Lecture 2 Outline
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Nanotechnology ? Nram (Nano Random Access
International Journal Of Engineering Research and Technology (IJERT) IFET-2014 Conference Proceedings INTERFACE ECE T14 INTRACT – INNOVATE - INSPIRE NANOTECHNOLOGY – NRAM (NANO RANDOM ACCESS MEMORY) RANJITHA. T, SANDHYA. R GOVERNMENT COLLEGE OF TECHNOLOGY, COIMBATORE 13. containing elements, nanotubes, are so small, NRAM technology will Abstract— NRAM (Nano Random Access Memory), is one of achieve very high memory densities: at least 10-100 times our current the important applications of nanotechnology. This paper has best. NRAM will operate electromechanically rather than just been prepared to cull out answers for the following crucial electrically, setting it apart from other memory technologies as a questions: nonvolatile form of memory, meaning data will be retained even What is NRAM? when the power is turned off. The creators of the technology claim it What is the need of it? has the advantages of all the best memory technologies with none of How can it be made possible? the disadvantages, setting it up to be the universal medium for What is the principle and technology involved in NRAM? memory in the future. What are the advantages and features of NRAM? The world is longing for all the things it can use within its TECHNOLOGY palm. As a result nanotechnology is taking its head in the world. Nantero's technology is based on a well-known effect in carbon Much of the electronic gadgets are reduced in size and increased nanotubes where crossed nanotubes on a flat surface can either be in efficiency by the nanotechnology. The memory storage devices touching or slightly separated in the vertical direction (normal to the are somewhat large in size due to the materials used for their substrate) due to Van der Waal's interactions. -
AXP Internal 2-Apr-20 1
2-Apr-20 AXP Internal 1 2-Apr-20 AXP Internal 2 2-Apr-20 AXP Internal 3 2-Apr-20 AXP Internal 4 2-Apr-20 AXP Internal 5 2-Apr-20 AXP Internal 6 Class 6 Subject: Computer Science Title of the Book: IT Planet Petabyte Chapter 2: Computer Memory GENERAL INSTRUCTIONS: • Exercises to be written in the book. • Assignment questions to be done in ruled sheets. • You Tube link is for the explanation of Primary and Secondary Memory. YouTube Link: ➢ https://youtu.be/aOgvgHiazQA INTRODUCTION: ➢ Computer can store a large amount of data safely in their memory for future use. ➢ A computer’s memory is measured either in Bits or Bytes. ➢ The memory of a computer is divided into two categories: Primary Memory, Secondary Memory. ➢ There are two types of Primary Memory: ROM and RAM. ➢ Cache Memory is used to store program and instructions that are frequently used. EXPLANATION: Computer Memory: Memory plays a very important role in a computer. It is the basic unit where data and instructions are stored temporarily. Memory usually consists of one or more chips on the mother board, or you can say it consists of electronic components that store instructions waiting to be executed by the processor, data needed by those instructions, and the results of processing the data. Memory Units: Computer memory is measured in bits and bytes. A bit is the smallest unit of information that a computer can process and store. A group of 4 bits is known as nibble, and a group of 8 bits is called byte. -
Solid State Drives Data Reliability and Lifetime
Solid State Drives Data Reliability and Lifetime White Paper Alan R. Olson & Denis J. Langlois April 7, 2008 Abstract The explosion of flash memory technology has dramatically increased storage capacity and decreased the cost of non-volatile semiconductor memory. The technology has fueled the proliferation of USB flash drives and is now poised to replace magnetic hard disks in some applications. A solid state drive (SSD) is a non-volatile memory system that emulates a magnetic hard disk drive (HDD). SSDs do not contain any moving parts, however, and depend on flash memory chips to store data. With proper design, an SSD is able to provide high data transfer rates, low access time, improved tolerance to shock and vibration, and