The Future of the Intel® Atom™ Processor
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Congatec Product Guide
Product Guide 2020 NXP based Modules congatec A story of courage and passion. Pursuing this dream calls for a lot of courage and absolute conviction. It’s a dream that inspires us, drives us anew every day. It’s a dream that requires passionate supporters to push it forward. People who help others progress and improve themselves in the process. People who inspire and are inspired. This is the story of congatec. The story of people who carry this spirit within them. People who put their all into developing new ideas – while remaining flexible and creative. Who respond quickly and solve problems. Who are always learning and want to explore the unknown. Who always beat a new path, whenever possible. Who stand out – when it’s good to be an individual. And who do it all for the customer and their needs. Embedded in your success. Pure-Play Roadmap Solid World’s largest vendor focused on Most complete roadmap Stable finance. COMs, SBCs and customized of COM products. Strong growth, no debt and designs only. solid profit. Design-In Innovative Logistics Proven superior design-in support. Close partnerships to Intel, AMD Logistics and stability of supply. Review of customers designs for and NXP. Strategy for long lead time compliance, thermal and Active player in standardization components. Flexibility through mechanical design to reduce risk committees SGET and PICMG. last time buy process. Proven and shorten design cycles. quality for more than 13 years. Technology Leader congatec has been driving industry standards since 2005 SMARC 2.0 Module Configurable Battery Thin 2.5” SBC 3.5” SBC BIOS Manager Mini-ITX Pico-ITX Type 2 Heat Pipe Type 6 First Type 10 Type 7 Acquisiton Module Cooling Module Module Module Real-Time Systems Founder Founding Design Guide Founding customizing IoT COM HPC Member Member Services Gateway Chairman 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 Technology Partnerships Executive Member Founding Member Board Member Associate member Specification editor Rev. -
Qseven MSC Q7-MB-RP3
Qseven MSC Q7-MB-RP3 Description Qseven™ 2.0 Evaluation Board The MSC Q7-MB-RP3 is the third generation reference platform provided to test and qualify Qseven™ Rev. 2.0 modules for compatibility with the SGET specification. The board is shipped with a complete set of design files. An extensive design guide for the Qseven™ module technology is also provided to allow the motherboard designer to easily implement a custom version of a Qseven™ carrier. The Qseven™ Rev. 2.0 reference platform MSC Q7-MB-RP3 offers a large variety of interfaces commonly used in industrial applications such as Gigabit LAN, USB 3.0/2.0, RS232 and CAN as well as HDMI, DP and LVDS 435 x 170 for display attachment. In addition PCI Express is supported with one x16 and three PCIe x1 slots. This platform for N.A. rapid prototyping helps to assess the fitness of a specific CPU Technology. It is a key instrument to shorten design N.A.N.A. cycles and to improve time to market of new Qseven™ based systems. Highlights . One PCI Express™ x16 slot and 3 x1 slots . Two graphic card slots for HDMI / DP / eDP / LVDS . Mini PCI Express™ & mSATA slot . SD Card socket and SIM Card slot . Two SATA onboard connectors . Winbond W83627DHG Super I/O . EXAR X28V384 Super I/O . 7x COM, HW monitor . CAN Transceiver . HD audio codec . USB 3.0, 4x USB 2.0 Host and USB 2.0 Client interfaces avnet.com/embedded Qseven Technical Data - MSC Q7-MB-RP3 Formfactor Wide-ATX Storage Interfaces 2x SATA USB USB 3.0, 4x USB 2.0 Host, USB 2.0 Client Serial Interfaces 2x COM from Winbond Super I/O 4x COM from EXAR Super I/O 1x COM from Qseven module Bus Interfaces PCI express x16, 3x PCIe x1 Display Interfaces HDMI, DP, eDP, LVDS on add-on cards Network Interface GbE Audio Interface HD Audio on 6 connectors + S/PDIF Power Requirement 12V on standard connectors Certificates UL avnet.com/embedded Qseven Order Reference - MSC Q7-MB-RP3 Order Description Reference Cat Number 1135005 The MSC Q7-MB-RP3 is a reference platform designed for evaluation and MSC Q7-MB-RP3 PV test of Qseven Rev. -
SFF.2009.RG.Pdf
