HP Openvms Guide to System Security

Total Page:16

File Type:pdf, Size:1020Kb

HP Openvms Guide to System Security HP OpenVMS Guide to System Security OpenVMS Version 7.3-2 This manual supersedes the OpenVMS Guide to System Security, Version 7.3-1. Manufacturing Part Number: AA-Q2HLG-TE September 2003 © Copyright 2003 Hewlett-Packard Development Company, L.P. Legal Notice PostScript is a trademark of Adobe Systems Incorporated. Microsoft is a US registered trademark of Microsoft Corporation. All other product names mentioned herein may be trademarks of their respective companies. Proprietary computer software. Valid license from HP required for possession, use or copying. Consistent with FAR 12.211 and 12.212, Commercial Computer Software, Computer Software Documentation, and Technical Data for Commercial Items are licensed to the U.S. Government under vendor's standard commercial license. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. ZK6346 2 Contents 1. Understanding System Security Types of Computer Security Problems . 22 Levels of Security Requirements. 23 Building a Secure System Environment. 24 Common Data Security Architecture (CDSA) . 25 Secure Sockets Layer (SSL). 26 Kerberos . 27 2. OpenVMS Security Model Structure of a Secure Operating System . 28 Reference Monitor Concept . 28 How the Reference Monitor Enforces Security Rules. 29 Implementation of the Reference Monitor . 29 Subjects . 29 Objects . 30 Authorization Database . 31 Audit Trail. 32 Reference Monitor. 33 Authorization Database Represented as an Access Matrix . 33 Summary: System Security Design. 34 3. Using the System Responsibly Choosing a Password for Your Account. 38 Obtaining Your Initial Password . 38 Observing System Restrictions on Passwords. 39 Knowing What Type of Password to Use . 39 Entering a System Password . 40 Entering a Secondary Password . 40 Password Requirements for Different Types of Accounts . 41 Types of Logins and Login Classes . 41 Logging In Interactively: Local, Dialup, and Remote Logins. 42 Logging In Using External Authentication. 42 Reading Informational Messages. 42 When the System Logs In for You: Network and Batch Logins . 43 Login Failures: When You Are Unable to Log In . 44 Using a Terminal That Requires a System Password . 45 Observing Your Login Class Restrictions . 45 Using an Account Restricted to Certain Days and Times . 45 Failing to Enter the Correct Password During a Dialup Login . 45 Knowing When Break-In Evasion Procedures Are in Effect . 46 Changing Your Password. 46 Selecting Your Own Password . 46 Using Generated Passwords. 47 Changing a Secondary Password . 48 Changing Your Password As You Log In . 48 Password and Account Expiration Times . 48 3 Contents Changing an Expired Password . 49 Renewing an Expired Account . 49 Guidelines for Protecting Your Password . 50 Network Security Considerations . 51 Protecting Information in Access Control Strings . 51 Using Proxy Login Accounts to Protect Passwords. 51 Auditing Access to Your Account and Files . 53 Observing Your Last Login Time . 53 Adding Access Control Entries to Sensitive Files . 54 Asking Your Security Administrator to Enable Auditing. 54 Logging Out Without Compromising System Security . 55 Clearing Your Terminal Screen . 56 Disposing of Hardcopy Output. 56 Removing Disconnected Processes. 56 Breaking the Connection to a Dialup Line . 57 Turning Off a Terminal . 57 Checklist for Contributing to System Security . 57 4. Protecting Data Contents of a User's Security Profile . 59 Per-Thread Security . 59 Persona Security Block Data Structure (PSB) . 60 Previous Security.