reduced power consumption. For some applications, the improved performance and durability outweigh the higher cost of an SSD relative to an HDD. Using flash memory as a hard disk replacement is not without challenges. The nano-scale of the memory cell is pushing the limits of semiconductor physics. Extremely thin insulating glass layers are necessary for proper operation of the memory cells. These layers are subjected to stressful temperatures and voltages, and their insulating properties deteriorate over time. Quite simply, flash memory can wear out. Fortunately, the wear-out physics are well understood and data management strategies are used to compensate for the limited lifetime of flash memory. Floating Gate Flash Memory Cells Flash memory was invented by Dr. Fujio Masuoka while working for Toshiba in 1984. The name "flash" was suggested because the process of erasing the memory contents reminded him of the flash of a camera. -
Embedded DRAM
Embedded DRAM Raviprasad Kuloor Semiconductor Research and Development Centre, Bangalore IBM Systems and Technology Group DRAM Topics Introduction to memory DRAM basics and bitcell array eDRAM operational details (case study) Noise concerns Wordline driver (WLDRV) and level translators (LT) Challenges in eDRAM Understanding Timing diagram – An example References Slide 1 Acknowledgement • John Barth, IBM SRDC for most of the slides content • Madabusi Govindarajan • Subramanian S. Iyer • Many Others Slide 2 Topics Introduction to memory DRAM basics and bitcell array eDRAM operational details (case study) Noise concerns Wordline driver (WLDRV) and level translators (LT) Challenges in eDRAM Understanding Timing diagram – An example Slide 3 Memory Classification revisited Slide 4 Motivation for a memory hierarchy – infinite memory Memory store Processor Infinitely fast Infinitely large Cycles per Instruction Number of processor clock cycles (CPI) = required per instruction CPI[ ∞ cache] Finite memory speed Memory store Processor Finite speed Infinite size CPI = CPI[∞ cache] + FCP Finite cache penalty Locality of reference – spatial and temporal Temporal If you access something now you’ll need it again soon e.g: Loops Spatial If you accessed something you’ll also need its neighbor e.g: Arrays Exploit this to divide memory into hierarchy Hit L2 L1 (Slow) Processor Miss (Fast) Hit Register Cache size impacts cycles-per-instruction Access rate reduces Slower memory is sufficient Cache size impacts cycles-per-instruction For a 5GHz -
Parallel Computer Architecture and Programming CMU / 清华 大学
Lecture 20: Addressing the Memory Wall Parallel Computer Architecture and Programming CMU / 清华⼤学, Summer 2017 CMU / 清华⼤学, Summer 2017 Today’s topic: moving data is costly! Data movement limits performance Data movement has high energy cost Many processors in a parallel computer means… ~ 0.9 pJ for a 32-bit foating-point math op * - higher overall rate of memory requests ~ 5 pJ for a local SRAM (on chip) data access - need for more memory bandwidth to avoid ~ 640 pJ to load 32 bits from LPDDR memory being bandwidth bound Core Core Memory bus Memory Core Core CPU * Source: [Han, ICLR 2016], 45 nm CMOS assumption CMU / 清华⼤学, Summer 2017 Well written programs exploit locality to avoid redundant data transfers between CPU and memory (Key idea: place frequently accessed data in caches/buffers near processor) Core L1 Core L1 L2 Memory Core L1 Core L1 ▪ Modern processors have high-bandwidth (and low latency) access to on-chip local storage - Computations featuring data access locality can reuse data in this storage ▪ Common software optimization technique: reorder computation so that cached data is accessed many times before it is evicted (“blocking”, “loop fusion”, etc.) ▪ Performance-aware programmers go to great effort to improve the cache locality of programs - What are good examples from this class? CMU / 清华⼤学, Summer 2017 Example 1: restructuring loops for locality Program 1 void add(int n, float* A, float* B, float* C) { for (int i=0; i<n; i++) Two loads, one store per math op C[i] = A[i] + B[i]; } (arithmetic intensity = 1/3) void mul(int -
