CPU Benchmarks - List of Benchmarked Cpus
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A Superscalar Out-Of-Order X86 Soft Processor for FPGA
A Superscalar Out-of-Order x86 Soft Processor for FPGA Henry Wong University of Toronto, Intel [email protected] June 5, 2019 Stanford University EE380 1 Hi! ● CPU architect, Intel Hillsboro ● Ph.D., University of Toronto ● Today: x86 OoO processor for FPGA (Ph.D. work) – Motivation – High-level design and results – Microarchitecture details and some circuits 2 FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT6-LUT 6-LUT6-LUT 3 6-LUT 6-LUT FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT 6-LUT 6-LUT 6-LUT 4 6-LUT 6-LUT FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 5 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 6 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel -
SIMD Extensions
SIMD Extensions PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 12 May 2012 17:14:46 UTC Contents Articles SIMD 1 MMX (instruction set) 6 3DNow! 8 Streaming SIMD Extensions 12 SSE2 16 SSE3 18 SSSE3 20 SSE4 22 SSE5 26 Advanced Vector Extensions 28 CVT16 instruction set 31 XOP instruction set 31 References Article Sources and Contributors 33 Image Sources, Licenses and Contributors 34 Article Licenses License 35 SIMD 1 SIMD Single instruction Multiple instruction Single data SISD MISD Multiple data SIMD MIMD Single instruction, multiple data (SIMD), is a class of parallel computers in Flynn's taxonomy. It describes computers with multiple processing elements that perform the same operation on multiple data simultaneously. Thus, such machines exploit data level parallelism. History The first use of SIMD instructions was in vector supercomputers of the early 1970s such as the CDC Star-100 and the Texas Instruments ASC, which could operate on a vector of data with a single instruction. Vector processing was especially popularized by Cray in the 1970s and 1980s. Vector-processing architectures are now considered separate from SIMD machines, based on the fact that vector machines processed the vectors one word at a time through pipelined processors (though still based on a single instruction), whereas modern SIMD machines process all elements of the vector simultaneously.[1] The first era of modern SIMD machines was characterized by massively parallel processing-style supercomputers such as the Thinking Machines CM-1 and CM-2. These machines had many limited-functionality processors that would work in parallel. -
Operating Guide
Operating Guide EPIA-P830 Mainboard EPIA-P830 Operating Guide Table of Contents Table of Contents .......................................................................................................................................................................................... i VIA EPIA-P830 overview.............................................................................................................................................................................1 VIA EPIA-P830 layout ..................................................................................................................................................................................2 VIA EPIA-P830 specifications ...................................................................................................................................................................3 VIA EPIA-P830 processor SKUs ...............................................................................................................................................................4 VIA VX900 chipset overview.....................................................................................................................................................................5 VIA EPIA-P830 and P830-A board dimensions.................................................................................................................................6 VIA P830-B board dimensions.................................................................................................................................................................7 -
5G: Perspectives from a Chipmaker 5G Electronic Workshop, LETI Innovation Days – June 2019
5G: Perspectives from a Chipmaker 5G electronic workshop, LETI Innovation Days – June 2019 Guillaume Vivier Sequans communications 1 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 MKT-FM-002-R15 Outline • Context, background, market • 5G chipmaker: process technology thoughts and challenges • Conclusion 2 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 5G overall landscape • 3GPP standardization started in Sep 2015 – 5G is wider than RAN (includes new core) – Rel. 15 completed in Dec 2018. ASN1 freeze for 4G-5G migration options in June 19 – Rel. 16 on-going, to be completed in Dec 2019 (June 2020) • Trials and more into 201 operators, 80+ countries (source GSA) • Commercial deployments announced in – Korea, USA, China, Australia, UAE 3 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 Ericsson Mobility Report Nov 2018 • “In 2024, we project that 5G will reach 40 percent population coverage and 1.5 billion subscriptions“ • Interestingly, the report highlights the fact that IoT will continue to grow, beyond LWPA, leveraging higher capability of LTE and 5G 4 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 5G overall landscape • eMBB: smartphone and FWA market – Main focus so far from the ecosystem • URLLC: the next wave – Verticals: Industry 4.0, gaming, media Private LTE/5G deployment, … – V2X and connected car • mMTC: – LPWA type of communication is served by cat-M and NB-IoT – 5G opens the door to new IoT cases not served by LPWA, • Example surveillance camera with image processing on the device • Flexibility is key – From Network side, NVF, SDN, Slicing, etc. -
Apparecchiature Medicali: Il Ruolo Delle Nanotecnologie
EO Medical APPAreCCHIAture MeDICALI: IL ruoLo DeLLe NANoteCNoLoGIe IN queSto NuMero III Mercati/Attualità VIII Stanford, in fase di sviluppo una ‘pelle elettronica’ X Dialisi direttamente a casa XII Affrontare richieste ad alte prestazioni per la visualizzazione di immagini mediche XIV Criteri di scelta per alimentatori conformi a Iec60601-1 3a edizione XVII News Foto: Future Electronics Murata MEMS Solutions for Medical and Healthcare Enabling MEMS Sensing Improved Care Elements (Dies) SCG12S and SCG14S In medical and healthcare applications Vertical Accelerometer Elements (Dies) Murata’s medical MEMS sensors enable • Size 3mm x 2.12mm x 1.95 or 1.25mm • Various measuring ranges possible (1 - 12g) improved care and a better quality of life • Proven capacitive 3D-MEMS Technology for patients and elderly people. Medical sensors increase the intelligence of life supporting SCG10X and SCG10Z Horizontal Accelerometer Elements (Dies) transplants, and they can be used in new types of patient • Size SCG10X: 2.55mm x 2.95mm x 1.91mm monitoring applications that allow patients to lead more • Size SCG10Z: 1.50mm x 1.70mm x 1.83mm independent lives. Detecting signals triggered by symptoms • Various measuring ranges possible (1 - 12g) • Proven capacitive 3D-MEMS Technology helps optimize medication and prevent serious attacks of illness. Murata’s unique MEMS design, which combines single SCB10H crystal silicon and glass, ensures exceptional reliability, Pressure Sensor Elements (Dies) unprecedented accuracy and excellent stability over time. The • Size 1.4mm x 1.4mm x 0.85mm • High pressure shock survival (> 200 bar) power requirements of these medical sensors are extremely • Various pressure ranges possible (1.2 - 25 bar) low, which gives them a significant advantage in small • Proven capacitive 3D-MEMS technology battery-operated devices. -
Professor Won Woo Ro, School of Electrical and Electronic Engineering Yonsei University the Intel® 4004 Microprocessor, Introdu
Professor Won Woo Ro, School of Electrical and Electronic Engineering Yonsei University The 1st Microprocessor The Intel® 4004 microprocessor, introduced in November 1971 An electronics revolution that changed our world. There were no customer‐ programmable microprocessors on the market before the 4004. It propelled software into the limelight as a key player in the world of digital electronics design. 4004 Microprocessor Display at New Intel Museum A Japanese calculator maker (Busicom) asked to design: A set of 12 custom logic chips for a line of programmable calculators. Marcian E. "Ted" Hoff Recognized the integrated circuit technology (of the day) had advanced enough to build a single chip, general purpose computer. Federico Faggin to turn Hoff's vision into a silicon reality. (In less than one year, Faggin and his team delivered the 4004, which was introduced in November, 1971.) The world's first microprocessor application was this Busicom calculator. (sold about 100,000 calculators.) Measuring 1/8 inch wide by 1/6 inch long, consisting of 2,300 transistors, Intel’s 4004 microprocessor had as much computing power as the first electronic computer, ENIAC. 2 inch 4004 and 12 inch Core™2 Duo wafer ENIAC, built in 1946, filled 3000‐cubic‐ feet of space and contained 18,000 vacuum tubes. The 4004 microprocessor could execute 60,000 operations per second Running frequency: 108 KHz Founders wanted to name their new company Moore Noyce. However the name sounds very much similar to “more noise”. "Only the paranoid survive". Moore received a B.S. degree in Chemistry from the University of California, Berkeley in 1950 and a Ph.D. -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References ............................................. -
EDIT THIS 2021 ISRI 1201 Post-Hearing Letter 050621
Juelsgaard Intellectual Property and Innovation Clinic Mills Legal Clinic Stanford Law School Crown Quadrangle May 7, 2021 559 Nathan Abbott Way Stanford, CA 94305-8610 [email protected] Regan Smith 650.724.1900 Mark Gray United States Copyright Office [email protected] [email protected] Re: Docket No. 2020-11 Exemptions to Prohibition Against Circumvention of Technological Measures Protecting Copyrighted Works Dear Ms. Smith and Mr. Gray: I write to respond to your April 27 post-hearing letter requesting the materials that I referenced during the April 21 hearing related to Proposed Class 10 (Computer Programs – Unlocking) that were not included in our written comments. In particular, I cited to three reports from the Global mobile Suppliers Association (“GSA”) to illustrate the rapid increase in cellular-enabled devices with 5G capabilities in the last three years. In March 2019, GSA had identified 33 announced 5G devices from 23 vendors in 7 different form factors.1 By March 2020, GSA had identified 253 announced 5G devices from 81 vendors in 16 different form factors, including the first 5G-enabled laptops, TVs, and tablets.2 And by April 2021, GSA had identified 703 announced 5G devices from 122 vendors in 22 different form factors.3 It should be noted that some of the 22 form factors, such as 5G modules,4 can be deployed across a wide range of use cases that are not directly tracked by the GSA reports.5 For example, one distributor of Quectel’s 5G modules described the target applications as including: Telematics & transport – vehicle tracking, asset tracking, fleet management Energy – electricity meters, gas/water meter, smart grid Payment – wireless pos [point of service], cash register, ATM, vending machine Security – surveillance, detectors Smart city – street lighting, smart parking, sharing economy Gateway – consumer/industrial router 1 GSA, 5G Device Ecosystem (Mar. -
5G, Lte & Iot Components Vendors Profiled (28)
5G, LTE & IOT COMPONENTS VENDORS PROFILED (28) Altair Semiconductor Ltd., a subsidiary of Sony Corp. / www.altair-semi.com Analog Devices Inc. (NYSE: ADI) / www.analog.com ARM Ltd., a subsidiary of SoftBank Group Corp. / www.arm.com Blu Wireless Technology Ltd. / www.bluwirelesstechnology.com Broadcom Corp. (Nasdaq: BRCM) / www.broadcom.com Cadence Design Systems Inc. / www.cadence.com Ceva Inc. (Nasdaq: CEVA) / www.ceva-dsp.com eASIC Corp. / www.easic.com GCT Semiconductor Inc. / www.gctsemi.com HiSilicon Technologies Co. Ltd. / www.hisilicon.com Integrated Device Technology Inc. (Nasdaq: IDTI) / www.idt.com Intel Corp. (Nasdaq: INTC) / www.intel.com Lime Microsystems Ltd. / www.limemicro.com Marvell Technology Group Ltd. (Nasdaq: MRVL) / www.marvell.com MediaTek Inc. / www.mediatek.com Microsemi Corp., a subsidiary of Microchip Technology Inc. (Nasdaq: MCHP) / www.microsemi.com MIPS, an IP licensing business unit of Wave Computing Inc. / www.mips.com Nordic Semiconductor ASA (OSX: NOD) / www.nordicsemi.com NXP Semiconductors N.V. (Nasdaq: NXPI) / www.nxp.com Octasic Inc. / www.octasic.com Peraso Technologies Inc. / www.perasotech.com Qualcomm Inc. (Nasdaq: QCOM) / www.qualcomm.com Samsung Electronics Co. Ltd. (005930:KS) / www.samsung.com Sanechips Technology Co. Ltd., a subsidiary of ZTE Corp. (SHE: 000063) / www.sanechips.com.cn Sequans Communications S.A. (NYSE: SQNS) / www.sequans.com Texas Instruments Inc. (NYSE: TXN) / www.ti.com Unisoc Communications Inc., a subsidiary of Tsinghua Unigroup Ltd. / www.unisoc.com Xilinx Inc. (Nasdaq: XLNX) / www.xilinx.com © HEAVY READING | AUGUST 2018 | 5G/LTE BASE STATION, RRH, CPE & IOT COMPONENTS . -
Communication Theory II
Microprocessor (COM 9323) Lecture 2: Review on Intel Family Ahmed Elnakib, PhD Assistant Professor, Mansoura University, Egypt Feb 17th, 2016 1 Text Book/References Textbook: 1. The Intel Microprocessors, Architecture, Programming and Interfacing, 8th edition, Barry B. Brey, Prentice Hall, 2009 2. Assembly Language for x86 processors, 6th edition, K. R. Irvine, Prentice Hall, 2011 References: 1. Computer Architecture: A Quantitative Approach, 5th edition, J. Hennessy, D. Patterson, Elsevier, 2012. 2. The 80x86 Family, Design, Programming and Interfacing, 3rd edition, Prentice Hall, 2002 3. The 80x86 IBM PC and Compatible Computers, Assembly Language, Design, and Interfacing, 4th edition, M.A. Mazidi and J.G. Mazidi, Prentice Hall, 2003 2 Lecture Objectives 1. Provide an overview of the various 80X86 and Pentium family members 2. Define the contents of the memory system in the personal computer 3. Convert between binary, decimal, and hexadecimal numbers 4. Differentiate and represent numeric and alphabetic information as integers, floating-point, BCD, and ASCII data 5. Understand basic computer terminology (bit, byte, data, real memory system, protected mode memory system, Windows, DOS, I/O) 3 Brief History of the Computers o1946 The first generation of Computer ENIAC (Electrical and Numerical Integrator and Calculator) was started to be used based on the vacuum tube technology, University of Pennsylvania o1970s entire CPU was put in a single chip. (1971 the first microprocessor of Intel 4004 (4-bit data bus and 2300 transistors and 45 instructions) 4 Brief History of the Computers (cont’d) oLate 1970s Intel 8080/85 appeared with 8-bit data bus and 16-bit address bus and used from traffic light controllers to homemade computers (8085: 246 instruction set, RISC*) o1981 First PC was introduced by IBM with Intel 8088 (CISC**: over 20,000 instructions) microprocessor oMotorola emerged with 6800. -
956830 Deliverable D2.1 Initial Vision and Requirement Report
European Core Technologies for future connectivity systems and components Call/Topic: H2020 ICT-42-2020 Grant Agreement Number: 956830 Deliverable D2.1 Initial vision and requirement report Deliverable type: Report WP number and title: WP2 (Strategy, vision, and requirements) Dissemination level: Public Due date: 31.12.2020 Lead beneficiary: EAB Lead author(s): Fredrik Tillman (EAB), Björn Ekelund (EAB) Contributing partners: Yaning Zou (TUD), Uta Schneider (TUD), Alexandros Kaloxylos (5G IA), Patrick Cogez (AENEAS), Mohand Achouche (IIIV/Nokia), Werner Mohr (IIIV/Nokia), Frank Hofmann (BOSCH), Didier Belot (CEA), Jochen Koszescha (IFAG), Jacques Magen (AUS), Piet Wambacq (IMEC), Björn Debaillie (IMEC), Patrick Pype (NXP), Frederic Gianesello (ST), Raphael Bingert (ST) Reviewers: Mohand Achouche (IIIV/Nokia), Jacques Magen (AUS), Yaning Zou (TUD), Alexandros Kaloxylos (5G IA), Frank Hofmann (BOSCH), Piet Wambacq (IMEC), Patrick Cogez (AENEAS) D 2.1 – Initial vision and requirement report Document History Version Date Author/Editor Description 0.1 05.11.2020 Fredrik Tillman (EAB) Outline and contributors 0.2 19.11.2020 All contributors First complete draft 0.3 18.12.2020 All contributors Second complete draft 0.4 21.12.2020 Björn Ekelund Third complete draft 1.0 21.12.2020 Fredrik Tillman (EAB) Final version List of Abbreviations Abbreviation Denotation 5G 5th Generation of wireless communication 5G PPP The 5G infrastructure Public Private Partnership 6G 6th Generation of wireless communication AI Artificial Intelligence ASIC Application -
Evolution Des X86befehlssatzes Und Seiner Erweiterungen
Technische Universität Dresden Evolution des x86-Befehlssatzes und seiner Erweiterungen Peter Ebert Dresden, 15.07.2009 Einführung · Überblick & Historie · Konkurrierende Befehlssatzarchitekture n · Befehlsarten · Registerstruktur · x87 15.07.2009 Evolution des x86-Befehlssatzes und seiner Erweiterungen 2/24 Übersicht & Historie · IBM 1981: erster PC · x86-Architektur verwendet einen CISC-Befehlssatz · alle Prozessoren seit dem Pentium Pro sind aber hybride CISC/RISC-Prozessoren 1978 1. Gen.: 8086 1982 2. Gen.: 80286 1985 3. Gen.: 80386 IA-32 1989 4. Gen.: 80486 1993 5. Gen.: Pentium MMX 1995 6. Gen.: P2, P3 3DNow!, SSE 1999 7. Gen.: Athlon (XP), P4 SSE2 2003 8. Gen.: Opteron x86-64 15.07.2009 Evolution des x86-Befehlssatzes und seiner Erweiterungen 3/24 Konkurrierende Befehlssatzarchitekturen · ARM (Acorn Risc Machine) RISC-Architektur 1983 vom englischen Computerhersteller Acorn. Einsatz vor allem im eingebetteten Bereich z.B.: Mobiltelefonen, PDAs, Routern, iPod, iPhone, Internet Tablets von Nokia und den neueren PDAs von ASUS, Konsolen wie der Nintendo DS, der GP2X und die Pandora. · PowerPC (Performance optimization with enhanced RISC Performance Chip) 1991 durch ein Konsortium aus Apple, IBM und Motorola. z.B.: Nintendo GameCube und Wii, Xbox 360 von Microsoft, Playstation 3 von Sony und in vielen eingebetteten Systemen. Auch benutzen PKW und Produkte in der Luft- und Raumfahrt · SPARC (Scalable Processor ARChitecture) Von Sun Microsystems entwickelt ab 1985 und vermarktete ab 1987, offene Architektur, 1995 64-Bit-Erweiterung (UltraSparc) 15.07.2009 Evolution des x86-Befehlssatzes und seiner Erweiterungen 4/24 Befehlsarten · Transferbefehlen werden Daten innerhalb des Systems bewegt. Die Daten werden dabei nur kopiert, d. h. bleiben an ihrem Quellort unverändert.