Only Print Single Only Print Single www.smallformfactors.com www.pc104online.com Volume 13 • Number 1 COLUMNS FEATURES 8 PC/104 Consortium THE BIG YET SMALL PICTURE: Embedded marketplace embraces PCI/104-Express By Dr. Paul Haris Small, smaller, smallest 12 The wireless toolbox 9 Small Form Factor SIG By John Schwartz, Digi International Separating interconnects from form factors By Paul Rosenfeld 15 Focus on Form Factors: Pico-ITXe 10 Euro Small Tech By Bob Burckle, WinSystems Compact board powers personal weather station By Hermann Strass TECH SMALL TALK: Insights from the experts 74 Editor’s Insight 16 COMIT hits the embedded computing world Rugged SFFs nail system designs By Bob Burckle, WinSystems By Chris A. Ciufo Only IT’S A SMALL (FORM FACTOR) WORLD: Unique applications DEPARTMENTS 19 PC/104 powers nanosatellite for space situational 24 Editor’s Choice Products awareness By Kristin Allen, Kristin Allen Marketing & Design By Don Dingee Print 22 Prototyping SoCs with customized PCI Express WEB RESOURCES development boards By Stephane Hauradou, PLDA Subscribe to the magazine or E-letter Live industry news • Submit new products RESOURCE GUIDE: http://submit.opensystemsmedia.com White papers: 27 2009 PC/104 and Small Form Factors Resource Guide Read: http://whitepapers.opensystemsmedia.com Submit: http://submit.opensystemsmedia.comSingle Communications and networking ...........27 Complete systems .....................29 ON THE COVER: In a progression from small to smallest, the ADLINK Technology Industrial automation ...................30 MilSystem 800, WinSystems Pico-I/O with VIA Pico-ITXe, and Digi XBee radio module show the latest trends in small form factor Interfaces ..........................32 systems and boards. -
Mini ATR, 3-Slot Openvpx™ Platform RUGGED, SMALL FORM FACTOR
DATA SHEET Mini ATR, 3-Slot OpenVPX™ Platform RUGGED, SMALL FORM FACTOR DESCRIPTION The modular design of this Mini ATR platform allows for various con- figurations. The chassis can easily be scaled up or down while using the same side walls. DC and AC power variations as well as custom front I/O configurations are available. Elma also offers a wide selec- tion of backplanes in various architectures and has different milled card cage sizes off-the-shelf. Functional Features Benefits ■■ Small form factor mini ATR-style chassis, natural convection- The all-aluminum Mini ATR incorporates military-grade cooled is low weight, ideal for weight critical applications components like MIL-DTL-38999L connector, on/off and reset switches, LEDs, breakers, etc. EMC shielding is compliant to (SWaP) MIL-STD-461E. Depending on specific applications, commercial, ■■ 3-slot backplane, 1in pitch to meet VITA 65 (OpenVPX) Back- industrial, or military-grade power supplies are available. The plane Profile BKP3-CEN03-15.2.9-n accepts 3U OpenVPX Mini ATR can also be configured with solid-state storage and boards on a 1in pitch, according to VITA 48.2 (REDI) and 250 W AC plug-in power supply module. VITA 65 (OpenVPX) ■■ Other backplanes can be accommodated: 3U CPCI, custom ■■ Two sizes available; other sizes custom: ■■ 1)133mm H x 175mm W x 311mm D (5.24in H x 6.89in W x 12.24in D) ■■ 2) 133mm H x 175mm W x 235mm D (5.24in H x 6.89in W x 9.25in D) ■■ Advanced airflow design distributes air across external fins in sidewalls ■■ Optional plug-in power supply provides up to 350 W VDC; AC versions also available ■■ Option to accommodate 2.5in storage with drive tray ■■ Custom I/O options including MIL-STD wiring and connectors OPTIONAL COMPUTING PRODUCTS ›■ 3U and 6U VPX compliant single board computers. -
COM Express® Basic, Compact, Mini • Qseven® • SMARC™
• • • • Computer Highlights Product ETX® SMARC™ Qseven COM Express® - ® Qseven® on (70 x 70 mm) - Module Basic SMARC™ (84 x 55 mm) , Compact COM Express® mini (84 x 55 mm) , Mini your specialist for embedded solutions COM Express® Compact (95 x 95 mm) 13.10.2017 COM Express® Basic (125 x 95 mm) Embedded Boards Industrial Mainboards Embedded Systems Accessories & IoT 2,5“ Pico-ITX™ Mini-ITX™ Embedded Box PCs Gateways 3,5“ Single Board Computer Micro-ATX Embedded Panel PCs Switches PC/104 Flex-ATX Embedded Server Router Slot SBC ATX Embedded Desktop PCs Memory, CPUs Computer-on-Module Digital Signage Player Cables Industrial Monitors Power Supplies Available