A 3T Gain Cell Embedded DRAM Utilizing Preferential Boosting for High Density and Low Power On-Die Caches Ki Chul Chun, Pulkit Jain, Jung Hwa Lee, and Chris H
IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 46, NO. 6, JUNE 2011 1495 A 3T Gain Cell Embedded DRAM Utilizing Preferential Boosting for High Density and Low Power On-Die Caches Ki Chul Chun, Pulkit Jain, Jung Hwa Lee, and Chris H. Kim, Senior Member, IEEE Abstract—Circuit techniques for enabling a sub-0.9 V logic-com- for achieving low static power and high operating speed. patible embedded DRAM (eDRAM) are presented. A boosted 3T SRAMs have been the embedded memory of choice due to gain cell utilizes Read Word-line (RWL) preferential boosting to their logic compatibility and fast access time. Recently, em- increase read margin and improve data retention time. Read speed is enhanced with a hybrid current/voltage sense amplifier that al- bedded DRAMs (eDRAMs) have been gaining popularity in lows the Read Bit-line (RBL) to remain close to VDD. A regu- the research community due to features such as small cell size, lated bit-line write scheme for driving the Write Bit-line (WBL) is low cell leakage, and non-ratioed circuit operation. There have equipped with a steady-state storage node voltage monitor to over- been a number of successful eDRAM designs based on tradi- come the data ‘1’ write disturbance problem of the PMOS gain cell without introducing another boosted supply for the Write Word- tional 1T1C DRAM cells as well as logic-compatible gain cells line (WWL) over-drive. An adaptive and die-to-die adjustable read [2]–[9]. 1T1C cells are denser than gain cells, but at the cost of a reference bias generator is proposed to cope with PVT variations. -
SRAM Edram DRAM
Technology Challenges and Directions of SRAM, DRAM, and eDRAM Cell Scaling in Sub- 20nm Generations Jai-hoon Sim SK hynix, Icheon, Korea Outline 1. Nobody is perfect: Main memory & cache memory in the dilemma in sub-20nm era. 2. SRAM Scaling: Diet or Die. 6T SRAM cell scaling crisis & RDF problem. 3. DRAM Scaling: Divide and Rule. Unfinished 1T1C DRAM cell scaling and its technical direction. 4. eDRAM Story: Float like a DRAM & sting like a SRAM. Does logic based DRAM process work? 5. All for one. Reshaping DRAM with logic technology elements. 6. Conclusion. 2 Memory Hierarchy L1$ L2$ SRAM Higher Speed (< few nS) Working L3$ Better Endurance eDRAM Memory (>1x1016 cycles) Access Speed Access Stt-RAM Main Memory DRAM PcRAM ReRAM Lower Speed Bigger Size Storage Class Memory NAND Density 3 Technologies for Cache & Main Memories SRAM • 6T cell. • Non-destructive read. • Performance driven process Speed technology. eDRAM • Always very fast. • 1T-1C cell. • Destructive read and Write-back needed. • Leakage-Performance compromised process technology. Standby • Smaller than SRAM and faster than Density Power DRAM. DRAM • 1T-1C cell. • Destructive read and Write-back needed. • Leakage control driven process technology. • Not always fast. • Smallest cell and lowest cost per bit. 4 eDRAM Concept: Performance Gap Filler SRAM 20-30X Cell Size Cell eDRAM DRAM 50-100X Random Access Speed • Is there any high density & high speed memory solution that could be 100% integrated into logic SoC? 5 6T-SRAM Cell Operation VDD WL WL DVBL PU Read PG SN SN WL Icell PD BL VSS BL V SN BL BL DD SN PD Read Margin: Write PG PG V Write Margin: SS PU Time 6 DRAM’s Charge Sharing DVBL VS VBL Charge Sharing Write-back VPP WL CS CBL V BL DD 1 SN C V C V C C V S DD B 2 DD S B BL 1/2VDD Initial Charge After Charge Sharing DVBL T d 1 1 V BL SS DVBL VBL VBL VDD 1 CB / CS 2 VBBW Time 1 1 I t L RET if cell leakage included Cell select DVBL VDD 1 CB / CS 2 CS 7 DRAM Scalability Metrics BL Cell WL CS • Cell CS. -
Unit 5: Memory Organizations
