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Ainodic Bonding Date: 23/04/2005 AINODIC BONDING •mm«t«r 774O fllaas waf «r slllcon w*f»r DATE: 23/04/2005 AUTHORS: Jun Shen Yanfei Van SUPERVISOR: RSillen Bachelor of Science in Engineering Product Design This thesi presentes si bacheloe th r dfo r Degre Sciencf eo : eat Hogeschool Van Utrecht Facult Sciencf yo Technologd ean y Industrial Technology Mediatheek HvU l $Ctf. ipfói <p)'2e>o i tt HOGESCHOOL VAN UTRECHT 4/28/2005________________________ l l l j| Acknowledgements i Firstly gratefue Honder. ar e Mr ,w o t l s makinr fo g thi l s project possibl givd eean • us the good time to practice in our school. Then we are specially to thank Mr. • suppore Silleth r nfo t give guidind nan s gu | through all the steps of this project. l I 1 l l I Final Project Anodic Bonding l l l i l HOGESCHOOL VAN UTRECHT 4/28/2005 l l INDEX i ABSTRACT.............................................................................................................................................................^ INTRODUCTION ....................................................................................................................................................5 CHARTER 1 BONDING..........................................................................................................................................^ l 1.1 Direct bonding {3}.....................................................................................................................................6 1.1.1 Fusion bonding .................................................................................................................................7 1.1.2 Mechanicalfasteningbonding{4}....................................................................................................7 i 1.2 Intermediate layers {5}.............................................................................................................................8 1.2.1 Glassfrit bonding..............................................................................................................................8 1.2.2 Thermocompression bonding.........................................................................................................9 1.2.3 Solder bonding..................................................................................................................................9 l 1.2.4 Adhesive bonding.............................................................................................................................9 1.2.5 Eutectic Bonding.............................................................................................................................10 1.3 Anodic bonding......................................................................................................................................0 .1 i CHARTE ANODIE TH R2 C BONDING PROCESS.............................................................................................15 2.1 SK3I888 {7} ............................................................................................................................... 2.2 Glass-Glass {8}....................................................................................................................................... 16 i 2.3 Glaas-Metal {9}....................................................................................................................................... 17 CHARTER 3 PHYSICAL PARAMETERS OF ANODIC BONDING PROCESS AND RESULTING EFFECT............................................................................................................................................18 i 3.1 Physical parameters of anodic bonding process.................................................................................. 18 3.1.1 Pressure {6}.....................................................................................................................................19 3.1.2 Vacuüm {6}.....................................................,............................................................................... 19 3.1.3 Voltage &temperature {9}..............................................................................................................20 i 3.1.4 Flatness & roughness {10}.............................................................................................................22 3.1.5 Current {9}.......................................................................................................................................23 3.1.6 Polarity {10}.....................................................................................................................................25 i 3.2 Resulting effect.......................................................................................................................................27 3.2.1 Bond strength {9}............................................................................................................................ 27 3.2.2 Thermal residual stress..................................................................................................................29 l CHARTE RMATERIAL4 BONDINF SO G ...........................................................................................................30 4.1 Glass-Glass{12}.....................................................................................................................................30 4.2 Glass-Metal {13}.....................................................................................................................................31 4.2.1 Pyre Foturad xan n square chips...................................................................................................2 .3 t 4.2.2 Polished Invar, Kovar and Alloy 42...............................................................................................33 4.2.3 Anodically bond glasses to titanium {14} ......................................................................................33 4.3 Silicon and glass....................................................................................................................................4 .3 i 4.3.1 Silico glasd nan s (Pyrex7740) {15} ..............................................................................................34 4.3.2 The sodium-borosilicate glass Tempax (Schott # 8330, almost identical to Pyrex, Corning # 7740) {15}......................................................................................................................................34 4.4 Stoichiometric silicon nitrid glaseo t s (Schott 8330) {16}....................................................................4 .3 i 4.5 Intermediate laye anodin ri c bonding ...................................................................................................35 i i Final Project Anodic Bonding i l l l HOGESCHOOL VAN UTRECHT 4/28/2005 4.5.1 Silicon wafer have been anodically bonded to sputtered lithium borosilicate glass layers (Itb 1060) on Silicon {16}...................................................................................................................... 35 t 4.5.2 Silicon to silicon anodic bonding process using a glass layer deposited by electron beam evaporation {16} ......................................................................................................................... ....36 4.5.3 Bonding lead zirconate titanate (PZT) ceramics to silicon wafer {17}....................................... ..36 l CHAPTE RINDUSTRIA5 NON-INDUSTRIAL& L MACHINE............................................................................40 5.1 Industrial machine.. ..................................... ....... .............................................................................. ....... 40 5.1.1 AML-WB04bonder.........................................................................................................................40 5.1.2 SB6/8e Substrate Bonder. ....... ............. ....... ................................................ ....... ............. ....... ......1 .4 i 5.1.3 SWS-100IRV/IRT bonder.. ................................................................................. ............. ....... ......1 .4 5.1.4 EVG501 Wafer Bonder...... ......................................................... ................................................... 41 5.2 Non-industrial machine..... ................... ....... ....... ............. ....... ....... ....... ....... ............. ....... ....... ....... ....... ...41 i 5.2.1 The table of non-industrial machine ..............................................................................................41 5.3 Defmin problee gth m ......................................... ........................................................... .......................... 42 CHAPTER 6 DESIGN OF UTRECHT ANODIC BONDING APPARATUS .......................................................45 i 6.1 Quality table ................................................ ....... ............................................... ....... ....... ........ ............ ....45 6.1.1 Interaction table .............................................................................................................................. 45 6.1 .2 Analysis of the relationship between EC (Engineering Characteristics) and Components of the product.. ....... ..................................................................................................................................... 46 i 6.2 Power supply and hotplate..... .............. ............. ..................................................................................
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