Dynatron K987 3U Active Air Cooler

Total Page：16

File Type：pdf, Size：1020Kb

® K987 3U Active Air Cooler PRODUCT SPECIFICATIONS ® K987 | Socket LGA 775/1356/1366/115X/1200 Model Number: K987 • Recommend for Intel® CPU as following . Intel® Xeon® Processor E3 v4 Family, Socket FCLGA 1150 . Intel® Xeon® E Processor/Intel Core™ i7 Processor, Socket FCLGA 1151; . Intel® Xeon® Processor E3 Family/Intel Core™ i5 Processor, Socket LGA 1155; . Intel® Xeon® processor X3400, Socket LGA 1156; . Intel® Core™ i9 Processor, Socket FCLGA 1200; . Intel® Xeon® Processor 5500 Series/Intel® Core™ i7 Processors I7-900 Series, Socket LGA 1356/1366; . Intel® Core™2 Extreme Processor/Core™2 Quad Processor/Core™2 Duo Desktop Processor/Pentium® D Processor/Pentium® Processor for Desktop/Pentium® 4 Processors/Pentium® 4 Processor Extreme/Celeron® Processor, Socket LGA 775 • Active Cooler for 3U Server & Up Overall Specification Dimension 106.0 x 106.0 x 72.6 mm Weight 500 g Material Aluminum Radial fin Heat Sink with Copper Inserted Fan 9225 Round Fan Top-Down Blowing Screw-on Retention Available for all Intel® Sockets Protection Finger Guard Protection Back Strip Set/Plate Available for all Intel® Sockets Screw Sets Bag Included Thermal Grease TIG830SP Thermal Grease Syringe Included TDP Up to 125 Watts CPU Power Heat Dissipation Cooling Fan Specification Dimension Ø92.0 x 25.0 mm Bearing Single-Ball Rated Voltage 12V Rated Speed At Duty Cycle 0~20%: 900 RPM At Duty Cycle 50%: 1700 RPM At Duty Cycle 100%: 2800 RPM Input Power At Duty Cycle 0~20%: 0.72 W At Duty Cycle 50%: 1.2 W At Duty Cycle 100%: 3.0 W Maximum Airflow At Duty Cycle 0~20%: 15.1 CFM At Duty Cycle 50%: 30.9 CFM At Duty Cycle 100%: 46.96 CFM www.dynatron.co © 2020 by Dynatron Corporation. 1 ® K987 | Socket LGA 775/1356/1366/115X/1200 Rated Static Pressure At Duty Cycle 0~20%: 0.30 mm- H2O At Duty Cycle 50%: 1.55 mm-H2O At Duty Cycle 100%: 2.977 mm-H2O Acoustical Noise At Duty Cycle 0~20%: 14. 0 dBA At Duty Cycle 50%: 19. 0 dBA At Duty Cycle 100%: 29.30 dBA Lead Wire Pin Out Pin#1- Black(-) Pin#2- Yellow(+) Pin#3- Green(Tachometer/ Signal Output) Pin#4- Blue (PWM) Performance Chart: Active Cooler K987 Thermal Resistance Cooling Performance vs. Airflow 0.34 32 0.331 29.9 0.33 30 0.32 28 0.31 0.305 25.1 26 C/W) ° 0.3 24 Rth 0.29 22 20.3 0.28 Noise 0.28 20 Noise Level(dBA) C ambient temperature ° 0.27 18 hermal Resistance( T at 35 0.26 15.1 0.255 16 0.25 14 0.24 12 22 32.3 41.1 48.4 Air Flow Rate(CFM) www.dynatron.co © 2020 by Dynatron Corporation. 2 ® K987 | Socket LGA 775/1356/1366/115X/1200 Cooling Performance vs. Fan Speed 0.34 32 0.33 0.331 29.9 30 0.32 28 0.31 26 C/W) ° 0.305 25.1 0.3 24 Rth 0.29 22 Noise 0.28 20.3 0.28 20 Noise Level(dBA) C ambient C ambient temperature ° 0.27 18 hermal Resistance( T at 35at 0.26 16 15.1 0.255 0.25 14 0.24 12 1000 1500 2000 2500 Fan Speed(RPM) www.dynatron.co © 2020 by Dynatron Corporation. 3 .

