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Soldering and Brazing of Copper and Copper Alloys DKI

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Soldering and Brazing of Copper and Copper Alloys DKI Soldering and brazing of copper and copper alloys Contents List of abbreviations 1. Introduction 4 5. Quality assurance 47 Abbreviations 2. Material engineering fundamentals 9 6. Case studies 48 Nd:YAG laser Neodymium-doped yttrium aluminium garnet laser SMD Surface-mounted device 2.1. Fundamentals of copper and copper alloys 9 6.1 Hot-air solder levelling of printed circuit boards 48 PVD Physical vapour deposition 2.2 Filler materials 10 6.2 Strip tinning 49 RoHS Restriction of (the use of certain) Hazardous Substances 2.2.1 Soft solder 11 6.3 Fabricating heat exchangers from copper 49 EG Europäische Gemeinschaft 2.2.2 Brazing filler metals 13 6.4 Manufacture of compact high-performance EC European Community 2.3 Soldering or brazing pure copper 16 radiators from copper 49 MIG Metal inert gas process 2.4 Soldering / brazing copper alloys 18 TIG Tungsten inert gas process 2.4.1 Low-alloyed copper alloys 18 7. Terminology 50 DVGW German Technical and Scientific Association for Gas and Water 2.4.2. High-alloyed copper alloys 22 [Deutsche Vereinigung des Gas- und Wasserfaches] 8. Appendix 51 3. Design suitability for soldering/brazing 26 References 57 4. Soldering and brazing methods 29 Chemical elements and compounds Index of figures 58 4.1 The soldering/brazing principle 29 Ag Silver 4.2 Surface preparation 30 Index of tables 59 Al Aluminium 4.3 Surface activation 32 Ar Argon 4.3.1 Fluxes 33 Be Beryllium 4.3.2 Protective atmosphere / Shielding gases 35 C Carbon 4.4 Applying the solder or brazing filler metal 36 CO2 Carbon dioxide 4.5. Soldering and brazing techniques 37 Cr Chromium 4.5.1 Soldering with soldering iron 38 Cu Copper 4.5.2 Dip bath soldering or brazing 38 H2 Hydrogen 4.5.3 Flame soldering or brazing 40 H2O Water 4.5.4 Furnace soldering or brazing 40 HF Hydrofluoric acid 4.5.5 Electric resistance soldering or brazing 43 Mn Manganese 4.5.6 Induction soldering or brazing 44 Ni Nickel 4.5.7 Electron beam brazing 45 O2 Oxygen 4.5.8 Arc brazing 45 P Phosphorus 4.5.9 Laser beam soldering or brazing 46 Pb Lead S Sulphur Sb Antimony Si Silicon Sn Tin Te Tellurium Zn Zinc Zr Zirconium 2 | KUPFERINSTITUT.DE KUPFERINSTITUT.DE | 3 1. Introduction Copper is a material that has been used by man for thousands of years because of its Chemical and metallurgical Physical special properties. As a native metal, i.e. one that is also found naturally in its pure me- properties properties Mechanical properties tallic form, copper was used early in human history because of its good malleability and · Chemical composition · Wettability · Strength and formability formability and because of its colour. Copper thus became man’s first working metal. · Oxidation behaviour · Solidus temperature · Residual stresses · Corrosion behaviour · Thermal expansion · Diffusion and solubility characteristics · Thermal conductivity, · Ability to undergo precipitation heat treatment specific heat capacity · Microstructure With increasing industrialisation, other technique to be used, the choice of filler This booklet aims to reflect the current properties of copper became important, material and any preparative or state of soldering and brazing copper and such as its excellent electrical and thermal after-treatment procedures, need to be copper alloys in industrial applications, but conductivity and its resistance to carefully selected on the basis of the does not claim to be complete. As research atmospheric corrosion, and its generally materials to be joined. The factors that and development work in this field is Material suitability for high resistance to chemical attack. influence the solderability or brazeability of continuing, enquiries should be directed to soldering/brazing Copper can form alloys with many a material are shown in figure 1 and need the German Copper Institute or corre- different metals and a large numbers of to be taken into account both individually sponding organisations. alloy systems are now available that enable and in combination. mechanical and technological properties, A component is considered solderable or such as hardness, tensile strength, yield brazeable if the parent material is suitable strength, chemical resistance, resistance to for soldering or brazing, and one or more Solderability or wear, to be modified in a controlled way. soldering or brazing techniques can be brazeability of a If their particular physical and mechanical applied, and if the parts to be joined are characteristics are taken into account, designed so as to facilitate the soldering/ workpiece copper and the majority of copper alloys brazing process and to ensure that the show a high degree of solderability or soldered/brazed part is safe under the brazeability. Fabrication process variables, conditions in which it is to be used [1]. such as the particular soldering or brazing Manufacturing suitability Design