Recommended publications
  • Wayne Community College 2009-2010 Strategic Plan End-Of-Year Report Table of Contents
    Wayne Community College INSTITUTIONAL EFFECTIVENESS THROUGH PLAN & BUDGET INTEGRATION 2009-2010 Strategic Plan End-of-Year Report Wayne Community College 2009-2010 Strategic Plan End-of-Year Report Table of Contents Planning Group 1 – President Foundation Institutional Advancement Planning Group 2 – VP Academic Services Academic Skills Center Ag & Natural Resources Allied Health Arts & Sciences Business Administration Cooperative Programs Dental Engineering & Mechanical Studies Global Education Information Systems & Computer Technology Language & Communication Library Mathematics Medical Lab Sciences Nursing Pre-Curriculum Public Safety Public Services Science SJAFB Social Science Transportation Planning Group 3 – VP Student Services VP Student Services Admissions & Records Financial Aid Student Activities Student Development Planning Group 4 – VP Educational Support Services VP Educational Support Services Campus Information Services Educational Support Technologies Facilities Operations Information Technology Security Planning Group 5 – VP Continuing Education VP Continuing Education Basic Skills Business & Industry Center Occupational Extension WCC PLANNING DOCUMENT 2009-2010 Department: Foundation Long Range Goal #8: Integrate state-of-practice technology in all aspects of the college’s programs, services, and operations. Short Range Goal #8.2: Expand and improve program accessibility through technology. Objective/Intended Outcome: The Foundation has experienced phenomenal growth in the last three years. With the purchase of the Raisers Edge Software, we have been able to see a direct increase in our revenues. In order to sustain this level of growth, The Foundation either needs to hire extra manpower or purchase additional Raiser’s Edge software to support our growth. 1. Raiser’s Edge NetSolutions: Enhance the Foundation office’s fundraising abilities. The Foundation would be able to accept online donations, reservations for golf tournament, gala, arts and humanities programs and reach out to alumni.
    [Show full text]
  • Intel Corporation 2000 Annual Report
    silicon is in 2000 Annual Report i n t e l .c o m i n t c . c o m Intel facts and figures Net revenues Diluted earnings per share Dollars in billions Dollars, adjusted for stock splits 35 1.6 33.7 1.51 30 29.4 1.2 26.3 25 25.1 Intel revenues 1.05 20.8 20 grew 15% in 2000, 0.97 0.86 0.8 giving us our 14th 16.2 15 0.73 consecutive year of 11.5 10 0.50 0.4 8.8 revenue growth. 0.33 0.33 5.8 5 4.8 0.12 0.16 0 0 91 92 93 94 95 9697 98 99 00 91 92 93 94 95 9697 98 99 00 Geographic breakdown of 2000 revenues Return on average stockholders’ equity Percent Percent 100 40 38.4 35.5 35.6 33.3 North America 41% Intel has 30 75 30.2 experienced strong 27.3 28.4 26.2 international growth, 21.6 20 50 with 59% of revenues 20.4 Asia-Pacific 26% outside North America in 2000. 10 25 Europe 24% 0 Japan 9% 91 92 93 94 95 9697 98 99 00 0 Capital additions to property, Stock price trading ranges by fiscal year plant and equipment † Dollars, adjusted for stock splits Dollars in millions 75 8,000 Capital invest- 6,674 ments reflect Intel’s 6,000 50 commitment to building leading-edge manu- 4,501 4,000 4,032 facturing capacity for 3,550 3,403 25 3,024 state-of-the-art 2,441 2,000 silicon products.
    [Show full text]
  • Intel Corporation Annual Report 1999
    clients networking and communications intel.com 1999 annual report the building blocks of the internet economy intc.com server platforms solutions and services 29.4 30 2.25 90 2.11 26.3 1.93 25.1 1.73 20.8 20 1.45 1.50 60 16.2 1.01 11.5 10 0.75 30 8.8 0.65 0.65 High 5.8 4.8 3.9 0.31 Close 0.24 0.20 Low INTEL CORPORATION 1999 0 0 0 90 91 92 93 94 95 96 97 98 99 90 91 92 93 94 95 96 97 98 99 90 91 92 93 94 95 96 97 98 99 Net revenues Diluted earnings per share Stock price trading ranges (Dollars in billions) (Dollars, adjusted for stock splits) by fiscal year (Dollars, adjusted for stock splits) 3,111 1999 facts and figures 3,000 45 2,509 Intel’s stock 38.4 2,347 35.5 35.6 price has risen 33.3 2,000 28.4 30 1,808 27.3 at a 48% 26.2 21.2 21.6 20.4 1,296 1,111 970 compound 1,000 15 780 618 517 annual growth 0 rate in the 0 90 91 92 93 94 95 96 97 98 99 90 91 92 93 94 95 96 97 98 99 Research and development Return on average (Dollars in millions, excluding purchased last 10 years. stockholders’ equity in-process research and development) (Percent) 9.76 4,501 9 Japan 4,500 7% 4,032 7.05 3,550 3,403 3,024 5.93 6 Asia- 3,000 Pacific North 5.14 23% America 2,441 43% 1,9 33 3.69 2.80 3 1,500 1,228 2.24 Machinery 948 & equipment 1.63 1.35 Europe 680 1.12 27% Land, buildings & improvements 0 0 90 91 92 93 94 95 96 97 98 99 90 91 92 93 94 95 96 97 98 99 Book value per share Geographic breakdown of 1999 revenues Capital additions to property, at year-end (Percent) plant and equipment† (Dollars, adjusted for stock splits) (Dollars in millions) Past performance does not guarantee future results.
    [Show full text]
  • (12) United States Patent (10) Patent No.: US 7,020,893 B2 Connelly (45) Date of Patent: Mar
    US007020893B2 (12) United States Patent (10) Patent No.: US 7,020,893 B2 Connelly (45) Date of Patent: Mar. 28, 2006 (54) METHOD AND APPARATUS FOR 5,945,988 A 8, 1999 Williams et al. CONTINUOUSLY AND 5,977.964. A 11/1999 Williams et al. OPPORTUNISTICALLY DRIVING AN 5.991,841 A 11/1999 Gafken et al. OPTIMIAL BROADCAST SCHEDULE BASED 6,002,393 A 12/1999 Hite et al. ON MOST RECENT CLIENT DEMAND FEEDBACK FROMA DISTRIBUTED SET OF (Continued) BROADCAST CLIENTS FOREIGN PATENT DOCUMENTS (75) Inventor: Jay H. Connelly, Portland, OR (US) WO WO 99,65237 12/1999 (73) Assignee: Intel Corporation, Santa Clara, CA (Continued) (US) OTHER PUBLICATIONS (*) Notice: Subject to any disclaimer, the term of this Intel: Intel Architecture Labs. Internet and Broadcast: The patent is extended or adjusted under 35 Key To Digital Convergence. Utilizing Digital Technology U.S.C. 154(b) by 882 days. to Meet Audience Demand, 2000, pp. 1-4. (21) Appl. No.: 09/882,487 (Continued) Filed: Jun. 15, 2001 Primary Examiner Ngoc Vu (22) (74) Attorney, Agent, or Firm—Blakely, Sokoloff, Taylor & (65) Prior Publication Data Zafman LLP US 20O2/O194598 A1 Dec. 19, 2002 (57) ABSTRACT (51) Int. C. HO)4N 7/173 (2006.01) Abroadcast method and system for continuously and oppor (52) U.S. Cl. ............................ 725/97; 725/91. 725/95; tunistically driving an optimal broadcast schedule based on 725/114; 725/121 most recent client demand feedback from a distributed set of (58) Field of Classification Search .................. 725/95, broadcast clients. The broadcast system includes an opera 725/97, 98, 105,109, 118, 121, 46,91, 92, tion center that broadcasts meta-data to a plurality of client 725/114, 120 systems.
    [Show full text]
  • Ultra-Wideband Research and Implementation
    Ultra­Wideband Research and Implementation Senior Capstone Project 2007 Final Report by: Jarrod Cook Nathan Gove Project Advisors: Dr. Brian Huggins Dr. In Soo Ahn Dr. Prasad Shastry Abstract Ultra‐wideband (UWB) is a wireless transmission standard that will soon revolutionize consumer electronics. UWB is interesting because of its inherent low power consumption, high data rates of up to 480 Mbps, and large spatial capacity1. Furthermore, the power spectral density is low enough to prevent interference with other wireless services. This new standard has recently been approved by the FCC for unlicensed use and has been gaining interest throughout the consumer electronics industry. The main goal of the project is to increase interest in UWB technology, and to explore its usefulness. The history and benefits of UWB will be discussed, followed by the project goals, implementation, and results. Texas Instruments DSP platforms were used in conjunction with Simulink and Code Composter Studio to implement the scaled‐down baseband modulation scheme. Also, RF microwave components were donated from Hittite Corporation to perform quadrature modulation and up conversion to a frequency of 3.4 GHz. 1 Spatial capacity is defined as bits/sec/square‐meter. UWB is projected at having 6 devices working simultaneously within a 10 m range [16]. ii. Acknowledgements There are some people that need to be acknowledged for their work with this project. They include, but are not limited to: • Luke Vercimak and Karl Weyeneth for work on their 2006 Senior Capstone Project, Software Defined Radio. • Dr. Brian Huggins, Dr. In Soo Ahn and Dr. Prasad Shastry for advising, guidance and general encouragement throughout.
