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High-Speed Data Transmission Using Substrate Integrated Waveguide-Type Interconnects High-Speed Data Transmission Using Substrate Integrated Waveguide-Type Interconnects Asanee Suntives Department of Electrical & Computer Engineering McGill University Montreal, Quebec, Canada February 2009 A thesis submitted to McGill University in partial fulfillment of the requirements for the degree, of Doctor of Philosophy. © 2009 Asanee Suntives Library and Archives Bibliotheque et 1*1 Canada Archives Canada Published Heritage Direction du Branch Patrimoine de I'edition 395 Wellington Street 395, rue Wellington OttawaONK1A0N4 OttawaONK1A0N4 Canada Canada Your file Votre reference ISBN: 978-0-494-53873-9 Our file Notre reference ISBN: 978-0-494-53873-9 NOTICE: AVIS: The author has granted a non­ L'auteur a accorde une licence non exclusive exclusive license allowing Library and permettant a la Bibliotheque et Archives Archives Canada to reproduce, Canada de reproduce, publier, archiver, publish, archive, preserve, conserve, sauvegarder, conserver, transmettre au public communicate to the public by par telecommunication ou par I'lnternet, prefer, telecommunication or on the Internet, distribuer et vendre des theses partout dans le loan, distribute and sell theses monde, a des fins commerciales ou autres, sur worldwide, for commercial or non­ support microforme, papier, electronique et/ou commercial purposes, in microform, autres formats. paper, electronic and/or any other formats. The author retains copyright L'auteur conserve la propriete du droit d'auteur ownership and moral rights in this et des droits moraux qui protege cette these. Ni thesis. Neither the thesis nor la these ni des extraits substantiels de celle-ci substantial extracts from it may be ne doivent etre imprimes ou autrement printed or otherwise reproduced reproduits sans son autorisation. without the author's permission. In compliance with the Canadian Conformement a la loi canadienne sur la Privacy Act some supporting forms protection de la vie privee, quelques may have been removed from this formulaires secondaires ont ete enleves de thesis. cette these. While these forms may be included Bien que ces formulaires aient inclus dans in the document page count, their la pagination, il n'y aura aucun contenu removal does not represent any loss manquant. of content from the thesis. 1*1 Canada i Abstract Electronic circuits have evolved into multifunctional and highly integrated systems that of­ ten require ultra-high-speed and wideband data transmission. Due to the miniaturization trend in CMOS devices, digital processors can now achieve these extreme specifications and enable operation with multi-gigahertz clock frequencies. However, fundamental in­ terconnect limitations prevent from full accomplishment of multi-Gigabit per second data rates. Most importantly, increased conductor and dielectric losses at high frequencies can significantly reduce the channel bandwidth. In addition, crosstalk and electromagnetic in­ terference further deteriorate the link performance, especially in compact routing networks. Therefore, alternative interconnects that enable ultra-high-speed/high-frequency signaling while maintaining signal integrity are needed. This thesis proposes a new method of high-speed data transfer by utilizing waveguide- type interconnects, which offer efficient and confined data transmission due to their low-loss and excellent isolation properties. The electromagnetic bandgap concept is employed for a systematic design of the waveguide sidewalls in order to yield negligible signal leakage in straight and meandered interconnect paths. The performance of the suggested waveg­ uide interconnects is fully investigated from the signal integrity point of view. Due to the three-dimensional nature of the waveguide and its incompatibility with planar structures, a few transition structures are investigated, and important design parameters are identi­ fied. Models for transition structures used in 3-D integration, i.e., the via and aperture transitions, are proposed in order to enable global circuit simulations. Due to the bandpass characteristic of the waveguide channel, modified driver and receiver blocks are introduced to accommodate high-speed baseband signaling, and the first all electrical high-speed serial data transmission system using a substrate integrated waveguide is implemented. Ex­ cellent transmission quality is demonstrated experimentally up to a data rate of 5 Gb/s achieving bit error ratio of better than 10~13. Furthermore, to compensate for the rela­ tively larger footprint occupied by the waveguide compared to conventional printed lines, a substrate reuse approach is proposed by inserting additional lowpass channels inside the waveguide. This hybrid technique proves to increase the