suitability for for soldering/brazing soldering/brazing · Dimensional stability of the parts to be joined · Location of soldering/brazing seam or zone · Condition of surfaces · Cross-sectional ratios · Surface coating · Notch effect · Shape and size of the assembly gap or · Seam irregularities the gap/joint to soldered or brazed · Static or dynamic loads · Stresses in the region of the soldered/brazed joint · Location of inserted solder/filler metal and air vents · Loading rate · Fastening of parts to be joined · Loading temperature · Solder or brazing filler metal · Load-transfer medium · Materials and methods of oxide removal · Soldering or brazing cycle · Soldering/brazing rate · Post annealing treatment · Joint clean-up · Joint testing Figure 1 – Definition of solderability/brazeability (see [2]) 4 | KUPFERINSTITUT.DE KUPFERINSTITUT.DE | 5 Like welding, soldering and brazing are Soldering and brazing do not involve any The following points should, however, be Both physical and chemical processes are Heat is applied to melt the filler metal and σ important methods of thermally joining melting of the parent material, i.e. of the noted: the strength of a soldered or brazed involved in soldering/brazing. Soldering/ any flux being used. The method used to 1,2 1 materials, typically metals. As it is the surfaces to be joined. Instead, the joint is typically not as great as that of the brazing joints are created through surface heat the parts to be joined will depend on resulting joint – irrespective of the method workpieces are joined by introducing an parent material; the parent metal and the chemical reactions and diffusional processes the type of join to be created (see ϑ σ1,3 σ2,3 2 used to make it – that ultimately deter- additional molten metal, the ‘filler metal’, solder/braze metal have different chemical of the liquid filler metal and the solid parent Section 4.3). Fluxes serve to activate the mines the properties of the part being possibly in combination with a flux and/or potentials; there is a risk of chemical material. The soldering/brazing mechanism surfaces to be joined. The molten filler fabricated, the two methods are classified in a protective gas atmosphere [4]. corrosion due to the presence of flux comprises the following steps: [7] metal will only be able to wet the surfaces 3 (see e.g. [3]) in terms of the chemical residues; design restrictions may be 1. Heating of the parts to be joined to be joined if they are clean and free from nature of the joint, the chemical composi- Some of the advantages of soldering or relevant because of factors such as narrow oil, grease and other surface deposits. The 2. Surface activation, e.g. by a flux or a tion of the parent metal (or metals) and brazing compared to other joining soldering/brazing gaps and tight dimen- wetting process is also influenced by 1 Surrounding vapour phase the type of filler material used, if any. Both methods are: [5] sional tolerances at the joint. Extensive shielding gas capillary action of the molten filler, 2 Molten filler welding and soldering/brazing lead to the preparatory and after-treatment proce- 3. Flow of filler metal and wetting – the adhesion and diffusion processes between 3 Parent material · soldering/brazing enables dissimilar ϑ Contact angle molten filler metal flows into the gap formation of a metallic joint, however the materials to be joined; dures are often required, such as degreas- the liquid phase and the parent material. chemical composition of these joints differ. ing, etching, removal of flux residues, etc. [6]. between the mating surfaces or spreads figure 3 shows the wetting of the surface σ1,2 Surface tension between molten filler and the Whereas a welded joint has the same · as less heat is applied in the joining The related joining techniques of soldering across the surface by the molten filler metal. The contact surrounding atmosphere process, soldered or brazed parts tend σ1,3 Surface tension between the solid base metal and chemical composition as that of the two and brazing are distinguished in the 4. Formation of the solder/braze metal angle ϑ is determined by the interaction to exhibit greater dimensional accuracy the surrounding atmosphere identical parent metals being joined, the DIN ISO 857-2 standard by the liquidus through (physical and chemical) inter- between the three surface tensions σ and less distortion; 2,3 Surface tension between molten filler and solid use of a filler alloy in a soldering or brazing temperature of the filler metal used. In action between the molten filler and involved in the wetting process: σ1,2 base metal procedure means that the soldered or · multiple soldered/brazed joints can soldering, the liquidus temperature of the the parent material (vapour-liquid surface tension), σ1,3 brazed joint has a different chemical be created on a single workpiece in a filler metal is below 450 °C; in brazing it is (vapour-solid surface tension) and σ2,3 Figure 3 - Wetting of a metallic surface with a 5.
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