiconductor companies, and I started a semiconductor company. Diamond: So that would be Synertek. Schreiner: Synertek. Diamond: Tell us about that. Schreiner: Okay. As you know from an earlier session I left Fairchild Semiconductor around 1971. And at the time I left I was running the LSI program at Fairchild, and I was a big believer that the future marketplace for MOS technology would be in the custom area. And since Fairchild let that whole thing fall apart, I decided there's got to be room for a company to start up to do that very thing, work with big producers of hardware and develop custom chips for them so they would have a propriety product that would be difficult to copy. So I wrote a business plan, and I went around to a number of manufacturers. I had a computer guy [General Automation], and I had Bulova Watch Company, and I had a company that made electronic telephones [American Telephones], and who was the fourth guy? Escapes my memory right now, but the pitch basically was, "Your business, which now you manufacture things with discrete components, it's going to change.
    [Show full text]
  • China's Progress in Semiconductor Manufacturing Equipment
    MARCH 2021 China’s Progress in Semiconductor Manufacturing Equipment Accelerants and Policy Implications CSET Policy Brief AUTHORS Will Hunt Saif M. Khan Dahlia Peterson Executive Summary China has a chip problem. It depends entirely on the United States and U.S. allies for access to advanced commercial semiconductors, which underpin all modern technologies, from smartphones to fighter jets to artificial intelligence. China’s current chip dependence allows the United States and its allies to control the export of advanced chips to Chinese state and private actors whose activities threaten human rights and international security. Chip dependence is also expensive: China currently depends on imports for most of the chips it consumes. China has therefore prioritized indigenizing advanced semiconductor manufacturing equipment (SME), which chip factories require to make leading-edge chips. But indigenizing advanced SME will be hard since Chinese firms have serious weaknesses in almost all SME sub-sectors, especially photolithography, metrology, and inspection. Meanwhile, the top global SME firms—based in the United States, Japan, and the Netherlands—enjoy wide moats of intellectual property and world- class teams of engineers, making it exceptionally difficult for newcomers to the SME industry to catch up to the leading edge. But for a country with China’s resources and political will, catching up in SME is not impossible. Whether China manages to close this gap will depend on its access to five technological accelerants: 1. Equipment components. Building advanced SME often requires access to a range of complex components, which SME firms often buy from third party suppliers and then assemble into finished SME.
    [Show full text]
  • American Semiconductor Equipment Technologies
    t, f • American Semiconductor Equipment Technologies American Semiconductor Equipment Technologies 6110 Variel Avenue Woodland Hills, California 91367 Telephone: (818) 884-5050 (Thousands of Dollars) Balance Sheet (Fiscal year ending 3/31/86) Working Capital $4,375 Long-Term Debt $2,000 Net Worth $3,446 Current Liability to Net Worth 183.75% Current Liability to Inventory 131.89% Total Liability to Net Worth 241.79% Fixed Assets to Net Worth 241.79% Total Employees 150 Operating performance data are not available Source: Dun & Bradstreet SEMS Industry Econometrics © 1987 Dataquest Incorporated May American Semiconductor Equipment Technologies (Material in this section has been compiled from Dun & Bradstreet financials, Dataquest's SEMS data base, and company literature supplied by ASET. For more information on this start-up company, Dataguest clients are invited to use their inquiry privileges.) > ir THE COMPAMY Background American Semiconductor Equipment Technologies (ASET) was formed in February 1986 to pursue both ongoing and newly developing markets for lithographic systems. The Company was organized by Greg Reyes and Ralph Miller with funding of $3.9 million from four venture capital firms. ASET's product line includes i-line wafer steppers, g-line wafer steppers, substrate steppers, standalone image repeaters and pattern generators, and combination systems. 0perat,^7"g aT«d Strategy ASET Corporation currently serves the semiconductor equipment markets in the image patterning area. The Company also looks to develop business in alternate industries, including laser cards, flat panel displays, and hybrid substrates. ASET maintains research efforts directed toward expanding micro- lithographic technology. ASET acquired the assets of TRE Corporation's wafer stepper and pattern generation manufacturing unit early in 1986.