Features & Options: Designed for Industrial Applications Long-term Availability Extended Temperature -40°C…+85°C Custom Design Design-in Support Fixed Bill of Material Kits (Board with OS, Display & Cables) EOL / PCN Handling your specialist for embedded solutions Systems - Custom - Standard Kit Solutions - Embedded Board - Operating System - Accessories e.g. Cable/Memory Distribution - Embedded Boards - Displays - Power Supplies your specialist for embedded solutions COM Express® Basic Type 6 & Type 7 COM Express® Basic (125 x 95 mm) your specialist for embedded solutions COM Express® Basic (95 x 125 mm) Intel® Core™ i CPU (Kaby Lake & Skylake) Product SOM-5898 COMe-bKL6 ET970 SOM-5897 COMe-bSL6 Vendor ADVANTECH Kontron iBASE ADVANTECH Kontron Type / Pin-out Type 6 R2.1 Type 6 Type 6 Type 6 Type 6 Intel® Xeon®, Core® i, Intel® Core® i, Xeon, Intel® Core™ i , Xeon (7th Intel® Core™ -
SECO PRESENTS ITS FIRST PRODUCT BUILT UPON the LATEST INTEL ATOM X6000e SERIES and INTEL PENTIUM and CELERON N and J SERIES PROCESSORS
SECO S.p.A. Cap. Soc. € 767.054,00 Via A. Grandi 20 52100 Arezzo – Italy Reg. Imprese n. 4196 Arezzo Pag.1of 6 Ph: +39 0575 26979 REA n. 70645 Fax: +39 0575 350210 Meccanografico AR007079 P.IVA – VAT IT 00325250512 Iscr. Reg. Pile e Accumulatori n. IT20080P00006356 SECO PRESENTS ITS FIRST PRODUCT BUILT UPON THE LATEST INTEL ATOM x6000E SERIES AND INTEL PENTIUM AND CELERON N AND J SERIES PROCESSORS Arezzo, Italy - September 23rd 2020 - SECO's goal has always been to be at the forefront of innovation, providing its customers with the latest technologies available on the market. Today SECO is pleased to unveil its latest product: the SM-C93, a SMARC® Rel 2.1.1 compliant module with the Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series processors. Thanks to the close partnership with Intel and being part of the early access program for this platform, SECO was able to develop a solution that would encompass its great potential. The Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series processors are Intel ’s first enhanced for IoT platforms, with CPU and GPU performance to support IoT applications requirements: with up to 4 cores and excellent performance/watt ratio (4.5W - 12W TDP), it boosts up to 40% faster CPU and 2x 3D graphics performance when compared to Intel Apollo Lake. Additional improvements are Intel UHD Graphics and integrated Gigabit Ethernet: up to 3 Ethernet ports at 2.5 Gb with Time Sensitive Network (TSN) capabilities, a technology aiming at standardizing the transmission of time-sensitive data over Ethernet networks. -
Highrel PC/104 ISA, PCI & Pcie Modules and Systems
Copyright © 2010 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. RTD Embedded Technologies, Inc. Catch the Express! Left: a stellar PCI/104-Express IDAN® including dual, hot-swappable SATA drawers, a 1.86 GHz Intel® Core™ 2 Duo cpuModule™ and Controller with video ports, serial ports, gigabit Ethernet, Advanced Analog & Digital I/O ports, and an 88W high-efficiency power supply. Below: a sample of RTD’s Express offering. RTD is proud to lead the industry in PCI/104-Express selection and development. PCI/104-Express PCIe/104 with Dual Ethernet Intel® Core™ 2 Duo cpuModule™ Intel® Core™ 2 Duo cpuModule™ High-Speed Digital I/O Isolated Digital I/O 88W Power Supply SATA Drive Carrier Dual-Slot Mini PCIe 5-Port Ethernet Switch Dual Gigabit Ethernet PCI Express to PCI Bridge rights reserved. All Inc. Inc. the property of their respective companies. the property of their respective are Technologies, Embedded RTD The Leading Source for Express. 2010 Design, Engineering, Manufacturing & Tech Support Copyright © Copyright All trademarks or registered trademarks All trademarks or registered www.rtd.com AS9100 and ISO 9001 Certified [email protected] www.smallformfactors.com www.pc104online.com Volume 14 • Number 5 COLUMNS FEATURES 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs 10 THE BIG YET SMALL PICTURE By Paul Rosenfeld Mission interoperable Achieving compatibility by 7 PC/104 Consortium Promotions and spec revisions on tap for standardizing -
Embedded Computing Highlights About Congatec 02|03