Copy Link

Recommended publications

Intel® Server Board S3420GP
Intel® Server Board S3420GP Technical Product Specification Intel order number E65697-010 Revision 2.4 January, 2011 Enterprise Platforms and Services Division - Marketing Revision History Intel® Server Board S3420GP TPS Revision History Date Revision Modifications Number Feb. 2009 0.3 Initial release. May 2009 0.5 Update block diagram. July. 2009 0.9 Updated POST error code and diagram. Aug. 2009 1.0 Updated MTBF. Nov. 2009 1.1 Additional details for memory configuration. Dec. 2009 1.2 Added Intel® Server Board S3420GPV details. Dec. 2009 2.0 Updated processor name. Jan. 2010 2.1 Corrected the typo. Apr. 2010 2.2 Corrected the typo, updated processor name and remove CCC certification marking information. July. 2010 2.3 Corrected the typo. Jan.2011 2.4 Corrected the typo. Added RDIMM support on S3420GPV. Updated Table 45. Add USB device readiness beep code information. ii Revision 2.4 Intel order number E65697-010 Intel® Server Board S3420GP TPS Disclaimers Disclaimers Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications.
[Show full text]
Heatsinks (X11/X10/X9)
Heatsinks (X11/X10/X9) X9, X10, and X11 1U Passive CPU Heat Sinks for UP, DP, and MP Systems Accessories Part Number SNK-P0037P SNK-P0041 SNK-P0046P SNK-P0047P SNK-P0047PD Proprietary 1U Passive, DP 1U Passive, UP 1U Passive, 1U Passive, Form Factor 1U Passive, DP (X9DBL Front CPU) (X11/X10/X9) UP, DP Proprietary, DP Intel® Xeon® Processor E3- Intel® Xeon® Processor Intel® Xeon® Processor 1200 product family; Intel® Intel® Xeon® Processor Intel® Xeon® Processor E5-2400 & Intel® Xeon® E5-2400 & Intel® Xeon® CPU Type Core™ i3 processor; E5-2600 v4/v3/v2 product E5-2600 v4/v3/v2 product Processor E5-2400 v2 Processor E5-2400 v2 Intel® Pentium® Processor & families families product families product families Intel® Celeron® Processor Socket Type LGA 1356 LGA 1356 LGA 1155/1151/1150 LGA 2011(Square ILM) LGA 2011 (Square ILM) Copper + Aluminum Base Copper + Aluminum Base Aluminum Base Aluminium Base Major Integrated Copper Base Aluminum Fins Aluminum Fins Aluminum Fins Aluminium Fins Part Aluminum Fins Heat Pipes Heat Pipes Heat Pipes Heat Pipes Dimension 90L x 90W x 27H mm 90L x 90W x 27H mm 95L x 95W x 27H mm 90L x 90W x 26H mm 90L x 110W x 27H mm Screws + Springs Mounting Method Screws + Springs Screws + Springs Mounting Bracket Screws + Springs Screws + Springs (BKT-0028L Included) Part Number SNK-P0047PS SNK-P0047PSC SNK-P0047PSM SNK-P0047PSR Proprietary 1U Passive, DP (1U 3/4 Low Profile Passive, Proprietary, Proprietary 1U Passive, DP (2U Form Factor 1U Passive, UP, DP, MP GPU/Intel® Xeon Phi™ coprocessor UP (X10/X9) Twin2+ Front CPU),
[Show full text]
Desktop 3Rd Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket
Desktop 3rd Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket Thermal Mechanical Specifications and Design Guidelines (TMSDG) January 2013 Document Number: 326767-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A “Mission Critical Application” is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined”.
[Show full text]
CPU) MCU / MPU / DSP This Page of Product Is Rohs Compliant
INTEL Central Processing Units (CPU) MPU /DSP MCU / This page of product is RoHS compliant. CENTRAL PROCESSING UNITS (CPU) Intel Processor families include the most powerful and flexible Central Processing Units (CPUs) available today. Utilizing industry leading 22nm device fabrication techniques, Intel continues to pack greater processing power into smaller spaces than ever before, providing desktop, mobile, and embedded products with maximum performance per watt across a wide range of applications. Atom Celeron Core Pentium Xeon For quantities greater than listed, call for quote. MOUSER Intel Core Cache Data Price Each Package Processor Family Code Freq. Size No. of Bus Width TDP STOCK NO. Part No. Series Name (GHz) (MB) Cores (bit) (Max) (W) 1 10 Desktop Intel 607-DF8064101211300Y DF8064101211300S R0VY FCBGA-559 D2550 Atom™ Cedarview 1.86 1 2 64 10 61.60 59.40 607-CM8063701444901S CM8063701444901S R10K FCLGA-1155 G1610 Celeron® Ivy Bridge 2.6 2 2 64 55 54.93 52.70 607-RK80532RC041128S RK80532RC041128S L6VR PPGA-478 - Celeron® Northwood 2.0 0.0156 1 32 52.8 42.00 40.50 607-CM8062301046804S CM8062301046804S R05J FCLGA-1155 G540 Celeron® Sandy Bridge 2.5 2 2 64 65 54.60 52.65 607-AT80571RG0641MLS AT80571RG0641MLS LGTZ LGA-775 E3400 Celeron® Wolfdale 2.6 1 2 64 65 54.93 52.70 607-HH80557PG0332MS HH80557PG0332MS LA99 LGA-775 E4300 Core™ 2 Conroe 1.8 2 2 64 65 139.44 133.78 607-AT80570PJ0806MS AT80570PJ0806MS LB9J LGA-775 E8400 Core™ 2 Wolfdale 3.0 6 2 64 65 207.04 196.00 607-AT80571PH0723MLS AT80571PH0723MLS LGW3 LGA-775 E7400 Core™ 2 Wolfdale
[Show full text]
Efficient Algorithms for Large-Scale Image Analysis
Efﬁcient Algorithms for Large-Scale Image Analysis zur Erlangung des akademischen Grades eines Doktors der Ingenieurwissenschaften der Fakultät für Informatik des Karlsruher Instituts für Technologie genehmigte Dissertation von Jan Wassenberg aus Koblenz Tag der mündlichen Prüfung: 24. Oktober 2011 Erster Gutachter: Prof. Dr. Peter Sanders Zweiter Gutachter: Prof. Dr.-Ing. Jürgen Beyerer Abstract The past decade has seen major improvements in the capabilities and availability of imaging sensor systems. Commercial satellites routinely provide panchromatic images with sub-meter resolution. Airborne line scanner cameras yield multi-spectral data with a ground sample distance of 5 cm. The resulting overabundance of data brings with it the challenge of timely analysis. Fully auto- mated processing still appears infeasible, but an intermediate step might involve a computer-assisted search for interesting objects. This would reduce the amount of data for an analyst to examine, but remains a challenge in terms of processing speed and working memory. This work begins by discussing the trade-offs among the various hardware architectures that might be brought to bear upon the problem. FPGA and GPU-based solutions are less universal and entail longer development cycles, hence the choice of commodity multi-core CPU architectures. Distributed processing on a cluster is deemed too costly. We will demonstrate the feasibility of processing aerial images of 100 km × 100 km areas at 1 m resolution within 2 hours on a single workstation with two processors and a total of twelve cores. Because existing approaches cannot cope with such amounts of data, each stage of the image processing pipeline – from data access and signal processing to object extraction and feature computation – will have to be designed from the ground up for maximum performance.
[Show full text]
Five9ns T3110 Tower Server
FIVE9NS DATA SHEET Note: This data sheet is for informational purposes. It is not a commitment to deliver hardware features or functionality. The development, release and timing of features and functionality described in this document are at the sole discretion of Five9 Network Systems. FIVE9NS T3110 TOWER SERVER The Five9NS T3110 is an entry-level, single socket, tower server. Powered by an Intel processor, this high-performance system provides I/O slot flexibility that enables seamless integration into a variety of OEM applications. HIGHLIGHTS: Flexible Tower Server Variety of expansion slots The Five9NS T3110 was designed with OEM needs in mind. With its Tower form factor rich feature set – including 7 expansion slots, remote management Supports Windows, Linux and capabilities, and high performance Intel 3400 series processor it’s an Solaris Operating Systems ideal fit for commercial printing and healthcare environments. The Remote system management Five9NS T3110 tower server is on the Oracle Solaris Hardware capabilities ideal for central Compatibility List (HCL). office and other demanding environments Easy to customize and integrate Specialty Services into existing infrastructure Easy to scale out as business OEM customers can choose from a host of services that will accelerate needs grow the integration process and reduce time to market. With our in-house Product Lifecycle Management service, Five9NS is uniquely positioned to architect systems for OEM customers. The Five9NS T3110 tower server is customizable and you can brand it as your own. We also provide free engineering support via experts who understand the unique requirements of OEM customers. The Five9NS Product Lifecycle Management service aims to help you proactively manage your product lifecycle.
[Show full text]
CPU Benchmarks - CPU Mega Page - Detailed List of Benchmarked Cpus
27.08.2020 PassMark - CPU Benchmarks - CPU Mega Page - Detailed List of Benchmarked CPUs CPU Benchmarks CPU Benchmarks Over 1,000,000 CPUs Benchmarked CPU Mega List Below is a list of all single socket CPU types that appear in the charts. By clicking the column headings you can sort the CPUs, you can also filter your search by selecting one of the drop down categories or by using the range sliders. Clicking on a specific processor name will take you to the chart it appears in and will highlight it for you. Single CPU Systems Last Updated: 26th of August 2020 Columns Show All entries CPU Mark Thread Mark TDP (W) CPU Name Min... - Min... - Min... - Socket Category Search... ▲▼ Max... ▲▼ Max... ▲▼ Max... ▲▼ ▲▼ ▲▼ AMD Ryzen Threadripper 3990X 80,087 2,518 280 sTRX4 Desktop AMD EPYC 7702 71,362 2,067 200 SP3 Server AMD EPYC 7742 67,185 2,376 225 SP3 Server AMD EPYC 7702P 64,395 2,316 200 SP3 Server AMD Ryzen Threadripper 3970X 64,015 2,704 280 sTRX4 Desktop AMD Ryzen Threadripper 3960X 55,707 2,702 280 sTRX4 Desktop AMD EPYC 7452 53,478 2,290 155 SP3 Server AMD EPYC 7502P 48,021 1,938 180 SP3 Server AMD Ryzen 9 3950X 39,246 2,743 105 AM4 Desktop AMD EPYC 7402P 39,118 1,742 180 SP3 Server Intel Xeon Gold 6248R @ 3.00GHz 38,521 2,270 205 FCLGA3647 Server Intel Xeon Platinum 8280 @ 2.70GHz 37,575 2,011 205 FCLGA3647 Server AMD EPYC 7302P 37,473 2,143 155 SP3 Server Intel Xeon W-3275M @ 2.50GHz 37,104 2,561 205 FCLGA3647 Server Intel Core i9-10980XE @ 3.00GHz 33,967 2,636 165 FCLGA2066 Desktop Intel Xeon Platinum 8168 @ 2.70GHz 33,398 2,167 205
[Show full text]
Intel®Server Boards S2400LP
Intel® Server Boards S2400LP Technical Product Specification Intel order number G52803-002 Revision 2.0 December 2013 Platform Collaboration and Systems Division - Marketing Revision History Intel® Server Boards S2400LP TPS Revision History Date Revision Modifications Number May 2012 1.0 Initial release. December 2013 2.0 Added support for Intel® Xeon® processor E5-2400 v2 product family ii Intel order number G52803-002 Revision 2.0 Intel® Server Boards S2400LP TPS Disclaimers Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.
[Show full text]
TH55 HD Motherboard TH55 HD Specifcation
TH55 HD Motherboard • Supports the Intel Core i7 / i5 / i3 / Pentium Processors in the LGA1156 Package • Intel H55 single chip architecture • 7 Phases Power Design • Support 4-DIMM DDR3- 2000+(OC)/1800(OC)/1600/1333 up to 16G maximum capacity • 100% X.D.C Japanese solid capacitor • Integrated HDMI/DVI interface with HDCP Supporting all HD formats including 720P, 1080i, 1080P. ( Required processors with Intel HD Graphics ) • CPU integrated Graphics performance tunable via BIOS • BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving • BIOSTAR Toverclocker utility • Optimized to deliver full windows 7 Experience TH55 HD Specifcation CPU SUPPORT Intel® Core™ i7 LGA 1156 Processor Intel® Core™ i5 LGA 1156 Processor Intel® Core™ i3 LGA 1156 Processor BIOSTARIntel® Pentium® LGA 1156 Processor MEMORY Support Dual Channel DDR3 800/1066/1333/1600(OC)/1800(OC)/2000(OC) MHz 4 x DDR3 DIMM Memory Slot Max. Supports up to 16GB Memory INTEGRATED VIDEO By CPU model STORAGE 6 x SATA II Connector 1 x IDE Connector LAN Realtek RTL8111DL - 10/100/1000 Controller AUDIO CODEC Realtek ALC888 8+2 Channel HD Audio USB 4 x USB 2.0 Port 3 x USB 2.0 Header EXPANSION SLOT 1 x PCI-E 2.0 x16 Slot 1 x PCI-E 2.0 x4 Slot 2 x PCI Slot REAR I/O 1 x PS/2 Mouse 1 x PS/2 Keyboard 4 x USB 2.0 Port 1 x HDMI Connector 1 x DVI Connector 1 x VGA Port 1 x LAN Port 6 x Audio Jacks INTERNAL I/O 3 x USB 2.0 Header 6 x SATA II Connector (3Gb/s ) 1 x IDE Connector 1 x Front Audio Header 1 x Front Panel Header 1 x CD-IN Header 1 x S/PDIF-Out Header 1 x CPU Fan Connector 2 x
[Show full text]
Acer Aspire M5811 Service Guide
Acer Aspire M5811 Service Guide Service guide files and updates are available on the ACER/CSD web; for more information, please refer to http://csd.acer.com.tw PRINTED IN TAIWAN Revision History Please refer to the table below for the updates made on this service guide. Date Chapter Updates ii Copyright Copyright © 2009 by Acer Incorporated. All rights reserved. No part of this publication may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without the prior written permission of Acer Incorporated. iii Disclaimer The information in this guide is subject to change without notice. Acer Incorporated makes no representations or warranties, either expressed or implied, with respect to the contents hereof and specifically disclaims any warranties of merchantability or fitness for any particular purpose. Any Acer Incorporated software described in this manual is sold or licensed "as is". Should the programs prove defective following their purchase, the buyer (and not Acer Incorporated, its distributor, or its dealer) assumes the entire cost of all necessary servicing, repair, and any incidental or consequential damages resulting from any defect in the software. Acer is a registered trademark of Acer Corporation. Intel is a registered trademark of Intel Corporation. Pentium Dual-Core, Celeron Dual-Core, Core 2 Duo, Core 2 Quad, Celeron, and combinations thereof, are trademarks of Intel Corporation. Other brand and product names are trademarks and/or registered trademarks of their respective holders. iv Conventions The following conventions are used in this manual: SCREEN Denotes actual messages that appear on screen.