    [Show full text]
  • Microprocessor Packaging (Intel)
    MicroprocessorMicroprocessor PackagingPackaging The Key Link in the Chain Koushik Banerjee Technical Advisor Assembly Technology Development Intel Corporation 1 MicroprocessorsMicroprocessors 1971 2001 2 GlobalGlobal PackagingPackaging R&DR&D China Shanghai Philippines Cavite Arizona Chandler Malaysia Penang VirtualVirtual ATDATD 3 MainMain R&DR&D facilityfacility inin Chandler,Chandler, AZAZ 4 Computing needs driving complexity First to introduce organic in mainstream CPUs First to introduce flip chip in Intel 486TM Pentium®mainstreamPentium® Pro Pentium® CPUs II Pentium® III Pentium® 4 Itanium® Processor Processor Processor Processor Processor Processor Processor 25 MHz 1.0+ GHz Ceramic Wire-bond To Organic To Flip Chip 5 LookingLooking aheadahead …… ComplexityComplexity andand ChallengesChallenges toto supportsupport Moore’sMoore’s LawLaw 1. Silicon to package interconnect 2. Within package interconnect 3. Power management 4. Adding more functionality GoalGoal :: BringBring technologytechnology innovationinnovation intointo HighHigh volumevolume manufacturingmanufacturing atat aa LOWLOW COSTCOST 6 SiliconSilicon ?? PackagePackage RelationshipRelationship AnatomyAnatomy 101101 Silicon Processor: The “brain” of the computer (generates instructions) Packaging: The rest of the body (Communicates instructions to the outside world, adds protection) NoNo PackagePackage == NoNo ProductProduct !! Great Packaging = Great Products !! Great Packaging = Great Products !! 7 TheThe KeyKey LinkLink inin thethe ChainChain OpportunityOpportunity Transistor-to-Transistor
    [Show full text]
  • Configuring and Scheduling an Eager-Writing Disk Array
    Configuring and Scheduling an Eager-Writing Disk Array for a Transaction Processing Workload Chi Zhang∗ Xiang Yu∗ Arvind Krishnamurthyy Randolph Y. Wang∗ Abstract cult challenges to storage systems than office work- loads. These applications exhibit little locality or Transaction processing applications such as those sequentiality; a large percentage of the I/O requests exemplified by the TPC-C benchmark are among the are writes, many of which are synchronous; and most demanding I/O applications for conventional there may be little idle time. storage systems. Two complementary techniques exist to improve the performance of these systems. Traditional techniques that work well for office Eager-writing allows the free block that is closest to workloads tend to be less effective for these transac- a disk head to be selected for servicing a write re- tion processing applications. Memory caching pro- quest, and mirroring allows the closest replica to be vides little relief in the presence of poor locality and selected for servicing a read request. Applied indi- a small read-to-write ratio. As disk areal density im- vidually, the effectiveness of each of these techniques proves at 60-100% annually [9], as memory density is limited. An eager-writing disk array (EW-Array) improves at only 40% per year, and as the amount combines these two complementary techniques. In of data in transaction processing systems continues such a system, eager-writing enables low-cost replica to grow, one can expect little improvement in cache propagation so that the system can provide excel- hit rates in the near future. Delayed write tech- lent performance for both read and write operations niques become less applicable in the presence of a while maintaining a high degree of reliability.
    [Show full text]
  • Oral History Avram Miller
    Oral History of Avram Miller Interviewed by: Dane Elliot Recorded: August 19, 2013 Mountain View, California CHM Reference number: X6923.2014 © 2013 Computer History Museum Oral History of Avram Miller Elliot: All right. I’m here with Avram Miller today. It’s August 19, 2013. And we’re interviewing Avram specifically on how Intel invests in their future. Miller: How Intel invested in their Future Elliot: Very good. I’m Dane Elliot, and this is: Miller: Avram Miller. Elliot: Let’s start off with a little bit of background here. Miller: Okay. Elliot: And the background that I’d like to get is education and significant contributions in your career path that led you to Intel. So education? Miller: Well, I basically am self-educated. I always say that I graduated from Avram U. I studied music when I was in high school and then I became a Merchant Seaman for a while. Eventually, I got into science. I was always interested in electronics, and I started doing science at the University of California Medical School in San Francisco. Long story short, I ended up in Holland, at the Faculty of Medicine, Erasmus University. By the time I was 28, I was in an assistant professor in Medicine (medical informatics). When I was 29, I moved with my family to Israel where I was an Adjunct Associate Professor at the Medical Faculty of the University of Tel Avi and started up a medical computer business. What’s probably most relevant to our discussion is that I returned to the United States in 1979 and joined Digital Equipment Corporation.
    [Show full text]
  • Abkürzungs-Liste ABKLEX
    Abkürzungs-Liste ABKLEX (Informatik, Telekommunikation) W. Alex 1. Juli 2021 Karlsruhe Copyright W. Alex, Karlsruhe, 1994 – 2018. Die Liste darf unentgeltlich benutzt und weitergegeben werden. The list may be used or copied free of any charge. Original Point of Distribution: http://www.abklex.de/abklex/ An authorized Czechian version is published on: http://www.sochorek.cz/archiv/slovniky/abklex.htm Author’s Email address: [email protected] 2 Kapitel 1 Abkürzungen Gehen wir von 30 Zeichen aus, aus denen Abkürzungen gebildet werden, und nehmen wir eine größte Länge von 5 Zeichen an, so lassen sich 25.137.930 verschiedene Abkür- zungen bilden (Kombinationen mit Wiederholung und Berücksichtigung der Reihenfol- ge). Es folgt eine Auswahl von rund 16000 Abkürzungen aus den Bereichen Informatik und Telekommunikation. Die Abkürzungen werden hier durchgehend groß geschrieben, Akzente, Bindestriche und dergleichen wurden weggelassen. Einige Abkürzungen sind geschützte Namen; diese sind nicht gekennzeichnet. Die Liste beschreibt nur den Ge- brauch, sie legt nicht eine Definition fest. 100GE 100 GBit/s Ethernet 16CIF 16 times Common Intermediate Format (Picture Format) 16QAM 16-state Quadrature Amplitude Modulation 1GFC 1 Gigabaud Fiber Channel (2, 4, 8, 10, 20GFC) 1GL 1st Generation Language (Maschinencode) 1TBS One True Brace Style (C) 1TR6 (ISDN-Protokoll D-Kanal, national) 247 24/7: 24 hours per day, 7 days per week 2D 2-dimensional 2FA Zwei-Faktor-Authentifizierung 2GL 2nd Generation Language (Assembler) 2L8 Too Late (Slang) 2MS Strukturierte
    [Show full text]
  • COMSATS Institute of Information Technology, Islamabad (STORE SECTION)
    COMSATS Institute of Information Technology, Islamabad (STORE SECTION) LIST OF SCIENTIFIC/LAB EQUIPMENT HELD BY ALL DEPARTMENTS OF CIIT ISLAMABAD CAMPUS ( FROM 2011-12 TO 27-5-2015) Date of Acquisition/Stock Financial Year Head Equipment Name Qty Department Detail Specifications Taking Balance Electronic Digital Top Loading wit UniBlock Technology, LCD Display, Capacity 320gm, Sensitivity 0.001gm, Pan Size(mm) 13/7/2011 LAB EQUIPMENT Electronic Digital Balance 1 BIO SCIENCES approx Ø110, in glass case with sliding glass door wind break as standard configuration, windows direct communication function with 2011-12 built in data interface Rs 232C, operated on 220 Volts, Model TX-323L Shimadzu Japan Vortas Mix Model # KMC - 1300V Vision Scientific, 12 13/7/2011 LAB EQUIPMENT Vortas Mix 1 BIO SCIENCES 2011- Sr. No. E18111KC0318 Block Heater fo Single block Digital Microprocessor controlled temperature setting range 30 to 2000C, temperature Stability 0.10C, 0 0 13/7/2011 LAB EQUIPMENT Block Heater 1 BIO SCIENCES Temperature uniformity 0.1 C, Temperature accuracy 0.1 C, Fast heat up time built in timer, 0 - 999 minute digital display of temperature and time, block material solid nodized aluminum complete wiht block capacity 20 x 1.5ml Operated on 220 Volts, Model 2011-12 HP-1, Wealtec, USA PH Meter Model :- 2212HANNA USA 12 13/7/2011 LAB EQUIPMENT PH Meter 1 BIO SCIENCES 2011- Sr. No. 08180261 12 08.02.2011 LAB EQUIPMENT Power Supply 1 BIO SCIENCES Power Supply Cat # EC300XL2 2011- Thermo Scientific Owl B2 Easy 08.02.2011 LAB EQUIPMENT Cast Mini Gel Horizontal 1 BIO SCIENCES Thermo Scientific Owl B2 Easy Cast Mini Gel Horizontal System Electrophoresis Cat# B2 2011-12 System Horizontal Electrophoresis multiSUB Mini, 7x10cm UV Tray 2x8 sample combs, loading guides and dams Capacity : 64 samples 08.08.2011 LAB EQUIPMENT Horizontal Electrophoresis Unit 1 BIO SCIENCES Buffer Volum: 225ml 2011-12 Note: 2 extra combs are available on request Cat No: MSMINI10; M/s Clever Scientific Sr.
