EditorialIndex 2014 • Volume 57

n ANTENNAS Reid, Bill Zhang, Zhi-Hao, Lin Li, Li-Li Yang, Ting Lang and Kundtz, Nathan “Tips for Transitioning Designs to Manufacturing,” Xue Cao “Next Generation Communications for Next Genera- No. 3, p. 20. “A Wide Stopband Lowpass Filter with Three Trans- tion Satellites,” No. 8, p. 56. Wang, Zhancang mission Zeros,” No. 6, p. 96. Mobashsher, Ahmed Toaha and Rabah W. Aldhaheri “Envelope Tracking Power Amplifier Design,” No. 4, Zhu, Z.J., C.L. Wei and B.F. Jia “CPW-Fed Folded Antenna with Forward-Directed p. 20. “Third-Order Fully Canonical Microstrip Bandpass Radiation Patterns for Handheld Dual-Band RFID Yu, Ross Transversal Filter with Source-Load Coupling,” No. Reader Applications,” No. 2, p. 90. “Mesh Network Protocols for the Industrial Internet 2, p. 112. Pasian, Marco of Things,” No. 12, p. 38 n DEVICES “Flexible and Low Cost Hands-On Lab for Antennas n DESIGN and Propagation,” No. 6, p. 84. Bacon, Peter, Drew Fischer and Ruan Lourens Coonrod, John “Overview of RF Switch Technology and Applica- n CAD/CAM “The Impact of Electrical and Thermal Interactions tions,” No. 7, p. 76. Barchanski, Andreas, Jens Kramer and Pietro Luzzi on Microwave PCB Performance,” No. 2, p. 68. Bianchi, Giovanni, Fabrizio Gentili, Roberto “EMC Simulation in the Design Flow of Modern Coonrod, John Sorrentino, Laura Urbani and Luca Pelliccia Electronics,” No. 12, p. 88 “Selecting Circuit Materials for Microwave Power “PIN-Diode SPMT Switch with Single-Supply, TTL- Compatible Driver,” No. 6, p. 62. Campbell, Derek, Gopinath Gampala, Martin Vogel Amps,” No. 11, p. 100. and C.J. Reddy Cox III, Charles H. and Edward I. Ackerman Ebefors, Thorbjorn and Joachim Oberhammer “Simulating Antenna Measurements in an Anechoic “Maximizing RF Spectrum Utilization with Simulta- “Through-Silicon Vias and 3D Inductors for RF Ap- Chamber,” No. 7, p. 90. neous Transmit and Receive,” No. 9, p. 114. plications,” No. 2, p. 80. Hartung, Juergen Feng, X., Y.H. Zhang, W. Xue, H. Zhang and Y. Fan Ejeckam, Felix, Daniel Francis, Firooz Faili, Frank Lowe, John J. Wilman, Tim Mollart, Joe Dodson, “Interoperability Enables a Complete RFIC/Package “6 to 26 GHz Detectors for High Data Rate ASK Sig- Daniel J. Twitchen, Bruce Bolliger and Dubravko Board Co-Design Flow,” No. 7, p. 66. nal Demodulation,” No. 9, p. 138. Babic n COMPONENTS/SUBSYSTEMS Gao, Yongzhen, ZongXin Tang, Biao Zhang and “GaN-on-Diamond: The Next GaN,” No. 5, p. 124. YunQiu Wu Gheitanchi, Shahin, Christophe Quindroit, Patrick Abramzon, Igor and Vadim Tapkov “Ultra-Wideband Double Balanced Mixer Utilizing a Roblin, Naveen Naraharisetti, Volker Maurer and “OCXO Solutions Based in IHR Technology,” No. 4, Compact Planar Balun,” No. 5, p. 172. p. 96. Mike Fitton Gong, Jian-Qiang and Chang-Hong Liang “Algorithm Development Platform for Dual-Band Beltchicov, Sergey “A Compact Wideband Quadrature Hybrid Coupler,” Digital Pre-Distortion,” No. 5, p. 140. “A Low Phase Noise Octave-Band Synthesizer Using No. 8, p. 66. an X-Band Frequency Reference,” No. 5, p. 104. Pengelly, Raymond, Ryan Baker, Mattias Astrom and Guo, Benqing, Shiquan An and Guoning Yang Joel L. Dawson Chenakin, Alexander “Wideband Balun-LNA with Noise Cancellation in “GaN Devices and AMO Technology Enable High Ef- “Synthesizers: Looking Beyond the Basics,” No. 4, p. 0.13 µm CMOS,” No. 10, p. 98. ficiency and Wide Bandwidth,” No. 3, p. 66. 