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BAE Systems Radiation Hardened Product Guide Datasheet (Pdf)

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BAE Systems Radiation Hardened Product Guide Datasheet (Pdf) Full-service, independent repair center -~ ARTISAN® with experienced engineers and technicians on staff. TECHNOLOGY GROUP ~I We buy your excess, underutilized, and idle equipment along with credit for buybacks and trade-ins. Custom engineering Your definitive source so your equipment works exactly as you specify. for quality pre-owned • Critical and expedited services • Leasing / Rentals/ Demos equipment. • In stock/ Ready-to-ship • !TAR-certified secure asset solutions Expert team I Trust guarantee I 100% satisfaction Artisan Technology Group (217) 352-9330 | [email protected] | artisantg.com All trademarks, brand names, and brands appearing herein are the property o f their respective owners. Find the BAE Systems RAD750 at our website: Click HERE 2013–2014 SHORT–FORM PRODUCT GUIDE RADIATION-HARDENED ELECTRONICS ELECTRONIC SYSTEMS Artisan Technology Group - Quality Instrumentation ... Guaranteed | (888) 88-SOURCE | www.artisantg.com TABLE OF Contents TECHNOLOGY CENTER FOR HIGH RELIABILITY SEMICONDUCTOR TECHNOLOGY CENTER 1 OVERVIEW Testing Manufacturer List (QML) for production of STANDARD COMPONENTS avionics and radiation-hardened space parts. MEMORY 4 BAE Systems is a global defense, security, The STC test facility encompasses five The wafer and assembly fabrication is under and aerospace company, delivering a full logic test systems and four memory test MICROPROCESSORS 6 statistical process control and uses in-line range of products and services for air, land, systems. It performs production testing physical and electrical data to assure product FPGAs 6 and naval forces, as well as advanced and engineering evaluation on wafers and quality and reliability in real time, rather than electronics, information technology packaged devices over the full military INTERFACE COMPONENTS 8 waiting for screening and qualification at the solutions, and customer support services. temperature range. The facility has fully end of the line. SINGLE-BOARD COMPUTER PRODUCTS equipped VLSI characterization, failure The company develops and produces a wide analysis, and reliability laboratories that Qualification under the DOD’s QML program RAD750® SINGLE-BOARD COMPUTERS 12 array of radiation hardened space products, perform routine and diagnostic testing and involves a rigorous validation process from standard components and single-board RAD750 6U EXTENDED FLEXIBLE ARCHITECTURE 14 evaluation. Failure analysis instruments by a panel of government agencies and computers, to complete system payloads. include photo-emission and scanning customers. Such qualification means INTERFACE, MICROCONTROLLER, AND EVALUATION BOARDS 14 BAE Systems specializes in a broad domain electron microscopes and a focused- the manufacturer understands user of radiation-hardened electronics, including SOFTWARE TOOLS 15 ion-beam system that supports process requirements and technical processes application-specific integrated circuits diagnostics and semiconductor repair. to produce — and constantly improve — ASIC TECHNOLOGIES (ASICs), microprocessors, memories, ASIC TECHNOLOGY 18 FPGAs, and single-board computers. With more than 600 computers in space, ASIC DESIGN KIT 20 including the 16-bit GVSC1750, 32-bit ASIC DESIGN FLOW 20 RAD6000®, and the RAD750® family of ASIC ENTRY POINTS/TECHNOLOGY ACCESS 21 products, BAE Systems space computers have logged over 5,700 years in orbit. ASIC DESIGN TOOLS 21 The BAE Systems Semiconductor IP CORES 22 Technology Center (STC) in Manassas, SERVICES Virginia, has been providing products and system-level solutions to the commercial, SERVICES 26 military, and space communities since QUALITY AND PERFORMANCE EXCELLENCE 26 the early 1980s. A leading manufacturer of radiation-hardened, space-qualified semiconductor devices, the STC offers a Front cover photo courtesy of Northrop Grumman complete design, fabrication, packaging, and test facility for very-large-scale integration, or VLSI, wafer and module development and production. The facility features the capabilities to handle procurement of materials through fully screened and qualified mil-spec packaged components. WAFER FABRICATION BAE Systems leverages both an in-house high-quality, reliable integrated circuits wafer fabrication facility and external On site for total-dose testing are and modules. QML V-level devices with foundry partners to produce advanced J.L. Shepherd Cobalt-60 Gamma source technology conformance inspection are semiconductor microcircuits from the models 109 and 494R, which can be qualified replacements for Qualified Parts 800nm to the 45nm technology nodes. configured for MIL-STD and low-dose List Class S devices. BAE Systems’ space rate testing, and an ARACOR 4100 X-ray