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Multiple patterning
Abstracts 2014 EUVL
Mack DFM Keynote
Advanced MOSFET Structures and Processes for Sub-7 Nm CMOS Technologies
An Etching Study for Self-Aligned Double Patterning
Design Enablement and Design-Centric Assessment of Future Semiconductor Technologies
Download 2020 Annual Report Based on IFRS
EE241B : Advanced Digital Circuits • Sign up for Piazza If You Haven’T Already
ITRS Lithography Roadmap: 2015 Challenges
Innovation on Line Cut Methods of Self-Aligned Multiple Patterning
Lithography (Summary)
Innovation Drives the Evolution of Semiconductors Innovation Drives the Evolution of Semiconductors
Promising Lithography Techniques for Next-Generation Logic Devices
Design for Manufacturability and Reliability in Extreme-Scaling VLSI
Exploiting Challenges of Sub-20 Nm CMOS for Affordable Technology Scaling
Assessing Benefits of a Buried Interconnect Layer in Digital Designs Liheng Zhu, Yasmine Badr, Shaodi Wang, Subramanian Iyer and Puneet Gupta
Nanolithography: Status and Challenges
2020 Edition
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