    [Show full text]
  • FGVM-02 Architecture of Vehicle Multimedia Systems
    International Telecommunication U n i o n ITU-T Technical Report TELECOMMUNICATION STANDARDIZATION SECTOR OF ITU (13 April 2021) Focus Group on Vehicular Multimedia (FG-VM) FGVM-02 Architecture of Vehicle Multimedia Systems - 2 - Acknowledgement This Technical Report was prepared under the leadership of Mr. Jun Li, Chair of ITU-T FG-VM (TIAA, China) and Yajun Kou, Chair of ITU-T FG-VM Working Group 2 (Global Fusion Media Technology and Development Co. Ltd, China). It is based on the contributions of numerous authors who participated in the Focus Group activities. Due credit is given to the following Focus Group participants: Srinivasagan Ayyappan, Yansong Guo (Great Wall Motors, Co, LTD, China); Yajun Kou, Jun Li (Global Fusion Media Technology and Development Co. Ltd, China); Koji Nakao (National Institute of Information and Communications Technology, Japan); Stiepan A. Kovac (QRCrypto SA; CEuniX.eu Project); Paolo Volpato, Francois Fischer (Huawei Technologies); Latif Ladid (IPv6 Forum); Jonas Walter (Technical University of Darmstadt Institute of Ergonomics & Human Factors); Gaëlle Martin-Cocher (InterDigital Canada, Lte, Canada); Prakash Ranganathan (University of North Dakota); Sébastien Ziegler, Anna Brékine, Cédric Crettaz (Mandat International); and Pradipta Biswas (Indian Institute of Science). Srinivasagan Ayyappan (Great Wall Motors, Co, LTD, China) served as the main Editor of this Technical Report. Stefano Polidori (Advisor), Mythili Menon (Project Officer), and Carolina Lima (Assistant) served as the FG-VM Secretariat. -
    [Show full text]
  • DEVICE and CIRCUIT DESIGN for VLSI by Amr Mohsen
    31 DEVICE AND CIRCUIT DESIGN FOR VLSI by Amr Mohsen* Intel Corporation 3065 Bowers Avenue Santa Clara, California 95051 ABSTRACT A review of the device and circuit design complexity and limitations for VLSI is presented. VLSI device performance will be limited by second order device effects, interconnection line de lay and current density and chip power dissipation. The complexity of VLSI circuit design will require hierarchial structured design methodology with special consideration of testability dnd more emphasis on redundancy. New organizations of logic function architectures and smart memories will evolve to take advantage of the topological properties of the VLSI silicon technology. * The author is also on the faculty of California Institute of Technology CALTECH CONFERENCE ON VLSI, January 1979 32 Amr Mohsen I. INTRODUCTION: As semiconductor technology has evolved from discrete to small-scale to medium-scale and through large-scale integration levels a rapid decrease in the cost per function provided by the technology have opened up new applications and industries. Today there is a large interest in the next phase of integration: very large scale integration (VLSI). The semi­ conductor technology will be able to fabricate chips with more than lOOK devices (l) in the 1980's. The continuous scaling of the semi- conductor devices and increase in components counts on a single chip is resulting in more complex technology developments, device and circuit designs and product definition. In this review paper, projections of how device technology will evolve in the future and the problems and limitations of device and circuit design for VLSI are presented. VLSI TECHNOLOGIES: In Fig.
    [Show full text]
  • Mos Technology, 1963-1974: a Dozen Crucial Years
    One of IBM’s most important MOS Technology, 1963-1974: A Dozen Crucial Years contributions to MOS research came from the Components Division, which was responsible for developing by Ross Knox Bassett and manufacturing bipolar transistors for its large computer systems and had very little interest in MOS transistors line can be drawn from the as such. As part of its work on Frosch’s and Derick’s work on bipolar transistors, Donald Kerr and silicon dioxide to the MOS (metal- a group of engineers had discovered A that depositing small amounts of oxide-semiconductor) transistor’s domi- nance of semiconductor technology, phosphorous on the silicon-dioxide but it is neither short nor straight. That surface and forming a layer of line has several discernable segments, phosphosilicate glass (PSG) could first from Frosch and Derick’s work, limit the amount of leakage in bipolar until 1963. In this interval, by and transistors and play an important role large, no one thought seriously about a in enhancing the stability of MOS metal-oxide-semiconductor as a viable transistors. Jerome Eldridge and Pieter technology in its own right. The second Balk from IBM Research implemented segment runs from 1963, when the this work by using thin layers of combination of integrated circuits and PSG to make stable MOS devices. the planar manufacturing process had Other important work on the physics FIG. 2. Drawing of Atalla and Kahng’s “silicon-silicon dioxide surface device,” now known as and chemistry of MOS devices done led people to see MOS transistors as a the MOS transistor, from a 1961 Bell Labs technical memorandum by Kahng.