84. Kahng, Kyungseok, Sungtek Kahng, Inkyu Yang and Reyes, Steve n COVER FEATURES Qun Wu “Device Technology and VNA Architecture for Broad- A Bandwidth-Enlarged and Isolation-Enhanced ZOR Acar, Mustafa, Robin Wesson and Mark P. van der band Device Characterization,” No. 5, p. 114. MIMO Antenna, Shorter than 0.11␭g,” No. 9, p. 128. Heijden Warder, Phil and David Schnaufer “Class-E Package Based Chireix Outphasing Power Ke, Qiao and Tang Zongxi “Temperature-Compensated Filter Technologies Amplifier,” No. 4, p. 40. “Second Harmonic Tuning for a Broadband High Ef- Solve Crowded Spectrum Challenges,” No. 11, p. 90. ficiency GaN Power Amplifier,” No. 11, p. 112. Agilent Technologies, ANSYS, COMSOL, CST, Watkins, Gavin and Stephen Wang Delcross, NI/AWR and Sonnet Software Lang, Ting, Lin Li, Li-Li Yang and Zhi-Hao Zhang “The Impact of Power Amplifier Turn-On Character- “2014 Design Software Review: Interoperability,” No. “Design of a Compact Wideband Bandstop Filter with istics in Cognitive Radio Networks,” No. 3, p. 86. 7, p. 22. Three Transmission Zeros,” No. 5, p. 182. n EUROPEAN MICROWAVES CONFERENCE Carlson, Doug Liu, Haiwen, Yan Wang, Jiuhuai Lei, Shen Li and “Commercialization of GaN,” No. 6, p. 34. Xiaomei Wang Mumford, Richard “Tri-Band Bandpass Filter Using Quad-Mode Stub- “Attending European Microwave Week 2014,” No. 9, Chandler, Joe and R. William Steagall Loaded Resonator,” No. 8, p. 76. p. 68. “DARPA’s Mobile Hotspots Program Drives E-Band Performance Benchmarks,” No. 10, p. 22. Lv, Zheng Liang, Shuxi Gong, Shiwei Zhao and Xiang Mumford, Richard Zhang “The 2014 EuMW Defence, Security and Space Fo- Corman, David, Peter Moosbrugger and Gabriel “A Tunable Dual-Band 6 Bit Digital Phase Shifter Us- rum,” No. 9, p. 78. Rebeiz ing DGS and Stubs,” No. 4, p. 102. “The Industry’s Next Tipping Point,” No. 5, p. 26. Sorrentino, Roberto and Ivar Bazzy Morley, Stephen “Welcome to European Microwave Week 2014,” No. Devlin, Liam “Designing Multiconductor RF Backplane Connec- 9, p. 64. “The Future of mm-wave Packaging,” No. 2, p. 24. tors for Embedded Computing,” No. 10, p. 86. Farr, David and Bill Henderson n INSTRUMENTS/MEASUREMENTS Palandoken, M. and A. Sondas “Antenna Design Challenges for Next Generation Sat- “Compact Metamaterial Based Bandstop Filter,” No. Aleiner, Boris ellites,” No. 8, p. 24. 10, p. 76. “ZigBee RF Power Measurements in the Field,” No. Guerci, J.R., T. Driscoll, R. Hannigan, S. Ebad, C. 5, p. 200. Park, Nam-Shin, Don-Yong Lee, Byung-Chul Kim, Tegreene and D.E. Smith Jung-Hee Won, In-Ho Na, Geon-Ho Jang, Young-Ho Hall, David, Haydn Nelson and Guillaume Pailloncy “Next Generation Affordable Smart Antennas,” No. Cho, Xu-Guang Wang and Sang-Won Yun “Key Test Requirements of Modern Handset Power 1, p. 24. “Triple-Mode Filter Using a Spherical Dielectric Res- Amplifiers,” No. 6, p. 70. Holmes, Damon onator and Coupling Structures,” No. 5, p. 150. Loberg, Chris “Asymmetric Doherty Power Amplifier Design,” No. Su, Chengjie, ZongXi Tang, Biao Zhang and YunQiu “Generating Radar Signals with an