Memory Organizations Unit 5: Memory Organizations Introduction This unit considers the organization of a computer's memory system. The characteristics of the most important storage technologies are described in detail. Basically memories are classified as main memory and secondary memory. Main memory with many different categories are described in Lesson 1. Lesson 2 focuses the secondary memory including the details of floppy disks and hard disks. Lesson 1: Main Memory 1.1 Learning Objectives On completion of this lesson you will be able to : • describe the memory organization • distinguish between ROM, RAM, PROM, EEPROM and • other primary memory elements. 1.2 Organization Computer systems combine binary digits to form groups called words. The size of the word varies from system to system. Table 5.1 illustrates the current word sizes most commonly used with the various computer systems. Two decades ago, IBM introduced their 8-bit PC. This was Memory Organization followed a few years later by the 16-bit PC AT microcomputer, and already it has been replaced with 32- and 64-bit systems. The machine with increased word size is generally faster because it can process more bits of information in the same time span. The current trend is in the direction of the larger word size. Microcomputer main memories are generally made up of many individual chips and perform different functions. The ROM, RAM, Several types of semi- PROM, and EEPROM memories are used in connection with the conductor memories. primary memory of a microcomputers. The main memory generally store computer words as multiple of bytes; each byte consisting of eight bits. -
Hereby the Screen Stands in For, and Thereby Occludes, the Deeper Workings of the Computer Itself
John Warnock and an IDI graphical display unit, University of Utah, 1968. Courtesy Salt Lake City Deseret News . 24 doi:10.1162/GREY_a_00233 Downloaded from http://www.mitpressjournals.org/doi/pdf/10.1162/GREY_a_00233 by guest on 27 September 2021 The Random-Access Image: Memory and the History of the Computer Screen JACOB GABOURY A memory is a means for displacing in time various events which depend upon the same information. —J. Presper Eckert Jr. 1 When we speak of graphics, we think of images. Be it the windowed interface of a personal computer, the tactile swipe of icons across a mobile device, or the surreal effects of computer-enhanced film and video games—all are graphics. Understandably, then, computer graphics are most often understood as the images displayed on a computer screen. This pairing of the image and the screen is so natural that we rarely theorize the screen as a medium itself, one with a heterogeneous history that develops in parallel with other visual and computa - tional forms. 2 What then, of the screen? To be sure, the computer screen follows in the tradition of the visual frame that delimits, contains, and produces the image. 3 It is also the skin of the interface that allows us to engage with, augment, and relate to technical things. 4 But the computer screen was also a cathode ray tube (CRT) phosphorescing in response to an electron beam, modified by a grid of randomly accessible memory that stores, maps, and transforms thousands of bits in real time. The screen is not simply an enduring technique or evocative metaphor; it is a hardware object whose transformations have shaped the ma - terial conditions of our visual culture. -
Open Poremba-Dissertation.Pdf
The Pennsylvania State University The Graduate School ARCHITECTING BYTE-ADDRESSABLE NON-VOLATILE MEMORIES FOR MAIN MEMORY A Dissertation in Computer Science and Engineering by Matthew Poremba c 2015 Matthew Poremba Submitted in Partial Fulfillment of the Requirements for the Degree of Doctor of Philosophy May 2015 The dissertation of Matthew Poremba was reviewed and approved∗ by the following: Yuan Xie Professor of Computer Science and Engineering Dissertation Co-Advisor, Co-Chair of Committee John Sampson Assistant Professor of Computer Science and Engineering Dissertation Co-Advisor, Co-Chair of Committee Mary Jane Irwin Professor of Computer Science and Engineering Robert E. Noll Professor Evan Pugh Professor Vijaykrishnan Narayanan Professor of Computer Science and Engineering Kennith Jenkins Professor of Electrical Engineering Lee Coraor Associate Professor of Computer Science and Engineering Director of Academic Affairs ∗Signatures are on file in the Graduate School. Abstract New breakthroughs in memory technology in recent years has lead to increased research efforts in so-called byte-addressable non-volatile memories (NVM). As a result, questions of how and where these types of NVMs can be used have been raised. Simultaneously, semiconductor scaling has lead to an increased number of CPU cores on a processor die as a way to utilize the area. This has increased the pressure on the memory system and causing growth in the amount of main memory that is available in a computer system. This growth has escalated the amount of power consumed by the system by the de facto DRAM type memory. Moreover, DRAM memories have run into physical limitations on scalability due to the nature of their operation. -