    [Show full text]
  • Vlsi Design Lecture Notes B.Tech (Iv Year – I Sem) (2018-19)
    VLSI DESIGN LECTURE NOTES B.TECH (IV YEAR – I SEM) (2018-19) Prepared by Dr. V.M. Senthilkumar, Professor/ECE & Ms.M.Anusha, AP/ECE Department of Electronics and Communication Engineering MALLA REDDY COLLEGE OF ENGINEERING & TECHNOLOGY (Autonomous Institution – UGC, Govt. of India) Recognized under 2(f) and 12 (B) of UGC ACT 1956 (Affiliated to JNTUH, Hyderabad, Approved by AICTE - Accredited by NBA & NAAC – ‘A’ Grade - ISO 9001:2015 Certified) Maisammaguda, Dhulapally (Post Via. Kompally), Secunderabad – 500100, Telangana State, India Unit -1 IC Technologies, MOS & Bi CMOS Circuits Unit -1 IC Technologies, MOS & Bi CMOS Circuits UNIT-I IC Technologies Introduction Basic Electrical Properties of MOS and BiCMOS Circuits MOS I - V relationships DS DS PMOS MOS transistor Threshold Voltage - VT figure of NMOS merit-ω0 Transconductance-g , g ; CMOS m ds Pass transistor & NMOS Inverter, Various BiCMOS pull ups, CMOS Inverter Technologies analysis and design Bi-CMOS Inverters Unit -1 IC Technologies, MOS & Bi CMOS Circuits INTRODUCTION TO IC TECHNOLOGY The development of electronics endless with invention of vaccum tubes and associated electronic circuits. This activity termed as vaccum tube electronics, afterward the evolution of solid state devices and consequent development of integrated circuits are responsible for the present status of communication, computing and instrumentation. • The first vaccum tube diode was invented by john ambrase Fleming in 1904. • The vaccum triode was invented by lee de forest in 1906. Early developments of the Integrated Circuit (IC) go back to 1949. German engineer Werner Jacobi filed a patent for an IC like semiconductor amplifying device showing five transistors on a common substrate in a 2-stage amplifier arrangement.
    [Show full text]
  • 6502 Introduction
    6502 Introduction Philipp Koehn 18 September 2019 Philipp Koehn Computer Systems Fundamentals: 6502 Introduction 18 September 2019 1 some history Philipp Koehn Computer Systems Fundamentals: 6502 Introduction 18 September 2019 1971 2 • First microprocessor on an integrated circuit: Intel 4004 • 4-bit central processing unit, 12 bit address space (4KB) Philipp Koehn Computer Systems Fundamentals: 6502 Introduction 18 September 2019 1975 3 • MOS Technology 6502 • Dominant CPU in home computers for a decade (Atari, Apple II, Nintendo Entertainment System, Commodore PET) Philipp Koehn Computer Systems Fundamentals: 6502 Introduction 18 September 2019 1977 4 • Atari 2600 • Video game console: Pong, Pac Man, ... connected to TV Philipp Koehn Computer Systems Fundamentals: 6502 Introduction 18 September 2019 1980 5 • Commodore VIC20 • 1 MHz, 5KB RAM, BASIC, 3.5KB RAM, 176x184 3 bit color video Philipp Koehn Computer Systems Fundamentals: 6502 Introduction 18 September 2019 1982 6 • Commodore C64 • 64KB RAM, 320x200 4 bit color video Philipp Koehn Computer Systems Fundamentals: 6502 Introduction 18 September 2019 Commodore C64 7 • BASIC programming language, but serious programs written in assembly • No fancy stuff like multi-process, user accounts, virtual memory, etc. • Machine itself had no mass storage - had to buy tape drive, then floppy disk drive, machine was obsolete once hard drives came around Philipp Koehn Computer Systems Fundamentals: 6502 Introduction 18 September 2019 BASIC Demo 8 • Commands get executed (just like Python interpreter)
    [Show full text]
  • Amigaland.Com V7
    < 0 f z /AMIGA A Volume 5 No. 1 January 1990 JL.COMPUTING I J US $3.95 Canada $4.95 Your Original AMIGA* Monthly Resource AMIGA ANIMATION Sculpt-Animate 4D AMIGA ANIMATION AMIGA ANIMATION Animation in BASIC AMIGA ANIMATION AMIGA ANIMATION Anim-Aids AMIGA ANIMATION The 1989 BADGE Killer Contest WinnersAMIGA ANIMATION Hi Quality Version Available on AMIGALAND.COMAMIGA ANIMATION AMIGA ANIMATION AMIGA Programming: [MIGA ANIMATION Scanning The Screen, Fractals Part Four I MIGA ANIMATION IJ//6 .I ANIMATION Calculating the Wind Chill Temperature 1.11/6.1 AM U Ml()\ Menu Builder 11//6..I , I N/.I/..I'/'//> \ 11//6 I IMUAIl(>\ \n 1 1u o \ Plus: "•I n n /w /m Thinker Hardware Home Control 07447074710901 0 iu y COMPUTING Y o u r OrigfanaH AM I&A MamSbfy &Gs<m&m&8 laundry. 1W() ifMATION ON THK AMIGA Dear Animators 4 l A nim ation by Bany Solomon With Sculpt-Animate -tD Introducing AC's Animation 51 section. by Lonnie Watson Create some stunning Ladies And Gentlemen, we aitw ork. give you... THE WINNER! 4 2 by B radley U". Schenck • ■ * Animation? The making of" the 19S9 BADGF BASK ally! 5 8 Killer Demo Contest winner. h r Mike Morrison The Sentinel, Using Cell animation in Amiga BASIC. A nim ation For Everyone 47 PIC-MAGIC: A Product Profile 54 by Barry Solomon An i m-Aids 64 Animation Can by Orlando T'tirioso Sidebar by Bany Solomon Be a Moving W onderfu 1 Iv sketched. Brushing-Up Where to find the help .-lienee. ready-lo-cok >r images! Hi Quality Version Available on AMIGALAND.COMOn Animation 5 4 you need.