    [Show full text]
  • (Nvme-MI™) and Drivers Update
    Architected for Performance NVMe™ Management Interface (NVMe-MI™) and Drivers Update Sponsored by NVM Express® organization, the owner of NVMe™, NVMe-oF™ and NVMe-MI™ standards Speakers Uma Parepalli Austin Bolen Myron Loewen Lee Prewitt Dave Minturn Suds Jain Jim Harris 2 Agenda • Session Introduction – Uma Parepalli, Marvell (Session Chair) • NVMe Management Interface - Austin Bolen, Dell EMC and Myron Loewen, Intel • NVMe Driver Updates • NVMe Driver Ecosystem and UEFI Drivers - Uma Parepalli, Marvell • Microsoft Inbox Drivers - Lee Prewitt, Microsoft • Linux Drivers - Dave Minturn, Intel • VMware Drivers -Suds Jain, VMWare • SPDK Updates - Jim Harris, Intel 3 Architected for Performance NVMe™ Management Interface (NVMe-MI™) Workgroup Update Austin Bolen, Dell EMC Myron Loewen, Intel Agenda . NVMe-MI™ Workgroup Update . NVMe-MI 1.0a Overview . What’s new in NVMe-MI 1.1 . In-band NVMe-MI . Enclosure Management . Managing Multi NVM Subsystem Devices . Summary 5 NVM Express®, Inc. 120+ Companies defining NVMe™ together 6 NVM Express™ Roadmap 7 NVMe-MI™ Ecosystem . Commercial test equipment for NVMe-MI . NVMe-MI 1.0a compliance testing program has been developed . Compliance testing started in the May 2017 NVMe™ Plugfest conducted by the University of New Hampshire Interoperability Laboratory (UNH-IOL) . 7 devices from multiple vendors have passed compliance testing and are on the NVMe-MI Integrators List . Servers are shipping that support NVMe-MI 8 What is the NVMe™ Management Interface 1.0a? A programming interface that allows out-of-band management of an NVMe Storage Device Field Replaceable Unit (FRU) 9 Out-of-Band Management and NVMe-MI™ . Out-of-Band Management – Management that operates with hardware resources and components that are independent of the host operating system control Host Processor Management Controller (BMC) Host Operating System BMC Operating System .
    [Show full text]
  • Lab Validation Report
    Lab Validation Report Dell PowerVault MD36X0f Series Mixed Workload Performance with Application Aware Data Management By Brian Garrett June 2011 © 2011, Enterprise Strategy Group, Inc. All Rights Reserved. Lab Validation: Dell PowerVault MD36X0f Series 2 Contents Introduction .................................................................................................................................................. 3 The Challenges .......................................................................................................................................................... 3 The Solution .............................................................................................................................................................. 4 The Results................................................................................................................................................................ 5 ESG Lab Validation ........................................................................................................................................ 6 Results ...................................................................................................................................................................... 6 Mixed Workload Storage Performance Testing ....................................................................................................... 8 Test Bed ...................................................................................................................................................................
    [Show full text]