aggregate transmission capacity (to 15 Gb/s) by simultaneously utilizing the lowpass and bandpass channels. Finally, an alternative parallel data transmission system is introduced by harnessing multimode trans­ mission through the same waveguide channel and using mode orthogonality. A number ii of transition structures and mode launchers to excite and retrieve TEio and TE2o modes are presented. Experimental characterizations demonstrate excellent transmission quality through the dual-channel system for a data rate of 1 Gb/s/channel. iii Abrege Les circuits electroniques ont evolue pour devenir des systemes multifonctionnels haute- ment integres requerant une transmission a tres haute vitesse et de large bande.. Du a la tendance de miniaturisation des composantes CMOS, les processeurs digitaux peu- vent maintenant atteindre ces specifications extremes et permettent par le meme fait une operation a plusieurs gigahertz. Cependant, des limitations fondamentales par rapport aux interconnections empechent une transmission de plusieurs Gigabits par seconde. Plus precisement, la croissance des pertes de conductions et dielectriques aux hautes frequences peuvent reduire la bande de transmission de fagon significative. De plus, la diaphonie et l'interference electromagnetique contribuent egalement a deteriorer la performance de lien, plus specialement dans des reseaux de routage compacts. Par consequent, une alternative aux interconnections standards est necessaire qui permit une transmission a des frequences ultra-rapide tout en maintenant l'integrite des signaux. Cette these propose une methode nouvelle de transmission de donnees a haute vitesse utilisant des interconnections a guide d'ondes permettant ainsi une transmission de donnees efficace grace aux pertes relativement basses et excellentes proprietes d'isolation. Le concept de bande electromagnetique interdite est utilise pour un design systematique des parois du guide d'ondes afin de procurer une fuite de signal negligeable dans des interconnections droites ou courbees. La performance de l'interconnexion a guide d'ondes suggeree est completement investiguee du point de vue de l'integrite du signal. Du fait de la nature tridimensionnelle du guide d'ondes et son incompatibilite avec les structures planaires, quelques structures de transitions sont investiguees et les parametres cruciaux de design sont identifies. Des modeles de structures de transitions utilisees dans l'integration 3-D, les transitions de via et d'aperture, sont proposes afin de permettre la simulation de circuits globales. Du fait de la caracteristique bande-passante du canal guide d'ondes, des blocs de transmetteur et recepteur sont introduits pour accommoder la signalisation a haute vitesse de la bande de base ainsi que le tout premier systeme de transmission en serie a haute vitesse entitlement electrique utilisant un guide d'ondes integre au substrat. Une transmission de qualite est demontree experimentalement jusqu'a des vitesses de 5 Gb/s ayant un taux d'erreurs binaires en dessous de 10~13. De plus, afin de compenser pour l'aire plus large occupee par le guide d'ondes comparativement aux lignes imprimes conventionnelles, une approche de reutilisation du substrat est proposee en inserant des canaux passe-bas a iv l'interieur du guide d'ondes. II a ete demontre que cette technique hybride accroit la capacite de transmission du canal jusqu'a 15 Gb/s en utilisant simultanement les canaux passe-bas et passe-bandes. Finalement, un systeme alternatif de transmission en parallele de donnees est introduit en attachant la transmission multimodale au meme canal a guide d'ondes et en utilisant l'orthogonalite modal. Un nombre de structures de transition et des lanceurs de modes pour exciter et recevoir les modes TE10 et TE2o sont presentes. Une caracterisation experimental demontre une excellente qualite de transmission par le systeme double-canal pour une vitesse de 1 Gb/s/canal. < V Acknowledgments First and foremost, I am very fortunate to receive unconditional love and support from my parents and my only sister. My family have always been by my side through good and tough times. They have given me so many opportunities to explore the world, which undoubtedly has helped towards this success. I am also very grateful to my supervisor, Professor Ramesh Abhari, for her kind support and dedication in the supervision of my research work. I have especially learned a lot from her in many ways. Professor Abhari has also provided me with so many opportunities to attend conferences to gain experience and broaden my horizon. As well, I would like to thank my Ph.D. thesis committee, Professor David V. Plant and Professor Gordon W. Roberts, for their valuable time and suggestions during the course of my program. I want to sincerely express my appreciation to
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