Electronics in Motion and Conversion July 2008 1SVI 8LER =SY )\TIGX

$Electronics in Motion and Conversion July 2008 1SVI 8LER =SY )\TIGX$

ISSN: 1863-5598 ZKZ 64717 07-08

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< XXXJOGJOFPODPNNJQBR > Analog Applications Journal DESIGN BRIEF New Current-Mode PWM Controllers Support Boost, Flyback, SEPIC and LED-Driver Applications

By Jürgen Schneider Ioij[ci;d]_d[[hFem[hIebkj_edi The Devices in a Nutshell

Introduction t *OQVUWPMUBHFUP7 With their wide input voltage range, the TPS40210 r $VSSFOUNPEFBSDIJUFDUVSF and TPS40211 PWM controllers are targeted for r 4XJUDIJOHGSFRVFODZL)[UP.)[ isolated and non-isolated power converters used (programmable and synchronizable) in industrial, automotive, and battery-powered r 1SPHSBNNBCMFTPGUTUBSU DMPTFEMPPQ applications. The full freedom in selecting the power stage and its compensation—as well as the r 3FGFSFODFWPMUBHFN7GPS514BOE advanced features, such as programmable soft N7GPS514 start, adjustable/synchronizable oscillator frequen- r *OUFSOBMTMPQFDPNQFOTBUJPO cy and internal slope compensation—supports the r 5ISFTIPMEGPSPWFSDVSSFOUEFUFDUJPON7 use of the devices in many applications. The basic r *OUFSOBM7SFHVMBUPSBOE/DIBOOFM.04'&5 converter architecture can provide different power driver levels by simply changing the power stage. While r 2VJFTDFOUDVSSFOUXIFOEJTBCMFE" the TPS40210 is designed for general-purpose applications, the TPS40211 is tailored for driving r .4011PXFS1"%BOENNYNN high-brightness LEDs. 40/QBDLBHF

Boost Converter Application The devices and their basic configuration are single inductors or one coupled inductor, L1, and a described in detail in Reference 1. capacitor C9, which is responsible for the energy transfer. The filter formed by L2 and C11 is optional. SEPIC Converter Application *USFEVDFTUIFPVUQVUSJQQMFWPMUBHFUPN7p-p in The SEPIC-converter shown in Figure 1 allows the UIFFYBNQMFTIPXO8IFOPQFSBUJOHUIFDPOWFSUFS input voltage to be smaller, larger, or equal to the BU .)[ UIF TJ[F PG UIF QPXFS TUBHF JOEVDUPST targeted output voltage. The topology requires two DBQBDJUPST DBOCFNJOJNJ[FE)PXFWFS EVFUPUIF

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J^[fbWj\ehcXWhWdZFem[hF7:Wh[jhWZ[cWhaie\J[nWi?dijhkc[dji$Ñ(&&.J?('.&A' increased switching loss at this high frequency, a High-Brightness LED-Driver Application HSFBUFSUIBO"DPOUJOVPVTPVUQVUDVSSFOUSFRVJSFT DC/DC regulators are usually designed to provide a 2 UP CF NPVOUFE PO B IFBU TJOL 0QFSBUJPO XJUI- constant-voltage output; however, LED applications PVU B IFBU TJOL JT QPTTJCMF BU B SFEVDFE TXJUDIJOH SFRVJSFBDPOTUBOUDVSSFOUPVUQVU*O'JHVSF 3JT GSFRVFODZBOEPSSFEVDFENBYJNVNJOQVUWPMUBHF used to sense the LED current. The losses in R1 are 8JUIB"DVSSFOUPVUQVUBOEB.)[TXJUDIJOH minimized with the TPS40211 because of its low frequency, converter efficiency was measured as N7SFGFSFODFWPMUBHF%QSPUFDUTBHBJOTUPVU- GPMMPXTXJUIB 7TPVSDF XJUIB 7 put overvoltage in the event of an LED-string open TPVSDF BOEXJUIB 7TPVSDF circuit. The brightness can be programmed by alter- ing R1, current injection into the FB pin, or by PWM Flyback Converter Application dimming. See Reference 1 for more information. Figure 2 shows the TPS40210 controller configured JO B áZCBDLDPOWFSUFS UPQPMPHZ GPS B EVBMPVUQVU isolated supply. Key components include the trans- GPSNFS 5 UIF TOVCCFST 3 $ % 3 $ 3 3 $BOE$ UIFPQUPDPVQMFS 6 UIF TFDPOEBSZTJEFSFGFSFODFBOEFSSPSBNQMJàFS 6 UIF CJBTSFTJTUPS 3 CFMPOHJOHUP6 UIFMPPQDPNQFO- sation (C19, C20 and R16), the output-voltage divider 3 BOE 3 BOE UIF TFDPOEBSZTJEF TPGUTUBSU BOEPWFSTIPPUDPOUSPM % 3BOE$ 5IFDJSDVJU TIPXOEJSFDUMZDPOUSPMTUIFQPTJUJWFPVUQVUSBJM 7065 ) POMZ/FHBUJWFSBJM SFHVMBUJPO JT CBTFE PO UIF DSPTT regulation between the two secondary windings of <_]kh[)$-&&#c7^_]^#Xh_]^jd[iiB;:Zh_l[h T1. When the negative output does not have a load, R12 and D4 provide a basic load.

0QUJPOBMQBSUT * Snubber for reduction of voltage stress and improved EMI ** Clamps negative output in case of heavily unmatched loads *** Soft start and overshoot control

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Reference 514%BUBTIFFU 4-64" Related Device 514UP78JEF*OQVU3BOHF Step-Down Converter

'PSNPSFJOGPSNBUJPO WJTJUXXXUJDPNQPXFSF CONTENTS Already part of your vision.

Viewpoint The Next Big Thing is Blue Efficiency ...... 4 LEM.

Events ...... 4

News ...... 6-9

Product of the Month Multi-Output Programmable Power Manager Combines Advanced Power Delivery with Digital Power Control ...... 10-11

Guest Editorial Hundred Dollar a Barrela HundredBy Dollar Claus Petersen, Danfoss Silicon Power ...... 12

Market Electronics Industry Digest By Aubrey Dunford, Europartners ...... 14

Market DigitalPower is a Mainstrem Power Technology By Douglas Bess, Editor, PowerPulse.NET ...... 16-17

Cover Story 6500V SPT+ HiPak Modules. Higher power and SOA performance By A. Kopta, M. Rahimo, U. Schlapbach, A. Baschnagel, ABB Semiconductor ...... 18-21

IGBT 600V Trench IGBTs Optimized for 20 kHz Operation By Carl Blake and Wibawa Chou, International Rectifier ...... 22-23

MOSFET Renewable Energy Application Efficency By Dean Henderson, Segment Marketing Manager/Computing, Infineon Technologies North America And Christian Wald,Senior Specialist, Regional Marketing Management, Infineon Technologies AG ...... 24-25

Digital Power A Panoramic View of Applications and Challenges By Steve Mappus, Systems Engineer,Fairchild Semiconductor, High Power Solutions, Bedford, NH ...... 26-28

Digital Power Digital Power, Hope or Hype? By Dr.– Ing. Artur Seibt, Vienna ...... 30-31

Power Supply Whatever you invent, imagine Flexible, Accurate & Efficient Power Solutions for or develop, LEM’s transducers LED Backlighting Applications are at the heart of your power By Steve Oliver, VP. V•I Chip Inc. (a Vicor company) ...... 32-35 electronics applications from the Capacitors very start. Super Capacitor Reference Design By Thomas Delurio, Applications Manager, LEM’s products, R&D, and people Advanced Analogic Technologies, Inc...... 36-40 provide knowledge intensive solutions to keep up with your PCIM Impressions changing industry, allowing your Blue Efficiency at the Next Level ...... 15 visions to come to life. PCIM New Product Review ...... 40-44 www.lem.com New Products ...... 45-48 The Gallery

2 July 2008 www.bodospower.com Cure for the Uncommon Power Source

Barrel jacks are a simple and effective way of connecting portable electronics to an external power supply. But what happens when the user plugs into a supply operating at the wrong voltage? Or what about when the supply is dirty and full of nasty voltage surges, as is often the case when power is supplied from an automobile power jack? Raychem Circuit Protection PolyZen™ devices can help protect your DC power ports by clamping excess voltages and smoothing inductive voltage surges. The PolyZen device's unique polymer-protected precision Zener design can help cure these all-too-common power problems. To learn more, visit www.circuitprotection.com/polyzen.

Features Benefits Applications • Overvoltage transient • Stable Zener diode helps shield • Cell Phones • Printers suppression downstream electronics from • PDAs • Scanners • Stable Vz vs fault current overvoltage and reverse bias • MP3 Players • Hard Drives • Time delayed, overvoltage trip • Analog nature of trip events • DVD Players • Desk Phones • Time delayed, reverse bias trip minimizes upstream inductive • USB Hubs • PBX Phones • Power handling on the order of spikes • Media Players • Digital Cameras 100 watts • Minimal heat sinking • Wireless Base Stations • Integrated device construction • Single component placement • RoHS compliant • Helps reduce warranty returns & replacement costs

www.circuitprotection.com

Tyco Electronics Raychem GmbH Finsinger Feld 1 85521 Ottobrunn Germany Tel: +49 89 6089 386 Fax: +49 89 6089 394 © 2008 Tyco Electronics Corporation • www.tycoelectronics.com Raychem, PolyZen, TE Logo and Tyco Electronics are trademarks VIEWPOINT

The Next Big Thing A Media Katzbek 17a D-24235 Laboe, Germany Phone: +49 4343 42 17 90 is Blue Efficiency Fax: +49 4343 42 17 89 [email protected] No doubt about it - the industry is bringing www.bodospower.com more specifics to Blue Efficiency. At PCIM Publishing Editor Europe, my podium discussion gave a repre- Bodo Arlt, Dipl.-Ing. [email protected] sentative view from the electronic perspective. Key messages from the participants are Creative Direction & Production Repro Studio Peschke summarised and published in this edition. It [email protected] is always a pleasure to give an impulse for new trends in the industry and I am happy to Free Subscription to qualified readers see others following in my footsteps. Bodo´s Power magazine is available for the following As expected, I planned something special for subscription charges: the audience at the end of the open discus- Annual charge (12 issues) is 150 € sion. Everyone enjoyed pulling the rope and world wide Single issue is 18 € recognizing the winner. Three winners For all of you who missed traveling to [email protected] received Marklin model train Starter Sets, Nuremberg to see the innovations at PCIM, circulation ten got Lego Locomotives, and eighty-seven the magazine has a summary of what was printrun enjoyed pickles in a can - and every winner showcased. 20000 got a bonus CD with all issues of Bodo’s Power. Now we are ready to take a break and relax. Printing by: It is summer and the beach is perfect these Central-Druck Trost GmbH & Co Inspiring children is important, as is develop- days. For me it is easy, I just walk down the Heusenstamm, Germany ing their skills for an engineering profession. hill and jump into the Baltic Sea. A Media and Bodos Power magazine assume and hereby disclaim any We who are working in engineering must Nevertheless, I will keep up with worki - my liability to any person for any loss or give a high visibility to our jobs, and make it magazine will reach you at the beginning of damage by errors or omissions in the attractive for young people to become engi- each month, twelve times a year, and you material contained herein regardless of whether such errors result from neers. Creative toys and the skill to handle will be up to date. If you have subscribed, negligence accident or any other cause them in construction are the forerunners for you will be refreshed with twenty-four e- whatsoever. solving problems in future generations. news-letters during the year. And my publi- cation is in the process of teaming up with Events Look for those who can get beyond the Nin- local publishers to carry news and articles EPE – PEMC 2008 tendo screens and just fighting a joystick for and content translated into local languages Poznan – Poland September 1-3 satisfaction. The little engineers will be able to serve additional people with leading edge http://epe-pemc2008.put.poznan.pl to assemble their train set and build scenery information in their region. from their imagination. What is needed is Husum WindEnergy 2008 Germany continuous attention and support in all the My Green Power Tip for this month is: September 9-13 aspects of growing up. As long as I can http://www.husumwindenergy.com interest a few kids with such engineering Have your bikes ready for a weekend excur- Digital Power Forum 2008 challenges, I will give away constructive sion – your trip will achieve zero emissions! San Francisco September 15-17 toys. As a child, a Marklin set from my older http://digitalpower.darnell.com brother was the seed that inspired me to I must push myself have to look into it as become an engineer. What worked for me well – but first I must visit my workshop and SEMICON Europe should still work for children today. fix all the little things to get the bike running. Stuttgart Germany October 7-9 I will report on my progress. www.semiconeuropa.org Creativity needs freedom and support - It takes a while to see the results. A train set H2expo 2008 can be a project to develop skills in long- Hamburg, Germany October 22-23 term activities and planning. Much of what is Regards http://h2expo.com needed to become an engineer is basic in electronica 2008 life – and to lifelong learning. Munich November 11-14 http://www.global-electronics.net

SPS/IPC/DRIVES 2008 Nuremberg November 25-27 http://www.mesago.de

4 July 2008 www.bodospower.com Intersil Battery Authentication

High Performance Analog

We’re On It.

Intersil’s ISL9206 FlexiHash+TM 32-bit pseudo-random Engine delivers high-security challenge word battery authentication at a 64-bit Secret from host Patent pending FlexiHash+ engine 32-bit Hash consists of four separate low cost. Function FlexiHash+ programmable CRC calculators. Two Engine 32-bit Hash sets of 32-bit secret codes are used Intersil’s ISL9206 is an easy-to-use, robust, Function for authentication code generation. and inexpensive battery authentication solution 8-bit for 1-cell Li-Ion/Li-Polymer or 3-cell NiMH authentication code series battery packs. XSD single-wire host bus interface communicates with all 8250- compatible UARTs or a single GPIO ISL9206 Key Features: 1-Wire Comm Oscillator Interface pin. Supports CRC on read data and Challenge/response-based authentication transfer bit-rate up to 23Kbps. scheme using 32-bit challenge code and 16x8 OTP FlexiHash+ 8-bit authentication code. ROM Engine FlexiHash+ engine uses two sets of 32-bit 16 bytes of one-time programmable secrets for authentication code generation. POR/2.5V Control ROM memory for storage of pack Regulator Register information and ID, device 16x8 one-time programmable ROM memory. authentication secrets, device default Additional programmable memory for storage. settings, and factory-programmed trim parameters.

Go to www.intersil.com for samples, datasheets and support

Intersil – Switching Regulators for precise power delivery.

©2007 Intersil Americas Inc. All rights reserved. The following are trademarks or services marks owned by Intersil Corporation or one of its subsidiaries, and may be registered in the USA and/or other countries: Intersil (and design) and i (and design). NEWS

Awards for Quality and Performance Royal Philips Electron- Philips executives and representatives from “NEC is proud to receive this prestigious ics and its subsidiary, top suppliers to create a powerful network of award. This award proves the success of our Philips Healthcare, business partners to generate customer strategy to develop and manufacture high- recognized NEC LCD value through shared goals, mutual quality liquid crystal display modules. Technologies, Ltd. for strengths and competencies. NEC LCD The awards were given to representatives its performance and Technologies supplies modules for patient from NEC LCD Technologies’ sales and mar- quality in 2007 with monitoring equipment to Royal Philips Elec- keting organizations in Europe and the two Philips “Partners for Growth” Global tronics and Philips Healthcare. Americas. Supplier Awards. These awards are a key Rob Green, president of NEC Electronics part of Philips’ strategic supplier relationship Europe, said of receiving the award from www.eu.necel.com management program, which brings together Philips on behalf of NEC LCD Technologies, ECPE Seminars & Tutorial Programmes COMPEL 08 11th IEEE Workshop on Control (29 Sept - 2 Oct. 2008 Maastricht NL) (20 – 21 November 2008, Delft, NL) and Modeling for Power Electronics Automotive Power Electronics Power Semiconductor (18-20 August 2008 ETH Zurich CH) (EC Projects) – Seminar Devices & Technologies – Tutorial ESREF 19th European Symposium (7 – 8 October 2008, Stuttgart, D) (4 – 5 December 2008, Nuremberg, D) "Reliability of Electron Devices, Failure Advanced Cooling Techniques (1st day) Physics and Analysis" including ECPE Power PCBs and Busbars (2nd day) www.ecpe.org Reliability Tutorial Session Workshop TI Commits to EnOcean Standard for Energy-Harvesting The EnOcean Alliance and Texas Instruments announced that TI has largest installation base in wireless building automation, with more become a full member and participating company in the recently than 70 shipping customers, 300 available products and tens of thou- established EnOcean Alliance. The Alliance was founded last month sands of EnOcean-enabled buildings. Building professionals highly to establish a global standard for sustainable buildings based upon value the interoperability across manufacturers and application pro- EnOcean´s revolutionary energy-harvesting wireless technology. files inherent to the EnOcean standard. TI is a key semiconductor supplier to the EnOcean Alliance eco-system, which includes innovators and industry leaders such as Masco, www.enocean-alliance.org Honeywell, Siemens, Osram Sylvania, Distech Controls, Omnio and Thermokon. The EnOcean self-powered wireless technology has the www.ti.com Indium Corporation Wins Vision Awards Indium Corporation’s Indium8.9 Pb-Free No- Awards honor the products and technologies properties, especially with CSP, 0201, and Clean Solder Paste was honored twice in that have shaped the PCB manufacturing 01005 components, with consistent print vol- two weeks with leading electronics assembly industry over the past year. umes through apertures below the industry awards. Indium8.9 earned the VISION Award Indium8.9 is a third-generation solder paste recommended minimum area ratio of 0.66. A at the APEX convention in Las Vegas, NV, that delivers more performance than any Pb- robust reflow process window can accom- and just one week later, garnered the China free solder paste on the market, bringing modate high peak temperatures and long VISION award at NEPCON China in Shang- together the reliability of a Sn/Pb paste with soak profiles. hai, China. Sponsored by SMT Magazine, RoHS compliance. and SMT China Magazine, the VISION Indium8.9 exhibits outstanding print-transfer www.indium.com/big H2Expo 2008 7th International Conference and Trade Fair ucts and for concepts with future potential. following day. Some 50 high-calibre speak- on Hydrogen and Fuel Cell Technologies, 22 This 7th International Conference and Trade ers from 11 countries are expected to partici- and 23 October 2008. Fossil fuels are run- Fair on Hydrogen and Fuel Cell Technolo- pate. The main highlights this year are tech- ning out. That is becoming more and more gies at the CCH Congress Center Hamburg nical innovations in the individual fuel cell evident with the current explosion in oil on 22 and 23 October is a meeting place for types and their most promising applications, prices and worldwide hunger for energy. the expert community, for discussion of the in hydrogen production from renewable Action to mitigate climate change is just one current state of developments. It will feature energy sources, and in storage and infra- of the factors that is driving the efforts to presentations by scientists from Germany structure. develop and secure alternatives, with hydro- and abroad, and reports from the industry on The complete conference programme, indi- gen and fuel cells playing a key role. Along- innovative projects, showcasing their latest cating the subjects and speakers at sympo- side the primary energy sources available in products. sium and the workshops, is available at the the future, storage and conversion will At the heart of this event is the scientific website: become increasingly important. The H2Expo conference, with a symposium on 22 Octo- is a prominent forum for market-ready prod- ber and three concurrent workshops on the www.h2expo.de

6 July 2008 www.bodospower.com The Best-Selling 2-Channel IGBT Driver Core

The 2SD315AI is a 2-channel driver for The 2SD315AI has been established on the market as an industrial standard IGBTs up to 1700V (optionally up to for the last four years. The driver has been tried and tested within hundreds 3300V). Its gate current capability of of thousands of industrial and traction applications. The calculated MTBF to ±15A is optimized for IGBTs from 200A MIL Hdbk 217F is 10 million hours at 40°C. According to field data, the actual to 1200A. reliability is even higher. The operating temperature is -40°C...+85°C.

The driver is equipped with the award- Driver stage for a gate current up winning CONCEPT SCALE driver to ±15A per channel, stabilized by chipset, consisting of the gate driver large ceramic capacitors ASIC IGD001 and the logic-to-driver interface ASIC LDI001.

Chipset Features • Specially designed transformers for Short-circuit protection creepage distances of 21mm • Supply undervoltage lockout between inputs and outputs or • Direct or half-bridge mode between the two channels. Insulat- • Dead-time generation ing materials to UL V-0. Partial dis- • High dv/dt immunity up to 100kV/us charge test according IEC270. • Transformer interface • Isolated status feedback • 5V...15V logic signals • Schmitt-trigger inputs • Switching frequency DC to >100kHz • Duty cycle 0...100% Isolated DC/DC power supply with • Delay time typ. 325ns 3W per channel

More information: www.IGBT-Driver.com/go/2SD315AI

CT-Concept Technology Ltd. is the technology As an ideas factory, we set new standards with leader in the domain of intelligent driver com- respect to gate driving powers up to 15W per ponents for MOS-gated power semiconductor channel, short transit times of less than 100ns, devices and can look back on more than 15 plug-and-play functionality and unmatched field- years of experience. proven reliability. In recent years we have developed a series of CT-Concept Technologie AG Key product families include plug-and-play customized products which are unbeatable in Renferstrasse 15 drivers and universal driver cores for medium- terms of today´s technological feasibility. 2504 Biel-Bienne and high-voltage IGBTs, application-specific Switzerland driver boards and integrated driver circuits Our success is based on years of experience, our (ASICs). outstanding know-how as well as the will and motivation of our employees to attain optimum Tel +41-32-344 47 47 By providing leading-edge solutions and expert levels of performance and quality. For genuine Fax +41-32-344 47 40 professional services. CONCEPT is an essential innovations, CONCEPT has won numerous tech- partner to companies that design systems for nology competitions and awards, e.g. the “Swiss [email protected] power conversion and motion. From custom- Technology Award” for exceptional achievements www.IGBT-Driver.com specific integrated circuit expertise to the in the sector of research and technology, and design of megawatt-converters, CONCEPT pro- the special prize from ABB Switzerland for the vides solutions to the toughest challenges con- best project in power electronics. This under- fronting engineers who are pushing power to scores the company´s leadership in the sector of Let experts drive your the limits. power electronics. power devices NEWS

Partnership to Provide Point-of-Load Digital Power Products Fairchild Semiconductor and Zilker Labs will allow us to develop and provide next and we look forward to expanding both our have entered into an agreement to manufac- generation leading edge digital power prod- customer base and our product offering. The ture and sell digital power products, includ- ucts and solutions for a variety of applica- partnership between Fairchild Semiconduc- ing point-of-load power devices, targeted at tions in the power management market,” tor and Zilker Labs will allow increased prod- the server, networking, graphics and high- said Bob Conrad, executive vice president of uct support and supply continuity for OEMs end desktop applications. Fairchild’s Mobile, Computing, Consumer and power supply manufacturers using digi- “We’re pleased to be able to expand our and Communications Product Group. “Zilker tal power control products.” industry-leading power management product Labs has developed an excellent reputation, Zilker Labs’ Digital-DC ICs are highly-inte- offering, particularly in the digital power area. and we’re looking forward to working closely grated, high-performance digital power solu- This partnership allows Fairchild to manufac- with them.” tions designed to be universal building ture and sell digital power products and “Zilker Labs’ innovative Digital-DC™ technol- blocks that can be easily combined and enhances our working knowledge of the digi- ogy enables efficient, flexible, easy-to-use adapted to address a wide variety of com- tal power market and application space, digital power solutions for today’s embedded plex power system requirements. while promoting and driving its adoption. communications and computing systems,” Developing close relationships with our cus- said Bob Bridge, CEO of Zilker Labs. “We’re www.fairchildsemi.com tomers, and understanding their challenges, excited about the partnership with Fairchild, www.zilkerlabs.com Strong Rebound in 2009 Says SEMI World Fab Forecast According to the World Fab Forecast report, In the Americas, fab equipment spending is Promos and Hynix are expected to join Sam- recently released by SEMI, spending on expected to decline over the next two years, sung, Flash Alliance and Intel as key worldwide fabs equipping is expected to while China and the Europe/Mideast are spenders on fab equipping. show declines of about 17 percent in 2008, expected to see growth both years. Spend- The SEMI World Fab Forecast provides high as more companies are forced ing in Japan and South Korea is projected to level summaries and graphs; in-depth analy- to postpone fab projects due to global eco- remain slow, but should improve from nega- ses of capital expenditure, capacity, technol- nomic uncertainties. In 2009, however, the tive double digits in 2008, to negative single ogy and products, down to the detail of each group expects to see a rebound with double- digits in 2009. fab; and forecasts for the next 18 months. digit growth of over 12 percent. The biggest three spenders in 2008 for These tools are invaluable for understanding Regions reflecting this trend most dramati- equipping fabs are Samsung, Flash Alliance how 2009 will look, and learning more about cally include Southeast Asia and Taiwan, and Intel. Though most companies are capex for construction projects, fab equip- who will likely experience declines of 40 per- investing in non-US fab opportunities, Sam- ping, technology level, and products. cent and 33 percent respectively this year, sung is making significant investment into its but are expected to recover in 2009 with sig- 300mm megafabs in Austin, Texas, and Intel nificant positive growth of over 50 percent continues to invest in its Arizona and New www.semi.org/fabs and 80 percent respectively. Mexico fabs. In 2009, Rexchip, TSMC, UMC, Solve System-Energy Challenges Reinforcing its leadership in power manage- sharing, mobile broadband, and unlimited unique system solutions which it embeds in ment and energy-efficient products, National storage capacity, the resources required to silicon or licenses as intellectual property. Semiconductor launched an initiative to help power this trend are finite. Therefore, There are currently approximately 300 ICs in customers create more energy-efficient sys- enabling electronic systems to be more National’s PowerWise family including ener- tems that use less power, generate less energy efficient becomes imperative and is gy-efficient power management, operational heat, have a smaller form factor and/or especially important as the cost of energy amplifier, interface and data conversion longer battery life. continues to rise. products. The trend towards energy conservation con- At the system level, National helps cus- tinues to grow worldwide. As market forces tomers solve energy efficiency problems with www.national.com/powerwise drive higher user experience expectations integrated circuits (ICs) from its PowerWise® and the adoption of video streaming and family of components as well as architecting ASSET Aligns with Embedded Instrumentation Responding to the increasing momentum in high-speed chips, I/O buses and systems. significantly enhanced its ScanWorks® plat- the electronics industry toward embedded Moreover, new chip geometries at 45 form over the last several years with embed- instrumentation, ASSET® InterTech, Inc. nanometers (nm) or smaller, as well as chip- ded instrumentation capabilities. According announced it is positioning the company, its level packaging technologies like system-in- to Glenn Woppman, president and CEO of products and its technologies to provide package (SiP) are making validation, test ASSET, the company will continue to lead in open tools for embedded instrumentation in and debug very difficult, if not impossible JTAG structural test while developing inno- design validation, test and debug applica- with traditional technologies. Building on its vative and open embedded instrumentation tions. long-established leadership in non-intrusive solutions. Many of the established validation and test boundary-scan structural test based on the technologies are inadequate or ineffective for IEEE 1149.1 JTAG standard, ASSET has www.asset-intertech.com 8 July 2008 www.bodospower.com NEWS

HUSUM WindEnergy 2008 International Development in the Offshore offshore capacity was installed in Europe by MW Farshore wind farm off the Belgian Sector – a key subject at HUSUM WindEn- the end of 2007, with Denmark and the UK coast. A scaled-up 6 MW model will be ergy 2008 the two main markets. Supply of offshore launched in the next few years. A joint ven- 2008 and 2009 are expected to be boom wind turbines is currently dominated by Ves- ture with rotor blade manufacturer A&R years in the offshore sector in Europe – with tas (with a market share of about 60%) and Rotec is to start in Bremerhaven in the near planned commissioning of a total of 1507.5 Siemens, both of them exhibitors at the future, under the project name of MW on new installations coming online. The HUSUM WindEnergy 2008. At the beginning PowerBlades, for production of 61.5 m off- United Kingdom alone is likely to account for of 2007, Vestas had to withdraw the V90-3 shore rotor blades developed by REpower. about 800 MW of this. Another milestone in MW turbine from the market for technical Other companies are likewise active in the offshore energy production will be the com- reasons, but has released the machine for offshore market. Converteam, for example, mercial launch of a number of wind turbines sale again from May 2008 onwards. At the is a key partner in the Dutch 4.7 MW Dar- of the 5 MW class. The European Wind beginning of March, the Dutch developer WinD offshore turbine project, supplying the Energy Association (EWEA) predicts that, by Evelop selected Vestas for supply of 110 tur- direct drive generator. the end of 2010, a cumulative offshore bines (V90-3 MW) for its Belgian 330 MW Nordex of Germany is operating a 2.5 MW capacity of between 3000 and 4000 MW will offshore project Belwind. turbine in the port of Rostock, and will deliv- be operational off the coasts of Europe. Off- At the end of 2007 Siemens had offshore er another 21 units for Baltic I, Germany’s shore is therefore a central theme at the turbines in operation with a total capacity of first commercial wind farm. This 52.5 MW upcoming HUSUM WindEnergy 2008. This 434 MW, and projects with more than 1080 project is scheduled to go on-line in 2009. premier fair of the wind energy sector will be MW in new portfolio projects. In 2007 the Nordex decided to enter the offshore sector held in the Northern German coastal town of company for the first time installed 25 off- on a step-by-step basis, starting with the Husum from 9 to 13 September. A large shore turbines of the 3.6 MW category off development of a new 3 to 5 MW turbine number of international companies that the British coast, at the Burbo Banks wind with “offshore features”. A prototype is to be develop or already commercially operate farm. A UK project with 180 MW will be com- built in 2010, and the 0 series by 2011/2. wind turbines specially developed for off- pleted in 2008, and at least three more proj- WinWinD of Finland has installed three of its shore application will exhibit their products, ects off the British and Danish coasts are 3 MW Multibrid type wind turbines on artifi- projects and specialised services in Husum. planned for 2009, with a combined capacity cial islands in the Kemi Ajos wind farm close Presenting the latest technical and scientific of 400 MW. to the shore. offshore wind advancements is also a main Starting in 2008, a number of companies are And finally, the Dutch company Blue H Tech- theme at the HUSUM WindEnergy confer- joining the offshore competition for commer- nologies will provide information on its inno- ence, which is an integral part of the fair. cial use of 5 MW turbines. German compa- vative “floating” offshore wind turbine tech- The growth plans are promising – a Euro- nies REpower and Multibrid, also present in nology at the HUSUM WindEnergy 2008. A pean offshore goal of 40 000 MW by the Husum, each developed a 5 MW turbine for prototype is currently being tested off the year 2020 was announced at the European offshore application. Each of these compa- Italian coast. The next (pre) series model will Offshore Wind Conference 2007 in Berlin. nies has been operating a prototype on feature a two-blade in-house modified 2.5 The United Kingdom alone aims at 33 000 shore since the end of 2004, and the tur- MW wind turbine. MW by 2020. Germany wants 25 000 MW bines are now ready for series production. HUSUM WindEnergy 2008 – the leading offshore wind power by 2030, sufficient to Rapid international expansion in this sector international wind industry fair – has for the cover 15% of its energy demand. Other is expected following acquisition by the first time been organised as a cooperation more moderate targets have been French nuclear group Arreva of 51% of venture between the Messe Husum and the announced by the Netherlands (6000 MW by Multibrid shares from the German project Hamburg Messe. From 9 to 13 September, 2020) and Sweden (2500 to 3000 MW by developer Prokon Nord in 2007. This year, a some 700 exhibitors from 35 countries will 2015). However, there could be bottlenecks first batch of six Multibrid 5 MW turbines will present their products and services at the due to the scarcity of offshore wind turbines be installed in the German offshore test field Husum trade fair site, including the world’s and the restricted number of suppliers. alpha ventus. REpower will install another leading wind turbine manufacturers and their Outside Europe, countries like the USA and six turbines of this category there in 2009. equipment suppliers. This fair is dedicated to China have announced plans to exploit their REpower was the first company in the world the wind industry, and will be the internation- offshore wind potential. According to a study to install 5 MW turbines in “real” offshore al meeting point and forum for companies by the National Renewable Energy Labora- operation – two of these are installed off the and trade visitors for five days. Further tory (NREL), the offshore wind energy poten- Scottish coast, in a record water depth of 44 tial of the United States is more than 1 000 metres. Another 60 turbines are currently in 000 MW. By comparison, some 1100 MW the initial project phase, for C-Power’s 300 www.husumwindenergy.com Exclusive Partnership on Distribution TTI and Tyco Electronics have recently TTI is already a preferred distributor of Tyco focussing on the markets in question, Tyco entered an exclusive partnership on the dis- Electronics with a strong global presence. Electronics expects a significant boost in tribution of connectors for the aerospace, The company constantly proves that it activities soon. defence and marine market. The aim of the actively promotes Tyco Electronics’ product agreement is to considerably strengthen the portfolio, with a special emphasis being presence of Tyco Electronics’ products in the made on demand creation and the genera- www.ttieurope.com referred markets within the regions Europe, tion of new business. Thanks to TTI’s com- Middle East and Africa. mitted Military, Aero and Space team www.tycoelectronics.com/ www.bodospower.com July 2008 9 PRODUCT OF THE MONTH

Multi-Output Programmable Power Manager Combines Advanced Power Delivery with Digital Power Control

Single-chip solution targets portable applica- The power manager operates at a switching abling, power-up/down sequencing, power- tions, maximizing design flexibility while frequency of 1MHz, allowing for space-sav- up slew rate control, static and dynamic out- reducing system cost, size and development ing system components. DC-DC Power con- put voltage control (Dynamic Voltage Man- time. version efficiency of up to 95 percent agement). A broad range of intelligent power reduces thermal dissipation and improves system diagnostics and monitoring functions Summit Microelectronics has announced the battery life in portable systems. Further can be easily accessed via the I2C serial latest addition to the company’s family of enhancing battery life, a shutdown mode interface and digital status outputs. These multi-output programmable power manager reduces current consumption to 0.1μA while include input and output monitoring for ICs. The SMB119 is targeted at portable automatic PWM/PFM operation improves under/over-voltage/over-current (UV/OV/OC) consumer equipment and integrates seven light load efficiency. A PWM-override mode and integrated RESET control. Enhancing precision programmable regulators and a is also available for noise sensitive RF or flexibility even further, the device can be pro- wide range of digital power control functions. audio applications. Short circuit current limit- grammed during development and then used This “one-chip” solution offers the highest ing and thermal protection safety circuits are in a "fixed" configuration, or it may be re-pro- design flexibility in the industry, while reduc- also built-in to enhance reliability. grammed in-system via the I2C interface. ing system solution size and cost. Programmability Applications Summit’s easy-to-use PC-based graphical The SMB119 provides Digital Power Man- The SMB119 is ideal for a wide range of (GUI) development environment lets system agement via an I2C interface and non- portable consumer electronics such as digital designers digitally program the entire multi- volatile memory allowing the user to config- still cameras/camcorders (DSC/DCC), ple output power supply and associated ure power functions and parameters for each portable media players (MP3/MPEG4), GPS power management functions with a few channel: individual channel enabling/dis- terminals, portable medical equipment, per- clicks of a mouse. In high-volume production Summit provides product that is pre-programmed with the customer’s “custom configuration” at no extra cost. Compared to inflexible conventional analog power ICs, the SMB119 yields optimized power system designs in significantly shorter development time.

Features The SMB119 incorporates three synchronous step-down converters, two step-up converters, one configurable step-up or step- down converter, and one low-dropout (LDO) linear regulator. Also included is a fully programmable system supervisor that monitors all channels for under-voltage and over-voltage events. The user can select how the SMB119 should react under abnormal conditions (assertion of RESET output, power- down in sequencing order or force shutdown), thereby maximizing system reliability.

Summit Diagramm

10 July 2008 www.bodospower.com PRODUCT OF THE MONTH

sonal digital assistants (PDAs), as well as tasks and also includes all necessary hard- Summit’s unique programmable, non-volatile the next generation of “smart” mobile ware to interface to the USB port of a laptop mixed-signal IC technology combined with a phones. The dynamic voltage management or PC. convenient GUI development environment feature is particularly useful in Xscale™ and allows for unparalleled functional and para- ARM™ CPU applications and where LED Once a user completes design and prototyp- metric flexibility in power supply design. This backlight brightness control is desired. ing, the SMB119EV automatically generates flexibility applied to common problems such a HEX data file that can be transmitted to as dynamic voltage/current control and intel- The SMB119 operates directly from +2.7V to Summit for review and approval. Summit ligent battery charging, allows for significant +6.0V input making it ideal for 1-cell Li-Ion then assigns a unique customer identifica- system performance improvement while real- (+3.0V to +4.2V) battery applications, tion code to the HEX file and programs the izing drastic reductions in design effort. although line-powered applications are readi- customer’s production devices prior to final ly supported as well. The device has an electrical test operations. This ensures that Digital programmability enables high integra- operating temperature range of +0°C to the device will operate properly in the end tion and system flexibility in a single chip - +70°C or –40°C to +85°C and is available in application. The design kit software can be impossible with conventional “hard-wired” the 7mm x 7mm 48-pad QFN package that downloaded from Summit’s website. analog power ICs. Additionally, this integra- is lead-free and RoHS-standard compliant. A reference design that utilizes the SMB119, tion reduces the bill-of-materials yielding the 7-level programmable power manager, and lowest total system cost and size. Summit Design Software/Hardware and Program- the SMB137, switch-mode charger with Cur- solutions address the biggest challenges mer for Prototype Development rentPath™ control, is also available for facing OEM developers today: increasing To speed user product development, Summit accelerating product development for a com- system functionality, performance and com- offers customers the SMB119EV companion plete portable system design. plexity accompanied by shrinking develop- evaluation board and a graphical user inter- ment time cycles. face (GUI) software so designers can quickly About Summit Microelectronics see the features and benefits and design a Summit Microelectronics is the leader in flex- prototype power supply with the SMB119. ible, highly integrated power management This is a complete development tool that lets solutions combining precision power regula- designers easily manipulate the characteris- tion with sophisticated digital control in a sin- tics of their systems. The SMB119EV design gle chip. The Company’s devices are found www.summitmicro.com kit includes menu-driven Microsoft Windows in a variety of consumer, communications (R) GUI software to automate programming and computing applications.

MAKING MODERN LIVING POSSIBLE

Simplify your design! E0 to E3 size v Short and long pins v Flexible pin-out IGBT’s and MOSFET’s from world class manufacturers v Low and high voltage For industry, transportation and automotive We design and manufacture to your needs.

Danfoss Silicon Power GmbH • Heinrich-Hertz-Straße 2 • D-24837 Schleswig, Germany • Tel.: +49 4621 9512-0 • Fax: +49 4621 9512-310

E-mail: [email protected] • http://siliconpower.danfoss.com 9936 GUEST EDITORIAL

Two Hundred Dollar a Barrel By Claus Petersen, CEO Danfoss Silicon Power

Earlier this year, the world was shocked Our industry is full of exciting success when crude oil prices exceeded the stories that will attract our future col- $100 per barrel mark. Now, oil commodi- leagues. Wind turbines in Northern Ger- ty experts are attempting to prepare us many and Denmark that today account for the next shock of $200 per barrel for more than 20% of the total electricity crude oil. consumption work only in an efficient manner due to advanced power Most people worry about rising energy prices. After all, nobody wants to pay electronics components. The same can increased prices for electricity, petrol or be said for photovoltaic energy genera- heating. However, there is an up-side. tion that requires efficient power elec- Whether we like it or not, we all know tronics components in order to feed the that we must do something drastic to power grid. reduce our dependence on fossil fuels. Whether used to accelerate an electric Along with the benefits of CO2 reduction motor or regenerate braking power, and improved air quality, we can also power electronics is the enabling tech- reap the economic benefits of substitut- nology for hybrid electric vehicles. More ing fossil fuels with renewable energy recently, our situation receives good sources. publicity from Formula 1 Racing. Formu- la 1 teams will soon be required to race For those of us in the power electronics hybrid electric cars in order to compete community, we have our work cut out for in this sport. us! Photovoltaic and wind power conversion equipment and hybrid electric vehi- A very pleasant surprise it was when cles, as a matter of fact, most renewable someone introduced me to a little “Pixi” energy sources, use power electronics booklet at the recent PCIM 2008 exhibi- as “the” enabling technology. tion. Phoenix Contact sponsors this booklet that tells the story of an electrical engineer as seen through the eyes of a very young girl. This will come as no surprise to most readers of “Bodo’s Power” Phoenix Contact is taking positive action to raise the awareness of magazine, but we tend to keep our growing need for talent as a big the engineering profession in a young target group. Through Danfoss secret within our relatively small community. Our secrecy complicates Universe (http://www.danfossuniverse.com/), Danfoss introduces any efforts to recruit new talent to our cause and meet the power young people to the engineering profession. I encourage everyone electronics industry’s great unfulfilled need for power electronics pro- else in our profession to follow these good examples and do even fessionals. more!

I want to make the point that we in the power electronics industry must cultivate excitement and awareness about our profession in the world. If we want to recruit enough of the best minds, we must work to attract young people to our industry during the time in their lives when they are making important decisions about their education. http://siliconpower.danfoss.com PCIM review by Video Just go to Darnell PowerPulse and watch what industry presented! http://www.powerpulse.net/conferenceVideo.php You find more videos from industry about PCIM produced by ICC media! http://ece-news.stc-d.de/pcimvideos/pcim/pcim08videos.html

12 July 2008 www.bodospower.com

MARKET

ELECTRONICS INDUSTRY DIGEST By Aubrey Dunford, Europartners

GENERAL DIGEST – FORM od last year. Book-to-bill ratio, meanwhile, Worldwide revenue ON Semiconductor has announced plans to stands at 1.06. for photovoltaic cells close its two wafer manufacturing facilities is projected to located in Piestany, Slovakia, and transfer OTHER COMPONENTS increase to as much the production lines to other company- ANSYS has signed a definitive agreement to as $22.1 billion in owned facilities. acquire Ansoft for a purchase price of 2012, up from $9.6 approximately $ 832 M. The complementary billion in 2007, so Texas Instruments has acquired Ireland- business combination of ANSYS and Ansoft iSuppli. By 2020, based Commergy Technologies, a power will create a provider of simulation capabili- about 50,000 supply referenceb design provider that spe- ties, with combined trailing 12-month rev- Megawatts worth of PV systems (MWp) will cializes in energy efficient and compact enues of $ 485 M. be installed annually, up by a factor of nearly architectures. The acquisition allows TI to 20 times from 2,538 MWp in 2007. But pro- broaden its focus on improving energy effi- EMS PROVIDERS duction capacity limitations are constraining ciency in endequipment designs, especially Flextronics has completed its previously polysilicon supply, causing PV suppliers to in the areas of AC adapters and high-power- announced acquisition of the FRIWO Mobile realign their strategies and to seek alterna- density computing and server systems. Power (FMP) business unit of CEAG, a glob- tive raw materials. The silicon shortage also al market leader for power supplies and is driving the advancement of thin-film tech- IXYS, a Silicon Valley power semiconductor chargers for mobile telephones. FMP is now nologies that can act as the raw material for company, has made a proposal to acquire all part of Flextronics' power supply division. PV cells. This will cause the revenue market the outstanding shares of ZiLOG common The acquisition will add approximately share of thin-film technologies to rise to 20 stock for per share consideration of $4.50, to 18,000 employees and 700,000 square feet percent of the total PV market in 2010, up be paid in cash and stock. ZiLOG's micro- of manufacturing capacity in China. from 5 percent in 2007. controller semiconductor devices will complement IXYS's IC business, so IXYS. DISTRIBUTION SEMICONDUCTORS Future Electronics EMEA have been recog- The capacity utilization of semiconductor- OPTOELECTRONICS nized as the International Rectifier distributor manufacturing plants worldwide edged up Large-sized LCD panel shipments in 2008 of the year for 2007. Avago Technologies 0.1 percentage point from the previous quar- are projected to rise to 458.9 million units, has also chosen Future Electronics for its ter to 90.5 percent, marking the fifth straight up 17.7 percent from 389.8 million in 2007, performance excellence in resale growth quarter of rise, so SICAS. Actual wafer-starts so iSuppli. across Europe. This was followed by Future rose sequentially by 1.9 percent to 1.950 Germany is a leading European market for Germany's recognition by Avago for best million per week in 8 inch equivalent wafers. flat panel displays. In 2007, nearly 4.5 mil- country performance for 2007. Future has 41 The utilization of advanced facilities that lion units of LCD and plasma television sets sales offices in 26 counties in the Europe, make chips with circuits of less than 80 nm were sold in Germany. Displaybank forecast Middle East and Africa region. came to 96.7 percent. that the LED market would grow from US $2,6B in 2006 to US$8.4B in 2011 with a This is the comprehensive power related Freescale has informed workers at its plant yearly average growth rate of 18 percent. extract from the « Electronics IndustryDigest in East Kilbride, Scotland, that it was unable », the successor of The Lennox Report. For to sell the fab and that it may be closed. PASSIVE COMPONENTS a full subscription of the report contact: 1,000 are employed at the site, with approxi- Germany’s PCB market revenue for Febru- [email protected] or by fax 44/1494 mately 750 directly involved in manufactur- ary 2008 registered a 12.8 percent growth 563503. ing. Freescale is also to close down its compared with the same period last year, design center in Cork, Ireland, with the loss albeit lower revenue compared with the pre- of 47 design engineering jobs, so Irish media vious month, so the ZVEI. During the first reports. two months of the year, total orders were 9 percent higher compared with the same peri- www.europartners.eu.com

14 July 2008 www.bodospower.com PCIM IMPRESSIONS

Blue Efficiency at the Next Level

Pull the rope. Ecodesign and Efficiency We had 100 winners. Three walked away with a Marklin Starter Set. By Alfred Hesener, Director Applications&Marketing, Ten had a Lego Locomotive and all the others had a pickle in a can. Fairchild Semiconductor EU All of the winners walked away with the CD with all of the magazine Ecodesign impacts: High efficiency (>94%), low standby power issues as pdfs. (210mW), lowest component count and space requirements. It was so good to see so many happy people. Blue Efficiency Bodo’s Podium at the PCIM show had put the mile stones down to By Dr. Martin Schulz AIM PMD ID TM Infineon look into the future. Energy Efficiency: the useful work per quantity of energy Just a few impressions and statements from experts. Electrical Efficiency: useful power output per electrical power consumed

Decreasing Computing Power Consumption By Adam Latham, Intersil The efficiency of the phase dropping/adding MOSFET drivers based on LSI protocol data provides significant power savings. However, it is not as efficient as the discrete circuitry solution that dynamically adjusts based on current levels

The Next Level for Design By Eric Persson, Executive Director, Global FAE, International Rectifier New Products targeted specifically at renewable energy inverters (distributed solar arrays)

Blue Efficiency the Design By Werner Berns, Technical Support Manager & University Collaboration Europe National Semi- conductor PowerWise® Adaptive Voltage Scaling (AVS) technology reduces energy consumption by 64% over other solutions for digital systems

Go Blue with TI By François Malléus, EMEA Power Solutions & Services Texas Instruments Supporting renewable energy sources : Generation: Letting nature work for us Distribution: Smart metering and grid management Smart appliances MARKET

Digital Power is a Mainstream Power Technology By Douglas Bess, Editor, PowerPulse.Net Recent news demonstrates that digital power conversion is no longer within the module is described as being truly unique to Ericsson and just an emerging technology - digital power has entered the main- as providing cutting edge performance in terms of the level of control stream. Some of the more interesting developments include: Infi- available, and efficiency. neon’s purchase of Primarion, Fairchild’s second-source agreement with Zilker Labs, Ericsson’s announcement of a digitally-controlled The power module was initially announced during 2007 as an evalua- MicroTCA power module, among others. tive level product intended for interoperability testing. The results from numerous interoperability workshops together with MicroTCA Infineon’s perspective on digital power can be seen in the following component suppliers and system integrators have been incorporated statement made at the time of the Primarion acquisition: “Infineon will into the product, now called BMR 911 483/1. Two features that have now be positioned to set the benchmark in system density, efficiency been added are a USB interface that is accessible to the user via the and control by combining the performance of Primarion’s digitally faceplate, and redundant operation of payload and management controlled power-management devices with Infineon’s leading power power. semiconductors portfolio,” said Peter Bauer, Member of the Manage- ment Board and Head of Infineon’s Automotive, Industrial and Multi- MicroTCA is for use in many different types of applications and kinds market Business Group. of Information and Communication Technology (ICT) equipment. Some of the most suitable ones will most likely be edge and access “The addition of Primarion helps accelerate our access to the poten- equipment. In addition to applications in the communications industry, tial growth in the digital power segment by providing advanced sys- this power module is also suitable for applications targeting enter- tem solutions for our customers. This investment is also a great comprise, military, medical and industrial markets. plement to our power management activities based out of Villach in Austria,” Bauer concluded. In a related action, Verizon has established its own energy-consumption standards and an associated measurement process for new Fairchild is similarly enthusiastic about digital power. Although telecommunications-related equipment. The standards will be applied Fairchild is not a newcomer (the company has had a digital power to certain broadband, video, data-center, network and customer- development effort underway for some time), Bob Conrad, Fairchild’s premises equipment purchased after January 1, 2009. Executive Vice President of the Mobile, Computing, Consumer and Communications Product Group stated, “This partnership allows The target provided to the manufacturers of such equipment is 20% Fairchild to manufacture and sell digital power products and greater efficiency than today’s gear. While not specifically calling for enhances our working knowledge of the digital power market and digital power techniques, achievement of this level of efficiency is application space, while promoting and driving its adoption.” often accomplished with a digital control loop.

“Developing close relationships with our customers, and understand- “This is similar to a consumer buying appliances according to the ing their challenges, will allow us to develop and provide next-gener- standardized ENERGY STAR® efficiency levels,” said Mark Wegleit- ation, leading edge digital power products and solutions for a variety ner, Senior Vice President-Corporate Network and Technology. “How- of applications in the power management market,” Conrad predicted. ever, in most cases, an ENERGY STAR-type rating system did not exist for the equipment we buy, so we set up our own standards and More recently, Zilker introduced what it describes as the industry’s measurement process to create an effective program. We want to most accurate dc-dc power controller for meeting the ever-increasing reduce our energy usage and do our part to improve the environ- voltage regulation accuracy requirements of today’s high-perform- ment. We’re proud to be leading the industry with this initial, impor- ance embedded processors and ASICs. The ZL2004-01 uses Zilker tant step, and invite others to use these standards so the cumulative Labs’ Digital-DC technology to provide ±0.2% dc output regulation, effect is increased.” which is said to enable the most integrated and cost-effective solution for delivering accurate power to sensitive devices, regardless of the Verizon established a series of Telecommunications Equipment Ener- use of analog or digital techniques. gy Efficiency Ratings based on formulas that test the consumption of equipment in various operating conditions and settings. Test data are The ZL2004-01 interfaces with external drivers and MOSFETs, pro- entered into formulas developed for each type of equipment, which viding a flexible controller that can be implemented using a wide vari- will indicate whether or not they achieve the target rating. ety of power train components. The device also supports active current sharing, allowing up to 8 devices in parallel to supply load cur- Equipment to be tested and rated includes optical and video trans- rent requirements in excess of 100A. port systems, switches and routers, DSLAM high-speed internet equipment and optical line termination gear, as well as switching The mainstreaming of digital power is also evident in the recent power systems, data center servers and power adapters that operate announcement of a MicroTCA power converter by Ericsson Power customer equipment. Modules. The digital control of the dc-dc converter that is embedded

16 July 2008 www.bodospower.com The requirements incorporate new applications of existing method- ologies as outlined in SPECpower_ssj2008™ and the Energy Star programs, combined with what are described as some innovative Verizon-led concepts and methods of measurement. The concepts and measurement methods have been submitted for consideration by appropriate standards bodies, such as ATIS’ Network Interface, Power and Protection Committee (NIPP).

CHiL Semiconductor, a developer of mixed-signal power management ICs for a wide variety of computing devices, announced the successful completion of its second major round of venture capital financing, securing $16.7 million. Silicon Valley investor Panorama Capital led the new round and joined the initial investor group of Flybridge Capital Partners, Highland Capital, and IdSoft Capital.

The CHiL controller architecture is said to use mixed-signal technol- Power Modules ogy to optimize performance, increase power efficiency and High Power streamline the design. CHiL’s use of digital power techniques with non-linear control is said to result in a very high bandwidth solution, Sixpacks for and to deliver a fast transient response for high performance servers, computers and other systems requiring high efficiency Motor Drives solutions. By efficiently using digital technology, CHiL claims that its devices integrate a number of differentiating features such as moni- rd toring and control capabilities with real-time response. NEW flowPACK 2 3 gen

“As the world moves toward computing solutions that are environ- up to 150A at 1200V mentally friendly, curtailing power consumption is the key” noted Ram Sudireddy, Chief Executive Officer, CHiL. “We are implementing our product roadmap for more efficient solutions, which ensures that our customers can maximize their design investments with an ongoing stream of new products with innovative technology and features. This new round of funding will extend our global reach to system and board designers in key markets in Asia Pacific and North America.”

The mainstream nature of digital power is evident beyond the news. It can be seen in the industry’s response to the fifth annual Main Features I IGBT4 technology for low Digital Power Forum. This year’s event has broadened to include saturation losses and all aspects of embedded system powering, not just digital power management and digital power conversion. improved EMC behavior

In response to industry demand, the 2008 Digital Power Forum I Low inductance layout (DPF ’08), has added a new track of papers on Advanced Compo- and compact design nents to the two existing tracks on Power Conversion and Mission Critical Facilities. Papers will be presented on planar magnetics, I flow advanced thermal solutions, new semiconductor devices, including High power 2 housing Silicon Carbide, in addition to detailed discussions of power management, energy efficiency and, of course, digital power technologies.

“Our expanded content is a reflection of the fact that digital power has rapidly become a mainstream power technology for embedded systems,” stated Jeff Shepard, President of Darnell Group. “Two years ago, if an engineer was considering using digital power tech- P68X series nology, they had better have had a good reason. Today, an expla- nation is necessary if digital power is not being considered,” Shep- ard observed. http://digitalpower.darnell.com

www.PowerPulse.net www.bodospower.com www.vincotech.com COVER STORY

6500V SPT+ HiPak Modules Higher power and higher SOA performance

The next generation 6500V HiPak IGBT modules employing the newly developed SPT+ IGBT and diode chips is presented. The SPT+ IGBT range achieves significantly lower overall losses while exhibiting higher safe-operating area (SOA) and the same desirable electrical characteristics as the successful SPT generation. By A. Kopta, M. Rahimo, U. Schlapbach, A. Baschnagel, ABB Switzerland Ltd, Semiconductor

Development trends in power electronic systems continue to demand power devices with continuously improved characteristics in terms of reduced losses, increased ruggedness and improved controllability. Following the introduction of the new generation of 1700V, 3300V and 4500V SPT+ IGBT HiPak range, the next generation 6500V HV- HiPak IGBT modules employing SPT+ IGBTs and diodes will be presented in this article. The SPT+ IGBT platform has been designed to substantially reduce the total semiconductor losses while increasing the turn-off ruggedness above that of the current SPT technology. The SPT+ platform exploits an enhanced carrier profile through optimization of ABB’s planar cell structure. The new cell technology significantly increases the plasma concentration at the emitter, which reduces the on-state voltage drop without affecting the turn-off loss- Fig.1: SPT+ IGBT (left) and Diode (right) technology. es. Due to the combination of the enhanced cell design and the soft- punch-through (SPT) buffer concept, the SPT+ IGBT design platform way, the SPT+ technology not only offers significantly lower losses enables ABB to establish a new technology benchmark for the 6.5kV but also an increased SOA capability as compared to the standard voltage class. technology.