product portfolio is certified and qualified PACKAGING irradiator. BAE Systems also has access to DLA/DSCC performance specifications to, and extensive experience with, linear MIL-PRF-38535 and MIL-STD-883, including BAE Systems offers a wide range of accelerator, flash X-ray, heavy-ion, proton, and support for legacy requirements. wirebond and flip chip hermetic packages neutron test facilities. to support space, military, avionics, and The facility is accredited as a DOD Category commercial ASICs and memories. These 1A Trusted Integrated Circuit Supplier, include families of ceramic quad flat packs, QUALITY covering design, foundry, test, packaging, ceramic column grid arrays, plastic ball grid arrays with glob-top, stacked and unstacked The Manassas STC and foundry partner and assembly services. The accreditation die-in multichip modules. fabrication facilities are included in the expresses the Defense Department’s Defense Logistics Agency (DLA)/Defense confidence in BAE Systems’ ability to deliver Supply Center Columbus (DSCC) Qualified trusted foundry microelectronics equipment and services to U.S. government end users. BAE Systems Artisan Technology Group - Quality Instrumentation ... Guaranteed | (888) 88-SOURCE | www.artisantg.com 2013-2104 Short-form product guide 1 STANDARD COMPONENTS R ELIABLE, RADIATION HARDENED, SPACE QUALIFIED, HERMETICALLY SEALED, MIL-SCREENED... 2 BAE Systems Artisan Technology Group - Quality Instrumentation ... Guaranteed | (888) 88-SOURCE | www.artisantg.com 2013-2104 Short-form product guide 3 memory Memory Part number (PN) Description Configuration Voltage (V) Typical Total-dose (rad[Si]) Single-event upset Latchup-immune Package Qualified SMD No. Access/clock (ns) (upsets/bit-day) 90% geo SRAM 251A172 MILLENNIUM 512K x 32 2.5/3.3 12 >100K <1E-10 Yes 84-lead FP Internally N/A qualified SRAM 251A137 MILLENNIUM 512K x 40 2.5/3.3 12 >100K <1E-10 Yes 84-lead FP Internally N/A qualified SRAM 8394325 MAGNUM 512K x 8 3.3 18 >500K <1E-10 Yes 40-lead FP V 5962G07210 SRAM 8427352 INDEPENDENCE 512K x 32 or 2M x 8 1.5/3.3 13 >1M <1E-12 Yes 86-lead FP Internally qualified Pending SRAM 8464575 TITAN 2M x 32 1.2/1.8/2.5 13 >100K <1E-11 Yes 86-lead FP Pending Pending SRAM 8485896 TITAN-STACK 8M x 40 1.2/1.8/2.5 ~15 >100K <1E-11 Yes 120-lead FP Pending Pending SSRAM 8401349 L2 Cache 128K x 72 1.8/3.3 Read: 4.5 >1M <1E-10 Yes 340-pin CCGA Internally qualified Pending Clock cycle: 7.6 PROM 238A790 32K x 8 3.3 TTL 60 >500K immune Yes 28-lead FP V 5962G02502 PROM 197A807 32K x 8 5.0 CMOS/TTL 27 >200K immune Yes 28-lead FP V 5962R96891 C-RAM 8406746 256K x 8 3.3 Read: 70 >500K <1E-11 Yes 40-lead FP Q 5962H08240 Write: 1000 C-RAM 8406746 512K x 8 3.3 Read: 70 >500K <1E-11 Yes 40-lead FP Q 5962H08241 Write: 1000 C-RAM 8466169 512K x 40 3.3 Read: 70 >500K <1E-11 Yes 100-lead FP Pending Pending Write: 1000 FIFO 8407971 1K x 36 3.3 Read: 13 >1M <1E-9 Yes 132-lead CQFP V 5962G08208 Write: 13 4 BAE Systems Artisan Technology Group - Quality Instrumentation ... Guaranteed | (888) 88-SOURCE | www.artisantg.com 2013-2104 Short-form product guide 5 MICROPROCESSORS Microprocessors P/N Speed Voltage (V) Total-dose Single-event upset Latchup- Package Qualified SMD No. (rad[Si]) (errors/bit-day immune (CCGA) (90% W. C. geo) RAD750 251A161 132 MHz 2.5/3.3 >200K <1.6 E-10 Yes 360-pin Q 5962R08229 RAD750 8447257 200 MHz 1.8/3.3 >1M <1.6 E-10 Yes 360-pin Q; V-pending 5962H12229 FPGAS FPGAs P/N Voltage (V) Logic cells Total-dose Single-event upset Single-event upset Latchup- Package Qualified SMD No. (rad[Si]) Effective LET Effective LET Immune (CQFP) 90% geo (C-latch) 90% geo (S-latch) RH1020B 197A805 5 2000 >150K 13 18.8 Yes 84-lead V 5962R90965 RH1280B 197A806 5 8000 >100K 17 4 Yes 172-lead Q; V-pending 5962R92156 6 BAE Systems Artisan Technology Group - Quality Instrumentation ... Guaranteed | (888) 88-SOURCE | www.artisantg.com 2013-2104 Short-form product guide 7 INTERFACE COMPONENTS Interface P/N Voltage (V) Total-dose Single-event Interfaces Data rates Embedded Embedded Latchup- Package Qualified SMD No. components (rad[Si]) upset (upsets/ microcontroller memory immune bit-day) (MIPs) Enhanced 8395188 2.5/3.3 200K <1E-10 PCI 2.2, UART, IEEE 1149.1, PCI peak bandwidth (32bit, 33MHz): 4 128Kb Yes 624 CCGA Q 5962R08A04 PowerPCI memory (PROM, EEPROM, SRAM, SDRAM), 132MB/s write, 126MB/s read RAD750/PowerPC, programmable discretes Golden Gate 8451457 1.5/3.3 1M <1E-9 Dual PCI 2.2 32 & 64 bit, UART, PCI peak bandwidth (64bit, 66MHz): 20 1.2Mb Yes 1144 CCGA Pending Pending IEEE 1149.1, memory (PROM, EEPROM, C-RAM, 264MB/s write, 252MB/s read SRAM, SSRAM, SDRAM), RAD750/PowerPC, SpaceWire bandwidth: 256Mb/s at SpaceWire (4-ports with router, 320MHz RMAP), 1553, programmable discretes, external FIFO SpaceWire 8396844 2.5/3.3 200K < 1E-9 Dual PCI 2.2, UART, IEEE 1149.1, memory PCI peak bandwidth (32bit,
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