Product Guide Spring 2014 EMBEDDED COMPUTING HIGHLIGHTS About congatec 02|03 congatec AG is the preferred global vendor for innovative embedded solutionsto enable competitive advantages for our customers. Letter from the CEO Since the company’s inception in December Moreover, we bolstered our sales presence in adopting in order to not only offer benefits for 2004, congatec AG has established itself as a Australia and New Zealand through opening customers, but also to further tap target markets. globally recognized expert and reliable partner a new branch in Queensland. The Australian for embedded computer-on-modules solutions, market offers great potential, especially in the This would all be impossible without our coupled with excellent service and support. We segments of entertainment (gaming), agricultural employees’ commitment. I would like to take have secured second ranking worldwide in our technology, transportation management and this opportunity to again express my thanks to all market segment within the space of just eight medical technology, where congatec products congatec employees. In the passion with which years after our founding thanks to our clear can be deployed optimally. they pursue their daily activities, and through focus. customer-orientation, creativity and team Following the opening of the branches in Japan spirit, they have already brought the company congatec has already ranked among the Deloitte Australia, congatec is now represented with six to a leading position, and, together with the On our way to market leadership Technology Fast 50 for the second consecutive branches on four continents – Asia (Taiwan and company’s management, continue to stand for year1. This award distinguishes Germany’s Japan), Australia, Europe (Germany and the a sustainable and partnership-based corporate congatec AG, headquartered in Deggendorf, highest-growth technology companies. -
LIPPERT Coreexpress-ECO
PC/104 and Small Form Factors Resource Guide COM/SOM Processor boards/SBCs LiPPERT Embedded Computers Inc. 5555 Glenridge Connector, Suite 200 • Atlanta, GA 30342 404-459-2870 www.lippertembedded.com CoreExpress®-ECO The CoreExpress-ECO is an advanced Computer on Module (COM) implementation in a tiny 58 mm x 65 mm format. CoreExpress modules are legacy-free. Should an applica- tion require analog signals, these can be implemented on the carrier board. The Intel Atom processor with its low TDP leads to minimum cooling efforts. The module comes with up to 1 GB of soldered SDDR2 RAM, graphics, LVDS and SDVO display ports, and HD Audio. Two PCI Express FEATURES lanes are available for I/O and graphics. There are 8 USB 2.0 › Intel Atom processor ports, IDE, SDIO/MMC interface, SMBus, and LPC bus avail- › 512 MB, 1 GB, (2 GB opt.) SDDR2 soldered RAM able. All signals are available on a 220-pin connector. › 2x PCI Express lanes › SDIO/MMC › SMBus, GMBus/DDC, LPC bus CoreExpress-ECO features LiPPERT Enhanced Manage- › 2x graphics ports (LVDS and SDVO) ment Technology. It handles power sequencing and other › HD Audio housekeeping tasks, and provides a secure write- and clear- › 8x USB 2.0 protected Flash area for miscellaneous user information. › IDE An evaluation kit is available. › 5 V only supply, 5 W › Optionally extended temperature range -40 °C to +85 °C For more information, contact: [email protected] RSC# 37871 @ www.smallformfactors.com/rsc PC/104 and Small Form Factors Resource Guide EBX Advantech 38 Tesla, Suite 100 • Irvine, CA 92618 800-866-6008 www.advantech.com PCM-9588 The PCM-9588 is targeted at system integrators who want a modular solution with the low-power fanless features of the Intel® Celeron® M processor. -
RABBIT Single Board Computers
Single Board Computers LIPPERT by ADLINK TECHNOLOGY Embedded Modules SINGLE BOARD COMPUTERS Cool FrontRunner-AF with AMD Fusion® Features: • AMD Fusion® APU, single and dual core • Gigabit Ethernet, 6x USB 2.0 • Extended temperature range: -40°C +85°C • Up to 4 GB DDR3 RAM • SATA port • Supports Smart Embedded Management Agent (SEMA) functions • Graphics: Radeon HD6320 (T56N), • High Definition Audio Radeon HD6250 (T40R) • Power consumption: max. 18W • LVDS: 1920 x 1200 resolution MOUSER Lippert Price Each Description Lippert STOCK NO. Part No. 1 10 976-CFRAFT40RC10HTS CFR-AF-T40R-C-10/HTS AMD Fusion® T40R G-Series Single Core Processor at 1GHz