The on-state losses of the new 6.5kV IGBT exhibits approximately a Fig. 1 shows also a cross-section of the SPT+ diode. The SPT+ diode 30% reduction as compared to the standard SPT device. This in technology utilizes a double local lifetime-control technique to opti- combination with the increased ruggedness of the SPT+ IGBT has mize the shape of the stored electron-hole plasma. Due to the enabled the current rating to be increased from 600A for the standard improved plasma distribution, the overall losses could be reduced 6.5kV HiPak up to 750A for the new SPT+ version. The new SPT+ while maintaining the soft recovery characteristics of the standard modules will provide high voltage system designers with enhanced SPT diodes. On the anode side, the SPT+ diode employs the same current ratings and simplified cooling while further enhancing the design as used in the standard SPT technology, utilizing a high- recently acquired robustness of the SPT IGBTs. doped P+-emitter. The anode emitter efficiency is adjusted using a first He++ peak placed inside the P+-diffusion. In order to control the 6.5kV SPT+ chip-set technology plasma concentration in the N-base region and on the cathode side The SPT+ IGBT platform was developed with the goal to substantially of the diode, a second He++ peak, implanted deeply into the N-base reduce the on-state losses while maintaining the low switching loss- from the cathode side is used. In this way, a double local lifetime pro- es, smooth switching behavior and high turn-off ruggedness of the file as shown in Fig. 1 is achieved. With this approach, no additional standard SPT (Soft-Punch-Through) IGBTs. This was achieved by homogenous lifetime control in the N-base is necessary. Due to the combining an improved planar cell design with the already well-opti- improved shape of the stored electron-hole plasma, a better trade-off mized vertical structure utilized in the SPT technology. between total diode losses and recovery softness was achieved.

In Fig. 1, a cross-section of the SPT+ IGBT can be seen. The planar 6.5kV/750A HV-HiPak electrical performance SPT+ technology employs an N-enhancement layer surrounding the The 6.5kV HV-HiPak module is an industry-standard housing with the P-well in the IGBT cell. The N-layer improves the carrier concentra- popular 190 x 140 mm footprint. It uses Aluminium Silicon Carbide tion on the cathode side of the IGBT, thus lowering the on-state volt- (AlSiC) base-plate material for excellent thermal cycling capability as age drop (VCE,on) without significantly increasing the turn-off losses. A required in traction applications and Aluminium Nitride (AlN) isolation further reduction of VCE,on was achieved by reducing the channel for low thermal resistance. The HV-HiPak version utilized for the resistance by shortening the lateral length of the MOS-channel. By 6.5kV voltage class is designed with an isolation capability of + optimizing the shape of the N-enhancement layer, the turn-off 10.2kVRMS. To verify the performance of the 6.5kV SPT chips and ruggedness (RBSOA) of the SPT+ cell could be increased even the HV-HiPak module, extensive measurements were carried out. beyond the level of the already very rugged standard SPT cell. In this The results of this characterization will be presented in this section.

18 July 2008 www.bodospower.com The nominal rated current of the 6.5kV HV-HiPak module is 750A, which corresponds to a current density of 34.3A/cm2 for the IGBT and 77.5A/cm2 for the diode. For dynamic measurements, the nominal DC-link voltage was 3600V, while SOA and softness measurements were carried out at 4500V.

Fig. 2-a: Forward characteristics of the 6.5kV SPT+ IGBT (module level measurements).

When power control failure is not an option . . .

)JHI'SFRVFODZ5SBOTGPSNFST GPS)JHI7BMVF4ZTUFNT r%SJWF$POUSPMTGPS3BJM.BSJOF Fig. 2-b: Forward characteristics of the 6.5kV SPT+ Diode (module level measurements). r8JOE1PXFS4PMBS1PXFS$POUSPM r*OEVTUSJBM%SJWF$POUSPMT In Fig. 2-a, the on-state curves of the 6.5kV SPT+ IGBT can be seen. The typical on-state voltage drop (VCE,on) at nominal current and PQUJNJ[FEGPSDPSPOBBOE T =125 °C is 4.0V. The SPT+ IGBT shows a positive temperature j QBSUJBMEJTDIBSHFSFRVJSFNFOUT coefficient of VCE,on, starting already at low currents, which enables a good current sharing capability between the individual chips in the module. In Fig. 2-b, the on-state characteristics of the 6.5kV SPT+ HF Transformer Types: diode are shown. Due to the advanced plasma shaping utilizing a double He++ irradiation scheme, the diode has a strong positive tem- t)JHI*TPMBUJPO t(BUF%SJWF perature coefficient of VF already well below the nominal current. At rated current and 125 °C, the diode has a typical on-state voltage t4XJUDI.PEF t4JHOBM$POEJUJPOJOH drop of 3.5V. t-PBE-FWFMJOH t1VMTF

Fig. 3-a shows the turn-off waveforms of the 6.5kV HiPak module measured under nominal conditions i.e. at 750A and 3600V. Under these conditions, the fully integrated turn-off losses of the module Bicron Electronics Company amount to 5.2J. The module was switched-off using an external gate www.bicronusa.us resistor (Rg,off) of 15Ω, which results in a voltage rise of 2000V/μs. 1 800 624 2766, 1 860 824 5125 The optimized N-base region combined with the Soft-Punch-Through In Europe—TransElectro, DK +45 9858 1022 (SPT) buffer allows the collector current to decay smoothly, ensuring www.bodospower.com July 2008 19 COVER STORY

a soft turn-off behavior without any disturbing voltage peaks or oscil- lations even at high DC-link voltages and stray inductances.

Fig. 3-b shows the turn-on waveforms under nominal conditions. The low input capacitance of the planar SPT+ cell allows a fast drop of the IGBT voltage during the turn-on transient. This, combined with the low-loss SPT+ diode, brings the turn-on switching losses down to a typical value of 6.4J. By carefully designing the diode cathode-sided He++ peak, a short, but still smoothly decaying current tail was achieved. Under nominal conditions, the diode recovery losses are 2.8J. Thanks to the high ruggedness and soft recovery behavior, the

diode can be switched with a high diF/dt, which significantly reduces the IGBT turn-on losses.

Fig. 4: 6.5kV SPT+ IGBT technology curve measured at chip level.

age current and turn-off softness while maintaining a good balance between switching and conduction losses.

In order to evaluate the performance of the 6.5kV SPT+ module under real application conditions a thermal simulation of the output current as function of the switching frequency was made. The results can be seen in Fig. 5. The 6.5kV SPT+ IGBTs have been optimized to operate in an application environment with high stray inductances utilizing low switching frequencies.

One of the main advantages of the new 6.5kV SPT+ IGBT is its extremely high turn-off ruggedness, setting a new benchmark for this Fig. 3-a: 6.5kV SPT+ IGBT turn-off under nominal conditions meas- voltage class. Fig. 6-a shows a turn-off waveform at module level, ured at module level. Eoff=5.2J. where a current of 2400A, which corresponds to more than three times the nominal current, was switched-off against a DC-link voltage of 4500V at a junction temperature of 125°C. The test was conducted with an external gate resistance of 1.0Ω, without using any clamps or snubbers. The stray inductance in this test was 750nH, which is more than double of that expected in the targeted application environment even under worst case conditions. Thanks to the ruggedness of the SPT+ cell, the IGBTs are capable of sustaining a long period of strong dynamic avalanche during the turn-off transient showing an excellent SOA capability. In this test the turn-off peak power reached a value of 11.7MW. In the standard production-level testing all modules are subjected to a turn-off SOA test with three times nominal current (2250A)

Fig. 3-b: 6.5kV SPT+ IGBT turn-on under nominal conditions meas-

ured at module level. Eon=6.4J.

In Fig. 4 the trade-off curve between the IGBT on-state voltage drop and the turn-off losses for the SPT+ as well as the standard SPT IGBT measured at chip level can be seen. The different points on the technology curves correspond to IGBTs with different anode emitter efficiencies. The devices were measured at a collector current of 25A, which is the nominal current of the SPT IGBTs. The new SPT+ IGBT exhibits an approximately 30% lower on-state voltage drop

(VCE,on) for the same turn-off losses as compared to the standard SPT chip. The final point on the technology curve for the SPT+ IGBTs Fig. 5: 6.5kV SPT+ HiPak module output current as function of the was carefully selected based on the trade-off between reverse leak- switching frequency.

20 July 2008 www.bodospower.com COVER STORY

where the modules are driven into dynamic avalanche. This very Fig. 6-b shows a diode reverse recovery SOA test at module level harsh test has been implemented in order to ensure high quality and measured with a forward current of 750A (nominal current) and a DC- reliability of all shipped 6.5kV HV-HiPak modules. link voltage of 4500V. Due to the IGBT turn-on characteristics the diode peak power reaches its maximum value close to the nominal current and starts decreasing again for higher forward currents. The

diode was switched using an external gate resistor (Rg,on) of 1.2Ω reaching a switching speed of 7000A/us and a peak power of 9.0MW.

The short circuit waveforms of the 6.5kV SPT+ module can be seen

Fig. 6-a: 6.5kV SPT+ IGBT turn-off under SOA conditions measured at module level. Ppoff =11.7MW

Fig. 8: 6.5kV SPT+ diode surge current waveforms at module level.

in Fig. 7. The IGBT was carefully designed to withstand a short circuit

at VGE=15.0V for all DC-link voltages up to 4500V and junction temperatures between –40 °C and 125 °C. The desired short-circuit ruggedness was achieved by optimizations of the SPT-buffer and the anode emitter efficiency.

Finally, to verify the surge current capability of the 6.5kV SPT+ diode, the HiPak module was subjected to 100 surge pulse with a magni- tude of 9.9kA and pulse duration of 10ms (I2t = 523kA2s) as shown in Fig. 8. After the 100th pulse, the module was electrically retested to ensure that no degradation had taken place. In the subsequent Fig. 6-b: 6.5kV SPT+ diode reverse recovery under SOA conditions destruction test the single pulse surge current capability was deter- measured at module level. mined. The diodes reached a peak current of 12.3kA, corresponding to an I2t value of 705kA2s before failing. This excellent surge current capability was achieved thanks to a combination of the strongly doped P+-emitter and a low on-state voltage drop facilitated by the optimum plasma distribution shaped by the double He++ irradiation scheme.

www.abb.com/semiconductors

Fig. 7: 6.5kV SPT+ IGBT short-circuit characteristics measured at module level.

www.bodospower.com July 2008 21 IGBT

600V Trench IGBTs Optimized for 20 kHz Operation

The new generation of 600 Volt IGBTs is targeted for DC-to-AC inverter applications. These new devices use Depletion Stop Trench technology to reduce both conduction and switching losses in high frequency switching applications such as UPS and solar inverters enabling higher efficiency power conversion. These devices have been optimized for switching at 20 kHz with low short circuit requirements. By Carl Blake and Wibawa Chou, International Rectifier

Compared to previous generation IGBTs operated at 20 kHz, trench cent reduction in power dissipation at 20 kHz. This reduction means IGBTs have lower conduction and lower switching losses at the same end-products can be designed smaller or more output power can be operating conditions. These devices are also rated for 175°C maxi- obtained from existing power board assembly. mum junction temperature to increase design margin further. Positive Vce(on) temperature coefficient allows easier paralleling of the devices for higher inverter power applications. In addition, 100 percent of the parts are clamped inductive tested (ILM) at 4x the rated current to guarantee robustness.

Trench IGBT One of the major improvements in IGBT designs is the introduction of trench gate IGBT. In a trench IGBT, the gate is trenched down into the p+ body region. This results in reduction of saturation voltage,

Vce(on), when the IGBT is conducting. Another major improvement in trench IGBT is the deploying of a depletion stop layer which allows thinner IGBT with reduced tail current at turn off.

Figure 2: Trench IGBT offers 30% power dissipation reduction compared to planar IGBT in a 20 kHz DC to AC inverter application.

Short Circuit Requirements In a typical DC-AC inverter, output inductors and capacitors filter out 20 kHz switching harmonics. This results in an output voltage that is very close to a true sine wave. When the output of the inverter is shorted, the output inductors will limit the rate of change (di/dt) of the current into the IGBT. Current will ramp linearly and the protection circuit should detect an over-current condition which terminates signals to the gates of the IGBTs. This condition is different from the one in a motor drive application where a short circuit usually means direct Figure 1:. Comparisons of planar punch through with trench depletion short of IGBT terminals without inductor to limit di/dt of the current. stop IGBTs The waveform differences are shown in Figure 3. The first oscillo- scope waveform shows current ramps linearly when an output induc- Figure 1 shows parametric comparisons between planar punch tor is present on the output of the inverter. The controller sets over through (planar) IGBT and trench depletion stop (trench) IGBT of the current limit at 12 Amperes and stops the gate signal to the IGBT same dimensions. This table shows important parameters of the when this limit is exceeded. When current ramps linearly, the IGBT is IGBTs in 20 kHz application. Trench IGBT parameters are superior to not saturated and voltage drop, Vce(on), across it is small (1.7V). those of planar IGBTs. Comparing parameter differences on Figure 1, Therefore, the instantaneous power dissipation is also relatively small trench IGBT’s advantages can be summarized as follows: lower con- at 20.4 Watts (12A x 1.7V).

duction voltage, Vce(on), lower switching losses and lower steady state thermal resistance (Rth) compared to planar IGBTs. Assuming that the controller takes 500 nano seconds to react to this over-current condition, the increase in the junction temperature of the Power Dissipation at 20 kHz IGBT is calculated to be 0.204°C above the steady state junction Power dissipation difference at 20 kHz is analyzed in Figure 2. 20 temperature. This is assuming an instantaneous thermal resistance

kHz is typically used for DC-AC inverter in applications such as solar of 0.01 °C/W and following the formula: dT = Zth x Pdissipation, where or UPS inverters. Calculation shows that there will be up to 30 per- dT is the increase in junction temperature, Zth is the instantaneous

22 July 2008 www.bodospower.com IGBT

thermal resistance and Pdissipation is power dissipation on the IGBT Another improvement made die. This increase in the junction temperature is insignificant in most on the 600V trench IGBT is its applications and the IGBT should be able to survive this condition capability to operate up to without any problem. 175°C junction temperature. This improvement allows On the second waveform, there is no output inductor that limits di/dt design engineers to have of the current. IGBT reaches its current saturation level almost at the more design margin for relia- instant the short circuit occurs. The entire bus voltage is dropped bility. It also means that the across the IGBT and power dissipation is very large. In this example, device can provide more the current saturates at 33 Amperes and the entire bus voltage of power density out of the same 400V is dropped across the IGBT. The instantaneous power dissipa- package. This allows design tion is approximately 13.2 kilowatts (33A x 400V). Using the previous engineers to provide more formula, the increase in junction temperature will be 132 °C above output current capability out of the steady state junction temperature. This increase is very signifi- the same power board assem- cant such that the gate signal to the IGBT must be extinguished bly. On planar IGBTs, the immediately to prevent catastrophic device failure. maximum junction tempera- Figure 4: Output inductor and par- ture is limited to 150°C. asitic inductors on a typical half bridge inverter. 4x Clamped Inductive Load On an inverter with inductor at the output, the IGBT will see high current and high voltage simultaneously at the instant the device switches off. This is due to the transition time of the IGBT from conducting

to blocking (usually specified as tdoff and tf on the datasheet) and par- asitic inductances of the circuit. These inductances are shown in Fig- ure 4 for clarity.

Figure 3: Output inductor limits the rate of change of current into the IGBT when the output is shorted.