Arbitrary Wave- 4, p. 32. Wu form Generator,” No. 1, p. 66. Howett, David, Michael P. Busse, David Rawlinson, “A Low Phase Noise Oscillator Based on an Active Martens, Jon, Jeffrey Hesler and Alex Arsenovic Jeff Burkett, Tim Dolan, Rafi Hershtig and Douglas Substrate Integrated Waveguide Resonator,” No. 11, “Quasi-Optical Techniques for Measuring Material King p. 120. Properties In the THz Region,” No. 3, p. 76. “Recent Market Driven Filter Advances,” No. 11, Tornatta, Paul p. 24. Patton, Ruska “A Method to Design an Aperture-Tuned Antenna “A Very-Near-Field Measurement Technique to Test Montiel-Sanchez, Ignacio Using a MEMS Digital Variable Capacitor,” No. 1, Large Antennas in the Lab,” No. 1, p. 116. “European RF Defence Sensors Systems Challenges p. 102. and Innovation,” No. 9, p. 24. Penso, Vitali Xie, Linli, Yong Hong Zhang and Yong Fan “Noise on Vcc for Serial Data Communications,” No. Ouzillou, Mendy “W-Band Radiometer Front End Module for Real- 6, p. 100. “Winning Design Strategies for Wireless Wearables,” Time Imaging,” No. 1, p. 80. No. 12, p. 26 Rodriguez, V., S. Matitsine, T.T. Chia, P. Lagoiski, L. Yun, Young, Jang-Hyeon Jeong, Hong-Seung Kim Matytsine and M. Matytsine Pengelly, Ray and Nak-Won Jang “Extending the Quiet Zone Using an RF Lens on a “Asymmetric Multilevel Outphasing Power Amplifier “A Miniaturized Impedance Transformer on PES for Conical Tapered Chamber to 18 GHz,” No. 10, p. 108. Design,” No. 4, p. 46. Flexible RFICs,” No. 2, p. 100. Shakhtour, Hammam, Dirk Heberling, Karam Pilgrim, Duncan Zhan, Xiaowu, Zongxi Tang, Yunqiu Wu and Biao Noujeim, Ferdinand Gerhardes and Peter Knott “Reconfigurable CMOS RF Front End,” No. 6, p. 22. Zhang “Measurement of an Active Radar Module in a Com- “Substrate Integrated Waveguide Dual-Mode, Dual- Band Filter,” No. 3, p. 94. EditorialIndex 2014 • Volume 57

pact Antenna Test Range,” No. 10, p. 64. 3, p. 32. blies,” No. 9, p. 180. Vinther, Gordon Broadband Wireless Microwave Vision Group (MVG) “TDR, Meeting Specifications Versus Good Transmis- “1805 to 1880 MHZ, 200 W Amplifier,” No. 4, p. 122. “Compact and Portable Antenna Measurement Tool,” sion Line Performance,” No. 5, p. 194. No. 9, p. 172. BSC Filters Ltd. Whitacre, Jan “Compact Waveguide-to-Coaxial Transition,” No. 8, Mini-Circuits “Toward 5G: What’s Changing and How to Address p. 60. “40 GHz Fixed Attenuators,” No. 5, p. 224. Design and Test Challenges?,” No. 5, p. 94 CIREXX International Mini-Circuits Williams, Tudor, Randeep Saini, Simon Mathias and “PCB Embedded Cooling Layer Interactive Power “DC to 12 GHz, 1 W SMA Fixed Attenuators,” No. Andreas Henkel System,” No. 8, p. 62. 7, p. 112. “Nonlinear Devices: Optimal Route from Test Bench Copper Mountain Technologies Mini-Circuits to Market,” No. 10, p. 128. “Low Cost, Fully Programmable 4-Port VNA,” No. 1, “700 to 2700 MHz Rack Mount 100 W Amplifier,” No. n MTT-S CONFERENCE p. 134. 9, p. 178. Narda Safety Test Solutions Dunleavy, Larry Crane Aerospace & Electronics Microwave Solutions “Interference and Direction Analyzer,” No. 7, p. 106. “Come Power the Waves with Us at IMS 2014,” No. “Ku-Band Iso-Divider,” No. 6, p. 114. 5, p. 50. CST-Computer Simulation Technology National Instruments “Wireless Prototyping with Software Defined Radio,” Hess, Sherry “CST STUDIO SUITE 2014: EM Simulation for Inte- No. 5, p. 208. “Tune in to Social Media at IMS 2014,” No. 5, p. 64. grated Design,” No. 2, p. 120. National Instruments Hindle, Patrick Custom Microwave Components Inc. “765 MHz BW PXI Signal Analyzer,” No. 10, p. 34. “Tampa Bay Attractions,” No. 5, p. 66. “24 × 12 Solid-State Non-Blocking Switch Matrix and GUI,” No. 8, p. 120. National Instruments Hindle, Patrick “Design Flow that Revolutionizes SDR,” No. 12, p. 48 “Mergers and Collaborations Dominate Landscape at Dow-Key Microwave IMS 2014,” No. 8, p. 92. “SP6T Coaxial Switch,” No. 12, p. 106 Norden Millimeter “9.5 to 12.5 GHz Down Converter,” No. 5, p. 228. Kushner, Lawrence, Bertan Bakkaloglu and Albert EM Software & Systems - S.A. (Pty.) Ltd. Wang “FEKO: The Power of Multiple Solvers,” No. 4, p. Pasternack Enterprises “RFIC 2014 Welcome Message,” No. 5, p. 52. 116. “9 kHz to 18 GHz Low Noise Amplifiers,” No. 7, p. 112. Pengelly, Ray Exodus Advanced Communications Pasternack Enterprises “WAMICON 2014 General Chair’s Message,” No. 5, “1 to 6 GHz, 50 W SSPA,” No. 8, p. 64. “Low PIM Cable Jumpers,” No. 10, p. 156. p. 62. FIRST RF Corp. Pasternack Enterprises Sayed, Mohamed “Low Cost X-Band Phased Array Weather Radar,” No. “Development System for 60 GHz Radio Links,” No. “Microwave Measurements for Emerging Technolo- 1, p. 138. 12, p. 100 gies,” No. 5, p. 58. Freescale Semiconductor Inc. Per Vices Vye, David “Flexible Device Lineups for TD-LTE and FDD- “DC to 6 GHz SDR,” No. 11, p. 48. LTE,” No. 4, p. 110. “Let the Sunshine In,” No. 5, p. 24. Phase Matrix Holzworth Instrumentation “Smaller, Faster, Cheaper Synthesizers,” No. 2, p. 40. n OPINION “High Spectral Purity Synthesizer,” No. 9, p. 182. Pico Technology Fields, Glen HUBER + SUHNER AG “Four-Channel 20 GHz Sampling Oscilloscope,” No. “Phased Array Radar at the Intersection of Military “Compact and Reliable 4.3-10 Connector,” No. 3, 10, p. 158. and Commercial Innovation,” No. 1, p. 42. p. 40. QRC Technologies Hindle, Patrick HYPERLABS “Transcorder Records 80 MHz Bandwidth Between “Merger Movement in 2014,” No. 12, p. 20 “5 MHz to 40 GHz Balun,” No. 11, p. 138. 50 MHz and 6 GHz,” No. 11, p. 44. Silvius, David IMST GmbH Rohde & Schwarz “For Better SWaP, Choose GaN,” No. 2, p. 44. “3D EM Solver,” No. 7, p. 102. “Vector Network Analysis with Up to 48 Ports,” No. n PRODUCT FEATURES Infineon Technology AG 3, p. 120. “Single-Chip 24 GHz Radar Front End,” No. 2, Rohde & Schwarz Aeroflex/Weinschel p. 126. “Easy and Powerful Oscilloscopes,” No. 6, p. 106. “The Next Evolution of Digital/Programmable At- tenuation,” No. 1, p. 126. Keysight Technologies Inc. SAF Tehnika JSC “Wireless Test Sets for 4G and Beyond,” No. 3, p. 104. Aethercomm “Handheld Microwave Spectrum Analyzer,” No. 9, p. 182. “High Power Pulsed or CW 16 to 18 GHz Amplifier,” Keysight Technologies Inc. No. 5, p. 226. “TDR/TDT Solution with Electronic Calibration,” SAGE Millimeter Inc. No. 3, p. 44. AMCAD Engineering “Waveguide Noise Figure and Gain Test Extenders,” No. 8, p. 56. “STAN Circuit Stability Analysis Tool,” No. 4, p. 112. Keysight Technologies Inc. “PXle Performance Vector Signal Analyzer,” No. 4, p. SAGE Millimeter Inc. Amplitech Inc. 52. “Millimeter-Wave Full Waveguide Band Mixers,” No. “Surface Mount Diplexers with Variable Crossover 10, p. 148. Attenuation,” No. 11, p. 130. Keysight Technologies Inc. “Multi-Channel Antenna Calibration Reference Solu- Schmid & Partner Engineering AG (SPEAG)/Zurich Analog Devices Inc. tion,” No. 8, p. 50. MedTech AG (ZMT) “Advanced RF Transceiver Meets the Demands of “Simulation Platform Offering Multiphysics, Multi- SDR Applications,” No. 1, p. 122. Keysight Technologies Inc. “One-Slot PXI Vector Network Analyzer,” No. 9, scale Simulation in Life Sciences,” No. 12, p. 96 Analog Devices Inc. p. 154. SenarioTek “Block Upconverter with HPA for Ka-Band,” No. 11, “High Performance, Off-the-Shelf Switch Matrix,” p. 138. Keysight Technologies Inc. “High Speed Arbitrary Waveform Generator,” No. 10, No. 8, p. 106. Anapico Ltd. p. 142. SenarioTek “Transient Analysis and VCO Testing,” No. 10, p. 152. Keysight Technologies Inc. “Multi-Lane, Single Connection Signal Integrity Mea- Anite “Leading-Edge Signal Analyzer,” No. 11, p. 48. surements,” No. 10, p. 160. “Field-to-Lab Virtual Drive Testing Tools,” No. 9, p. Signal Hound 168. Linear Technology Corp. “A High IIP3, 300 MHz to 6 GHz Active Mixer,” No. “Affordable Real-Time Spectrum Analysis,” No. 5, p. Anritsu Co. 5, p. 210. 216. “Handheld Cable and Antenna Analyzer with Fre- Skyworks Solutions Inc. quency Coverage Up to 40 GHz,” No. 4, p. 120. MACOM “Handheld Mobile Radio PA Solution,” No. 6, p. 110. “Second Generation Front End Modules Support Anritsu Co. Carrier Aggregation,” No. 5, p. 214. “High Performance, Broadband Network Analysis So- Magus (Pty) Ltd. Spacek Labs Inc. lutions,” No. 8, p. 112. “Antenna Magus Version 5: Synthesis to Meet Specifi- cation,” No. 3, p. 120. “E-Band Mixer with LO Multiplier,” No. 2, p. 130. Anritsu Co. Spectrum Elektrotechnik GmbH “Field Analyzer with PIM Testing Capability,” No. 11, Marki Microwave “Flexible Cables Offer Replacement for Semi-Rigid,” p. 46. “Isolated Baluns Eliminate Tradeoffs in Differential Measurements,” No. 7, p. 44. No. 3, p. 46. Anritsu S.A. Spectrum Elektrotechnik GmbH “Locating Sources of Interference,” No. 11, p. 40. Maury Microwave “All-Purpose Test & Measurement Cables,” No. 3, p. “Multiport Connectors Evolve,” No. 9, p. 162. AWR 46. SPINNER GmbH “Analyst V11 Offers User-Customizable Library,” No. Maury Microwave “Hybrid Rotary Joints for Radar Applications,” No. 1, “High Performance RF/Microwave Cable Assem- EditorialIndex 2014 • Volume 57

p. 130. Coonrod, John Sumitomo Electric Device Innovations USA Inc. “Signal Launch Methods for RF/Microwave PCBs,” “High Power C- to X-Band GaN Amplifiers,” No. 8, No. 3, p. 12. p. 118. Deng, Sijia, Christopher J. Slezak, George R. TEGAM MacCartney Jr. and Theodore S. Rappaport “Two-Thermistor Bolometer,” No. 6, p. 116. “Small Wavelengths-Big Potential: Millimeter Wave Propagation Measurements for 5G,” No. 11, p. 4. Tektronix Inc. “Enhanced Spectrum Analyzer Performance of Mixed Eged, Bertalan, Raffaele Fiengo and David A. Hall Domain Oscilloscopes,” No. 1, p. 136. “Modular Platform Approach for UWB Radar System Design and Verification Challenges,” No. 8, p. 8. Tektronix Inc. “6 in 1 Oscilloscope Instrument,” No. 5, p. 222. Eron, Murat “Passive Intermodulation Characteristics,” No. 3, p. Tektronix Inc. 34. “Affordable, Full-Featured Highly Portable Spectrum Analyzer,” No. 12, p. 104 Hall, David A. “Six LTE Receiver Measurements Every Wireless En- Teledyne LeCroy gineer Should Know,” No. 11, p. 18. “9 Channel, 12-bit, 1 GHz Bandwidth Oscilloscope,” No. 7, p. 114. Hansen, John S. “A Cost-Effective Approach to Simulation for Elec- Teledyne Microwave Solutions tronic Warfare Systems,” No. 8, p. 18. “Ka-Band ITAR-Free Suite,” No. 4, p. 124. Huel, Steffen and Andreas Roessler TriQuint Semiconductor “Co-existence Tests for S-Band Radar and LTE Net- “High Efficiency Amplifier for Picocells,” No. 8, p. works,” No. 8, p. 26. 100. John, Robert TRU Corp. “Reliable Cable Assembly Performance Over Time,” “The Next Generation in High Power RF Transmis- No. 3, p. 28. sion,” No. 3, p. 42. Johnson, Emmy W.L. Gore & Associates “Disruptive Factors in the Global Long Haul Market,” “Spaceflight Cable Assemblies and Connectors,” No. No. 11, p. 36. 3, p. 44. Lim, Chin Leong XMA Corp. “Low Loss Configuration for Integrated PIN-Schottky “Coaxial Attenuators, Terminations and Adapters,” Limiters,” No. 8, p. 40. No. 11, p. 134. Liu, Wei and Da Wenpen n SPECIAL REPORTS “Optimizing Cable Assemblies per Application Re- quirement,” No. 3, p. 20. Flemming, J.H., R. Cook, S. Sibbet, C.F. Schmidt, K. Dunn and J. Gouker Mumford, Richard and Pat Hindle “Cost Effective 3D Glass Microfabrication for Ad- “RF Cable and Connector Outlook,” No. 3, p. 6. vanced RD Packages,” No. 4, p. 76. Qian, Yu Hindle, Patrick “Understanding Envelope Tracking and Its Measure- “IMS 2014 MicroApps Special Panel Session,” No. 5, ment Challenges,” No. 11, p. 14. p. 48. Vilar, R., J. Marti, R. Czarny, M. Sypek, M. Kimery, James and Ian Wong Makowski, C. Martel, T. Crepin, F. Boust, R. Joseph, “Prototyping Massive MIMO,” No. 1, p. 92. K. Herbertz, T. Bertuch, A. LeFevre and F. Magne “Smart Antennas and Front End Modules in Q-Band Lerude, Gary for Backhaul Networks,” No. 11, p. 28. “Honored to Join You,” No. 22, p 20. Zhao, Li, Jian-Yi Zhou, Wen-Wen Yang, Zhi-Qiang Mumford, Richard Yu and Li-Na Cao “Microwaves in Europe: Vision 2020,” No. 9, p. 84. “Design of an 8 × 8 MIMO Broadband RF Subsystem Nickerson, Kent for Future WLAN,” No. 11, p. 22. “Envelope Tracking Comes of Age on Mobile Hand- sets,” No. 9, p. 100. Rohde, Ulrich L. and Ajay K. Poddar “Möbius Strips and Metamaterial Symmetry: Theory and Applications,” No. 11, p. 76. Rohde, Ulrich L. and Ajay K. Poddar “Metamaterial Resonators: Theory and Applications,” No. 12, p. 74 Ross, Jim, Vic Wilkerson and Peter Lefkin “MIPI’s RFFE: A Standard for Unifying Mobile De- vice Communications Designs,” No. 8, p. 84. Sheffres, Carl “Reality Bites,” No. 1, p. 18. Sheffres, Carl “The Mission Remains the Same…,” No. 9, p. 20. Vye, David “Semiconductor Technology Drives the EDI CON 2014 Technical Program,” No. 1, p. 46. Vye, David “Countdown to EDI CON 2014,” No. 2, p. 20. Vye, David “The Promise of the Tribe,” No. 3, p. 62. Vye, David “EDI CON Program Review,” No. 3, p. 63. Vye, David “The Path to 5G Runs Through China,” No. 5, p. 44. Vye, David “Passing the Torch,” No. 8, p. 20. n SUPPLEMENT FEATURES