    [Show full text]
  • Silicon Valley Group
    Silicon Valley Group ANNUAL REPORT AND FORM 10-K Silicon Valley Group Enabling integrated circuit manufacturers to win the productivity race by providing leading-edge technology products that maximize yield through innovative design is the driving force of Silicon Valley Group. Our mission is fulfilled when products are delivered and installed on time and top-of-the-line service and support are provided to help customers achieve their productivity objectives. SILICON VALLEY GROUP TECHNOLOGY LEADER We are prepared for growth. a letter to our shareholders AS THE SEMICONDUCTOR GROWTH CYCLE GAINS MOMENTUM, SVG IS WELL POSITIONED FOR THE FUTURE. As the semiconductor industry goes, so too does SVG. The recent industry downturn, which started in 1998 and continued into 1999, presented major hurdles for Silicon Valley Group and its customers. It particularly impacted SVG at a time when our lithography manufacturing capacity and other capabilities had been increased to take advantage of what had been predicted to be a period of unprecedented growth. Managing a downturn is no easy feat. Although our return to profitability in the fourth quarter of the fiscal year was not as vigorous as we would have liked, I am pleased to say that SVG has risen to the challenge. We focused on the long-term health of the Company with cash preservation and investments in research and development (R&D). Our business is cyclical in nature, and I believe that the current upward momentum we are experiencing in the industry is a very positive indicator for the future. This was a very difficult year for SVG.
    [Show full text]
  • Open Networking & the Security of Open Source Software Deployment
    Open Networking & the Security of Open Source Software Deployment A white paper presenting security considerations for practical deployment January 2021 Table of Contents Executive Summary ......................................................................................................... 5 Welcome ........................................................................................................................... 7 Introduction ...................................................................................................................... 8 Open Source in Virtualised Open Networks ................................................................... 9 The Software Development Process ............................................................................. 11 Shades of Open Source ................................................................................................. 13 Open Interfaces and Open Source Software Are Different .......................................... 15 Two Perspectives: Systems and Component ............................................................... 16 Systems-level Approach ................................................................................................... 17 Component-level approach............................................................................................... 19 Deployment Considerations .......................................................................................... 20 Layered Security Defence ...............................................................................................
    [Show full text]
  • MEC for Automotive in Multi-Operator Scenarios
    MEC for Automotive in Multi-Operator Scenarios 5GAA Automotive Association Technical Report CONTACT INFORMATION: Copyright © 2021 5GAA. All Rights Reserved. Lead Coordinator – Thomas Linget Email: [email protected] No part of this White Paper may be reproduced without written permission. MAILING ADDRESS: 5GAA c/o MCI Munich Neumarkter Str. 21 81673 München, Germany www.5gaa.org VERSION: 1.0 DATE OF PUBLICATION: 03.03.2021 DOCUMENT TYPE: Technical Report CONFIDENTIALITY CLASS: P (Public use) REFERENCE 5GAA WORKING GROUP: Working Group 2 DATE OF APPROVAL BY 5GAA BOARD: 11.01.2021 MEC for Automotive in Multi-Operator Scenarios 2 3 5GAA A-200150 Contents Foreword............................................................................................................................................................. 5 1 Scope ........................................................................................................................................................ 6 2 References ................................................................................................................................................ 7 3 Abbreviations ........................................................................................................................................... 9 4 Definition of Edge Computing ............................................................................................................... 11 4.1 The application perspective (three-tier paradigm) ..........................................................................................
    [Show full text]