600V trench IGBTs for 20 kHz inverter application offer a trade-off between short circuit time and Vce(on). Typically, the higher the short circuit time, the higher Vce(on) will be. However, since output inductors are always present on the application, current ramps linearly when the output is shorted. Therefore, short circuit time handling capability of the IGBTs does not have to be as long as that for motor drive applications. These trench IGBTs have 5 usec short circuit time at room temperature and 3 usec at 150°C. This specification is sufficient Figure 5:. Typical voltage and current across the IGBT at turn off for modern protection circuit and controllers to detect abnormality on transition. the inverter and to terminate gate signals to the IGBTs to prevent catastrophic failure. Increasing short circuit time is not necessary as it During transition time, current on the output inductor can not change will increase the Vce(on) significantly which reduces efficiency of the instantaneously. This means that current will continue flowing on the inverter. co-pack diode of the complementary IGBT. However, it takes time for the co-pack diode to conduct, during which time, the voltage across Paralleling and 175°C Operations the IGBT will spike above the bus voltage. This high voltage spike Since 600V trench IGBTs are based on depletion stop thin wafer will coincide with the high current to be turned off causing a lot of design, the temperature coefficient of the Vce(on) is positive, similar to power dissipation across the IGBT. In order to guarantee robustness, that of a power MOSFET. This means increasing junction tempera- 600V trench IGBTs are designed to be able to turn off four times its ture will increase Vce(on) of the IGBT. This has an advantage when rated current. This is guaranteed by 100 percent testing each device multiple IGBTs are put in parallel to increase power handling capabili- in production for clamped inductive load test. Typical waveform ty of the inverter. With positive temperature coefficient, when one across the IGBT at turn off transition is shown in Figure 5. device takes more current than the others, it will heat up more and its

Vce(on) will increase. When Vce(on) increases, current through the Conclusions IGBT will automatically reduce and current balance is automatically 600V trench IGBTs offer several benefits compared to planar punch restored. On punch through planar IGBTs without thin wafer design, through IGBTs. These advantages are increased power density, the temperature coefficient is negative. Increasing temperature of the increased reliability and ease of paralleling. This generation of IGBTs

IGBT will result in reduction in Vce(on). It is, therefore, more difficult to is targeted for DC-AC inverter application at 20 kHz with low short achieve current balance in parallel operation since the device that circuit rating requirements. takes more current will have its Vce(on) reduced and continues taking more and more current leading to device destruction. www.irf.com www.bodospower.com 23 MOSFET

Renewable Energy Application Efficency A new horizon for SMPS

Developed alongside such other power MOS devices as the IGBT, power MOSFETs have filled niches for many applications. In lower voltage applications, they offer high efficiency for power supplies and DC-to-DC converters, and provide high stability in servo and motor control designs. By Dean Henderson, Segment Marketing Manager/Computing, Infineon Technologies North America And Christian Wald,Senior Specialist, Regional Marketing Management, Infineon Technologies AG

In higher voltage applications, such as auto- Device characteristics

motive anti-lock braking systems, their com- Along with the world’s lowest RDS(on) per mutation speed allows them to be switched package type for 900V MOSFETs (e.g., 120 on and off at very high frequencies, which is mΩ in TO-247 and 340 mΩ in TO-220 pack- a valuable asset in applications that use ages), the Infineon CoolMOS 900V devices pulse width modulation (PWM). However, the have continuous drain currents of up to 36 A growing spectrum of applications for high- and pulse currents of up to 96 A. They also voltage MOSFETs – including high-efficiency achieve a total gate charge (Qg) that is up to

SMPSs (switched-mode power supplies), 25 percent lower than similar RDS(on) types. industrial power converters and renewable This results in the lowest figure of merit, or

energy systems – creates a need for more- FOM (RDS(on) x Qg), in the voltage class, efficient MOSFET technology. Superjunction which translates into low conduction losses, Figure 1. Schematic cross-sections of stan- MOSFETs with higher breakdown voltages, easy driving and low switching losses. dard and superjunction power MOSFETs such as the Infineon CoolMOS™ 900V, meet this need. charge is available for current conduction In addition, the Infineon CoolMOS imple- compared to a standard MOSFET device mentation of superjunction technology sets CoolMOS 900V power MOSFETs overcome (Figure 1). In the blocking state of a super- new benchmarks for device capacitances. the “silicon limit” in power transistor manu- junction MOSFET, the charge is counterbal- The energy being stored in the output facturing, and provide an alternative for high- anced by exactly the same amount of capacitance is an effect that must be consid- voltage designs using standard TO (Transis- charge of the opposite type. The two ered in the context of switching losses. This tor Outline) packages. The devices represent charges are separated locally in the device energy, Eoss, is converted into heat during the first time superjunction technology has by a very refined technology, and the result- hard-switched turn-on. Due to the strongly been extended to 900 V. They offer signifi- ing structure shows a laterally stacked fine- nonlinear voltage dependence of the output cant performance capabilities that did not pitched pattern of alternating arranged p- capacitance, the CoolMOS 900V devices previously exist, giving designers new ways and n-areas. The finer the pitch can be offer extremely good performance if switched

to think about implementing their high-volt- made, the lower the RDS(on) of the device will to more than 150 V. Energy stored in the age solutions. be. Infineon achieves the industry’s finest output capacitance of the MOSFETs is pitch in its CoolMOS devices, yielding reduced by a factor of two or more at the

Superjunction Technology benchmark-setting RDS(on) figures. Target working voltage. Conventional power MOSFETs today have applications for the CoolMOS 900V MOS- suffered from a “silicon limit,” which means FETs are ATX (Advanced Technology The characteristics of the CoolMOS 900V that doubling the voltage blocking capability Extended) PC “silver box” power supplies, MOSFETs allow them to offer more design typically leads to an increase in the RDS(on) quasi-resonant flyback designs for LCD TVs, flexibility, and let designers of power units (on-state resistance) by a factor of five. active 3-phase applications, solar converters benefit from their high blocking voltage, low and other designs in which high blocking RDS(on) and low Qg in a wide range of appli- With superjunction technology, the basic voltage and low conduction and switching cations. Depending on the application, effi- idea is to allow the current to flow from top losses combined with low gate charge are ciency can be increased and/or designs can to bottom of a MOSFET in very-high-doped necessary. be simplified without additional costs or other vertically arranged regions, so much more disadvantages.

24 July 2008 www.bodospower.com MOSFET

Single-Transistor-Forward (STF) Convert- Quasi-Resonant Flyback ers Converters for LCD TVs The output power benchmark for STF con- Modern LCD TVs require out- verters in PC “silver box” supplies can be put power up to 200 W, with increased by using CoolMOS 900V MOS- high power supply efficiency FETs. Up to 500 W is achievable with a sin- and low costs. The best gle MOSFET, with increased performance topology for these require- and lower costs compared to standard two- ments is the quasi-resonant transistor-forward (TTF) converters using flyback converter (Figure 3), Figure 3. Quasi-resonant flyback converter for LCD TV 200 mΩ 500 V/600 V MOSFETs (Figure 2). for which the CoolMOS 900V The STF circuit uses only one transistor, is ideally suited. increase of switching frequency without compared to the two transistors and pulse increased losses. Therefore, a reduction of transformer of a TTF, a topology change that Quasi-resonant flyback designs for LCD TV system size is possible without losing energy simplifies the design and adds layout bene- power supplies can benefit from a higher fly- efficiency. fits without the disadvantages of TTF, such back voltage, which provides a longer pri- as the need for high-side-switching. mary duty cycle with reduced peak current, Lighting applications true zero-voltage switching and significantly Ballast designs for lamps that are fed from a lower voltage stress on the secondary side. three-phase mains supply, such as special Because of its very low RDS(on), a single discharge lamps used in comfort lighting and CoolMOS 900V MOSFET in a TO-220-FP electronic lamp ballasts for street lights and package can be used in such a design, greenhouse heating lamps, will also benefit rather than the two or more TO-220-FP from topologies based on the CoolMOS 900 packages that must be used with conven- V family. The ballasts for such lamps require tional 900V MOSFETS. Efficiency improve- a higher voltage capability than is offered ments of 0.2 percent compared to available with 600 V or 800 V MOSFETs, as well as a 800 V parts, and of 0.7 percent compared to lower RDS(on) than is offered with convention- standard 600 V/650 V parts, have been al 900V MOSFETs. The CoolMOS 900V demonstrated using CoolMOS 900V devices. devices allow improved design of PFC (Power Factor Correction) supplies and lighting ballasts Figure 2a. Comparison of TTF and STF con- because they permit design- verter topologies (STF) ers to accept a higher DC

Despite the higher RDS(on) of 900 V MOS- link or input voltage. For FET, it is possible to design a STF with a example, high-power applica- higher efficiency than a TTF that uses 200 tions that use three-phase mΩ 600V devices. This is due to the higher PFC and PWM stages with dynamic losses in a TTF, in which in every DC link voltages of up to 750 cycle two transistors have to be switched, V will see such benefits as compared to only one transistor in an STF. Figure 4. Typical DC/AC solar converter (with overvoltage higher power density from Also, the transformer in an STF converter protection) having the industry’s lowest needs an additional demagnetizing winding, RDS(on) in a small package, which causes a small amount of losses that such as the TO-247. do not exist in a TTF topology. Designs Renewable energy applications/solar con- using the 340 mΩ CoolMOS 900V have verters Conclusion been shown to reduce losses by up to 0.7 In solar power generating systems, more The key consideration with power MOSFETs percent compared to TTF designs with 200 photovoltaic converter panels can be placed is how low can RDS(on) become at a particu- mÙ MOSFETs. in series instead of in parallel if the MOSFET lar breakdown voltage and in a given pack- voltage is increased to 900 V, or solar panel age. The introduction of superjunction MOS- voltage window can be increased. This FETs at 900 V, with the lowest RDS(on) avail- series connection reduces cabling power able at that voltage in a variety of small- losses and costs, with cabling costs alone form-factor packages, gives designers of cut by a factor of two when changing from high-voltage systems a new set of tools for 600 V to 900 V devices. In addition, Cool- increasing switching speeds and perform- MOS 900V devices allow converters to be ance while improving overall efficiency. designed with an enlarged input voltage range, coming closer to the upper limit of 1000 V as defined by the IEC 60364 for solar modules. www.infineon.com

Another factor in photovoltaic systems is the size and cost of magnetic components.

Figure 2b. Comparison of TTF and STF con- Offering a device with improved RDS(on) x Qg verter topologies (TTF) and RDS(on) x Eoss performance allows an www.bodospower.com July 2008 25 DIGITAL POWER

Digital Power on the Move A Panoramic View of Applications and Challenges

When digital power first emerged as a topic of debate in the early 2000s, most power supply designers cast their doubts at the thought of replacing analog PWM controllers with a DSP based digital power supply controller. By Steve Mappus, Systems Engineer, Fairchild Semiconductor, High Power Solutions, Bedford, NH

Power engineers associated digital power growth is summarized graphically in figure 1 just about all digital POL controllers include with fears of z-transforms, software coding indicating a progressive growth pattern with some distinguishing control technique aimed or blowing up power supplies due to “blue DPM far outpacing DCP for the next several at improving transient response. Since most screen of death”, as sometimes seen in a years. of these proprietary control algorithms were particular computer operating system. Fur- thermore, prior to the introduction of semi- Source: iSuppli Corp, December 2007 conductors that included all the functionality $1,000 necessary to digitally communicate and con- DPM $900 trol a complex power system, the fundamen- DCP tal concepts were proven using high cost $800 DSPs or performance limited FPGAs. Even though digital power techniques had demon- $700 strated the ability to raise power system per- $600 formance, the industry could not accept mimicking digitally what was already being $500 done in analog at more than 10 times the $400 silicon cost. Much progress has been made during the past several years and market $300 analysts as well as financial investors

appear very optimistic regarding the future of Millions in Dollars Revenue $200 growth of digital power. $100

Today’s digital power market is made up of $0 numerous semiconductor suppliers and orig- 2006 2007 2008 2009 2010 2011 inal equipment manufacturers (OEMs) each contributing unique solutions. It’s important Figure 1. Global Digital Power Semiconductor Revenue Forecast (Millions of U.S. Dollars) to first distinguish what is meant by digital (Source: iSuppli Corp, December 2007) power. Power system supervision, monitoring, fault detection and data logging is one The majority of dedicated digital controllers developed by start-up venture companies, aspect of “digital power management” (DPM) available to date are targeted for high vol- the OEM’s demand for preferred suppliers that can be implemented using an inexpen- ume, non-isolated, DC-DC power conver- and dual sourcing became a barrier to gain- sive microcontroller, FPGA or PLD, where sion, including voltage regulator modules ing market acceptance. This in turn has led the time base requirements are relatively (VRM) and point of load (POL) converters. to licensing agreements between a number slow. However, the more challenging exam- These types of DC-DC converters typically of digital power start-ups and the more ple of digital power refers to “digital control deliver power to low voltage, high current established analog semiconductor suppliers. of power” (DCP) where one or more power digital loads such as microprocessors, DSPs Non-isolated, DC-DC POL applications are supply control loops are closed around a and other high speed digital circuits that are viewed as a digital power entry point into the high speed analog to digital converter (ADC) very dynamic in nature. It is becoming power conversion market. However, it is and a micro-controller, state machine or increasingly difficult to maintain accurate eventually expected that isolated DC-DC DSP-based control algorithm. voltage regulation around 1V, while meeting and AC-DC power factor correction (PFC), load transient requirements approaching which currently implement digital control Semiconductor market research firm, iSuppli 200A/ns using pure analog control tech- using non-dedicated DSPs, will gain even estimates that the total world wide digital niques. Some digital controllers can offer higher acceptance in coming years. power market will grow from its current 2008 certain features, such as non-linear control revenue of just over $200M to about $900M which may be more difficult or impossible to The functional requirements for a digital PFC in 2011. The digital power rate of revenue realize in an equivalent analog IC. In fact, controller are much different compared to a

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POL controller. PFC regulators require less graphically in figure 2. Interestingly, recent not be ignored. Tougher global efficiency load regulation accuracy and operate at a government and regulatory requirements for requirements beg the question: what can lower switching frequency and lower overall PFC above certain power levels combined digital power contribute towards increasing control loop bandwidth making quantization with the falling costs of silicon for digital con- efficiency? When implemented correctly, dig- errors, limit cycling and ADC resolution less trollers may enable the feasibility for digital ital control can potentially offer some effi- of a design challenge. Still, there are unique power development in some consumer ac-dc ciency improvements through duty cycle design issues with PFC controllers demand- power supplies such as game systems, set- optimization, adaptive shoot-thru control, ing significant system knowledge and experi- top boxes, digital televisions, AC adaptors meeting transient requirements while ence. Although load transient requirements and battery chargers. enabling lower switching frequency, real time and dead-time optimization are not concerns Source: iSuppli Corp, December 2007 for PFC, non-linear control could be useful 25% for handling line transient conditions which are characteristic of virtually all off-line converters. 20% Server dc-dc AC-DC power supplies generally require an Graphic Card electro-magnetic interference (EMI) filter Telecom dc-dc 15% capable of attenuating noise generated by Datacom dc-dc harmonic distortion and switching regulators. Computing dc-dc Since EMI filters are designed using net- ac-dc works of inductors and capacitors that 10% Lighting appear in series with the AC mains, they Digital TV have a negative effect on overall efficiency Total but are necessary for meeting certain equip- Rate Percentage Penetration 5% ment specifications. Some digital PFC regulators can incorporate features aimed at reducing EMI filter requirements, resulting in 0% smaller more efficient EMI filters. Analog 2006 2007 2008 2009 2010 2011 PFC controllers are distinguishable by various control algorithms and operating modes Figure 2. Digital Power Semiconductor Market Penetration Rates (Source: iSuppli Corp, such as discontinuous conduction mode December 2007) (DCM), continuous conduction mode (CCM) or boundary conduction mode (BCM). Each PFC operating mode has advantages and Regardless of analog or digital, power sup- adaptation of critical timing such as synchro- disadvantages that become more evident at plies developed for consumer market appli- nous rectification or resonant dead time, various power levels. Similar to the multi- cations are especially cost sensitive. The phase shedding and varying operating mode operation of a digital POL, a digital cost pressure compared to existing analog modes based upon load current. Digital con- PFC controller could be assigned to operate solutions has made digital power a tough trol can yield better overall efficiency results in either PFC control mode. Whether for sell for consumer applications but some because the system power is managed more PFC or POL applications, a controller that is industry analysts predict that within 2008 the efficiently according to the demands of the configurable across many OEM product plat- silicon cost of existing digital controllers may load. Any efficiency improvement is always forms provides value through faster develop- approach price parity compared to similar welcome but in order to set realistic expecta- ment time and less component inventory to analog solutions. The value proposition of tions, it is important to emphasize that effi- maintain. digital power will never be compelling ciency is primarily determined by the power enough if compared to a simple analog stage design. Higher power AC-DC applications are better power supply solution. One power supply candidates for digital power because they OEM in particular has designed a platform of A reliable, easy to use graphical user inter- require one or more PFC regulators as well digital power solutions that has been shown face (GUI) is an essential requirement for as multiple, isolated and non-isolated power to beat their existing analog solutions in the success of any digital power controller. rails and complex cooling profiles. Server terms of performance and overall cost. Many power designers are quick to nod in power systems are one example where digi- Issues such as system complexity and pro- agreement at the thought of wanting all the tal control and power management can offer prietary intellectual property demanded that flexibility a digital controller can offer. performance and efficiency benefits in a dis- the proof come from within their own compa- Enabling flexibility through hundreds of pro- tributed power architecture (DPA). As more ny. The cost comparison between digital and grammable commands requires careful con- digital power content makes its way into the analog power solutions has to be looked at sideration in terms of software layers, parti- server and computing power segments, from the entire system point of view includ- tioning, protection features and command other high power DPA systems such as ing: the cost of design, process develop- grouping. The GUI needs to have an intu- those used in telecom and datacom are ment, test, qualification, manufacturing, itive, natural feel but most importantly it beginning to embrace digital power solu- inventory control and component savings. needs to work one hundred percent of the tions. The depth of present and forecasted time. Power supply design is difficult enough market penetration for all digital power semi- Although wide market adoption of digital without adding doubt as to whether the con- conductors is clearly being led by these power is still early in its infancy, there are troller is behaving the way it was pro- types of high power applications, as shown several key factors for acceptance that can grammed.

28 July 2008 www.bodospower.com DIGITAL POWER

Digital controllers also need to be self-con- nal approaches no matter how “digital” a dig- update their design skills accordingly but figurable, meaning that no calibration should ital power system becomes. The fundamen- regardless of different viewpoints on adop- be required by the end user. Some power tal groundwork necessary for shaping the tion rates, one thing is certain: digital power supplies are manufactured in an environ- landscape of digital power is in place but is inevitable. ment where the controller module and power there are still questions remaining as to how stage might be arriving from different suppli- digital power will complement or compete ers and are not integrated until final assem- with traditional analog solutions. Most bly. In this case, there is no opportunity to accomplished power supply designers who www.fairchildsemi.com calibrate the controller since the power stage recognize the value of digital power will is unavailable at the time of delivery.

Every digitally controlled power converter inevitably requires a certain amount of analog circuitry. Whether external or integrated into the same package, gate drivers are just one example of an inter- 2009 face between the analog and digital domains. ADCs, voltage references, regulators and comparators February 13–21, 2009 are also required analog functions that must perform seamlessly in or Washington, DC around a digital controller. Because there are numerous ways to partition digital and analog func- TTHEHE PPREMIERREMIER tions, obtaining the optimal balance between silicon performance, efficiency, intelligence, cost, GLOBALGLOBAL EVENT EVENT process capability and die area continually poses a difficult challenge for system engineers. In ret- ININ POWER POWER rospect, the concept of digital power is really nothing new or rev- TMTM olutionary. DSPs and microcon- ELECTRONICSELECTRONICS trollers have been widely used in industrial motor control applications for many years. The power supply industry has been inching toward digital power adoption but the necessary standards and dedicated semiconductors were not CALL FOR PAPERS! available until recently. CALL FOR PAPERS! deadline for submission, Digital content such as combina- July 18, 2008, go to web for details: tional logic, clocks, counters and timers have always existed inside analog controllers. As mixed signal www.apec-conf.orgwww.apec-conf.org design processes continue to improve, expect the relationship between digital and analog components to be optimized to a much SPONSORED BY higher degree. Depending on the complexity of a targeted application, some functions would benefit best from a digital process while others should remain in the analog domain. At least in the near term, the most cost-effective, optimal solutions appear to be mixed sig-

www.bodospower.com July 2008 29 GUEST EDITORIAL

Digital Power Hope or Hype?

By Dr.– Ing. Artur Seibt, Vienna

Where it makes sense. head the bill, the cost of the control chips is absolutely zilch. The Before the term „Digital Power“ was ever coined, it has been used claim that with DP „a SMPS can now be designed within minutes“ is since decades whenever it made sense, i.e. in large power supplies, utterly absurd: most of the design effort is and will remain devoted to especially in those destined for complex installations. However, the the design of the major components like transformers, the placement term DP as it is used and advocated now applies to the replacement of components, the conductor layout and testing; the design work to of analog control by digital control using DSP’s resp. mixed chips in fulfill the emi norms may take up a sizeable portion of the whole all SMPS. This means to exchange something perfectly and reliably design costs and time. The design of the control loops is not even functioning at low cost by something much more expensive, less reli- worthwhile mentioning. able and without any tangible advantage. This is exemplified by the Costs rule, this fact will prevent widespread use of DP, the cost quality and tenor of the „pushers‘“ arguments. squeeze being extreme. It is astonishing why DP proponents still wonder why the „breakthrough“ they predicted just doesn’t happen, Quality of arguments for Digital Power (DP). they just forgot about cost, underestimated the intelligence of SMPS The abuse of the term „digital“ as a synonym for superiority like „digi- designers, also they never mentioned the disadvantages and dan- tal is better than analog“ is marketing hype; scrutiny of the claims of gers! the DP pushers yields a list of major disadvantages for the vast majority of SMPS. The pushers overlooked that all SMPS in the past Claim 2: DP is more reliable. 60 years functioned perfectly without DP which says enough about In all articles this author encountered, the serious dangers of using the need for it today’s digital ic‘s inside a SMPS were omitted. In fact, there is no „Naturally, the digital loop concept is driven by the start-ups in the environment more hostile to digital circuitry! There are extremely power industry.“ In other words by people with zero or rudimentary strong magnetic and electric hf fields beyond 100 MHz emanating knowhow and experience in power design. especially from inductive components but also from others and the After conceding: „System makers push the market“, an analyst states conductors. And it is just the continuing shrinking of digital ic’s with bluntly: „Analog technology cannot avoid becoming obsolete“, „Many ever lower voltages down to below 1 V and higher speed which in the analog community do not appreciate the impact of Moore’s makes them increasingly vulnerable to interference and hence unfit Law and do not understand that the fate of analog power technology for use inside a SMPS. Most SMPS are extremely densely packed. is already determined.“ He concludes that DP ic’s will fast become „Obsolete“ fairly „slow“ 12 V CMOS ic’s with their 6 V threshold are less costly than analogue ones and this would force total conversion. quite safe even close to 800 V signals with rise times of under 10 ns Obviously, he assumes that SMPS consist of circuit boards full of ic’s. and are being used since decades; there is nothing new about digital circuitry in SMPS whereever it was appropriate, e.g. for generating Another analyst : „The analog designers’ identities seem to be tied up multiphase signals. with their black-art experience in analog; it’s just too scary or painful to imagine that such knowledge might not be valuable in the near This problem is aggravated by the fact that microcomputers/ DSP’s future. However, the analog suppliers find themselves very much in are basically highly vulnerable to interference: while analog or other the same position as mom-and-pop grocery stores in the US...“ digital logic will either ignore an interference pulse or react at most A DP pusher: „Before the advent of DP, hardware engineers were for- with a short hiccup, a single pulse disturbing any of e.g. 32 address ever tweaking and experimenting with different design approaches to lines will cause the program to fetch from a wrong memory location, solve anomalies...“ so e.g. an add instruction will be replaced by e.g. a branch instruction Arguments of such quality are none but insults, and it remains the with catastrophic consequences. If an interference disturbs a data secret of these authors why they consider insults the most effective bus or control signal, equally fatal results will ensue. But even without method of convincing prospective customers. Calling analog design a the influence of interference, plain software errors will lead to disas- „black art“ denounces professional engineering, not understanding trous failures, especially in high power supplies. Due to the nature of that analog design is immensely more difficult than digital design, the these problems it will be close to impossible to ever reconstruct the latter being nothing else but a primitive reduced form of analog cause of the failure! A bit further down into the nitty-gritty: the inputs design! and outputs of CMOS ICs must be protected against exceeding Vcc or ground levels by more than 0.3 V; if this is not strictly observed, Claim 1: DP reduces costs, also SMPS can now be designed arbitrary malfunctions or total failures may result. Interference pulses within minutes. are not only present during „normal“ operation, but especially during Starting from the indisputable fact that present SMPS function per- start-up, overload or short-circuit conditions not to speak of extremely fectly well, the only salient argument for introducing DP would be high interference from the mains and the environment. Many SMPS lower cost. Costs rule, and as long as a DP ic replacing a TL 431 are not shielded, due to the high frequencies of cell phones any con- costs more than this, i.e. a few cents, this claim remains false, even if ductor of a few centimeters may pick up high levels of hf which would DP ICs would be given away, this would not materially affect the not affect properly designed analog circuits but well microcomputers BOM of a SMPS; it is the inductive and capacitive components, the or DSP’s running at speeds of several hundred MHz, generating by power semiconductors, the e.c. board, housing, connectors which the way also additional highly undesirable emi.

30 July 2008 www.bodospower.com Inside a SMPS temperatures run anywhere from 60 to over 100 degrees; transformers are designed for 100 degree operation. Such International Conference ambient temperatures are detrimental to microcomputers/ DSP’s; the and Trade Fair on Hydrogen usual answer that such chips are also used in cars disregards the and Fuel Cell Technologies fact that the actual operating life of a car is just a few thousand hours while a standard SMPS is expected to operate for 5 to 30 years! (Not all electronics are pc’s designed for 2 years.) Here, another basic severe problem of all present digital ic’s comes in: after a few years they will no longer be available, hence a repair of a defective SMPS will become impossible.

In case of malfunction of a DP ic, the state of its ports may become any; if e.g. the drive signal of a power FET lasts a few microseconds 22–2322–23 Oct.Oct. 20082008 too long, it can destroy the FET. How do the proponents of DP guarantee that any conceivable malfunction will be automatically detected CCH – Congress Center Hamburg · Germany and corrected within at most a few microseconds? The benefits of DP in a cell phone may be real, but 3.6 V DC and 230 V AC with the full power of the mains behind are two different stories. No type of fuse or electronic circuit can prevent some components of a SMPS from burning, e.g. capacitors and inductors. Analog circuitry is by Register online! nature extremely reliable, anybody planning to replace it by something inferior should first learn about product safety and manufacturer’s liability and think twice about it! In EU, the liability is squarely on the manufacturers! www.h2expo.com In Germany e.g., the highest court (Bundesgerichtshof) ruled in 2004 that a person who suffered damage by a product could not only sue the company but additionally all managers of that company who decided upon product safety! The author has seen many managers‘ faces fall after they were presented with this court verdict! As long as the „pushers“ of DP could not prove that their products resp. circuitry are of equal reliability, they better abate their marketing hype or give in writing that they will defend their customers in all cases of product safety litigation.

.2/(.7250$*0$GRR Claim 3: DP offers better performance and higher efficiency. Speaking about „better performance“ resp. „higher efficiency“ the first IRUPHU,VNUD)HULWL question is which SMPS was taken as the reference for this claim, an old-fashioned and poorly designed one? The performance and the efficiency of a SMPS are determined entirely by the circuit concept and the proper design resp. selection of the vital components which is indeed an art but not a black one but a professional one. Efficiencies of off-line PFC’s run from 96 to 98 %, of combined PFC plus main converter SMPS from 87 to to > 90 %, without DP, of course. Any further increase will require better components. Low efficiency has nothing to do with the control loop but with poor design and cheap components; no DSP in the control loop can www.kolektormagma.com [email protected] compensate for a poor transformer. Also, a properly designed SMPS will function over its full line and load ranges down to no load with standard analog control circuitry, a „change of parameters“ claimed as necessary by the DP pushers is superfluous, it may be advanta- geous in KW SMPS which constitute only a small fraction of the ferrite cores SMPS population. inductive Summary. components Unless DP pushers can prove that their products save costs or offer better performance so badly needed that customers are willing to pay for it, it will fail; no customer will pay a cent more for „digital control“. absorber sheets nanomaterials http://members.EUnet.at/seibt www.bodospower.com July 2008 31 POWER SUPPLY

Flexible, Accurate & Efficient Power Solutions for LED Backlighting Applications V•I Chips enable high-current, low-voltage distribution inside displays

Traditionally, large size LCDs (liquid crystal displays) used CCFLs (cold cathode fluores- cent lamps) as the source of backlight to achieve a uniform white light. Using LEDs (light-emitting diodes) as backlight is gaining share at key manufacturers as LED outper- forms CCFL in size, energy efficiency, spectral purity, mechanical ruggedness, reliability and the elimination of hazardous substances such as mercury. By Steve Oliver, VP, V•I Chip Inc. (a Vicor company)

White light can come from a single white LED or be generated by three separate R-G- B LEDs with a color spectrum that closely matches the color filters of the LCD pixels. This results in a great improvement in light efficiency and a wide color range for a more vivid display. Currently LCD with CCFL backlight can generate only 70-80% of NTSC colors while newer displays based on LED backlight will generate all the colors in the NTSC specification plus additional colors. By using the ultra-fast switching time of LEDs, the backlight intensity can be modulated to enhance picture contrast and reduce the smearing effect due to fast-moving images.

To replace CCFL in small size (19” typical) LCD monitors, tri-color LED devices can be deployed alongside the housing to replace the CCFL tubes. Typically, only the light source (from CCFL to LED strings) is changed; the housing, light guide and optical films remain unchanged. For larger size LCD Of course, there are challenges to deal with, These new LEDs require a 4 Vdc power (20” or above), where higher light throughput such as maintaining spectral consistency supply at 200 W in a very small package is required, an LED matrix can be deployed due to temperature change and the rate of size. This design is based on the patented directly behind the LCD panel. The matrix LED aging. However, the future is promising. technology of a company that develops and size, typically in hundreds, varies in accor- Key players in the portable electronic indus- markets innovative High Dynamic Range dance with panel size. To ensure homoge- try plan to roll out more models with LED (HDR) image technology. This technology neous illumination, a special diffractive dif- backlight. Large screen TV manufacturers makes it possible to build much brighter dis- fuser is used over standard optical film. As have committed resources to make LED plays, as much as ten times brighter than a LED technology improves, the number of backlight more popular in the consumer mar- conventional LCD, by using intensive video LEDs in the string or matrix can be reduced kets. processing algorithms to adjust the bright- as luminous output (lumens/W) increases, ness of the LEDs. Every single LED in the further reducing overall material and system There has been a recent breakthrough in backlight is individually addressable so the cost. backlight panel technology – the utilization of light levels can be changed dynamically the newly available high-brightness white frame by frame and specifically microregion LEDs in a backlighting panel for LCDs. by microregion. This technology for

32 July 2008 www.bodospower.com POWER SUPPLY

enhanced dynamic range displays enables them to display pictures much more vividly with much darker darks and much brighter brights than previously possible. An existing application involves large-format displays (37 inch and 46 inch high-definition displays) for high-end imaging applications.

New architecture These new LEDs require a 4 Vdc @ 200 W power supply in very small package size. Figure1. Using a 48 Vin BCM to drive a white light LED Earlier designs were powered from a 5.5 V trimmed to 4.1 to 4.2 V. As the BCM module The implementation of a VTM module pro- power supply at 500 A, an unwieldy amount is an unregulated converter and not a regu- vides point-of-load current multiplication as of current to distribute around inside the dis- lator, designers are able to increase the the output current is proportional to its input play due to I2R distribution losses with asso- input voltage to get to the designated output current by the following equation: ciated large and expensive cabling and con- voltage. IIN nectors. IOUT = Other LED Backlight Options K A V•I Chip™ BCM™ bus converter is now Providing a Constant Current for Powering Where K is the K-factor (transformer ratio) of designed into this high-power LED applica- LEDs the VTM module. tion to address the current distribution issue. The BCM utilizes a patented Sine Amplitude Other backlights may require a constant cur- Thus in a controlled current application, the Converter (SAC) topology with state-of-the- rent driving an array of high-power LEDs input current to the VTM transformer can be art power density, efficiency and low noise. connected in series. Generally, constant cur- sensed and regulated to control the output With a footprint of just 1.1 in2 and weighing rent is required to ensure predictable lumi- current. Sensing a lower current (at a higher 15g, the BCM converter provides an isolat- nosity and chromaticity levels. PRM™ regu- voltage) requires a smaller sensor which dis- ed, stepped-down voltage to power niPOLs lators and VTM™ voltage transformers, sipates lower power and improves overall (non-isolated point of load converters), in though originally designed to provide a regu- efficiency. Also, as the V•I Chips themselves this case LED driver ICs. Due to its fast lated voltage from an unregulated input, are provide high efficiency and high power den- response and low output noise, the need for able to provide an extremely efficient and sity, this makes the overall LED system limited life bulk capacitors at the load is accurate constant current with a simple feed- small, cool and maximizes the output in reduced or eliminated, resulting in saving of back circuit. lumens per watt of dissipation – more than board space, materials and total system >1,000 Lumens emitted per 1 Watt dissipat- cost. In a traditional DC-DC converter – the func- ed by the V•I Chips. The overall system tions of regulation and voltage transforma- architecture is illustrated in Figure 2. Now the system distributes 48 V everywhere tion are combined limiting the ability to opti- at a much lower current. At the point of load, it is locally stepped down to high-current at 4 V. On each of the large format boards there are four boards in one system. In total, there are 16 BCM modules running in each system. The result is 4 V at 200 A on each board. In contrast, the previous design using the large centralized power supply would need to provide 800 A for each board incur- ring significantly more distribution losses. Of course, such a supply is dangerous as well due to the high currents involved. That is why 20 A of 48 V are distributed to each board, which is much more manageable and quite fusible. Figure 2. Regulated Current Source Basic Architecture

Well-suited solution Several factors make the BCM converter the mize the system. The PRM regulator and Most LEDs can be driven with a single PRM right solution. First, due to the small size and VTM transformer are individual components + VTM pair. The PRM regulator is pre-con- high efficiency (>94%), no special heatsink- and can be separated or ‘factorized’ to figured with an internal voltage loop to regu- ing is required. Second, it runs at 48 V – an enable higher power densities, higher effi- late its output voltage to a set value. The easily routed, safe (SELV) voltage. There is ciencies and more efficient, flexible system external constant current circuit is designed a family of BCM devices providing different designs. to work in conjunction with the internal volt- standard output voltages which are optimal age control loop, changing the PRM voltage for different applications. Typically, in the Using the PRM regulator and VTM trans- reference in order to regulate the VTM out- LED backlight application, the downstream former for constant current provides several put current. LED driver ICs require an input voltage advantages over conventional approaches. www.bodospower.com July 2008 33 POWER SUPPLY

A simplified block diagram of the PRM internal voltage control loop is adjustment of the regulator’s output set point. The error amplifier will

shown in Figure 3. adjust the PRM output voltage until VSENSE is equal to the reference voltage VREF. This forces the VTM transformer’s input current, and Here, an internal reference is generated and connected to the SC hence, its output current to be constant as determined by the VREF. (secondary control) port through a 10 k resistor and a 0.22 μF capacitor, which provides a soft-start. The SC voltage can be adjusted by adding an external resistor or by applying an external voltage.

Figure 4. Constant Current Circuit

The resulting current may be 99.7% accurate directly from the PRM Figure 3. Functional Diagram of PRM Internal Error Amplifier regulator and up to 98.7% when measured at the VTM transformer output, as shown in figure 5. The SC voltage is buffered and fed to the error amplifier through a

resistive divider represented by the gain block of 0.961. R68 forms the top half of the voltage-sensing resistive divider. The bottom half of the divider is formed by adding a resistor from the OS pin to SG

(ROS). Equation 2 defines the regulator output as a function of VSC and ROS. From Equation 2, it is seen that for a given ROS resistor, adjusting the SC voltage will determine the output voltage. This is the method by which the external current control circuit will control the output.

0.961 x V x (R + )R = SC 68 OS PRM_VOUT R OS

Where:

VSC is the voltage at the SC pin. ROS is the resistance from OS to SG Figure 5. Current Source Accuracy (PRM regulator alone providing of the PRM regulator. 48 V) R68 is the internal resistor. A single PRM regulator with a simple external current sense circuit Current Control Circuit can be used as constant-current source (at 26 - 55 V). The VTM unit The recommended current control circuit is shown in Figure 4. As the transforms this ‘factorized’ bus voltage to the voltage that matches VTM transformer is a current multiplier, the output current can be reg- different color LEDs from 0.8 to 55 V (for instance, 6 V for a blue ulated by its input current. The advantage of this approach is that the LED, 14 V for amber and 24 V for green – though this varies by LED current can be sensed prior to the current multiplication stage (at the manufacturer). higher voltage), reducing the I2R power dissipation in the external shunt. In addition, the control circuitry remains on the primary side The flexibility of Factorized Power Architecture (FPA) allows the (linked to the PRM regulator’s output), eliminating the need for isolat- same regulator to drive different transformers (of different K factors) ing the feedback signal. for different color LEDs. Also, if the LED color voltage requirement is constant, the same VTM transformer may be used while the PRM The circuit consists of a voltage reference, shunt resistor, differential regulator may be changed for a different input source voltage. Fur- amplifier, and error amplifier. Low-side sensing is implemented at the thermore, by ‘factorizing’ the conversion, only the VTM transformer is output of the PRM using an op amp configured as a differential required at the LED load, minimizing the voltage droop and power

amplifier. The voltage across the shunt resistor (R1) is sensed and dissipation. The PRM regulator may be placed elsewhere, perhaps amplified with a gain determined by resistors R2 through R5. The ref- on a separate PCB and linked via a cable or a connector. erence voltage is generated using a precision adjustable shunt reference, and is tied to the non-inverting terminal of the error amplifier. Conclusion This is the voltage to which the error amplifier will compare the differ- V•I Chips represent an accurate, highly efficient, low profile power

ential amplifier output (VSENSE). The output of the error amplifier train for LED backlighting and illumination applications. Depending on (VEAO) is tied to SC through resistors R7 and R8, allowing for the the LED configuration (individual or in higher power ‘strings’), the 34 July 2008 www.bodospower.com 24h sample service for customized transformer BCM converter or the combination of PRM regulator and VTM transformer provides the optimal solution, as shown in Figure 6 as an example. 10 customized samples

8-days-service free of charge Including datasheet & test report

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Figure 6. LED Options Powered by V•I Chips from 48 V Designed to your specification

PRM, VTM, BCM, Factorized Power Architecture (FPA), Sine Ampli- tude Converter (SAC) and V•I Chip are trademarks of Vicor Corpora- EMC COMPONENTS tion. INDUCTORS The Application Note: 018, Providing a Constant Current for Power- TRANSFORMERS ing LEDs using the PRM and VTM is available RF COMPONENTS at:www.vicorpower.com/ccdemo PRESS-FIT TECHNOLOGY CONNECTORS VARISTORS www.vicorpower.com ASSEMBLY TECHNIQUE www.we-online.com

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Super Capacitor Reference Design LED flash power issues for high resolution camera phones solved

Cell phones are becoming the ultimate converged consumer portable appliance. Capabilities include capturing high-quality photography, Wi-Fi web access, crisp audio and extended talk time along with longer battery life. A major design challenge is now emerging. A phone battery still struggles to provide enough peak power to drive some highly-complex mobile applications, driving the demand for circuits that can store high currents for short periods without overloading the battery to provide the power required for high performance operation. By Thomas Delurio, Applications Manager, Advanced Analogic Technologies, Inc

For makers of advanced camera phones, One way to solve the problem with Flash electrolyte as the dielectric to minimize the delivering the high peak current consumed LEDs driven at 1 to 2A each is to use a distance between the plates. Using this by high-intensity camera flash is of utmost capacitor to store the current and deliver it approach they can manufacture capacitors importance. As resolution of camera phones quickly without draining the main battery. with values from 16mF up to 2.3F. The con- grows to three megapixels and beyond, the However, the use of conventional capacitors struction of these devices results in a very amount of light required to achieve a high would require either a very large case size low internal resistance or ESR (Equivalent quality image has sharply increased. In order or multiple devices connected in parallel. A Series Resistance) allowing them to deliver to match the photo quality of digital still cam- more practical solution for space-constrained high peak current pulses with minimal droop eras, cell phones must either drive flash portable systems is to use very high value in the output voltage. These super capacitors LEDs at currents as high as 2A or Xenon “super” capacitors. These devices offer high reduce system footprint requirements by flash tubes charged to over 330V. Other levels of capacitance in a relatively small, flat delivering a very high capacitance in a rela- applications in the phone such as the RF case size. By using a super capacitor, tively small case size. They can be manufac- power amplifier, GPS mapping, internet designers can deliver the high current levels tured in any size and shape and recharge in access, music and video can also exceed needed for these short duration events and seconds. By averaging high power source current availability. then recharge from the battery between demands, they extend battery life by up to a events. To support the battery, designers can factor of five and allow designers to specify Design Challenges add a thin super capacitor to handle the much smaller, lighter and less expensive Camera phones require a high intensity flash phone’s peak-power needs – flash photos, batteries. in medium to low light conditions to produce audio and video, wireless transmissions and good pictures. Designers can choose either GPS readings – without compromising slim Inherent challenges LED or xenon flash units, but there are chal- handset design. It also allows the designer That low ESR presents designers with an lenges with each: to reduce the system footprint by optimally inherent problem during the charge cycle, High-current Flash LEDs need up to 400% sizing the battery and power circuitry to however. In any system the capacitor is ini- more power than a battery can provide to cover just the average power consumption tially discharged. When the supply voltage is achieve the light intensity needed for high- instead of peak levels. then applied, the super capacitor looks like a resolution images. To overcome this power low value resistor. This can result in a huge limitation some camera phones have used Defining a super capacitor in-rush current if the current is not controlled long flash exposure times to compensate for What is a super capacitor (SC)? Like any or limited. Therefore, designers must imple- the lack of light, resulting in blurry photos. capacitor, a super capacitor is basically two ment some sort of in-rush current limit to Xenon flash tubes deliver good light power, parallel conducting plates separated by an ensure the battery does not shut down. Any but have a short flash exposure and can’t be insulating material known as a dielectric. The circuit of this type also typically requires used for a video capture/movie-mode func- value of the capacitor is directly proportional short-circuit, overvoltage and current flow tions. The required electrolytic storage to the area of the plates and inversely pro- protection. capacitors are very bulky for slim-line portional to the thickness of the dielectric. The challenge for designers is how to effi- designs, operate at high voltages, take a Manufacturers building “super” capacitors ciently interconnect the battery, DC/DC con- long time to recharge between flashes and achieve higher levels of capacitance while verter and super capacitor in a way that will cannot be used for other peak-power needs minimizing size by using a porous carbon limit the super capacitor inrush charge cur- in the phone. material for the plates to maximize the sur- rent and continually recharge the cap face area and deploying a molecularly thin between load events. LED flash drivers that

36 July 2008 www.bodospower.com

CAPACITORS

can manage super capacitor charging requirements have appeared and super-capacitor charging capabilities. The solution controls and on the market to make the designers’ jobs easier, integrating the cir- regulates the current from a cell phone’s battery source, steps up the cuitry to save space, cost and time to market. Flash LEDs for digital battery voltage, and manages the charging of a super cap, for the still cameras require 1 to 2A for up to 120mS. control and supply of high-current to flash LEDs In the end applica- A super capacitor can be used to store the required current and deliv- tion. er it quickly without draining the main battery. Working together with the battery, the super capacitor discharges its power during peak To better achieve this, the step-up converter features built-in circuitry loads and recharges between peaks, providing the power needed to to prevent excessive inrush current during start-up as well as a fixed operate systems from battery operated hosts up to 200% longer input current limiter of 800mA and true load disconnect after the while extending the life of the battery. Clearly, any time designers use super capacitor is charged. The AAT1282 boost converter’s output a super capacitor, they must limit in-rush current. Moreover, the super voltage is limited by internal overvoltage protection circuitry, which capacitor needs to be recharged when the voltage drop or droops prevents damage to the AAT1282 converter and the super capacitor below the operational limit of the LEDs. When the SC is fully from an open LED (open circuit conditions). During an open circuit, charged, it has to be disconnected from the source. Short circuit pro- the output voltage rises and reaches 5.5V (typical), and the OVP cir- tection, source over voltage protection and current flow protection are cuit disables the switching, preventing the output voltage from rising also required. higher. Once the open circuit condition is removed, switching will resume. The controller will return to normal operation and maintain Benefits an average output voltage. An industry-standard I2C serial digital Conventional capacitor technology would require either a very large input enables, disables LEDs and sets the movie-mode current with case size or multiple devices connected in parallel to achieve high up to 16 movie-mode settings for lower light output. capacitance values. Super capacitors recharge in seconds with >500k Cycles and store energy in an electrostatic field as opposed to In figure 2, a detailed schematic illustrates that few components are a chemical state like a battery. Since voltage does not droop exces- sively until heavy load currents when fully charged, the use of a super capacitor also reduces ESR and impedance. Super capacitors can be manufactured in any size and shape, flat and small size. They can be used to extend battery life by five times by ‘averaging out' high power demands so they allow smaller, lighter and cheaper batteries. Super capacitors also have a long life (10 to 12 years). Unlike a battery, they have an open-circuit (high ESR) failure mode that is not destructive. Similarly, if over-voltage is applied to the device, the only consequence will be a slight swelling and a rise in ESR, eventually progressing to an open circuit. There will be no fire, smoke or explosion. Figure 2 – Detailed Circuit Schematic. Driven at 2A each, the LEDs deliver more light than a K800i xenon strobe. The SC flash solution is Design Solution less than 2mm thick. Super capacitor-powered LED flash units can drive high-current required, An 0.55F, 85mOhm super capacitor delivers 9W LED power-bursts using the AAT1282 LED Flash driver which has the SC charger integrated with the Boost DC/DC LED Driver. To achieve high light levels, the flash LEDs are driven at currents of between 1A and 2A. The forward voltage (VF) across the LED at these high currents can range up to 4.8V. If we include 200mV of overhead for the current control circuitry, it’s easy to see how the total load voltage during a flash event can range up to 5V, demonstrating the need for the 5.5V step-up voltage.

Figure 1 - Using a super capacitor, it is possible to drive very high LED currents for an ultra bright LED flash. The actual size of the super capacitor is small and flat, ideal for cell phone applications. LEDs to provide light intensity that is many times greater than standard battery-powered LED flash units or longer than xenon strobes. In the block diagram shown in Figure 1, the AAT1282 contains a step-up converter used to boost the 3.2V-to-4.2V battery input voltage up to a constant 5.5V. If the battery voltage is 3.5V and the boost converter is 90% efficient, the battery would need to supply over 3A for the duration of a 2A flash pulse. This will either cause the battery Figure 3 – Performance results, two LEDS at 1A each or one LED at protection circuit to shut the battery down or cause a low voltage 2A. shutdown while plenty of energy still remains in the battery. This solution also offers flash management capabilities, such as movie-mode,

38 July 2008 www.bodospower.com

CAPACITORS

Figure 3 shows test results using two flash LEDs at 1A each and one use relatively low currents and offer fairly long charge times. By com- LED at 2A. As can be seen, the super capacitor can easily supply the bining newly available boost converters with super capacitors, necessary current for 120ms while holding up the supply voltage suf- designers can now create compact solutions that supply high levels ficiently above the VF of the LEDs. Between flash events, the super of current for short durations and, in the process, extend battery life capacitor is recharged at a slower rate to be ready for the next pic- or allow the use of smaller, lighter and less expensive power sources. ture. The time to charge the super capacitor between flashes is set externally and can be optimized for different battery By using a super capacitor and a Flash LED controller in a complete sizes/chemistries. Figure 4 illustrates the digital control of the Flash reference design, it is possible to drive very high LED currents for an function and movie-mode option. ultra bright LED flash. For example, 2x Lumiled’s PWF4 Flash LEDs can be driven at 1A each to deliver more light than a K800i xenon strobe. The super capacitor is less than 2mm thick and can provide other benefits such as extending talk time and improving audio quality.

References: Comparison of xenon flash and high current LEDs for photo flash in camera phones Use of Supercapacitors to Improve Performance of GPRS Mobile Stations Pierre Mars CAP-XX Ltd. 9/12 Mars Road Lane Cove NSW 2066 Australia Figure 4 – Flash and movie-mode control. The movie-mode is con- http://www.cap-xx.com trolled by the I2C interface while the Flash is controlled by a flash enable pin.

Conclusions: Super capacitors have rarely been used in portable systems. Their www.analogictech.com use has been typically limited to back-up or standby functions that

PCIM NEW PRODUCTS Automotive Grade 2.5A Gate Drive Optocoupler

Avago Technologies Designed to met stringent automotive AEC-Q100 guidelines, Avago's announced a new gate drive new ACPL-312T provides 2.5A maximum peak output current to drive optocoupler targeting auto- high powered IGBTs/MOSFETs and operates up to a high tempera- motive hybrid electric vehicle ture rating of 125°C. Additionally, a propagation delay of 0.5 ìs allows applications. The company the circuit designer to reduce switching dead time and improve inverter is a leading supplier of ana- efficiency. log interface components for communications, industrial and consumer applications. www.avagotech.com/optocouplers Plug-and-Play Drivers for High-Power IGBTs.

CONCEPT presented the next generation of ogy and market leader in its self-created IGBT drivers for high-power applications segment. The current family of plug-and- based on the new SCALE-2 chipset. This play drivers supports all known IGBT manu- product type has become a virtual standard facturers. ever since CONCEPT presented a plug-and- Thanks to SCALE-2 technology, the new play driver solution for a high-voltage IGBT 2SD421A and 2SD412B families comprise for the first time ten years ago. Plug-and- extremely compact, 2-channel plug-and-play play drivers are complete ready-to-use IGBT drivers that can be used for the entire drivers that have been perfectly matched by PrimePACKTM portfolio from Infineon with CONCEPT to a large selection of IGBTs. reverse voltages of 1200V and 1700V. CONCEPT now offers over 200 versions of these drivers, which cover all voltage class- current range from 50A to 3600A. This es between 1200V and 6500V as well as a makes CONCEPT the unchallenged technol- www.IGBT-Driver.com

40 July 2008 www.bodospower.com PCIM NEW PRODUCTS

Reference Design for 400W Ecodesigns

The commercial power supply market is switch (FSFR2100) and Power-SPM™ acutely aware of the need to Fairchild Semi- (FFP06R001) in modular SIP-9 packages, conductor’s system-power experts from the creates an elegant and efficient design. With Global Power Resource Center in Fuersten- efficiency at more than 92 percent, this feldbruck, Germany have developed the design exceeds the 87 percent efficiency tar- industry’s first power supply reference get proposed by the Energy Using Products design for 400W ecodesigns. This power directive (EuP). supply reference design shows how the combination of two state-of-the-art products, the award-winning Green FPS™ power www.fairchildsemi.com Thermal Busbar

Rogers N.V. Power Distribution Systems cantly, it presents a distinct advantage for Division has shown its new RO-LINX® Ther- customers: it allows for current system mal (upgraded temperature rating) laminated designs to be upgraded to a higher power busbar. level in a shorter time frame without the The RO-LINX Thermal allows for a sizeable need to start a complete new power module increase in working temperature from the design – avoiding expensive and time con- trical requirements for voltage, current and previous limit of 105°C to 125°C. suming new development. partial discharge. RO-LINX Thermal offers a complete solution Designed for use in propulsion systems, RO- to all aspects of busbar design. Most signifi- LINX Thermal busbars address specific elec- www.rogerscorporation.com Drivers go Digital

Semikron has unveiled a new IGBT driver Differential digital signal processing not only generation. The new driver SKYPER® 52 is provides numerous technical advantages but based on fully digital signal processing, also ensures a high level of signal integrity allowing for the transmission of isolated sen- and hence high noise rejection. With the dig- sor signals and individual protection level ital driver SKYPER® 52, switching charac- settings. This means that development engi- teristics, shut down levels, as well as error neers can do away with costly discrete iso- processing can be set to meet the given lated circuits. The result is fewer system application requirements. components and improved overall system reliability. www.semikron.com EMC Power Line Chokes

EPCOS has extended its range of EMC between 1.5 and 2800 mÙ. The rated volt- power chokes by types designed for high age of the double power chokes is 250 V currents. Its double power line chokes now AC, that of the triple variants up to 690 V attain current capabilities of up to 54 A. The AC. The chokes are designed for nominal new B82725S* and B82726S* series cover temperatures of between 40 °C and 85 °C inductance values from 0.2 to 100 mH. The depending on their type. triple chokes of the B8274* series are now available with current capabilities of up to 62 A. www.epcos.com/power_chokes Depending on the type, their resistance is Low ESR Enhanced Reliability Tantalum Capacitors

The commercial power supply market is range of product within its TRJ professional acutely aware of the need to minimize failure series tantalum chip which delivers signifi- rates as more of their products are being cantly lower ESR while achieving reliability designed into high-end systems. This has levels twice that of standard tantalum led to an increased demand for different lev- devices. els of enhanced-reliability, low ESR capacitors. In response, AVX has introduced a new www.avx.com www.bodospower.com July 2008 41 PCIM NEW PRODUCTS

Automotive Battery Monitoring Transducers

LEM has introduced the HAB xx-S family of The transducers use open-loop, Hall-effect current transducers for automotive battery- technology that simplifies both installation monitoring applications. These transducers and servicing by removing the need to cut have been designed to measure DC, AC, or the [primary] cable carrying the measured pulsed currents up to ±100A. A new Applica- current. They provide a pulse-width modulat- tion Specific Integrated Circuit (ASIC) incor- ed (PWM) output signal proportional to the porated into the units offers resolution 2.5 primary current being measured and operate times better than previous models and a from a unipolar 5V supply. two-fold improvement in offset error, coupled with a significant reduction in price. www.lem.com Punch Through Series IGBTs

Microsemi Corporation has announced a (600V) and 2.5V (900V), to increase overall new family of high speed Power MOS8 insu- circuit efficiency. Low switching losses lated gate bipolar transistors (IGBTs) featur- enable operation at frequencies over ing punch through technology in 600 and 100kHz--approaching the performance of 900 Volt devices. power MOSFETs but at lower cost. The new Power MOS8 IGBTs target applica- Power MOS 8 IGBTs are available as single tions that include solar inverters, high per- devices or packaged with DQ series fast, formance SMPS, and industrial equipment soft recovery diodes. Samples are available such as welders, battery chargers, and now. induction heaters. The new Power MOS8 IGBT series exhibits www.microsemi.com low conduction losses VCE(ON), typ = 2.0V

High-Performance Thermal Management

The participation of Ferraz Shawmut Ther- heat the electronic components to achieve mal Management in European thermal satisfactory operation. research groups and design work on several Ferraz Shawmut Thermal Management demanding thermal applications all over designs and manufactures a complete range Europe shows its expertise, today the group of cooling systems with high thermal per- develops its approach to China. At the PCIM formances: heat sinks, cold plates, heat Exhibition to in Nuremberg, FERRAZ Shaw- pipes and cooling loops and units. mut has presented its solutions for Thermal Each product range is made according to Management. standardized manufacturing technologies. In cases of extreme low environmental temperatures, it may actually be necessary to www.ferrazshawmut.com LED Constant Current Demonstration Board

V.I Chip, Inc., a subsidiary of Vicor Corporation, has announced a constant current (CC) PRM™ regulator demonstration board for light emitting diode (LED) applications such as street & stadium lighting, high-end projectors, active outdoor advertising and architectural installations. The board provides a precisely regulated current as required for direct-drive multi-LED applications where the intensity and brightness are controlled by regulating the current through the LEDs. The board can be used to provide adjustable current up to 240 W (5 A at 48 V) when employed as an standalone non-isolated source or can be combined with the range of VTMTM transformers to provide an adjustable isolated current up to 100 A.

http://www.vicorpower.com/ccdemo

42 July 2008 www.bodospower.com PCIM NEW PRODUCTS

MIPAQ Family of Power Modules

Infineon Technologies introduced its new known-good systems. MIPAQ™ family of IGBT (Insulated Gate The MIPAQ family is based on an innovative Bipolar Transistor) modules that offers a packaging concept and utilizes the advan- very high level of integration. The MIPAQ tages of the Infineon IGBT4 chips. These (Modules Integrating Power, Application and chips feature excellent electrical ruggedness, Quality) products enable highly efficient provide approximately 20 percent lower power inverter designs to be used in Unin- switching losses than IGBT3 and offer higher terruptible Power Supply (UPS); industrial power cycling capability. All MIPAQ products drives, such as compressors, pumps and feature an IGBT six-pack configuration. fans; solar power plants; and air conditioning systems. The modules are characterized by enhanced testing and are delivered as www.infineon.com PWM Controller Increases Efficiency Over Entire Load Range

Building on its portfolio of advanced multiple downstream point-of-load con- pulse-width modulator (PWM) power man- versions. agement controllers, Texas Instruments The integrated UCC28230 PWM con- introduced a power supply controller for troller supports both the half-bridge and unregulated output voltages that achieves full-bridge topologies and reduces overall up to 97 percent system efficiency in an size and the need for external compo- intermediate bus architecture. The con- nents. Designers can set the operation to troller allows intermediate bus architecture work in a fixed volt-second or fixed fre- power systems to combine the highest quency mode, which reduces the size of amount of energy savings, high power- the transformer. density and low system costs in telecom and data communication systems with www.ti.com