Hard Disk Drive Specifications Models: 2R015H1 & 2R010H1
Hard Disk Drive Specifications Models: 2R015H1 & 2R010H1 P/N:1525/rev. A This publication could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein – which will be incorporated in revised editions of the publication. Maxtor may make changes or improvements in the product(s) described in this publication at any time and without notice. Copyright © 2001 Maxtor Corporation. All rights reserved. Maxtor®, MaxFax® and No Quibble Service® are registered trademarks of Maxtor Corporation. Other brands or products are trademarks or registered trademarks of their respective holders. Corporate Headquarters 510 Cottonwood Drive Milpitas, California 95035 Tel: 408-432-1700 Fax: 408-432-4510 Research and Development Center 2190 Miller Drive Longmont, Colorado 80501 Tel: 303-651-6000 Fax: 303-678-2165 Before You Begin Thank you for your interest in Maxtor hard drives. This manual provides technical information for OEM engineers and systems integrators regarding the installation and use of Maxtor hard drives. Drive repair should be performed only at an authorized repair center. For repair information, contact the Maxtor Customer Service Center at 800- 2MAXTOR or 408-922-2085. Before unpacking the hard drive, please review Sections 1 through 4. CAUTION Maxtor hard drives are precision products. Failure to follow these precautions and guidelines outlined here may lead to product failure, damage and invalidation of all warranties. 1 BEFORE unpacking or handling a drive, take all proper electro-static discharge (ESD) precautions, including personnel and equipment grounding. Stand-alone drives are sensitive to ESD damage. 2 BEFORE removing drives from their packing material, allow them to reach room temperature. -
Design and Comparative Analysis of Low Power Dynamic Random Access Memory Array Strucyure
International Journal of Engineering Research & Technology (IJERT) ISSN: 2278-0181 Vol. 4 Issue 04, April-2015 Design and Comparative Analysis of Low Power Dynamic Random Access Memory Array Strucyure Mr. K. Gavaskar Mr. E. Kathikeyan, Ms. S. Rohini, Assistant professor/ECE, Mr. S. Kavinkumar Kongu Engineering College UG scholar/ECE, Erode, India Kongu Engineering College Erode, India Abstract- Memory plays an essential role in the design of structure is simplicity [8] and it is used in high densities. electronic systems where storage of data is required. In this DRAM is used in main memories in personal computers paper comparative analysis of different DRAM (Dynamic and in mainframes [7]. Random Access Memory) cell based memory array structure In modern day processor power dissipation plays a major has been carried out in nanometer scale memories. Modern advanced processor use DRAM cells for chip and program role because of the miniaturization of the chip memory. But the major drawback of DRAM is the power design. So this stack technique can be used in future for dissipation. The major contribution of power dissipation in reducing the power consumption. Further enhancement can DRAM is off-state leakage current. Also the improvement of also be made in the design in future to reduce the delay, power efficiency is difficult in DRAM cells. This paper because stacking of transistors increases delay and this investigates the power dissipation analysis in DRAM cells. DRAM cell can be used effectively. Since the cost and size Here 1T1C dram cell, 3T dram cell, 4T dram cell has been of DRAM cells are less when compared to SRAM cells and designed using TANNER EDA Tool.