[Show full text]
Superworkstations
SuperWorkstations Enterprise-Class Systems Optimized for Media & Entertainment, Engineering, and Research 5038A-iL 7047GR-TRF 7047AX-TRF/72RF 7047A-T/73 7037A-i/iL High Performance GPU Optimized Hyper-Speed Storage Optimized w/ Dual CPU Workstation Versatile Features & I/O w/ 5 GPUs Workstation 8x SATA/ SAS 2.0 HDDs Mini-Tower Access Performance • Efficiency • Expandability • Reliability • Optimized Applications : Video Editing, Digital Content Creation, CAD/CAE/CAM Software Development, Scientific Research and Oil & Gas Applications • Whisper-Quiet 21dB Acoustics Models • Redundant Platinum Level (95%+) Digital Power Supplies Available • Up to 1TB DDR3 memory and 8x Hot-Swap HDDs • Up to 5x GPUs supported with PCI-E 3.0 x16 • Supports Intel® Xeon® Processor E5-2600/2400/1600 v2 series up to 150W CPUs and E3-1200 v3 Product Families • Server-Grade Design for 24x7 Operation www.supermicro.com/SuperWorkstations April 2014 High-Performance, High-Efficiency for Personal SuperComputing Hyper-Speed Workstation The Only 4+1 GPU New! Outperforms by 20% System in the Market Whisper-Quiet DP Compact High-End High Performance, Versatile Most Cost-Effective Whisper-Quiet Entry Level via Hardware Acceleration Up to 67% Performance Gain Solution with SAS DP Solution Compact DP Solution Features & I/O Access Maximus System Cost-Effective Solution ULTIMATE ULTIMATE HIGH END HIGH END MAINSTREAM MAINSTREAM MAINSTREAM ENTRY LEVEL SYSTEM 7047AX-TRF/72RF 7047GR-TRF 7047A-T/73 7037A-i 7037A-iL 5038A-iL 5037A-i 5037A-iL Socket R LGA 2011 Socket R LGA 2011 Socket
[Show full text]
Intel's Core 2 Family
Intel’s Core 2 family - TOCK lines II Nehalem to Haswell Dezső Sima Vers. 3.11 August 2018 Contents • 1. Introduction • 2. The Core 2 line • 3. The Nehalem line • 4. The Sandy Bridge line • 5. The Haswell line • 6. The Skylake line • 7. The Kaby Lake line • 8. The Kaby Lake Refresh line • 9. The Coffee Lake line • 10. The Cannon Lake line 3. The Nehalem line 3.1 Introduction to the 1. generation Nehalem line • (Bloomfield) • 3.2 Major innovations of the 1. gen. Nehalem line 3.3 Major innovations of the 2. gen. Nehalem line • (Lynnfield) 3.1 Introduction to the 1. generation Nehalem line (Bloomfield) 3.1 Introduction to the 1. generation Nehalem line (Bloomfield) (1) 3.1 Introduction to the 1. generation Nehalem line (Bloomfield) Developed at Hillsboro, Oregon, at the site where the Pentium 4 was designed. Experiences with HT Nehalem became a multithreaded design. The design effort took about five years and required thousands of engineers (Ronak Singhal, lead architect of Nehalem) [37]. The 1. gen. Nehalem line targets DP servers, yet its first implementation appeared in the desktop segment (Core i7-9xx (Bloomfield)) 4C in 11/2008 1. gen. 2. gen. 3. gen. 4. gen. 5. gen. West- Core 2 Penryn Nehalem Sandy Ivy Haswell Broad- mere Bridge Bridge well New New New New New New New New Microarch. Process Microarchi. Microarch. Process Microarch. Process Process 45 nm 65 nm 45 nm 32 nm 32 nm 22 nm 22 nm 14 nm TOCK TICK TOCK TICK TOCK TICK TOCK TICK (2006) (2007) (2008) (2010) (2011) (2012) (2013) (2014) Figure : Intel’s Tick-Tock development model (Based on [1]) * 3.1 Introduction to the 1.
[Show full text]