Power Modules for Solar Inverters

Modules for transformer, transformer-less and neutral point solar inverter topologies Vincotech, the former Electronic Modules division of Tyco Electronics, is releasing four module families specially designed for solar inverter applications. The modules are optimised for a powers ranging between 2kW and 6kW to satisfy the requirements of transformer- based (up to 400Vdc) and transformer-less (400Vdc and 800Vdc) architectures. The chip technologies used are optimised for the individual requirements of each system. The two modules for transformer-based architectures enable the use of small transformers. Transformer-less systems are covered by a boost plus inverter circuit in one individual module. www.vincotech.com

Motion Platform Speeds Development of BLDC motor

Toshiba Electronics Europe has launched an evaluation platform that will simplify and speed the development of brushless DC (BLDC) motor drives used in applications ranging from home appliances and pumps to industrial automation and automotive motion control. The TB6582FG_EVB3 brings together Toshiba’s latest motor controller IC ASSP and the company’s single-chip inverter drive technology to provide a complete sensorless sine wave motor control and driver solution on a single board.

www.toshiba-components.com www.bodospower.com July 2008 43 PCIM NEW PRODUCTS

LinkSwitch®-II Exceeds Global Energy-Efficiency Standards

Power Integrations announced the introduc- Integrations’ extremely successful tion of its LinkSwitch-II family of highly inte- LinkSwitch series of ICs, simplifies the grated AC-DC switched-mode power conver- design of accurate output CV/CC converters sion ICs with very accurate primary-side by eliminating the need for optocouplers and control. LinkSwitch-II dramatically simplifies all secondary-side CV/CC control circuitry as constant-voltage, constant-current (CV/CC) well as all control-loop compensation circuit- converters, and enables consumer products ry. By integrating all control and protection to meet all worldwide energy-efficiency and circuitry plus a 700 V MOSFET in an 8-pin no-load regulations, such as ENERGY STAR package, LinkSwitch-II significantly reduces 2.0 for external power supplies. The new ICs component count, space and system cost are ideal for applications such as chargers while increasing reliability. for cell phones and cordless phones, high CV or CC applications. brightness LED drivers and other accurate LinkSwitch-II, a new generation in Power www.powerint.com MOSFETs in Robust TO-247 Packag

International Rectifier has expanded its port- ing to improve thermal dissipation compared folio of 60 V, 75 V and 100 V MOSFETs for to a TO-220 package. Incorporating IR’s switch mode power supplies (SMPS), unin- benchmark HEXFET® trench MOSFET tech- terruptible power supplies (UPS) and indus- nology in a robust TO-247 package these trial applications such as power tools, fork- devices offer designers more flexibility where lifts and other high power DC drives. power and thermal performance are a priority. These new devices, an extension to IR’s The new devices are offered lead free and family of N-channel MOSFETs, feature low are RoHS compliant. on-state resistance (RDS(on)) and high switching capability while the rugged TO-247 package provides a larger area for heat sink- www.irf.com

NEW PRODUCTS

80 Kilovolt High Voltage Power Amplifier TREK, INC., a designer and manufacturer of high-voltage power The Model 40/15 HV amplifier is the first of amplifiers and high-performance electrostatic instrumentation, recent- its kind to achieve such high voltage ly introduced a High Voltage Power Amplifier (Trek Model 40/15) ranges along with high performance capa- which, by providing up to 80 kV peak-to-peak (±40 kV), delivers the bilities typically available only with lower highest level of output voltages for any amplifier in its class, taking voltage units. the term ‘high voltage’ to new heights – to voltage levels not previously feasible or available from high voltage linear amplifiers. www.trekinc.com

High-Bandwidth MEMS Vibration Sensor Analog Devices introduced a high-bandwidth solution. MEMS vibration sensor to enable better Vibration analysis is emerging as an impor- monitoring of equipment performance and tant preventative maintenance tool in today’s reduce costly downtime due to unforeseen factory environment. For many industrial system failures on the factory floor. Based operations, however, vibration analysis on Analog Devices’ iMEMS Motion Signal remains cost-prohibitive or is conducted only Processing™ technology, the new ADXL001 periodically. Now, the new ADXL001 allows industrial vibration and shock sensor for the vibration monitoring to be performed continu- first time allows designers of industrial ously without interrupting normal operation process control instruments to cost-effective- of the equipment. ly incorporate high-performance, depend- able high-bandwidth vibration monitoring into their applications via an easy-to-use sensor www.analog.com/ADXL001

44 July 2008 www.bodospower.com EPE 2009 nÊ£äÊ-i«ÌiLiÀ° Barcelona, Spain

13th European Conference on Power Electronics and Applications

Receipt of synopses: Monday 3 November 2008 Receipt of full papers: Monday 11 May 2009

www.epe2009.com NEW PRODUCTS

Emulated Current-Mode-Controlled Buck-Boost National Semiconductor introduced the industry’s first emulated current- mode-controlled buck-boost DC-DC regulator controller with a best-in-class operating voltage range of 3V to 75V for automotive, telecommunications and battery-powered systems. The LM5118 features programmable switching frequency up to 500 kHz, ultra-low shutdown current and smooth transition between buck and buck-boost modes. The LM5118 switching regulator features peak efficiency of 95 percent, positioning it among National’s Power- Wise® family of energy-efficient products. The simple two-switch configuration enables design engineers to easily assemble a complete power converter with ultra-wide input voltage range. Operation below 3V to 75V makes the LM5118 well-suited for automotive applications such as powering the dashboard display, electronic controls such as anti-lock braking or fuel injection control, and the multitude of micro- controllers used in today’s cars. www.national.com Low-Loss Chokes and Filters SMP Sintermetalle Prometheus GmbH & Co as single-conductor chokes for high-current KG introduces inductive components for applications, individual chokes, choke mod- industrial power electronics, drives, power ules or LC filters. generation and instrumentation and control For use in power electronics, power genera- applications. tion, and instrumentation and control, SMP To meet the ever more demanding require- supplies chokes and filters for frequencies ments in power electronics, SMP has devel- up to 200 kHz and current ratings up to 1000 oped high-performance chokes and filters. amperes, with component sizes ranging from These inductive components offer a high 36 to 300 mm diameter and weights from 50 energy storage capacity at low volume, g to 130 kg. reduced losses, good EMC characteristics and a cost-conscious design. Depending on their application, they are constructed either www.smp.de AC/DC-Isolated LED Driver Modules ROHM Electronics introduces the industry's emergency lighting. The two new AC/DC iso- first AC/DC-isolated LED driver modules uti- lated driver modules' constant-current output lizing constant-current circuits optimized for and adjustable brightness control offer driving LEDs. The new BP58xx series inte- designers a highly accurate, high-perform- grates all required LED-driving control cir- ance device for simplifying designs while cuits, switching elements, isolation trans- saving valuable board space. formers and constant-current circuits into a The BP58xx series was developed using single SIP package. The result is an all-in- energy-saving technologies culled from one solution that increases power-conver- AC/DC converter designs. sion efficiency in a broad range of illumination/lighting applications, including theater, landscape, residential, commercial and www.rohmelectronics.com Class-D Audio Amplifier with Integrated Boost Converter Texas Instruments introduced a monolithic, devices are designed to provide high output filter-free Class-D audio amplifier with an power, which is dependent on battery volt- integrated boost converter for portable appli- age. As the battery discharges, the maxi- cations including wireless handsets, person- mum output power decreases, causing al navigation devices, portable gaming and reduced volume and increased distortion. wireless speakers. Addressing the need for The TPA2014D1 provides a higher constant louder volume and higher output power from output power across the entire Li-Ion battery the speakers, the TPA2014D1 provides up to range, thus maintaining loud volume, even 1.5 W across an 8-Ohm load, ensuring that as the battery discharges. volume is maintained even when the battery discharges to its minimum voltage. Conventional Class-D amplifiers for portable www.ti.com

46 July 2008 www.bodospower.com NEW PRODUCTS

Plug-and-Play Solutions for LED-Backlit LCDs Endicott Research Group (ERG), specialist driver boards are less than 5 mm in height, in power solutions for LCD backlights since and both provide brightness stability over a 1979, has released two new high-efficiency, wide input voltage and can power up to 6 low-profile Smart Force™ LED driver boards LED strings. as standard products for a wide range of industrial and medical LCDs. The SFDE Series provides a plug-and-play solution with an outstanding cost/perform- The SFDE (Economical) and SFDM (Mini) ance ratio. It measures only 1.11” (28.2 mm) Series provide full function power supplies x 3.10” (78.7 mm), and is less than 5 mm with optimum power for high brightness as high. It provides an input voltage range of well as lower power consumption and lower 10-20 V, with external PWM dimming to cost in an exceptionally compact size. Both 500:1. www.ergpower.com CeramCool in the Cadillac The lighting and electronics specialist Hella process and is then metallized. The high KGaA Hueck & Co is ready to launch serial level of customer requirements meant that a production of the first fully LED based head- special process had to be developed. Espe- light this summer. It has been developed for cially crucial to the process are the obser- the Cadillac Escalade Platinum, which is the vance of the lowest tolerances and an first Sports Utility Vehicle in the world to be absolutely faultless metallization. Each head- fitted with this trend-setting lighting technolo- light is equipped with 7 LEDs and subse- gy. The high-performance multi-chip LEDs quently fitted with the ceramic CeramCool. are mounted on a specially developed Cer- The LED solution is particularly robust and amCool ceramic frame. It is produced by the works reliably in temperatures ranging from - high-performance ceramics manufacturer 40°C to + 125°C. CeramTec AG, Electronics Division, in Mark- tredwitz, Germany. The partially transparent frame is produced using the dry pressing www.ceramtec.com Line of Floating Hot Deck Power Supply Subsystems UltraVolt, Inc. announced an enhanced provides a second analog up channel and upgraded LV output power provides tightly series of floating-hot-deck power supplies. improved input / output faraday shielding regulated ±15VDC @ 50mA and +5.1VDC at “EFL” Series modules are isolated power along with upgraded low-voltage (LV) output 500mA. The main output is now available at supplies featuring isolation up to 15kV, along power and analog channels. 12V 1amp or 24V 1amp / 1.5 amp. with analog & digital I/O. Therefore, “EFL” The improved input / output faraday shield- The upgraded analog channels auto-zero Series modules create a completely integrating reduces power-stage coupling noise. The and auto-correct for linearity errors and full- ed floating-hot-deck subsystem. scale gain. This provides a control & monitor Floating hot decks operate multiple bias sup- capability of 0 to 10VDC with a temperature plies, pulse generators, and control systems coefficient of <10ppm per °C. These analog in E-beam, I-beam, and mass-spectrometer channels have an initial offset error of <1mV systems. and a full-scale gain error of <0.1% while While UltraVolt’s original floating-hot-deck keeping the linearity error to <0.1%. power supply, the “FL” Series, provides one analog up channel, the new “EFL” Series www.ultravolt.com SMD High-Precision Male Header Fischer Elektronik have extended their prod- tics (combustibility class UL94 V-0). The uct range in the field of connectors by a contacts are either available with a gold-plat- high-precision male header in horizontal sur- ed surface or made from tin (pure tin). face-mounted design, which is available with The high-precision male headers are in con- immediate effect. formity with EU directive 2002/95/EC This high-precision male header with 2.54 (RoHS). The reference number for the 20- mm grid spacing is offered with 2 – 20 con- contact design with gold-plated surface is tacts. Other numbers of contacts are avail- MK 27 SMD 20 G. able on request. The insulator of the high- precision male header is made from reflow- solderable high temperature resistant plas- www.fischerelektronik.de www.bodospower.com July 2008 47 CONTENTS

Low Power DC/DC Converter There are numerous integrated DC/DC con- ers still find it tricky to create a working cir- mA load current and a line regulation of verters on the market, but systems design- cuit when good regulation, input-output isola- ±0.5% over the rated input voltage range. tion and reasonable efficiency are required The ANCRONA AM05 05S05RAW offers an over a wide input voltage range that extends input-output isolation of 1000 VDC and con- remarkably below 5 volts. ANCRONA now tinuous short circuit protection. Ripple and has developed a solution that maintains suf- noise are specified with 100 mVpp maximum ficient efficiency even in low power designs. and can be further reduced with an external The ANCRONA AM05 05S05RAW (World- capacitor. The SIL package measures 9.2 x wide distribution: Willi Bacher GmbH; 21.8 x 11.1 mm. Velden, Austria) operates over an input voltage range of 3.4 V to 8.4 V (1:2.5) and generates an output voltage of 5 V ±3% with a load regulation ±0.8% from 25 mA to 100 www.wbacher.com High-Brightness Surface Mount Tricolor LEDs vago Technologies introduced a new family of enhanced thermal management. The ASMT- compact high-brightness tricolor surface YTB0 incorporates a separate heat path for mount (SMT) LEDs for indoor and outdoor full each LED dice to enable it to be driven at color signs and video displays. Avago's higher currents. As a result, these SMT LEDs ASMT-YTB0 LEDs, which are available in a can operate in a wide range of environmental PLCC-6 package, provides full color display conditions to provide customers with high and video application designers with better reliability. These new tricolor LEDs are ideal color control and contrast, and a 115-degree for use in indoor and outdoor video screens, viewing angle. With dimensions of 4.4 mm by advertising displays and stadium score- 4.4 mm by 3.5 mm, this new family of LEDs boards. from Avago also incorporates silicone material to extend light output performance over time. The family of ASMT-YTB0 LEDs are compatible with reflow soldering processes and have Avago's compact ASMT-YTB0 package is specially designed to meet a moisture sensitivity level of 2a (MSL 2a) to make them ideal for use indoor and outdoor LED screen requirements for better screen reso- in SMT production environments. lution (greater than 12mm pixel size), and high-brightness performance. It also has six-leads to enable individual color control of each color chip to display a multitude of colors including white and www.avagotech.com/led High-Speed Optocouplers NEC Electronics Europe announced five new megabit per second (Mbps) and guaranteed high-performance optocouplers for industrial operation at temperatures up to 110 degrees and motor control applications. The PS9301 Celsius (°C). The PS9317 is even faster, insulated-gate bipolar transistor (IGBT) gate offering a bit rate of 10 Mbps. All five opto- drive coupler with output of 0.6 amperes and couplers comply with common international the high-speed PS8302, PS9303, PS9313 and safety standards, making them ideally suited PS9317 couplers are packaged in a 6-pin for applications ranging from factory automa- shrink dual inline package (SDIP) that reduces tion equipment to environmentally friendly the on-board footprint to half of a conventional home appliances. 8-pin DIP. The high-speed PS8302 and PS9313 couplers mark an industry first by offering a communication speed of 1 www.eu.necel.com/opto

ADVERTISING INDEX

ABB semiconductor C3 Fuji Electric 49 Mesago 27 APEC 2009 29 Husum Wind Energy 50 Microsemi 19 Bicron Electronis 19 Infineon 13 + C2 Power Electronics 39 CT Concept Technologie 7 International Rectifier C4 Texas Instruments Bound Insert Danfoss Silicon Power 11 Intersil 5 Tyco Raychem 3 Darnell 37 Kolektor 31 Vincotech 17 EPE 2009 45 LEM 1 Würth Electronics 35 EXPO H2O 31 Magnetics 35

48 July 2008 www.bodospower.com The new IGBT Generation with improved switching characteristics & thermal management

f V-series: New Trench-FS Structure f Reduced turn-on dV/dt f Lower spike voltage & oscillation f dIc Excellent turn-on /dt control by RG f Extended temperature range: Tj, max = 175°C f Extended package capacity

6-Pack IGBT 50A 100A 1200V 75A 150A 100A 180A

PIM IGBT 25A 75A 1200V 35A 100A 50A 150A1

2-Pack IGBT 225A 1200V 300A 450A 600A

Fuji Electric Device Technology Europe GmbH Goethering 58 · 63067 Offenbach am Main · Germany Fon +49 (0)69 - 66 90 29 0 · Fax +49 (0)69 - 66 90 29 56 [email protected] · www.fujielectric.de © Thomas/Pixelio Meet the wind experts!

9 –13 September 2008

Where better to discover the potential of wind power than on the bracing North Sea coast? It’s small wonder that Husum has hosted the world’s largest specialist trade fair for the wind energy industry for almost 20 years now. Over 700 renowned exhibitors and 18,000 visitors will be attending. So don’t miss out – join us at HUSUM WindEnergy 2008. www.husumwindenergy.com

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HiPak with SPT+

Revolutionary Evolution!

ABB Switzerland Ltd Semiconductors Power and productivity Tel: +41 58 586 1419 www.abb.com/semiconductors for a better world™ Lower RDS(on) Higher Performance

R Max V I DS(on) Qg Part Number DS D V =10V Package (V) (A) GS (nC) (m7) IRF2804PBF 40 270 2.3 160 TO-220 • Tailored for Synchronous Rectiﬁcation • Optimized for fast switching IRF2804SPBF 40 270 2.0 160 D2-PAK

• Up to 20% lower RDS(on)* IRF2804S-7PPBF 40 320 1.6 170 D2-PAK -7 • Up to 20% increase in power density* IRFB3306PBF 60 160 4.2 85 TO-220 • RoHS Compliant

IRFP3306PBF 60 160 4.2 85 TO-247 • Lead Free

IRFB3206PBF 60 210 3.0 120 TO-220 *Compared to previous generations IRFS3206PBF 60 210 3.0 120 D2-PAK

IRFP3206PBF 60 200 3.0 120 TO-247 IRFS3207ZPBF 75 170 4.1 120 D2-PAK Your FIRST CHOICE IRF2907ZS-7PPBF 75 180 3.8 170 D2-PAK -7 for Performance IRFB3077PBF 75 210 3.3 160 TO-220

IRFP3077PBF 75 200 3.3 160 TO-247

IRFS4310ZPBF 100 127 6.0 120 D2-PAK

IRFP4310ZPBF 100 134 6.0 120 TO-247

IRFB4110PBF 100 180 4.5 150 TO-220

IRFP4110PBF 100 180 4.5 150 TO-247

For more information call +33 (0) 1 64 86 49 53 or +49 (0) 6102 884 311 THE POWER MANAGEMENT LEADER or visit us at http://www.irf.com

Electronics in Motion and Conversion July 2008 1SVI 8LER =SY )\TIGX

Electronics in Motion and Conversion July 2008 1SVI 8LER =SY )\TIGX