with 4GB RAM, PC/104-Plus, 0 to 60°C 716.87 695.31 976-CFRAFT56NC16HTS CFR-AF-T56N-C-16/HTS AMD Fusion® T56N G-Series Dual Core Processor at 1.65GHz with 4GB RAM, PC/104-Plus, 0 to 60°C 779.38 756.15 976-CFRAFT56NE16HTS CFR-AF-T56N-E-16/HTS AMD Fusion® T56N G-Series Dual Core Processor at 1.65GHz with 4GB RAM, PC/104-Plus, 0 to 60°C 807.31 783.03 Cable Assembly 976-CFR-AF-X-01 CFR-AF-X-01 Cable Set for Cool FrontRunner-AF 109.06 105.81 976-THSH-CFR-AF THSH-CFR-AF Passive Heat Sink for Cool FrontRunner-AF 60.50 58.69 Cool LiteRunner-ECO with Intel® Atom™ LiPPERT by ADLINK Cool LiteRunner-ECO PC/104 Single Board Computers are powered by the CoreExpress®-ECO Advanced COM module with an Intel® Atom™ Z510 or Z530 processor, which keeps power consumption low and allows passive cooling. -
Methods of Achieving High Color Rendering Index with Leds
Special Features: Embedded Wireless electronica Preview Boards & Modules Cover Story Methods of achieving high Color Rendering Index with LEDs VIEWPOINT Dear Readers, Once more its showtime again: the electronics industry will meet from November 11th to 14th at the fair- grounds of Messe München. Th is year electronica is celebrating its 50th birthday – evidence for the long lasting success of this event. Beside all other aspects and com- ponents of electronic embedded systems will play a major role in the exhibition and also in the embed- ded platform conference program. Th e conference is being held in conjunction with electronica in Munich on November 11 and 12. Participants of the embedded platforms conference will get an overview of and insights into the ecosystems of modern embedded platforms. Speakers may make pre- sentations on the following topics: cores and peripherals, 8-/16-bit controllers, 32-bit processors, DSP platforms, FPGAs, multicore chips, SoC approaches, security and safety, saving energy, testing, debugging, trace as well as porting and migration, RTOS and other operating systems, initializing and booting, standardization, tool chains and ecosystems, obsolescence, simulation, emulation and modelling platforms. More information about electronica 2014 and the Embedded Forum organized by ICC Media and Messe München you´ll fi nd starting at page 10 of this issue. One sector of the electronics industry which combines nearly all aspects of embedded systems is automotive electronics. Latest trend are energy effi ciency, lighting, electromobility, connected cars, and autonomous driving. Th is means that the future of driving will be electrifi ed, automated and networked. Th erefore it is expected that the value of hardware and soft ware in cars will continue to grow in the years to come. -
INTEGRITY 0510 Integrity Brochure
Green Hills Software The most advanced RTOS technology The most secure & reliable RTOS The flagship of our family of operating systems, the INTEGRITY® RTOS, is built around a microkernel architecture that provides embedded systems with total reliability, absolute security, and maximum real-time response. With its leadership pedigree underscored by certifications from a range of industries, INTEGRITY sets the standard for real-time operating systems. Maximum performance, security, reliability Safety and security certifications From inception, the INTEGRITY RTOS was designed so that Since its release over 13 years ago, the INTEGRITY embedded developers could ensure their applications met RTOS has received the following certifications and the highest possible requirements for security, reliability, accreditations that testify to its robustness, enabling and performance. developers to achieve the highest levels of safety, security, and reliability in their designs. To achieve this, INTEGRITY uses hardware memory protec- s FAA: DO-178B, Level A tion to create secure partitions that isolate and protect s embedded applications. Secure partitions guarantee each Common Criteria: EAL 6+ High Robustness, the highest task the resources it needs to run correctly and fully pro- security level ever achieved for an operating system tect the operating system and user tasks from errant and s FDA: Class II and Class III medical devices malicious code—including denial-of-service attacks, s IEC: Industrial safety 61508 SIL 3 worms, and Trojan horses. s CENELEC: